CN104582319A - Metallized semi-hole forming method and printed circuit board manufacturing method - Google Patents
Metallized semi-hole forming method and printed circuit board manufacturing method Download PDFInfo
- Publication number
- CN104582319A CN104582319A CN201310492837.8A CN201310492837A CN104582319A CN 104582319 A CN104582319 A CN 104582319A CN 201310492837 A CN201310492837 A CN 201310492837A CN 104582319 A CN104582319 A CN 104582319A
- Authority
- CN
- China
- Prior art keywords
- metallized semi
- circuit board
- printed circuit
- forming method
- hole forming
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
Abstract
The invention provides a metallized semi-hole forming method and a printed circuit board manufacturing method, and belongs to the field of printed circuit boards. The metallized semi-hole forming method is applied to a manufacture process of a printed circuit board (PCB), and comprises the following steps: drilling holes after the printed circuit board is subjected to pressing; performing metallized processing on the surface of the printed circuit board; performing pattern transfer on the surface of the printed circuit board through an acid etching method; performing solder mask and surface treatment; carrying out forming processing on the metallized semi-holes. According to the metallized semi-hole forming method, the problem that a certain risk of management and control of a circuit exists due to secondary etching (alkaline etching) is solved, the high-quality metallized semi-holes and the printed circuit board can be manufactured, and the production cost is reduced.
Description
Technical field
The invention belongs to art of printed circuit boards, particularly a kind of metallized semi hole forming method and board, printed circuit board manufacturing method.
Background technology
Along with the variation of the development of printed circuit board (PCB) (PCB) technology and the design of product, the pcb board part for the design of edges of boards metallized semi-pore also increases increasingly.Metallized semi-pore is also called half PTH (platingthrough hole, plated-through-hole).
The work flow of industry half bore is often similar, usually adopts alkali etching flow process, carries out the processing of half bore before striping, recycling dry film or tin coating protection outer circuit, the copper wire produced when removing half hole machined by alkali etching liquid medicine, burr etc.And to the main processing mode of half bore pcb board be:
Substrate is holed → sinks copper plating → Graphic transitions → graphic plating → move back film and drying up → need circular hole gong except processing procedure after half bore → pcb board alkali etching → take off tin → anti-welding grade by design.
Through above-mentioned processing mode, obtain metallized semi-pore pcb board part finished product schematic diagram as shown in Figure 1, plate needs to obtain the half bore without copper wire, burr by design.
Above metallized semi-pore pcb board, its outer graphics adopts alkali etching method to make, and work flow is longer, and cost of manufacture is higher; Before being all arranged in alkali etching for the processing of metallized semi-pore, milling plate slightly misoperation very easily produces tin face and wipes flower, causes the quality abnormals such as the open circuit of outer graphics, breach; For half hole machined produce copper wire, burr process be utilize the tin layers of graphic plating to protect, carry out secondary alkali etching to realize, certain risk existed for circuit management and control.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of metallized semi hole forming method and board, printed circuit board manufacturing method, realizes high-quality metallized semi-pore and pcb board.
For achieving the above object, embodiments of the invention provide a kind of metallized semi hole forming method, are applied to the manufacture craft of printing board PCB, comprise the following steps:
Hole after being pressed into printed circuit board (PCB);
Metalized is carried out to the surface of described printed circuit board (PCB);
With aciding, Graphic transitions is carried out to described printed circuit board surface;
Anti-welding and surface treatment;
Processing and forming is carried out to metallized semi-pore.
Wherein, described metallized semi hole forming method also comprises: described shaping and described surface-treated step is carried out to metallized semi-pore after carry out alkali etching, remove described shaping time the copper sheet that tilts of the hole wall that produces and/or burr.
It is wherein, described that to carry out shaping step to metallized semi-pore be complete after or before described surface treatment step.
Wherein, described anti-welding middle employing anti-solder ink; The mode of spray tin, chemical turmeric or electrogilding is adopted in described surface treatment; The protective layer that wherein said alkali etching utilizes described anti-solder ink, described spray tin, described chemical turmeric or described electrogilding to be formed is as anti-etching resist.
Wherein, described aciding specifically comprises the step that circuit board surface carries out Graphic transitions:
Pre-treatment, pad pasting, exposure, development, acid etching, striping.
The embodiment of the present invention additionally provides a kind of board, printed circuit board manufacturing method, comprises above-mentioned metallized semi hole forming method.
The beneficial effect of technique scheme of the present invention is as follows:
The metallized semi hole forming method of the embodiment of the present invention, holes after comprising pressing; Metallize in plate face; Aciding carries out Graphic transitions to circuit board surface; Anti-welding; Surface treatment; Carry out shaping step to metallized semi-pore, Graphic transitions obtains outer graphics by adopting acid etching, avoids secondary alkali etching in conventional method and circuit management and control may be made to there is the problem of some risks.
The metallized semi hole forming method of the embodiment of the present invention, also be included in the alkali etching step of carrying out after shaping and surface-treated step to metallized semi-pore, the copper sheet that the hole wall produced when removing shaping tilts and/or burr, simple flow, improves operating efficiency.
The metallized semi hole forming method of the embodiment of the present invention; anti-welding middle employing anti-solder ink; the mode of spray tin, chemical turmeric or electrogilding is used in surface treatment; because first time etching adopts acid etching; protective layer is retained; can directly as anti-etching resist in alkali etching; the copper wire, burr etc. that are produced by shaping milling plate through alkali etching are thoroughly removed; just without the need to carrying out the graphic plating processing procedure in conventional method again; simplify work flow; shorten production hour, improve production efficiency.
The metallized semi hole forming method of the embodiment of the present invention, acid etching flow process is adopted to make metallized semi-pore product, the processing and fabricating that filling holes with resin, high density interconnect HDI, high thickness to diameter ratio etc. can not walk the half bore pcb board part of alkali etching flow process can be completed, be also applicable to the making of the hardware products such as other stainless steels, full aluminium.
Accompanying drawing explanation
Fig. 1 is metallized semi-pore pcb board part finished product schematic diagram;
Fig. 2 is the schematic diagram of the metallized semi hole forming method of the embodiment of the present invention;
Fig. 3 is the schematic diagram of the board, printed circuit board manufacturing method of the embodiment of the present invention.
Embodiment
For making the technical problem to be solved in the present invention, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
The present invention is directed to existing is utilize the tin layers of graphic plating to protect for the copper wire of half hole machined generation, the process of burr; carry out second etch (alkaline etching) to realize; circuit management and control is existed to the problem of certain risk, a kind of metallized semi hole forming method and board, printed circuit board manufacturing method are provided.
The metallized semi hole forming method of the embodiment of the present invention, is applied to the manufacture craft of printing board PCB, comprises the following steps:
Hole after being pressed into printed circuit board (PCB);
Metalized is carried out to the surface of described printed circuit board (PCB);
With aciding, Graphic transitions is carried out to described printed circuit board surface;
Anti-welding and surface treatment;
Processing and forming is carried out to metallized semi-pore.
Graphic transitions completes by adopting acid etching, avoids secondary alkali etching in conventional method and circuit management and control may be made to there is the problem of some risks.
As everyone knows, obtain the half bore of high-quality, be very important for the copper wire of half hole machined generation, the process of burr.Therefore, in the metallized semi hole forming method of another embodiment of the present invention, as shown in Figure 2, on the basis of above-described embodiment, metallized semi hole forming method also comprises: described shaping and described surface-treated step is carried out to metallized semi-pore after carry out alkali etching, remove described shaping time the copper sheet that tilts of the hole wall that produces and/or burr.
So far, just can obtain designing the high-quality metallized semi-pore needed.And because Graphic transitions directly adopts acid etching to make, just without the need to carrying out the graphic plating processing procedure in conventional method again, simplifying work flow, shortening production hour, improve production efficiency.
Namely metallized semi-pore described above carries out shaping is the step needing circular hole gong to become by design half bore.The metallized semi hole forming method of another embodiment of the present invention is on the basis of above-described embodiment, and described to carry out shaping step to metallized semi-pore be complete after or before described surface treatment step.But preferably complete after the surface treatment, the tin face produced due to misoperation at milling plate can be avoided like this to wipe flower thus the quality abnormal such as open circuit, breach of the outer graphics caused, improve product quality.
At the metallized semi hole forming method of another embodiment of the present invention, on the basis of above-described embodiment, described anti-welding middle employing anti-solder ink; The mode of spray tin, chemical turmeric or electrogilding is adopted in described surface treatment; The protective layer that wherein said alkali etching utilizes described anti-solder ink, described spray tin, described chemical turmeric or described electrogilding to be formed is as anti-etching resist.
Anti-welding middle employing anti-solder ink in the embodiment of the present invention; the mode of spray tin, chemical turmeric or electrogilding is used in surface treatment; because first time etching adopts acid etching; protective layer is retained, can directly as anti-etching resist in alkali etching, and the copper wire, burr etc. that are produced by shaping milling plate through alkali etching are thoroughly removed; just without the need to carrying out the graphic plating processing procedure in conventional method again; simplify work flow, shorten production hour, improve production efficiency.
Certainly, the preferred version that the anti-solder ink adopted in the embodiment of the present invention, spray tin, chemical turmeric, electrogilding etc. just meet the demands is not unique scheme.When conditions permit, can use and adopt other schemes.
The metallized semi hole forming method of another embodiment of the present invention, on the basis of above-described embodiment, described aciding specifically comprises the step that circuit board surface carries out Graphic transitions:
Pre-treatment, pad pasting, exposure, development, acid etching, striping.
Obtain outer graphics by above-mentioned steps, just accomplish the end in view.
To sum up, the metallized semi hole forming method of the embodiment of the present invention, outer graphics transfer directly adopts acid etching to make, and without the need to carrying out graphic plating processing procedure, simplifying the work flow of pcb board, shortening production hour, enhancing productivity; The process such as copper sheet, peak is tilted for the hole wall produced during metallized semi hole machined, directly utilize anti-solder ink, spray tin, chemical turmeric etc. as anti-etching resist, the cloak, burr etc. that are produced by shaping milling plate through alkali etching are thoroughly removed, and guarantee pcb board part quality.Except this, process capability is also well expanded, acid etching flow process is adopted to make metallized semi-pore product, the processing and fabricating that filling holes with resin, high density interconnect HDI, high thickness to diameter ratio etc. can not walk the half bore pcb board part of alkali etching flow process can be completed, be also applicable to the making of the hardware products such as other stainless steels, full aluminium.
For achieving the above object, the embodiment of the present invention also provides a kind of board, printed circuit board manufacturing method, comprises above-mentioned metallized semi hole forming method.
It should be noted that the method is the method comprising above-mentioned metallized semi hole forming method, the implementation of above-mentioned metallized semi hole forming method is applicable in the method, also can reach identical technique effect.
As shown in Figure 3, the board, printed circuit board manufacturing method schematic diagram of the embodiment of the present invention is provided:
S1, blanking substrate or pressing pcb board;
S2, holes pcb board;
S3, completes pcb board hole and sinks copper or plating;
S4, completes outer graphics by pcb board part by acid etching flow process;
S5, carries out anti-welding making by pcb board;
S6, completes spray tin, chemical turmeric or the surface treatment such as gold-plated by pcb board;
S7, mills out metallized semi-pore on request by gong machine on pcb board part;
S8, carries out alkali etching by pcb board.
Certainly, the board, printed circuit board manufacturing method of the embodiment of the present invention is comprising outside metallized semi hole forming method, also has the old process such as test, inspection in later stage, does not enumerate at this.
Pcb board part finished product as shown in Figure 1 can be completed by the manufacture method of above-mentioned printed circuit board (PCB), and improve the quality of metallized semi-pore and plate.
The board, printed circuit board manufacturing method of the embodiment of the present invention, outer graphics transfer directly adopts acid etching to make, and without the need to carrying out graphic plating processing procedure, simplifying the work flow of pcb board, shortening production hour, enhancing productivity; The process such as copper sheet, peak is tilted for the hole wall produced during metallized semi hole machined, directly utilize surface treatment such as spray tin, chemical turmeric etc. as anti-etching resist, the cloak, burr etc. that are produced by shaping milling plate through alkali etching are thoroughly removed, and guarantee pcb board part quality.Except this, process capability is also well expanded, and adopts acid etching flow process to make metallized semi-pore product, can complete the processing and fabricating that filling holes with resin, high density interconnect HDI, high thickness to diameter ratio etc. can not walk the half bore pcb board part of alkali etching flow process.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (6)
1. a metallized semi hole forming method, is applied to the manufacture craft of printing board PCB, it is characterized in that, comprise the following steps:
Hole after being pressed into printed circuit board (PCB);
Metalized is carried out to the surface of described printed circuit board (PCB);
With aciding, Graphic transitions is carried out to described printed circuit board surface;
Anti-welding and surface treatment;
Processing and forming is carried out to metallized semi-pore.
2. metallized semi hole forming method according to claim 1, it is characterized in that, described metallized semi hole forming method also comprises: described shaping and described surface-treated step is carried out to metallized semi-pore after carry out alkali etching, remove described shaping time the copper sheet that tilts of the hole wall that produces and/or burr.
3. metallized semi hole forming method according to claim 1 and 2, is characterized in that, described to carry out shaping step to metallized semi-pore be complete after or before described surface treatment step.
4. metallized semi hole forming method according to claim 2, is characterized in that, described anti-welding middle employing anti-solder ink; The mode of spray tin, chemical turmeric or electrogilding is adopted in described surface treatment;
The protective layer that wherein said alkali etching utilizes described anti-solder ink, described spray tin, described chemical turmeric or described electrogilding to be formed is as anti-etching resist.
5. metallized semi hole forming method according to claim 1, is characterized in that, described aciding specifically comprises the step that circuit board surface carries out Graphic transitions:
Pre-treatment, pad pasting, exposure, development, acid etching, striping.
6. a board, printed circuit board manufacturing method, is characterized in that, comprises the metallized semi hole forming method described in any one of claim 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310492837.8A CN104582319A (en) | 2013-10-18 | 2013-10-18 | Metallized semi-hole forming method and printed circuit board manufacturing method |
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| CN201310492837.8A CN104582319A (en) | 2013-10-18 | 2013-10-18 | Metallized semi-hole forming method and printed circuit board manufacturing method |
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| CN104582319A true CN104582319A (en) | 2015-04-29 |
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| CN201310492837.8A Pending CN104582319A (en) | 2013-10-18 | 2013-10-18 | Metallized semi-hole forming method and printed circuit board manufacturing method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120598A (en) * | 2015-07-25 | 2015-12-02 | 深圳恒宝士线路板有限公司 | Semi-hole PCB manufacturing method based on acid etching technology |
| CN105555063A (en) * | 2016-01-29 | 2016-05-04 | 浪潮电子信息产业股份有限公司 | Multiplexing method for via holes on same layer for PCB |
| CN106231817A (en) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI plate |
| CN106550553A (en) * | 2016-10-27 | 2017-03-29 | 惠州中京电子科技有限公司 | A kind of manufacture method of the double parallel bore metallized semi-pore of wiring board |
| CN107278027A (en) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | Circuit board and mobile terminal |
| CN108012435A (en) * | 2017-12-27 | 2018-05-08 | 大连崇达电路有限公司 | Move back the reworking method for the half-finished product plate for finding to leak after graphic plating gong groove/opening after tin |
| CN108575058A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of half bore plate producing process |
| CN109152224A (en) * | 2018-10-17 | 2019-01-04 | 同健(惠阳)电子有限公司 | A kind of manufacture craft of metallized semi-pore wiring board |
| CN110072341A (en) * | 2019-04-18 | 2019-07-30 | 奥士康精密电路（惠州）有限公司 | A kind of acid etching method of two-sided weld-ring without copper U-type groove hole without burr |
| CN110167259A (en) * | 2019-05-07 | 2019-08-23 | 湖南好易佳电路板有限公司 | A kind of edges of boards plated through-hole or the multi-electrode circuit board on side of metallizing |
| CN110312380A (en) * | 2019-06-05 | 2019-10-08 | 湖南好易佳电路板有限公司 | A kind of production production method of side metal side multilayer insulation isolation circuit plate |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120598A (en) * | 2015-07-25 | 2015-12-02 | 深圳恒宝士线路板有限公司 | Semi-hole PCB manufacturing method based on acid etching technology |
| CN105555063A (en) * | 2016-01-29 | 2016-05-04 | 浪潮电子信息产业股份有限公司 | Multiplexing method for via holes on same layer for PCB |
| CN106231817A (en) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI plate |
| CN106550553A (en) * | 2016-10-27 | 2017-03-29 | 惠州中京电子科技有限公司 | A kind of manufacture method of the double parallel bore metallized semi-pore of wiring board |
| CN106550553B (en) * | 2016-10-27 | 2019-03-22 | 惠州中京电子科技有限公司 | A kind of production method of the double parallel bore metallized semi-pore of wiring board |
| CN108575058A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of half bore plate producing process |
| CN107278027A (en) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | Circuit board and mobile terminal |
| CN108012435A (en) * | 2017-12-27 | 2018-05-08 | 大连崇达电路有限公司 | Move back the reworking method for the half-finished product plate for finding to leak after graphic plating gong groove/opening after tin |
| CN109152224A (en) * | 2018-10-17 | 2019-01-04 | 同健(惠阳)电子有限公司 | A kind of manufacture craft of metallized semi-pore wiring board |
| CN110072341A (en) * | 2019-04-18 | 2019-07-30 | 奥士康精密电路（惠州）有限公司 | A kind of acid etching method of two-sided weld-ring without copper U-type groove hole without burr |
| CN110167259A (en) * | 2019-05-07 | 2019-08-23 | 湖南好易佳电路板有限公司 | A kind of edges of boards plated through-hole or the multi-electrode circuit board on side of metallizing |
| CN110312380A (en) * | 2019-06-05 | 2019-10-08 | 湖南好易佳电路板有限公司 | A kind of production production method of side metal side multilayer insulation isolation circuit plate |
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Application publication date: 20150429 |