CN102802363A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN102802363A CN102802363A CN2012103080615A CN201210308061A CN102802363A CN 102802363 A CN102802363 A CN 102802363A CN 2012103080615 A CN2012103080615 A CN 2012103080615A CN 201210308061 A CN201210308061 A CN 201210308061A CN 102802363 A CN102802363 A CN 102802363A
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Abstract
The invention discloses a printed circuit board and a manufacturing method thereof. The invention provides a method for manufacturing printed circuit boards, which comprises the steps of carrying out the silk-screen printing of carbon oil twice as follow: 1) printing carbon oil on one side of a printed circuit board through silk-screen printing, and then baking the printed circuit board; and 2) printing carbon oil on the side of the printed circuit board through silk-screen printing again, and then baking the printed circuit board. A printed circuit board manufactured by using the manufacturing method can meet the thickness requirements of more than 4 million test times, so that a key position is uneasy to be pierced by a key head. Moreover, in the process of silk-screen printing/resistance welding, compared with a line film, the film exposure of a position film is reduced, so that the gap difference between resistance welding and carbon oil conducting keys can be filled; and in the process of printing carbon oil, a carbon oil film at the position of the carbon oil conducting key increases the film exposure, and then in the subsequent silk-screen printing of carbon oil, the resistance welding position at the key position is covered, therefore, the quality problem that a copper exposed phenomenon is produced at the key position can be solved.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB) field, be meant a kind of printed circuit board (PCB) and preparation method thereof especially.
Background technology
Along with the develop rapidly of electronics industry, the carbon oil printed board is at electrical equipment commonly used, instrument trend multifunction and aspect, microminiaturized aspect and progressively be used, as: television set; Telephone set, electronic organ, game machine; Video tape recorders etc., the technology that it is new, new function constantly obtain exploitation and utilize; Computer keyboard, card form computing machine, miniature radio-cassette player; The electronic applications of electronic measuring device and SMT also begins to select for use the carbon film printed board, and the positions such as for example button in the printed circuit on the PCB of electronic apparatus surface often need contact conducting but are not fixed together.In routine techniques, normally certain thickness gold solves through plating in the corresponding position of printed circuit board (PCB).
Proposed on printed circuit board (PCB), to carry out the carbon oil printing and substituted expensive craft of gilding, in order to practice thrift cost.The principle of carbon oil typography is that electric conductive carbon printing is passed through the silk screen figure, is being screen-printed under the certain function power on the surface of printed circuit board (PCB) (PCB), through behind the high-temperature baking, the carbon film figure is solidificated on the PCB surface, to meet customer need.The seal carbon oil is meant the employing screen printing technique, stamps carbon oil in the position of pcb board appointment, behind oven for solidifying test OK, forms the qualified carbon film with certain resistance and replaces original resistive element, has excellent conducting performance,
The main component of carbon oil is a carbon, and it has conductivity and non-oxidizability, can replace the gold of institute's plating in the prior art,
But the pcb board key position of producing at present all is being difficult on hardness and the abrasion resistance reach more than 4,000,000 testing times, and key position is easy to pierced through by the button point.And for the pcb board that the thick requirement of copper is arranged, after accomplishing the carbon oil printing, key position is easy to generate the edge and reveals copper, thereby influences outward appearance.
Summary of the invention
In view of this, the objective of the invention is to propose a kind of printed circuit board (PCB) and preparation method thereof, in order to the problem that solves key position dew copper and be prone to be pierced, thus the quality of raising printed circuit board (PCB).
Based on above-mentioned purpose, the present invention provides a kind of manufacture method of printed circuit board (PCB), and said manufacture method comprises the step of twice silk screen printing carbon oil: 1) to the one side silk screen printing carbon oil of printed circuit board (PCB), bake plate then; 2) again this face is carried out the silk screen printing carbon oil, bake plate then.
Alternatively, the step of said twice silk screen printing carbon oil comprises: behind the carbon oil of silk screen printing printed circuit board (PCB), bake plate, roasting plate temperature is about 130 ~ 150 ℃, time and is about 10 ~ 15 minutes; Again this face is carried out the silk screen printing carbon oil, bake plate then, roasting plate temperature is about 130 ~ 150 ℃, time and is about 25 ~ 30 minutes.
Preferably, said manufacture method may further comprise the steps:
1) opens material: copper-clad plate is cut to required size with driving the material plate shearing machine; Then oil removing, little erosion, pickling, hot blast drying are carried out in said copper-clad plate, then carry out image transfer, circuit etching and melanism;
2) boring: after the copper-clad plate after the melanism is range upon range of, the pressing, hole in the copper-clad plate that layer closes with drilling machine, with the copper-clad plate of each layer of conducting;
3) heavy copper thickening: the hole wall copper facing after the method for use electroless copper plating will be holed, use galvanoplastic that hole wall copper facing is thickeied then;
4) graphic making: in coated feel luminescent material in the copper-clad plate of heavy copper thickening, utilize mask to carry out the selectivity exposure, form needed line pattern; Remove the photosensitive material of unexposed portion, so that the copper of this part exposes;
5) graphic plating: use plating mode, on the copper that exposes, thicken copper facing, on copper, plate resist layer after the copper facing again;
6) striping etching: remaining photosensitive material is removed on the surface with said copper-clad plate, exposes unwanted copper, then uses strong oxidizing property reagent that said unwanted copper is removed;
7) the resistance weldering is made: to the surface screen-printed solder resist of said copper-clad plate, said solder resist uses the exposure of mask selectivity after baking in advance, and the position film dwindles film exposure than the circuit film; To need the resistance weldering of welding position to develop to fall then with alkalescent liquid medicine;
8) solidify the back: the printed circuit board (PCB) that will be formed with resistance weldering meter places the high temperature baking oven to toast, to increase the adhesion of solder resist and copper interlayer;
9) surface treatment: printed circuit board (PCB) is sprayed tin, turmeric and be coated with the surface treatment that organizational security welds film at welding region;
10) silk screen printing character: with half tone silk screen printing one deck thermo-cured ink on the surface of printed circuit board (PCB);
11) twice carbon oil of silk screen printing: to the one side silk screen printing carbon oil of printed circuit board (PCB), bake plate then, roasting plate temperature is about 130 ~ 150 ℃, time and is about 10 ~ 15 minutes; Again this face is carried out the silk screen printing carbon oil, bake plate then, roasting plate temperature is about 130 ~ 150 ℃, time and is about 25 ~ 30 minutes;
12) external form processing: the printed circuit board behind the silk-screen carbon oil is cut out the shape that needs;
13) test: each internetwork electric property on the test board;
14) product inspection: the outward appearance of visual plate, warehousing after passing.
Preferably, also comprise the solarization net in the step of twice carbon oil of said silk screen printing, said solarization net comprises the steps:
Block glue is scraped with the silk-screen scraper in the place that on silk screen, is not covered by photosensitive material, and dry, be positioned over then and carry out exposure on the exposure machine, and the carbon oil conduction button position carbon oil film strengthens film exposure.
The present invention also provides a kind of printed circuit board (PCB) that obtains of making according to said method.
Saidly can find out that the manufacture method of printed circuit board (PCB) provided by the invention adopts silk screen printing carbon oil flow process twice, has solved the hardness and the abrasion resistance problem of printed circuit board (PCB) key position from top; The printed circuit board (PCB) that obtains according to above-mentioned manufacture method can satisfy the thickness requirement more than 4,000,000 testing times, thereby makes key position be not easy to be pierced through by key head.And the position film dwindles film exposure than the circuit film during silk screen printing resistance weldering, can tamp the difference gap between resistance weldering and the carbon oil conduction button position; Printing is during carbon oil, and the carbon oil conduction button position carbon oil film strengthens film exposure, then when follow-up silk screen printing carbon oil the weldering of the resistance on button position lid position, produce and produce the quality problem of revealing copper thereby can solve the button position.
Embodiment
For making the object of the invention, technical scheme and advantage clearer, below in conjunction with specific embodiment, to further explain of the present invention.
The manufacture method of printed circuit board (PCB) provided by the invention comprises:
1) opens material: copper-clad plate is cut to required size with driving the material plate shearing machine; Then oil removing, little erosion, pickling, hot blast drying are carried out in said copper-clad plate, then carry out image transfer, circuit etching and melanism;
2) boring: after the copper-clad plate after the melanism is range upon range of, the pressing, hole in the copper-clad plate that layer closes with drilling machine, with the copper-clad plate of each layer of conducting;
3) heavy copper thickening: the hole wall copper facing after the method for use electroless copper plating will be holed, use galvanoplastic that hole wall copper facing is thickeied then;
4) graphic making: in coated feel luminescent material in the copper-clad plate of heavy copper thickening, utilize mask to carry out the selectivity exposure, form needed line pattern; Remove the photosensitive material of unexposed portion, so that the copper of this part exposes;
5) graphic plating: use plating mode, on the copper that exposes, thicken copper facing, on copper, plate resist layer after the copper facing again;
6) striping etching: remaining photosensitive material is removed on the surface with said copper-clad plate, exposes unwanted copper, then uses strong oxidizing property reagent that said unwanted copper is removed;
7) the resistance weldering is made: to the surface screen-printed solder resist of said copper-clad plate, said solder resist uses the exposure of mask selectivity after baking in advance, and the position film dwindles film exposure than the circuit film; To need the resistance weldering of welding position to develop to fall then with alkalescent liquid medicine;
8) solidify the back: the printed circuit board (PCB) that will be formed with resistance weldering meter places the high temperature baking oven to toast, to increase the adhesion of solder resist and copper interlayer;
9) surface treatment: printed circuit board (PCB) is sprayed tin, turmeric and be coated with the surface treatment that organizational security welds film at welding region;
10) silk screen printing character: with half tone silk screen printing one deck thermo-cured ink on the surface of printed circuit board (PCB);
11) twice carbon oil of silk screen printing:
A. shine net: the place that on silk screen, is not covered by photosensitive material, scrape block glue (blue oil) with the silk-screen scraper, and dry, be positioned over then and carry out exposure on the exposure machine, and the carbon oil conduction button position carbon oil film strengthens film exposure;
B. select the carbon oil model according to requirement of client; Whether whether the inspection half tone has the leakage of oil point, have the photoresists of carbon oil graph area defective and place under repair such as not rinse well; The carbon oil jar is opened, and with transferring oily cutter to stir, the about 30min of mixing time stirs the static about 15min in back and can be used for producing; The cleaning half tone is promptly with the rubbish on the sticking half tone of binding dust rumble; The carbon oil half tone is installed to fixing and locking on the screen process press, seal half tone frame and non-graph area with transparent adhesive tape again, prevent carburizing oil; Regulate the net distance, net is apart from being controlled at about 3 ~ 5mm; Regulate half tone contraposition accuracy, promptly use the adjusting knob on the silk screen printing platform, before and after regulating respectively, about and rotary knob, make on half tone figure and the pcb board face pattern alignment and lock;
C. the carbon oil that stirs is poured on non-graph area on the half tone, with scraper and make scraper and half tone has a certain degree and scrapes trial production, root a tree name printing effect is finely tuned again; Behind the carbon oil of silk screen printing printed circuit board (PCB), bake plate, roasting plate temperature is about 150 ℃, time and is about 10 ~ 15min; Again this face is carried out the silk screen printing carbon oil, bake plate then, roasting plate temperature is about 150 ℃, time and is about 25 ~ 30min;
D. produce as a trial qualified after, earlier the first plate of seal confirms to have or not carbon oil short circuit, carbon oil position to leak bad defectives such as copper and carbon oil pin hole for the quality personnel, confirms that by the quality personnel first plate just can manufacture after qualified;
12) external form processing: the printed circuit board (PCB) behind the silk screen printing carbon oil is cut out the shape that needs;
13) test: each internetwork electric property on the test board;
14) product inspection: the outward appearance of visual plate, warehousing after passing.
The present invention also provides a kind of printed circuit board (PCB) that obtains of making according to said method.
Saidly can find out from top; The manufacture method of a kind of printed circuit board (PCB) provided by the invention; Adopt silk screen printing carbon oil flow process twice; And the temperature of twice roasting plate is all inconsistent, has improved the thickness and the uniformity of carbon oil, has solved the hardness and the abrasion resistance problem of printed circuit board (PCB) key position; The printed circuit board (PCB) that obtains according to above-mentioned manufacture method can satisfy the thickness requirement more than 4,000,000 testing times, thereby makes key position be not easy to be pierced through by key head.
And the position film dwindles film exposure than the circuit film during silk screen printing resistance weldering, can tamp the difference gap between resistance weldering and the carbon oil conduction button position; Printing is during carbon oil, and the carbon oil conduction button position carbon oil film strengthens film exposure, then when follow-up silk screen printing carbon oil the weldering of the resistance on button position lid position, can effectively solve the quality problem that copper is revealed in the button position.
The those of ordinary skill in affiliated field is to be understood that: the above is merely specific embodiment of the present invention; Be not limited to the present invention; All within spirit of the present invention and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. the manufacture method of a printed circuit board (PCB) is characterized in that, said manufacture method comprises the step of twice silk screen printing carbon oil: 1) to the one side silk screen printing carbon oil of printed circuit board (PCB), bake plate then; 2) again this face is carried out the silk screen printing carbon oil, bake plate then.
2. the manufacture method of printed circuit board (PCB) according to claim 1; It is characterized in that; The step of said twice silk screen printing carbon oil comprises: behind the carbon oil of silk screen printing printed circuit board (PCB), bake plate, roasting plate temperature is that 130 ~ 150 ℃, time are 10 ~ 15 minutes; Again this face is carried out the silk screen printing carbon oil, bake plate then, roasting plate temperature is that 130 ~ 150 ℃, time are 25 ~ 30 minutes.
3. the manufacture method of printed circuit board (PCB) according to claim 2 is characterized in that, said manufacture method may further comprise the steps:
1) opens material: copper-clad plate is cut to required size with driving the material plate shearing machine; Then oil removing, little erosion, pickling, hot blast drying are carried out in said copper-clad plate, then carry out image transfer, circuit etching and melanism;
2) boring: will deceive/copper-clad plate after the brown is range upon range of, after the pressing, hole in the copper-clad plate that layer closes with drilling machine, with the copper-clad plate of each layer of conducting;
3) heavy copper thickening: the hole wall copper facing after the method for use electroless copper plating will be holed, use galvanoplastic that hole wall copper facing is thickeied then;
4) graphic making: in coated feel luminescent material in the copper-clad plate of heavy copper thickening, utilize mask to carry out the selectivity exposure, form needed line pattern; Remove the photosensitive material of unexposed portion, so that the copper of this part exposes;
5) graphic plating: use plating mode, on the copper that exposes, thicken copper facing, on copper, plate resist layer after the copper facing again;
6) striping etching: remaining photosensitive material is removed on the surface with said copper-clad plate, exposes unwanted copper, then uses strong oxidizing property reagent that said unwanted copper is removed;
7) the resistance weldering is made: to the surface screen-printed solder resist of said copper-clad plate, said solder resist uses the exposure of mask selectivity after baking in advance, and the position film dwindles film exposure than the circuit film; To need the resistance weldering of welding position to develop to fall then with alkalescent liquid medicine;
8) solidify the back: the printed circuit board (PCB) that will be formed with resistance weldering meter places the high temperature baking oven to toast, to increase the adhesion of solder resist and copper interlayer;
9) surface treatment: printed circuit board (PCB) is sprayed tin, turmeric and be coated with the surface treatment that organizational security welds film at welding region;
10) silk screen printing character: with half tone silk screen printing one deck thermo-cured ink on the surface of printed circuit board (PCB);
11) twice carbon oil of silk screen printing: to the one side silk screen printing carbon oil of printed circuit board (PCB), bake plate then, roasting plate temperature is that 130 ~ 150 ℃, time are 10 ~ 15 minutes; Again this face is carried out the silk screen printing carbon oil, bake plate then, roasting plate temperature is that 130 ~ 150 ℃, time are 25 ~ 30 minutes;
12) external form processing: the printed circuit board behind the silk-screen carbon oil is cut out the shape that needs;
13) test: each internetwork electric property on the test board;
14) product inspection: the outward appearance of visual plate, warehousing after passing.
4. the manufacture method of printed circuit board (PCB) according to claim 3 is characterized in that, also comprises the solarization net in the step of twice carbon oil of said silk screen printing, and said solarization net comprises the steps:
Block glue is scraped with the silk-screen scraper in the place that on silk screen, is not covered by photosensitive material, and dry, be positioned over then and carry out exposure on the exposure machine, and the carbon oil conduction button position carbon oil film strengthens film exposure.
5. a printed circuit board (PCB) is characterized in that, said printed circuit board (PCB) makes according to the manufacture method of any described printed circuit board (PCB) of claim 1 ~ 4.
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| CN201210308061.5A CN102802363B (en) | 2012-08-27 | 2012-08-27 | Printed circuit board and manufacturing method thereof |
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| CN201210308061.5A CN102802363B (en) | 2012-08-27 | 2012-08-27 | Printed circuit board and manufacturing method thereof |
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| CN102802363B CN102802363B (en) | 2015-05-20 |
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| CN103017669A (en) * | 2012-12-07 | 2013-04-03 | 惠州中京电子科技股份有限公司 | Method for detecting thicknesses of welding resistant layer of printed circuit board (PCB) |
| CN103607848A (en) * | 2013-11-27 | 2014-02-26 | 广东成德电路股份有限公司 | Method for improving solder resist alignment accuracy of printed-circuit board |
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
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| CN103017669A (en) * | 2012-12-07 | 2013-04-03 | 惠州中京电子科技股份有限公司 | Method for detecting thicknesses of welding resistant layer of printed circuit board (PCB) |
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| CN104284528A (en) * | 2013-07-02 | 2015-01-14 | 深南电路有限公司 | Machining method of printed circuit board back drill |
| CN104519671A (en) * | 2013-09-26 | 2015-04-15 | 深圳崇达多层线路板有限公司 | Carbon ink PCB and manufacturing method thereof |
| CN104519671B (en) * | 2013-09-26 | 2017-12-22 | 深圳崇达多层线路板有限公司 | Carbon oil pcb board and preparation method thereof |
| CN103607848A (en) * | 2013-11-27 | 2014-02-26 | 广东成德电路股份有限公司 | Method for improving solder resist alignment accuracy of printed-circuit board |
| CN103906362B (en) * | 2014-02-28 | 2017-02-15 | 双鸿电子(惠州)有限公司 | Mobile phone capacitive screen flexible printed circuit board manufacturing method |
| CN103997860B (en) * | 2014-04-23 | 2017-04-12 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
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| CN104902672A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Circuit board having board edge structure and preparation method thereof |
| WO2017152509A1 (en) * | 2016-03-08 | 2017-09-14 | 意力(广州)电子科技有限公司 | Lap joint process of frame area circuit and window area circuit, and touch screen |
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| CN106346948A (en) * | 2016-08-30 | 2017-01-25 | 江阴鑫辉太阳能有限公司 | Method for prolonging service life of solar cell screen printing plate |
| CN106686895A (en) * | 2016-12-30 | 2017-05-17 | 昆山元茂电子科技有限公司 | Surface treatment method for printed circuit board |
| CN107027240A (en) * | 2017-05-09 | 2017-08-08 | 东莞福哥电子有限公司 | A kind of high resistance carbon film wiring board and its manufacture method |
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