CN106817849A - A kind of thick copper plate solder resistance process - Google Patents
A kind of thick copper plate solder resistance process Download PDFInfo
- Publication number
- CN106817849A CN106817849A CN201510847687.7A CN201510847687A CN106817849A CN 106817849 A CN106817849 A CN 106817849A CN 201510847687 A CN201510847687 A CN 201510847687A CN 106817849 A CN106817849 A CN 106817849A
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- thick copper
- minutes
- printing
- copper coin
- ink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of thick copper plate solder resistance process, its technological process is as follows：1）After carrying out pre-treatment to thick copper coin, the prebake conditions 5 to 8 minutes under the conditions of 68 DEG C to 70 DEG C stand 20-30 minutes；2）After carrying out the first printing to thick copper coin, after standing 10-15 minute, it is pre-baked 5-8 minutes to carry out first time under the conditions of 68 DEG C to 70 DEG C, then stands 10-15 minutes；3）After carrying out the second printing to thick copper coin, 10-20 minutes is stood, carried out under the conditions of 70 DEG C to 72 DEG C pre-baked 25-30 minutes for the second time；4）After standing 10-15 minutes, thick copper coin aligned successively, is exposed, being developed, being checked, solidify afterwards.Solder resistance process of the invention is except printing and pre-baked operation are by addition to twice, remaining operation only needs once complete so that overall anti-welding flow shortening, and this is allowed for, and technological process is simple, process cycle is short, is conducive to cost-effective.
Description
Technical field
The present invention relates to manufacturing process for printed circuit board technical field, more particularly to a kind of thick copper plate solder resistance process.
Background technology
, it is necessary to being directed to thick copper coin carries out anti-welding treatment during print circuit plates making, to reach following purpose：
1st, prevent between conductor line because of moisture, the different degrees of short circuit that chemicals etc. is led to；
2nd, the open circuit caused by malfunction during production and assembling element is prevented；
3rd, the tin sticky of conductor part position is prevented；
4th, printed board circuit and various humitures, acid-base environment insulation, to ensure the good electrical function of printed wiring board are made.
In order to ensure anti-welding quality, current solder resistance process is carried out by the way of twice anti-welding flow is repeated, and basic procedure is：
First time pre-treatment → printing → pre-baked → contraposition → exposure → development → inspection → solidification；
Second pre-treatment → printing → pre-baked → contraposition → exposure → development → inspection → solidification.
But using the flow make there is a problem of three it is particularly pertinent：
1st, the production cycle is long, causes productivity effect not catch up with.
2nd, flow need to be repeated twice, so causing production cost higher.
If the 3, not solidified after the completion of anti-welding flow for the first time, ink is easily attacked by solvent when anti-welding for the second time, the steadiness that influence welding resisting layer is combined with copper face and base material, if carrying out curing process, then because thick copper coin needs to be toasted since low temperature, time-consuming, such as causes bad plate to would become hard to move back and wash heavy industry in second anti-welding making, and quality aspect is particularly difficult to management and control.
The content of the invention
The present invention is to overcome the shortcomings of prior art described above, there is provided a kind of thick copper plate solder resistance process, and anti-welding treatment is carried out to thick copper coin using this technique, and flow is simple, process cycle is short, is conducive to the cost-effective and anti-welding quality of lifting.
The present invention is realized by following proposal：A kind of thick copper plate solder resistance process, its technological process is as follows：
1）, pre-treatment is carried out to thick copper coin after, the prebake conditions 5 to 8 minutes under the conditions of 68 °C to 70 °C, stand 20-30 minutes；
2）, the first printing is carried out to thick copper coin after, after standing 10-15 minute, it is pre-baked 5-8 minutes to carry out first time under the conditions of 68 °C to 70 °C, then stands 10-15 minutes；
3）, the second printing is carried out to thick copper coin after, stand 10-20 minute, carried out under the conditions of 70 °C to 72 °C for the second time it is pre-baked 25-30 minutes；
4）, stand 10-15 minutes after, thick copper coin aligned successively, exposed, being developed, being checked, solidify afterwards.
Anti-welding treatment is carried out to thick copper coin using present invention process, compared with twice solder resistance process of anti-welding flow using repetition conventional at present, one of innovative point is except printing and pre-baked operation are by addition to twice, remaining operation is completed by only needing once, so that overall anti-welding flow shortens, this allows for that technological process is simple, process cycle is short, is conducive to cost-effective.
Another innovative point of present invention process is, after pre-treatment being carried out to thick copper coin, prebake conditions are carried out under the conditions of 68 °C to 70 °C of relative low temperature 5 to 8 minutes, 20-30 minutes is stood again, may be such that through the thick copper coin after pre-treatment, holding surface is dried before being printed after low temperature prebake conditions, it is ensured that thick copper coin surface remains without steam, to improve press quality.After thick copper coin is through pre-treatment, often easily there is residual moisture in the edge in plate face, if residual moisture is dealt carefully with, will influence press quality.Therefore, thick copper coin of the present invention process after 68 °C to 70 °C of relative low temperature is to pre-treatment carries out prebake conditions, easily there is residual moisture in the edge that can eliminate plate face, so that follow-up printing process is carried out in the case where no moisture is remained, can significantly improve press quality.Inventor has found that prebake conditions temperature preferably controls the relative low temperature condition at 68 °C to 70 °C, and prebake conditions time preferably to control at 5 to 8 minutes by research.Because often there is less residual moisture in the edge of plate face, the low temperature prebake conditions of short time can eliminate moisture, it is unlikely to cause plate face to expand in view of low temperature simultaneously, and it is then to consider that shortening process cycle is short that prebake conditions are controlled in 5 to 8 minutes clocks, improves anti-welding efficiency.Stand 20-30 minute, be in order that through prebake conditions thick copper coin plate face recovery normal temperature, to carry out the first printing to thick copper coin under normal temperature condition.
Step 2）In, after the first printing being carried out to thick copper coin, through standing 10-15 minutes, the bubble produced in ink printing process can effectively be eliminated, inventor tests by long term test and finds, by time of repose control at 10-15 minutes, can effectively eliminate bubble, be conducive to shortening anti-welding integrated artistic cycle is short again, improve efficiency.In addition, pre-baked 5-8 minutes for the first time to being carried out through the thick copper coin after the first printing under the conditions of 68 °C to 70 °C, this is the optimum temperature and time conditions that inventor draws by studying for a long period of time.Inventor is engaged in PCB manufacturings for many years, if it has been investigated that temperature pre-baked after the first printing is too high, pre-baked overlong time will cause plate face to expand, this is combined influence printing-ink with plate face, ink is even caused to be peeled off with plate face, press quality is influenceed, while the process that the second printing will be influenceed；If pre-baked temperature is too low, the time is short, it is unfavorable for that the abundant of ink is dried and solidified, while the quality that the second printing will be influenceed.Therefore, inventor emphasizes pre-baked 5-8 minutes for the first time to being carried out through the thick copper coin after the first printing under the conditions of 68 °C to 70 °C, allow for carrying out first time preexamination under the conditions of the temperature and time, can either the abundant of ink dry and solidify, printing-ink can be promoted to be combined with plate face again, it is to avoid cause ink and plate face stripping, lifting press quality, do not influence the process and quality of the second printing simultaneously, shorten the solder resistance process cycle, be conducive to cost-effective.After pre-baked for the first time again by thick copper coin stand 10-15 minute, be in order that thickness copper coin be thus capable of sufficiently recovering normal temperature, to carry out the second printing.
As a same reason, based on above-mentioned Consideration, step 3）In, after carrying out the second printing to thick copper coin, 10-20 minutes is stood, carried out under the conditions of 70 °C to 72 °C pre-baked 25-30 minutes for the second time.But step 3）In pre-baked temperature compared with step 2）High and time of repose and second pre-baked time are compared with step 2）It is long, because inventor considers, the first printing is the ink that layer is covered in plate face, the easy dry solidification of ink, and the second printing is that one layer of viscosity ink higher and thicker is covered on the basis of the first printing, therefore need higher temperature and long period to carry out pre-baked, enable the ink fully dry solidification of the second printing, and make the ink good combination printed twice.
Step 4）In, present invention innovation being aligned successively to thick copper coin, expose, develop, checking, before the subsequent handling such as solidify afterwards, standing 10-15 minutes.This is based on from the aspect of following two, on the one hand, by standing 10-15 minutes, it can be ensured that issuable bubble is thoroughly eliminated after printing twice, is conducive to shortening anti-welding integrated artistic cycle is short again, improves efficiency；On the other hand, it is in order that recover normal temperature through the thick copper coin plate face after the second printing, to thick copper coin aligned under normal temperature condition, exposing, develop, to check, the subsequent handling such as solidify afterwards.
By the discovery that studies for a long period of time, the viscosity of ink is preferably controlled within 100dpas the present inventor during the first printing, and dpas is ink viscosity unit.Because the characteristics of plate face of thick copper coin has copper thick, if viscosity is too high during the first printing, ink cannot be printed between easily causing circuit, press quality will be influenceed.And the purpose of the first printing is the ink that layer is covered in plate face, so ink viscosity control is conducive to forming relatively thin ink layer in plate face within 100dpas.Wherein, preferably the viscosity of ink is 50-100dpas.
To thicken welding resisting layer, the viscosity of ink is preferably controlled in 170-180dpas the second printing during second printing, in the second printing using the ink of viscosity higher, is conducive to making the ink good combination printed twice, lifts anti-welding quality.
After the second printing, carry out second pre-baked and after standing 10-15 minute, according to industry Normal practice, thick copper coin aligned successively, is exposed, developed, checked, solidify afterwards, you can completion solder resistance process of the invention.
Further, step 1）In, after the preceding treatment, before the first printing, consent is carried out using the ink of agent without dilution.In industry, the purpose that diluent is added in ink is adjustment ink viscosity, and ink is scratched onto working plate easily by silk screen when making printing, and diluent volatilizees completely after being baked, and ink will shrink after baking.The main purpose of consent is to fill up via between PCB layer using ink, generation baking after-contraction is caused the risk in crack by the ink plugging using addition diluent, in chemical treating process, liquid medicine can be dipped into the inside and sting pit copper by gap, and serious meeting causes via to be broken open circuit.The present inventor is utilized after the preceding treatment, before the first printing, consent is carried out using the ink of agent without dilution, and the ink after pre-baked can be avoided to shrink causes rabbet ink crack bad, can prevent the generation of above mentioned problem.
Compared with prior art, the invention has the advantages that：
1st, anti-welding treatment is carried out to thick copper coin using present invention process, the present invention is except printing and pre-baked operation are by addition to twice, remaining operation is completed by only needing once, compared with twice solder resistance process of anti-welding flow using repetition conventional at present, so that overall anti-welding flow shortens, this allows for that technological process is simple, process cycle is short, is conducive to cost-effective.
2nd, after the present invention carries out pre-treatment to thick copper coin, prebake conditions are carried out under the conditions of 50 °C to 60 °C of relative low temperature 3 to 5 minutes, 5-10 minutes is stood again, may be such that through the thick copper coin after pre-treatment, holding surface is dried before being printed after low temperature prebake conditions, ensure that thick copper coin surface remains without steam, to improve press quality.
3rd, in step 2）、3）In, after being printed at first and second time respectively, thick copper coin is stood in good time, bubble can be effectively eliminated, be conducive to shortening anti-welding integrated artistic cycle is short again, improve efficiency.Pre-baked temperature, time printed to first and second time simultaneously after are rationally set, can either the abundant of ink dry and solidify, the combination of printing-ink and plate face, printing-ink twice can be promoted again, avoid causing ink to be peeled off with plate face, lifting press quality, do not influence the process and quality of the second printing simultaneously, shorten the solder resistance process cycle, be conducive to cost-effective.
4th, the present invention being aligned successively to thick copper coin, expose, develop, checking, before the subsequent handling such as solidify afterwards, thick copper coin is stood in good time again, on the one hand issuable bubble is thoroughly eliminated after can ensure that printing twice, be conducive to shortening anti-welding integrated artistic cycle is short again, improve efficiency；On the other hand, it is in order that recover normal temperature through the thick copper coin plate face after the second printing, to thick copper coin aligned under normal temperature condition, exposing, develop, to check, the subsequent handling such as solidify afterwards, so as to shorten the anti-welding cycle, improve anti-welding quality.
5th, scientific offering is carried out by the viscosity for printing ink used twice, when enabling the first printing relatively thin ink layer is formed in plate face, thickening welding resisting layer can be formed during the second printing again, while being conducive to making the ink good combination printed twice, anti-welding quality is lifted.
Specific embodiment
With reference to embodiment, the present invention is described in further detail.
Embodiment 1
The present embodiment uses this thick copper plate solder resistance process to copper thickness for 2.5 ounces of thick copper coin carries out anti-welding making, and concrete technology flow process is as follows：
1）, using Normal practice, after carrying out the pre-treatments such as Chemical cleaning, polish-brush, cleaning and heated drying to thick copper coin, prebake conditions 5 minutes under the conditions of 68 °C, stand 20 minutes；
2）, the first printing is carried out to thick copper coin according to Normal practice after, after standing 10 minutes, carried out under the conditions of 68 °C pre-baked 5 minutes for the first time, then stand 10 minutes, wherein the first printing when ink viscosity be 50dpas；
3）, the second printing is carried out to thick copper coin according to Normal practice after, stand 10 minutes, second is carried out under the conditions of 70 °C pre-baked 25 minutes, wherein the second printing when ink viscosity be 170dpas；
4）, stand 10 minutes after, according to industry Normal practice, thick copper coin aligned successively, exposed, being developed, being checked, solidify afterwards, you being completed solder resistance process of the invention.
Detected to carrying out the thick copper coin that anti-welding making copper thickness is 2.5 ounces through the present embodiment thickness copper plate solder resistance process, as a result proved, anti-welding quality is good, ink is well combined with plate face, and the ink good combination printed twice, and flow is simple, process cycle is short, is conducive to cost-effective.
Embodiment 2
The present embodiment uses this thick copper plate solder resistance process to copper thickness for 5 ounces of thick copper coin carries out anti-welding making, concrete technology stream
Journey is as follows：
1）, using Normal practice, after carrying out the pre-treatments such as Chemical cleaning, polish-brush, cleaning and heated drying to thick copper coin, prebake conditions 8 minutes under the conditions of 70 °C, stand 30 minutes；
2）, the first printing is carried out to thick copper coin according to Normal practice after, after standing 15 minutes, carried out under the conditions of 70 °C pre-baked 8 minutes for the first time, then stand 15 minutes, wherein the first printing when ink viscosity be 100dpas；
3）, the second printing is carried out to thick copper coin according to Normal practice after, stand 20 minutes, second is carried out under the conditions of 72 °C pre-baked 30 minutes, wherein the second printing when ink viscosity be 180dpas；
4）, stand 15 minutes after, according to industry Normal practice, thick copper coin aligned successively, exposed, being developed, being checked, solidify afterwards, you being completed solder resistance process of the invention.
Above-mentioned steps 1）In, after the preceding treatment, before the first printing, consent is carried out using the ink of agent without dilution.
Detected to carrying out the thick copper coin that anti-welding making copper thickness is 2.5 ounces through the present embodiment thickness copper plate solder resistance process, as a result proved, anti-welding quality is good, ink is well combined with plate face, and the ink good combination printed twice, and flow is simple, process cycle is short, is conducive to cost-effective.
Claims (5)
1. a kind of thick copper plate solder resistance process, its technological process is as follows：
1）, pre-treatment is carried out to thick copper coin after, the prebake conditions 5 to 8 minutes under the conditions of 68 °C to 70 °C, stand 20-30 minutes；
2）, the first printing is carried out to thick copper coin after, after standing 10-15 minute, it is pre-baked 5-8 minutes to carry out first time under the conditions of 68 °C to 70 °C, then stands 10-15 minutes；
3）, the second printing is carried out to thick copper coin after, stand 10-20 minute, carried out under the conditions of 70 °C to 72 °C for the second time it is pre-baked 25-30 minutes；
4）, stand 10-15 minutes after, thick copper coin aligned successively, exposed, being developed, being checked, solidify afterwards.
2. the production method of thick copper plate solder resistance according to claim 1, it is characterised in that：The viscosity of ink is controlled within 100dpas during the first printing.
3. the production method of thick copper plate solder resistance according to claim 2, it is characterised in that：The viscosity of ink is 50-100dpas during the first printing.
4. the production method of thick copper plate solder resistance according to claim 1, it is characterised in that：The viscosity of ink is 170-180dpas during the second printing.
5. the production method of thick copper plate solder resistance according to claim 1, it is characterised in that：Step 1）In, after the preceding treatment, before the first printing, consent is carried out using the ink of agent without dilution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847687.7A CN106817849A (en) | 2015-11-30 | 2015-11-30 | A kind of thick copper plate solder resistance process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847687.7A CN106817849A (en) | 2015-11-30 | 2015-11-30 | A kind of thick copper plate solder resistance process |
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| CN106817849A true CN106817849A (en) | 2017-06-09 |
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| CN201510847687.7A Pending CN106817849A (en) | 2015-11-30 | 2015-11-30 | A kind of thick copper plate solder resistance process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110944456A (en) * | 2019-12-16 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board solder mask process |
| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
| CN113490339A (en) * | 2021-08-04 | 2021-10-08 | 东莞市若美电子科技有限公司 | Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product |
-
2015
- 2015-11-30 CN CN201510847687.7A patent/CN106817849A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
| CN110944456A (en) * | 2019-12-16 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board solder mask process |
| CN113490339A (en) * | 2021-08-04 | 2021-10-08 | 东莞市若美电子科技有限公司 | Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product |
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Application publication date: 20170609 |