CN102427678A - PCB (Printed Circuit Board) manufacturing method - Google Patents
PCB (Printed Circuit Board) manufacturing method Download PDFInfo
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- CN102427678A CN102427678A CN2011103535137A CN201110353513A CN102427678A CN 102427678 A CN102427678 A CN 102427678A CN 2011103535137 A CN2011103535137 A CN 2011103535137A CN 201110353513 A CN201110353513 A CN 201110353513A CN 102427678 A CN102427678 A CN 102427678A
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- pcb board
- pcb
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- hole
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of PCB (Printed Circuit Board) processing and particularly discloses a PCB manufacturing method. The PCB manufacturing method mainly comprises the manufacturing steps of copper deposition, board electroplating, board polishing, dry green oil stuffing, roasting, grinding, manufacturing of an outer layer line and manufacturing of a green oil solder resist protective layer. In the PCB manufacturing method, by improving a plug hole process and plug hole oil, a plug hole of a PCB is fuller, the surface of the PCB is flat after the PCB is printed and the redness problem at the edge of the hole is also well improved, so that a series of problems caused by the poor plug hole are solved.
Description
Technical field
The invention belongs to the PCB processing technique field, be specifically related to a kind of pcb board manufacture method that adopts dried green oil consent.
Background technology
PCB (Printed Circuit Board), Chinese is a printed wiring board, is called for short printed board, is one of vitals of electronics industry.Every kind of electronic equipment almost arrives computer greatly to electronic watch, calculator for a short time, the communication electronic equipment, and military armament systems as long as electronic devices and components such as integrated circuit are arranged, for the electric interconnection between them, all will use printed board.The design of printed board and workmanship directly have influence on the quality and the cost of entire product, even cause the success or failure of commercial competition.
In order to prevent non-hole in piece part in natural environment all the year round, caused short circuit by after soda acid oxidation and the corrosion, cause electrically badly, especially the BGA place need take the measure of consent.
At present, what jack panel still adopted is the green oil consent, accomplishes consent through following technological process:
Heavy copper (on pcb board face and hole wall, deposit the thin copper of one deck through chemical principle), plate are electroplated (on pcb board, adding thick copper layer through the means of electroplating), outer-layer circuit and are made the making of (make outer-layer circuit through positive blade technolgy, comprise operations such as graphic plating and alkali etching) and green oil resistance weldering protective layer (comprise green oil pre-treatment, aluminium flake consent, print surface ink, bake in advance, baking, exposure, development, low temperature, high temperature and other normal process flow).
Above-mentioned technology does not reach requirement in the plumpness of intensive place, position, hole consent, and the rubescent or one-tenth coppery phenomenon (mainly embodying the position at the intensive place of BGA) in limit, hole can appear in inspection behind the silk-screen exposure imaging, and this mode cannot satisfy the development of following PCB.Along with the design of the development trend .BGA position precision of following PCB electron trade with require highlyer, (BGA position tangent like half hole or the design of mesopore position, hole require to window etc.) used photosensitive-ink to connect plug band seal technology and can't be met the demands.Can occur the bad or light leakage phenomenon of consent after the development, cause via hole to hide tin sweat(ing) or upward gold short circuit when client is assembled.
Summary of the invention
In order to solve the not full and rubescent problem in limit, hole of above-mentioned consent, the object of the present invention is to provide a kind of pcb board manufacture method that adopts dried green oil consent.
For realizing the foregoing invention purpose, technical scheme that the present invention adopts is following:
A kind of manufacture method of pcb board comprises heavy copper and plate plating step, and is further comprising the steps of after said plate plating step:
Nog plate carries out smooth and clean with polish-brush to the pcb board face;
Fill in dried green oil, dried green oil is filled in the hole of pcb board with printing machine;
The back is roasting, and pcb board was toasted 40-60 minute under 150 ± 5 ℃ of conditions;
Grind, utilize the adhesive-bonded fabric brush wheel to grind the dried green oil that will protrude from the pcb board face and polish;
Outer-layer circuit is made, and adopts negative film technology to make outer-layer circuit at the pcb board face; And
The making of green oil resistance weldering protective layer.
In the said pcb board manufacture method, said outer-layer circuit is made, and adopts negative film technology to make outer-layer circuit at the pcb board face, and is specific as follows:
Attach one deck dry film etching resistance agent at whole pcb board face;
Film base plate is being alignd with pcb board, and the dry film on the pcb board is made public and develops;
Utilize acidic etching liquid that the unnecessary copper of pcb board face is etched away;
Outer-layer circuit is exposed in the dry film removal that is attached to the pcb board face.
In the said pcb board manufacture method, the speed of said acid etching is 4 meters per minutes.
In the said pcb board manufacture method, said acidic etching liquid is oxidant, hydrochloric acid, water and copper.
In the said pcb board manufacture method, the baking temperature in the roasting step in said back is that 150 ℃, stoving time are 50 minutes.
In the said pcb board manufacture method, said plate plating step requirement PCB face copper is thick to be the 27-29 micron, hole copper is thick reaches 18 microns.
In the said pcb board manufacture method, the area that requires to fill in dried green oil area coverage and hole area in the dried green oil step of said plug compares greater than 80% in the hole in.
In the said pcb board manufacture method, the grinding rate of said grinding steps is a 0.8-1.0 rice per minute, and the number of times of grinding is 2-3 time.
In the said pcb board manufacture method, minimum feature line-spacing 4 Mills (MIL) of said outer-layer circuit, the minimum line distance is 3 Mills (MIL).(MIL) equals mil in 1 Mill.
Dried green oil belongs to resin type and thermohardening type printing ink, and contained solvent is less with other chemical substances, can increase the internal stress in hole.Therefore, adopt dried green oil consent can effectively improve the bad problem of consent to the tangent BGA in follow-up half hole with the design of hole mesopore.
Through method improvement of the present invention, make that the pcb board consent is fuller, printing back surfacing and the rubescent problem in limit, hole also obtain fine improvement, thereby have solved bad some the row problems brought of consent.
Embodiment
To combine the practical implementation method to specify the present invention below, be used for explaining the present invention in schematic enforcement of the present invention and explanation, but not as to qualification of the present invention.
Embodiment 1:
The invention discloses a kind of manufacture method of pcb board, comprise heavy copper and plate plating step, further comprising the steps of after said plate plating step:
Step1: nog plate, carry out smooth and clean with polish-brush to the pcb board face;
Step2: fill in dried green oil, dried green oil is filled in the hole of pcb board with printing machine, the area that requires to fill in dried green oil area coverage and hole area compares greater than 80% in the hole in;
Step3: the back is roasting, and pcb board was toasted 40-60 minute under 150 ± 5 ℃ of conditions; Wherein, baking temperature is preferably 150 ℃, stoving time and is preferably 50 minutes;
Step4: grind, utilize the adhesive-bonded fabric brush wheel to grind the dried green oil that will protrude from the pcb board face and polish, its grinding rate is a 0.8-1.0 rice per minute, and the number of times of grinding is 2-3 time;
Step5: outer-layer circuit is made, and adopts negative film technology to make outer-layer circuit at the pcb board face, and is specific as follows: attach one deck dry film etching resistance agent at whole pcb board face;
Film base plate is being alignd with pcb board, and the dry film on the pcb board is made public and develops;
Utilize acidic etching liquid that the unnecessary copper of pcb board face is etched away, the speed of said acid etching is 4 meters per minutes, and said acidic etching liquid is oxidant, hydrochloric acid, water and copper;
Outer-layer circuit is exposed in the dry film removal that is attached to the pcb board face; Minimum feature line-spacing 4 Mills (MIL) of the outer-layer circuit that this step is processed, the minimum line distance is 3 Mills (MIL); And
Step6: the making of green oil resistance weldering protective layer.
Wherein, heavy copper is meant through chemical principle and on pcb board face and hole wall, deposits the thin copper of one deck, and plate is electroplated and is meant on pcb board and adds thick copper layer through the means of electroplating, require PCB face copper thick for the 27-29 micron, hole copper is thick reaches 18 microns.
Below be the detailed test of step according to the method described above:
1, breadboard model and ink name:
Test model: SR01189 quantity: be total to 10PCS (internal layer consent)
Test printing ink: hold big 3100 thermosetting inks (dried green oil)
2, experiment process and relevant parameter:
Basic procedure:
Heavy copper--plate electricity (the thick copper of disposable plating)--nog plate--the dried green oil of Sai--back is roasting--grind (adhesive-bonded fabric)--outer-layer circuit is made (negative film)--making of green oil resistance weldering protective layer (the green oil pre-treatment--the Yin surface----roasting in advance----exposure----high temperature---normal process flow of developing).
Test parameters, result and points for attention
Can know that to sum up the present invention is through using dried green oil instead to jack panel, the outward appearance behind the consent is good, limit, hole printing ink is smooth, even, the thermal shock resistance properties test can reach relevant quality requirements.
The dried green oil that the present invention uses belongs to resin type and thermohardening type printing ink, and contained solvent is less with other chemical substances, increases the internal stress in hole.Therefore, adopt dried green oil consent can effectively improve bad, the rubescent problem of consent and a series of quality problem such as via hole falls oil, gathers oil, bleed fourth to the tangent BGA in follow-up half hole with the design of hole mesopore.
When the present invention ground with the 600# adhesive-bonded fabric, the thick wearing and tearing of surperficial copper 4-6UM (grinding altogether 3 times) need compensate the thick grinding coefficient of copper when follow-up disposable plate electro-coppering.
The present invention is primarily aimed at the BGA position to be had the tangent or hole mesopore in half hole to be designed with the product of windowing to adopt dried green oil or filling holes with resin.
More than the technical scheme that the embodiment of the invention provided has been carried out detailed introduction; Used concrete example among this paper the principle and the execution mode of the embodiment of the invention are set forth, the explanation of above embodiment only is applicable to the principle that helps to understand the embodiment of the invention; Simultaneously, for one of ordinary skill in the art, according to the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (9)
1. the manufacture method of a pcb board comprises heavy copper and plate plating step, it is characterized in that, and is further comprising the steps of after said plate plating step:
Nog plate carries out smooth and clean with polish-brush to the pcb board face;
Fill in dried green oil, dried green oil is filled in the hole of pcb board with printing machine;
The back is roasting, and pcb board was toasted 40-60 minute under 150 ± 5 ℃ of conditions;
Grind, utilize the adhesive-bonded fabric brush wheel to grind the dried green oil that will protrude from the pcb board face and polish;
Outer-layer circuit is made, and adopts negative film technology to make outer-layer circuit at the pcb board face; And
The making of green oil resistance weldering protective layer.
2. pcb board manufacture method according to claim 1 is characterized in that:
Said outer-layer circuit is made, and adopts negative film technology to make outer-layer circuit at the pcb board face, and is specific as follows:
Attach one deck dry film etching resistance agent at whole pcb board face;
Film base plate is being alignd with pcb board, and the dry film on the pcb board is made public and develops;
Utilize acidic etching liquid that the unnecessary copper of pcb board face is etched away;
Outer-layer circuit is exposed in the dry film removal that is attached to the pcb board face.
3. pcb board manufacture method according to claim 2 is characterized in that:
The speed of said acid etching is 4 meters per minutes.
4. pcb board manufacture method according to claim 2 is characterized in that:
Said acidic etching liquid is oxidant, hydrochloric acid, water and copper.
5. pcb board manufacture method according to claim 1 and 2 is characterized in that:
Baking temperature in the roasting step in said back is that 150 ℃, stoving time are 50 minutes.
6. pcb board manufacture method according to claim 1 and 2 is characterized in that:
Said plate plating step requirement PCB face copper is thick to be the 27-29 micron, hole copper is thick reaches 18 microns.
7. pcb board manufacture method according to claim 1 and 2 is characterized in that:
The area that requires to fill in dried green oil area coverage and hole area in the dried green oil step of said plug compares greater than 80% in the hole in.
8. pcb board manufacture method according to claim 1 and 2 is characterized in that:
The grinding rate of said grinding steps is a 0.8-1.0 rice per minute, and the number of times of grinding is 2-3 time.
9. pcb board manufacture method according to claim 1 and 2 is characterized in that:
Minimum feature line-spacing 4 Mills (MIL) of said outer-layer circuit, the minimum line distance is 3 Mills (MIL).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110353513.7A CN102427678B (en) | 2011-11-09 | 2011-11-09 | PCB (Printed Circuit Board) manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110353513.7A CN102427678B (en) | 2011-11-09 | 2011-11-09 | PCB (Printed Circuit Board) manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102427678A true CN102427678A (en) | 2012-04-25 |
| CN102427678B CN102427678B (en) | 2014-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110353513.7A Expired - Fee Related CN102427678B (en) | 2011-11-09 | 2011-11-09 | PCB (Printed Circuit Board) manufacturing method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260361A (en) * | 2013-05-14 | 2013-08-21 | 金悦通电子（翁源）有限公司 | Method with simple process for processing HDI outer layer line negative film being |
| CN104582319A (en) * | 2013-10-18 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Metallized semi-hole forming method and printed circuit board manufacturing method |
| CN104661447A (en) * | 2015-03-18 | 2015-05-27 | 红板（江西）有限公司 | Hole plugging method for manufacturing double-sided window by using thermoset printing ink |
| CN105491803A (en) * | 2015-12-31 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Improvement method for solder plug hole depressions of IC substrate and manufacturing method |
| CN107645834A (en) * | 2017-08-30 | 2018-01-30 | 景旺电子科技(龙川)有限公司 | A kind of etching method substitutes machining making and destroyed or force to yield method for product |
| CN107770966A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of outer layer manufacturing method thereof of pcb board |
| CN108449876A (en) * | 2018-03-21 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of non-VIA-IN-PAD resin plugs orifice plate |
| CN109429432A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of PCB consent board machining process |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
| CN113141733A (en) * | 2021-03-03 | 2021-07-20 | 柏承科技(昆山)股份有限公司 | Hole plugging and film pressing process with high processing capacity |
| WO2022183411A1 (en) * | 2021-03-03 | 2022-09-09 | 柏承科技(昆山)股份有限公司 | Hole plugging and lamination process having high process capability |
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| CN102056409A (en) * | 2009-10-30 | 2011-05-11 | 湖南寰球电子科技有限公司 | Method and device for plugging hole by using piston during printed circuit board manufacture |
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Patent Citations (4)
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| CN1835659A (en) * | 2005-03-16 | 2006-09-20 | 杨合卿 | Anti-welding procedue of PCB |
| CN102056409A (en) * | 2009-10-30 | 2011-05-11 | 湖南寰球电子科技有限公司 | Method and device for plugging hole by using piston during printed circuit board manufacture |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260361B (en) * | 2013-05-14 | 2016-07-06 | 金悦通电子（翁源）有限公司 | A kind of HDI outer-layer circuit negative film processing method |
| CN103260361A (en) * | 2013-05-14 | 2013-08-21 | 金悦通电子（翁源）有限公司 | Method with simple process for processing HDI outer layer line negative film being |
| CN104582319A (en) * | 2013-10-18 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Metallized semi-hole forming method and printed circuit board manufacturing method |
| CN104661447A (en) * | 2015-03-18 | 2015-05-27 | 红板（江西）有限公司 | Hole plugging method for manufacturing double-sided window by using thermoset printing ink |
| CN105491803A (en) * | 2015-12-31 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Improvement method for solder plug hole depressions of IC substrate and manufacturing method |
| CN109429432A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of PCB consent board machining process |
| CN109429432B (en) * | 2017-08-29 | 2021-09-10 | 湖北龙腾电子科技有限公司 | PCB (printed circuit board) plugging plate processing technology |
| CN107645834A (en) * | 2017-08-30 | 2018-01-30 | 景旺电子科技(龙川)有限公司 | A kind of etching method substitutes machining making and destroyed or force to yield method for product |
| CN107770966A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of outer layer manufacturing method thereof of pcb board |
| CN108449876A (en) * | 2018-03-21 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of production method of non-VIA-IN-PAD resin plugs orifice plate |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
| CN113141733A (en) * | 2021-03-03 | 2021-07-20 | 柏承科技(昆山)股份有限公司 | Hole plugging and film pressing process with high processing capacity |
| WO2022183411A1 (en) * | 2021-03-03 | 2022-09-09 | 柏承科技(昆山)股份有限公司 | Hole plugging and lamination process having high process capability |
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| Publication number | Publication date |
|---|---|
| CN102427678B (en) | 2014-08-13 |
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