CN105376954B - A kind of firmly golden faces of battery PCB prevent the method for wiping flower - Google Patents
A kind of firmly golden faces of battery PCB prevent the method for wiping flower Download PDFInfo
- Publication number
- CN105376954B CN105376954B CN201510772780.6A CN201510772780A CN105376954B CN 105376954 B CN105376954 B CN 105376954B CN 201510772780 A CN201510772780 A CN 201510772780A CN 105376954 B CN105376954 B CN 105376954B
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- CN
- China
- Prior art keywords
- pcb
- battery pcb
- gold
- blue glue
- battery
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Abstract
The invention discloses a kind of firmly golden faces of battery PCB to prevent the method for wiping flower, including step：Electric hard gold；Etching；AOI；Welding resistance；Character；Test；The blue glue of print；Molding；Final inspection.The present invention carries out printing blue glue processing after a test, before molding to battery PCB, and the plate face of battery PCB is made to pass through peelable blue glue and is protected, even if the plate face of battery PCB will not be injured by carrying out stamping by high tonnage punching machine in forming process.And the blue glue of the present invention can not interfere with the quality of battery PCB after molding and final inspection by manual stripping.Compared with prior art, the battery PCB made of present invention process wipes flower fraction defective and drops to existing 0.53% by original 8.7%, so as to which the quality for substantially increasing product reduces the production cost of product.
Description
Technical field：
The invention belongs to printed wiring board manufacturing technology fields, and in particular to be that a kind of firmly golden faces of battery PCB prevent from wiping
Colored method.
Background technology：
The appearance requirement of battery PCB is very strict, is not allow for a little wiping flower, otherwise will influence activation signal, cause
It is abnormal using the product of battery, and in order to avoid the appearance of battery PCB wipes flower problem, it usually needs using the hard gold process of electricity to electricity
Pond PCB is protected, to promote properties of product.
Current battery PCB is needed after electric hard gold by " etching → AOI → welding resistance → character → test → molding " six
The flow of process makes and transhipment, and battery PCB does not flow in different lines in transport process, and battery PCB is firmly golden in order to prevent
Wipe the problem of flower in face, it will usually partition board be carried out using blank sheet of paper film or pearl cotton etc. between battery PCB.
But during actual battery PCB is molding, since the molding mode of battery PCB generally uses is stamping, and
Stamping is using high tonnage punching machine（80T-160T）If blank sheet of paper film when onboard, is easily forced in blanking process
Hinder plate face；Can be with partition board although pearl cotton is more soft, punching machine, which is worked continuously, during stamping can generate high fever, can make pearl
Cotton fusing adherency plate face, causes PCB to pollute, therefore can not be in plate interval blank sheet of paper, pearl cotton and film.
It follows that in the molding processes of battery PCB, it can not be in a manner that blank sheet of paper film or pearl cotton etc. carry out partition board
To prevent the problem of battery plate face wipes flower；And during the flow use before battery PCB moldings, using blank sheet of paper film or
The problems such as partition boards such as pearl cotton tool also can be because of material purity, cleanliness factor leads to the wiping flower problem in the firmly golden faces of battery PCB.
Invention content：
For this purpose, flow making and transport process are carried out after electric hard gold the purpose of the present invention is to provide a kind of battery PCB
In, prevent the firmly golden faces of battery PCB from wiping colored method.
To achieve the above object, the present invention mainly adopts the following technical scheme that：
A kind of firmly golden faces of battery PCB prevent the method for wiping flower, including step：
Electric hard gold；Etching；AOI；Welding resistance；Character；Test；Molding；Final inspection.
Further, it also needs to that battery PCB is carried out to print blue glue processing after a test, before molding.
Further, it is further included after final inspection and tears blue glue processing.
Further, it is hard by the plating last layer for being electrolysed thick golden liquid medicine in the pad face of battery PCB after the hard gold of the electricity
Gold.
Further, the hard gold of the electricity includes pickling, electronickelling, pre- gold-plated, plating gold cobalt alloy.
Further, the etching includes etching away in the lead that battery PCB is generated after electric hard gold.
Further, the blue glue processing of the print includes：Net is shone according to thick carat (measure of the purity of gold) figure using 18T silk-screens grenadine and makes networking
Version, recycle silk-screen with hardness be 60HV scraper and 5-8KG/ square centimeters of pressure silk-screen indigo plant glue.
Further, the blue glue is the peelable blue glue of model SD-2952.
The present invention carries out printing blue glue processing after a test, before molding to battery PCB, passes through the plate face of battery PCB
Peelable indigo plant glue is protected, even if carrying out stamping by high tonnage punching machine in forming process will not injure battery PCB's
Plate face.And the blue glue of the present invention can not interfere with the quality of battery PCB after molding and final inspection by manual stripping.
Compared with prior art, the battery PCB made of present invention process, wiping flower fraction defective are dropped to existing by original 8.7%
0.53%, so as to which the quality for substantially increasing product reduces the production cost of product.
Specific embodiment：
To illustrate the thought and purpose of the present invention, below in conjunction with specific embodiment, the present invention is described further.
There is plate face wiping flower during process operations after electric hard gold and leads to the problem of polishing scratch in battery PCB in order to prevent,
The present invention by after battery PCB tests, increase by one layer of blue compound protective layer, indigo plant glue guarantor's layer shell before molding on pcb board face
The problems such as wiping in the effectively hard golden face of prevention is colored in the forming process of battery PCB and rubs.
To achieve these goals, present embodiments providing a kind of firmly golden faces of battery PCB prevents the method for wiping flower, specific
Include the following steps：
Electric hard gold：It is firmly golden by way of being electrolysed thick golden liquid medicine last layer to be electroplated on PCB pads face（Containing cobalt）, to ensure
Subsequently use plug abrasion resistance.Electric hard metal is hard golden and soft for electroplating mild alloy in a kind of mode of electroplating gold
This layer golden composition of the gold difference lies in last plating up, can select plating proof gold or alloy when gold-plated, because
Pure gold hardness is softer, so being also just referred to as soft gold, if selection plating nickel alloy or gold cobalt alloy, because alloy ratio is pure
It is golden hard, so being also just referred to as hard gold.And the plating by using in this present embodiment is hard golden for alloy, so hardness is harder,
It is suitable for use in needing the place of stress friction, is suitble to the use of battery PCB.And the mode that hard gold is electroplated is mainly as follows：Pickling →
Electronickelling → pre- gold-plated → electroplating gold nickel or gold cobalt alloy.
Etching：Since electric hard gold thickeies gold for part, lead is needed to be connected in electrolytic process, and drawing after the completion of being electrolysed
Line is not required in battery PCB, it is therefore desirable to use etchant flow to remove lead.It mainly will be without dry using etching solution
The lead etching solution of film protection dissolves, and other are then left by the line pattern that dry film is protected.
AOI（Automatic Optical Inspection, automatic optics inspection）：Circuit file first is called in AOI to set
It is standby, it is then made comparisons by AOI device scans material object printed line road with the simulation files in equipment, finds out different position, i.e.,
Find out shortcoming position.
Welding resistance：One layer of wet film and cure in the surface silk-screen of pcb board or coating, during preventing PCB from welding at non-solder
Short circuit plays insulating effect.Welding resistance is commonly called as " green oil ", and purpose includes anti-welding, backplate and insulation.It is anti-welding predominantly to reserve on plate
Pad and welding hole, all circuits and copper face are all covered using ink, to prevent wave-soldering when causes short circuit, and save
The dosage of scolding tin.Backplate mainly prevents the infringement of moisture and various electrolyte from circuit being made to aoxidize and endanger electric property, and prevent
Only the mechanical wounding of outer Come is to maintain the good insulation of plate face.Insulation is then since plank line width is away from more and more thin, therefore between conductor
Insulation Problems day shape highlight, also increase solder mask insulation performance importance.
And the concrete technology of welding resistance includes：Pre-treatment, the first face of printing, prebake conditions, the second face of printing, prebake conditions, exposure
Light, development, curing.Pre-treatment mainly removes the oxide of PCB surface, increases the roughness of plate face by volcanic ash, strengthens
The ink adhesion of plate face.Ink is mainly printed on plank by printing using silk screen, and prebake conditions are then partially desiccated ink
Interior solvent, hardens ink portions, will not when being exposed sticky end piece.Exposure imaging mainly realizes shadow by exposure machine
As transfer；Development is then to get rid of unpolymerized photosensitive-ink.Curing is mainly by high-temperature baking by the epoxy in ink
Resin thoroughly hardens.
Character：In PCB surface silk-screen character, component mark when being welded to follow-up PCB patches is provided and is distinguished.Silk-screen character
Ink correspondence is onboard formed into character mainly by way of silk-screen printing, in order to subsequently identify differentiation and repair.
Test：Detect the conduction property of PCB product, it is ensured that product is without opening short circuit problem.
The blue glue of print：Net is shone according to thick carat (measure of the purity of gold) figure using 18T silk-screens grenadine and is fabricated to halftone, recycling silk-screen is with hardness
The pressure silk-screen indigo plant glue of the scraper and 5-8KG/ of 60HV square centimeter.It is flat after the completion of silk-screen that battery PCB is placed in thousand layer frames, and
It is placed in oven and is kept for 150 DEG C toast 50 minutes.
Blue glue is peelable blue glue in the present embodiment, model SD-2952, and appearance is blue paste liquid, viscosity
For 200-400Ps (20 DEG C, 10rpm）；Solid content>90%.Then its occupation mode controls 130 DEG C admittedly first to stir 10 ~ 15mi
Change 10 ~ 15min, printed on battery PCB using 200 mesh polyester nets or stainless steel cloth later.It is peelable in the present embodiment
Be the viscous silk fabric shape ink of blue from blue glue, it is main the characteristics of be exactly that can easily be removed with hand or tool after application, and
Residue face on the substrate is not had.
In addition, the thickness of blue glue can be adjusted by scraper pressure in the present embodiment, silk-screen indigo plant glue does not need to be too thick, too
Gap during thickness molding between plate and mold is big, unbalance stress, and too thin personnel are not easy to operate when rear process tears blue glue.
Molding：The PCB product of bulk is processed into the shape of client's needs by the way of numerically-controlled machine tool or punching machine.
Final inspection：It by 100% visual inspection plate open defect, and places under repair to light defects, avoids problematic and defect plate
Part flows out.
Tear blue glue：Pattern after molding before shipment using handwork tears blue glue.
It is that firmly golden face prevents the method for wiping flower from having carried out detailed Jie to a kind of battery PCB provided by the present invention above
It continues, specific case used herein is expounded the structural principle and embodiment of the present invention, and above example is
It is used to help understand the method and its core concept of the present invention；Meanwhile for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in specific embodiments and applications, in conclusion the content of the present specification should not be understood
For limitation of the present invention.
Claims (1)
1. a kind of firmly golden faces of battery PCB prevent the method for wiping flower, which is characterized in that including step：
Electric hard gold：It is electroplated by way of being electrolysed thick golden liquid medicine that last layer is firmly golden on PCB pads face, wherein the side of the hard gold of plating
Formula is as follows：Pickling → electronickelling → pre- gold-plated → electroplating gold nickel or gold cobalt alloy；
Etching：The lead that no dry film is protected is dissolved using etching solution, and other are then stayed by the line pattern that dry film is protected
Under；
AOI：Circuit file is first called in into AOI equipment, then passes through the simulation in AOI device scans material object printed line road and equipment
File is made comparisons, and finds out different position, that is, finds out shortcoming position；
Welding resistance：One layer of wet film and cure in the surface silk-screen of pcb board or coating, during preventing PCB from welding with short circuit at non-solder,
Play insulating effect；The concrete technology of wherein welding resistance includes：Pre-treatment, the first face of printing, prebake conditions, the second face of printing, preliminary drying
Roasting, exposure, development, curing；
Character：In PCB surface silk-screen character, component mark when being welded to follow-up PCB patches is provided and is distinguished；
Test：Detect the conduction property of PCB product, it is ensured that product is without opening short circuit problem；
The blue glue of print：Net is shone according to thick carat (measure of the purity of gold) figure using 18T silk-screens grenadine and is fabricated to halftone, recycling silk-screen is 60HV's with hardness
Battery PCB is lain in thousand layer frames, is placed in baking by scraper and 5-8KG/ square centimeters of pressure silk-screen indigo plant glue, silk-screen after the completion
150 DEG C are kept in case to toast 50 minutes；Wherein described blue glue is peelable blue glue, and appearance is blue paste liquid, viscosity
200-400Pa.s ；Solid content>90%, then occupation mode controls 130 DEG C of 10 ~ 15min of curing first to stir 10 ~ 15min,
It is printed on battery PCB using 200 mesh polyester nets or stainless steel cloth later；
Molding：The PCB product of bulk is processed into the shape of client's needs by the way of numerically-controlled machine tool or punching machine；
Final inspection：It by 100% visual inspection plate open defect, and places under repair to light defects, avoids problematic and defect plate stream
Go out；
Tear blue glue：Pattern after molding before shipment using handwork tears blue glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772780.6A CN105376954B (en) | 2015-11-12 | 2015-11-12 | A kind of firmly golden faces of battery PCB prevent the method for wiping flower |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772780.6A CN105376954B (en) | 2015-11-12 | 2015-11-12 | A kind of firmly golden faces of battery PCB prevent the method for wiping flower |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105376954A CN105376954A (en) | 2016-03-02 |
| CN105376954B true CN105376954B (en) | 2018-06-22 |
Family
ID=55378631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510772780.6A Expired - Fee Related CN105376954B (en) | 2015-11-12 | 2015-11-12 | A kind of firmly golden faces of battery PCB prevent the method for wiping flower |
Country Status (1)
| Country | Link |
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| CN (1) | CN105376954B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617106A (en) * | 2018-04-24 | 2018-10-02 | 昆山大洋电路板有限公司 | A kind of complete golden face sheet copper protective film processing method |
| CN113766762A (en) * | 2021-06-01 | 2021-12-07 | 奥士康科技股份有限公司 | Method for preventing gold surface from being scratched and scratched |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234734A (en) * | 2006-02-28 | 2007-09-13 | Fujikura Ltd | Flexible printed circuit and its production process |
| CN103002661A (en) * | 2012-09-19 | 2013-03-27 | 胜宏科技（惠州）股份有限公司 | Post production process of thin panels |
| CN104507257A (en) * | 2014-12-11 | 2015-04-08 | 江门崇达电路技术有限公司 | Printed circuit board (PCB) molding method |
| CN105050330A (en) * | 2015-07-02 | 2015-11-11 | 江门崇达电路技术有限公司 | Method for manufacturing thickened silk printing plate and method for silk printing blue gel by using thickened silk printing plate |
-
2015
- 2015-11-12 CN CN201510772780.6A patent/CN105376954B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234734A (en) * | 2006-02-28 | 2007-09-13 | Fujikura Ltd | Flexible printed circuit and its production process |
| CN103002661A (en) * | 2012-09-19 | 2013-03-27 | 胜宏科技（惠州）股份有限公司 | Post production process of thin panels |
| CN104507257A (en) * | 2014-12-11 | 2015-04-08 | 江门崇达电路技术有限公司 | Printed circuit board (PCB) molding method |
| CN105050330A (en) * | 2015-07-02 | 2015-11-11 | 江门崇达电路技术有限公司 | Method for manufacturing thickened silk printing plate and method for silk printing blue gel by using thickened silk printing plate |
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| Publication number | Publication date |
|---|---|
| CN105376954A (en) | 2016-03-02 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Gao Tuanfen Inventor after: Jiang Yanping Inventor after: An Guoyi Inventor before: Gao Tuanfen |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180622 Termination date: 20181112 |