CN104902672A - Circuit board having board edge structure and preparation method thereof - Google Patents
Circuit board having board edge structure and preparation method thereof Download PDFInfo
- Publication number
- CN104902672A CN104902672A CN201510309032.4A CN201510309032A CN104902672A CN 104902672 A CN104902672 A CN 104902672A CN 201510309032 A CN201510309032 A CN 201510309032A CN 104902672 A CN104902672 A CN 104902672A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- groove milling
- milling
- board
- edge structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention, which belongs to the circuit board processing field, particularly relates to a circuit board having a board edge structure and a preparation method thereof. A moulding milling board edge tool procedure is added to the original flow; the board suspension way and manufacturing way of the large-dimension multi-layer panel back panel during the graph electroplating process and the solder resist and electrostatic spraying processes can be improved. The circuit board and the preparation method are suitable for all large-dimension multi-layer board tool graph designs and using methods. The electroplating and electrostatic spraying board suspension of the large-dimension multi-layer panel can be improved; and the yield of subsequent production and manufacture is improved, so that the production quality is substantially improved. Therefore, the method has the great economic value and broad market application prospects.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to a kind of wiring board with edge structure and preparation method thereof.
Background technology
Current large scale multi-layer sheet backboard because of thickness of slab, during plating and welding resistance make, cannot make or weight excessive and fall cylinder and cause scrapping.Therefore need to design a kind of edges of boards instrument figure being beneficial to the operation link plates such as plating, welding resistance.The production procedure of prior art is: sawing sheet-layer pattern-internal layer etching-pressing-boring-heavy copper-plate electricity-outer graphics-graphic plating-skin etching-welding resistance-surface treatment.Wherein Pcb edges of boards are designed to rivet position and OPE optical point centre distance unit formation line is 8mm and rivet position and OPE optical point centre distance sawing sheet plate 6mm, behind pressing gong limit, and edges of boards position≤14mm.But when Pcb edges of boards position≤14mm time, in manufacturing process, edges of boards need design section hole, follow-up making contraposition optical point etc., and cannot edges of boards be dealt with further, therefore large scale pcb is because of thickness of slab, exceeds electroplating clamp plate clamp jaw width and cannot to make or manufacturing process is fallen the operation such as cylinder because of the excessive appearance production of large scale pcb weight and scrapped.
Summary of the invention
For this reason, technical problem to be solved by this invention to be to overcome in prior art large scale multi-layer sheet backboard because of thickness of slab, during plating and welding resistance make, cannot make or weight excessive and fall the technical bottleneck that cylinder causes scrapping, thus propose one and be convenient to clip and clamp edges of boards further, strengthen edge structure of clamping effect and preparation method thereof.
For solving the problems of the technologies described above, of the present inventionly disclosing wiring board described in a kind of wiring board with edge structure and be made up of effective operation plate, groove milling and margin plate; Wherein said groove milling is at the edge of effective operation plate, and described margin plate is arranged on outside groove milling; Described groove milling is provided with at least one slotted eye.
Preferably, the described wiring board with edge structure, the width of described groove milling is 10mm, and the degree of depth is 1/2 of described wiring board thickness of slab, and described margin plate is wide is 2mm, groove milling height 1mm described in the depth ratio of described margin plate.
More preferred, the described wiring board with edge structure, described slotted eye is long is 10mm, and wide is 5mm.
The invention also discloses and a kind ofly prepare arbitrary described method with the wiring board of edge structure, described method comprise following steps:
(1) sawing sheet process is carried out by wiring board size, to output effective operation plate and to reserve the edges of boards of 12mm at the edge of effective operation plate;
(2) wiring board exposed successively, etch, detect, pressing and boring process;
(3) according to the maximum temperature value of different materials maintaining rigidness, select corresponding milling board parameter, and carry out the operation of milling edges of boards, thus mill out the groove milling that width is 10mm, the degree of depth is 1/2 of described wiring board thickness of slab; The wide margin plate for groove milling height 1mm described in 2mm, depth ratio;
(4) reprocessing is carried out to wiring board.
Preferably, described method, in described step (4), reprocessing comprises heavy copper, plating, exposure, etching, detection, welding resistance, character and surface treatment successively.
More preferred, described method, wiring board thickness >=5mm described in described step (1).
Further, described method, in exposure-processed described in described step (4), the lattice number of exposure guide rule is 6-21 lattice.
More further, the method described in 4, described step (3) milling edges of boards operate in the groove milled out, and shaping gong goes out to be no less than the long 10mm of, the wide slotted eye for 5mm.
Preferably, described method, in described step (4), in electroplating processes, electroplating thickness is 5-12 μm.
More preferred, described method, in described step (4), character process adopts white net to carry out; Surface treatment adopts taping machine to carry out.
Technique scheme of the present invention has the following advantages compared to existing technology: in former flow process, add shaping milling edges of boards tool flow, improve large scale multilayer backboard plate electricity, scheme link plate mode in the processes such as electric electroplating process link plate and welding resistance electrostatic spraying and make, be applied to all large scale multi-layer sheet instrument graphic designs and using method, improve the plating of large scale multi-layer sheet and electrostatic spraying link plate, improve yield for subsequent production makes, thus improve production quality greatly.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the schematic diagram of edges of boards Facad structure described in one embodiment of the invention 1;
Fig. 2 is edge structure side structure schematic diagram described in one embodiment of the invention 1.
In figure, Reference numeral is expressed as: 1-effective operation plate; 2-slotted eye; 3-groove milling; 4-margin plate.
Embodiment
In order to make content of the present invention be more likely to be clearly understood, list 2 specific embodiments below, the present invention is further detailed explanation.
Embodiment 1
Present embodiment discloses a kind of wiring board with edge structure, as shown in Figure 1 and Figure 2, described edges of boards are by effective operation plate 1, groove milling 3 and margin plate group 4 one-tenth; The width of wherein said groove milling 3 is 10mm, the degree of depth is 1/2 of described wiring board thickness of slab, is provided with margin plate 4 in addition outside described groove milling 3, and described edge 4 plate is wide is the high 1mm of groove milling 3 described in 2mm, depth ratio; In described groove milling 3, arranging at least one long is 10mm, and wide is the slotted eye 2 of 5mm.
Described effective operation plate refers to the routine work part of wiring board.
Embodiment 2
Present embodiment discloses the method for the wiring board described in a kind of preparation with edge structure, described method comprise following steps:
S1: carry out sawing sheet process by wiring board size, outputs effective operation plate and reserves the edges of boards of 12mm at the edge of effective operation plate; Described wiring board thickness >=5mm;
S2: use the exposure guide rule of 6-21 lattice number to complete internal layer circuit exposure, development after etching goes out line pattern;
S3: detect opening circuit defect and making correction of internal layer;
S4: brown speed, according to the thick brown of end copper copper, selects suitable lamination to carry out pressing according to the maximum temperature of plate maintaining rigidness, outer copper foil selects the Copper Foil be suitable for according to table copper thickness;
S5: according to thickness of slab, carries out outer Drilling operation;
S6: according to the maximum temperature value of different materials maintaining rigidness, selects corresponding milling board parameter, and carries out the operation of milling edges of boards according to graphic designs; Edges of boards mill out the oblique hook-like groove that the degree of depth is 1mm, width is 10mm; In the groove milled out, shaping gong goes out long 10mm, and wide is the slotted eye of 5mm;
S7: heavy Copper treatment is carried out to wiring board skin;
S8: electric plating of whole board process is carried out to circuit board, electroplating thickness is 5-12 μm;
S9: complete outer-layer circuit exposure with exposure guide rule, and carry out outer graphics development treatment;
S10: graphic plating is carried out to the hole of wiring board, table copper;
S11: carry out outer alkali etching process, etching speed etches by end copper, controls etching live width;
S12: detect and outer fieldly open the defects such as short circuit and make correction;
S13: carry out the process of silk-screen welding resistance with solder mask;
S14: adopt white net to carry out print character and image, and adopt taping machine to carry out surface treatment.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (10)
1. have a wiring board for edge structure, it is characterized in that, described wiring board is made up of effective operation plate, groove milling and margin plate; Wherein said groove milling is at the edge of effective operation plate, and described margin plate is arranged on the outside of groove milling; Described groove milling is provided with at least one slotted eye.
2. have the wiring board of edge structure as claimed in claim 1, it is characterized in that, the width of described groove milling is 10mm, and the degree of depth is 1/2 of described wiring board thickness of slab, and described margin plate is wide is 2mm, groove milling height 1mm described in the depth ratio of described margin plate.
3. have the wiring board of edge structure as claimed in claim 1, it is characterized in that, described slotted eye is long is 10mm, and wide is 5mm.
4. prepare the arbitrary described method with the wiring board of edge structure of claim 1-3, it is characterized in that, described method comprise following steps:
(1) sawing sheet process is carried out by wiring board size, to output effective operation plate and to reserve the edges of boards of 12mm at the edge of effective operation plate;
(2) wiring board exposed successively, etch, detect, pressing and boring process;
(3) according to the maximum temperature value of different materials maintaining rigidness, select corresponding milling board parameter, and carry out the operation of milling edges of boards, thus mill out the groove milling that width is 10mm, the degree of depth is 1/2 of described wiring board thickness of slab; The wide margin plate for groove milling height 1mm described in 2mm, depth ratio;
(4) reprocessing is carried out to wiring board.
5. method as claimed in claim 4, it is characterized in that, in described step (4), reprocessing comprises heavy copper, plating, exposure, etching, detection, welding resistance, character and surface treatment successively.
6. method as claimed in claim 4, is characterized in that, wiring board thickness >=5mm described in described step (1).
7. method as claimed in claim 4, it is characterized in that, in exposure-processed described in described step (4), the lattice number of exposure guide rule is 6-21 lattice.
8. method as claimed in claim 4, it is characterized in that, described step (3) milling edges of boards operate in the groove milled out, and shaping gong goes out to be no less than the long 10mm of, the wide slotted eye for 5mm.
9. method as claimed in claim 4, is characterized in that, in described step (4), in electroplating processes, electroplating thickness is 5-12 μm.
10. method as claimed in claim 4, is characterized in that, in described step (4), character process adopts white net to carry out; Surface treatment adopts taping machine to carry out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510309032.4A CN104902672A (en) | 2015-06-08 | 2015-06-08 | Circuit board having board edge structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510309032.4A CN104902672A (en) | 2015-06-08 | 2015-06-08 | Circuit board having board edge structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104902672A true CN104902672A (en) | 2015-09-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510309032.4A Pending CN104902672A (en) | 2015-06-08 | 2015-06-08 | Circuit board having board edge structure and preparation method thereof |
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| Country | Link |
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| CN (1) | CN104902672A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813376A (en) * | 2016-05-05 | 2016-07-27 | 广合科技（广州）有限公司 | PCB (Printed circuit board) breakage prevention milling and plating slot and application method of the PCB (Printed circuit board) break prevention board milling and plating slot |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| JP2011233836A (en) * | 2010-04-30 | 2011-11-17 | Nippon Mektron Ltd | Build-up type multilayer printed wiring board and method for manufacturing the same |
| CN102802363A (en) * | 2012-08-27 | 2012-11-28 | 长沙牧泰莱电路技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN103068165A (en) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
-
2015
- 2015-06-08 CN CN201510309032.4A patent/CN104902672A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| JP2011233836A (en) * | 2010-04-30 | 2011-11-17 | Nippon Mektron Ltd | Build-up type multilayer printed wiring board and method for manufacturing the same |
| CN102802363A (en) * | 2012-08-27 | 2012-11-28 | 长沙牧泰莱电路技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN103068165A (en) * | 2012-12-20 | 2013-04-24 | 东莞生益电子有限公司 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813376A (en) * | 2016-05-05 | 2016-07-27 | 广合科技（广州）有限公司 | PCB (Printed circuit board) breakage prevention milling and plating slot and application method of the PCB (Printed circuit board) break prevention board milling and plating slot |
| CN105813376B (en) * | 2016-05-05 | 2018-08-17 | 广合科技（广州）有限公司 | A kind of anti-breaking plate milling coating bath of PCB and its application process |
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Application publication date: 20150909 |