CN102752964A - Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein - Google Patents
Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein Download PDFInfo
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- CN102752964A CN102752964A CN2012102469787A CN201210246978A CN102752964A CN 102752964 A CN102752964 A CN 102752964A CN 2012102469787 A CN2012102469787 A CN 2012102469787A CN 201210246978 A CN201210246978 A CN 201210246978A CN 102752964 A CN102752964 A CN 102752964A
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Abstract
The invention discloses a selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and an anti-plating layer therein. In the selective gold-plated process, sensitive printing ink is adopted to manufacture the anti-plating layer, thus effectively solving the problem that a dry film can not resist thick-gold-electroplated film falling diffusion coating to be incapable of manufacturing thick plated gold; furthermore, the sensitive printing ink is adopted in the PCB manufacture procedure, new materials and equipment are not required for being additionally developed, so that the cost is saved; and finally, pattern transfer can be conveniently and accurately conducted by a counterpoint exposure developing mode, thus meeting the requirement of selecting electroplating gold.
Description
Technical field
The present invention relates to PCB processing and manufacturing technical field, relate in particular to a kind of pcb board selective electroplating gold processing procedure and anti-coating wherein.
Background technology
At PCB (printed circuit board (PCB)) manufacture field; Electroplating (Electroplating) utilizes electrolysis principle on the pcb board surface, to plate the process of other metal or alloy of skim; Be to utilize electrolysis to make the technology of the surface attachment layer of metal film of pcb board; Prevent corrosion thereby play, improve resistance to wear, conductivity, reflective and promote effects such as attractive in appearance.Wherein, said coating is single metal or alloy mostly, like titanium target, zinc, cadmium, gold or brass, bronze etc.
The gold plate corrosion resistance is strong, good conductivity, be easy to welding, high temperature resistant, and has the certain resistance to wear hard gold of a small amount of other elements (as be mixed with).Thereby, obtained extensive use.
At present, industry generally is used in the anti-coating of selecting the electrogilding processing procedure and is anti-electric golden dry film, and this kind dry film generally also can only be applicable to the processing procedure of making the thick requirement of 0.3-0.8um gold.To the thick metal plated processing procedure of needs (gold is thick >=1um), anti-coating takes place easily gets rid of film and drop, cause the bad grade of plating unusual.
In view of this, prior art awaits to improve and development.
Summary of the invention
Deficiency in view of above-mentioned prior art; The object of the present invention is to provide a kind of printed substrate selective electroplating gold processing procedure and anti-coating wherein; When being intended to solve the selective electroplating of prior art owing to adopt anti-electric golden dry film, thereby problems such as infiltration is bad appear when the thick gold of plating easily.
Technical scheme of the present invention is following:
A kind of pcb board selective electroplating gold processing procedure wherein, may further comprise the steps:
ST1, pcb board is carried out pre-treatment;
ST2, adopt silk screen printing that photosensitive-ink is coated to the pcb board face and to drying processing;
ST3, with the golden figure of predefined electricity, transfer on the pcb board face through contraposition, exposure, visualization way, satisfy to spill needs electrogilding zone, and will need not the requirement that the electrogilding zone covers with green oil;
ST4, the roasting plate mode of employing are with ink solidification;
ST5, gold-plated processing is carried out in needs electrogilding zone;
ST6, will cover the photosensitive-ink that does not need electrogilding zone and move back and wash off, accomplish the selective electroplating gold.
Described printed substrate selective electroplating gold processing procedure, wherein, the thickness of said selective electroplating gold is greater than 1 micron.
Described printed substrate selective electroplating gold processing procedure, wherein, the pre-treatment among the said step ST1 comprises removes pcb board face oxide and impurity.
Anti-coating in a kind of pcb board selective electroplating gold processing procedure, wherein, the material of said anti-coating is a photosensitive-ink.
Beneficial effect: pcb board selective electroplating gold processing procedure of the present invention and anti-coating wherein, in selective electroplating gold process, adopt photosensitive-ink to make anti-coating; Effectively solve dry film and can't resist thick metal platedly to fall the film plating and can't make thick metal plated problem, and, also need not new material of extra exploitation and equipment because the photosensitive-ink of using is to adopt in the PCB processing procedure; Practiced thrift cost; At last, can make things convenient for through contraposition exposure imaging mode and accurately to carry out figure transfer, satisfy and selected to electroplate.
Description of drawings
Fig. 1 is the flow chart of pcb board selective electroplating gold processing procedure of the present invention.
Fig. 2 is the sketch map of the embodiment of the pcb board that carries out pre-treatment in the pcb board selective electroplating of the present invention gold processing procedure.
Fig. 3 is the sketch map of the embodiment that carries out the pcb board after the gold-plated processing in the pcb board selective electroplating of the present invention gold processing procedure.
Fig. 4 is for moving back showing of the embodiment that washes the pcb board after the photosensitive-ink in the pcb board selective electroplating of the present invention gold processing procedure.
Embodiment
The present invention provides a kind of pcb board selective electroplating gold processing procedure and anti-coating wherein, and is clearer, clear and definite for making the object of the invention, technical scheme and effect, below to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
See also Fig. 1, it is the flow chart of pcb board selective electroplating gold processing procedure of the present invention.As shown in the figure, pcb board selective electroplating gold processing procedure wherein, may further comprise the steps:
S1, pcb board is carried out pre-treatment;
S2, adopt silk screen printing that photosensitive-ink is coated to the pcb board face and to drying processing;
S3, with the golden figure of predefined electricity, transfer on the pcb board face through contraposition, exposure, visualization way, satisfy to spill needs electrogilding zone, and will need not the requirement that the electrogilding zone covers with green oil;
S4, the roasting plate mode of employing are solidified photosensitive-ink;
S5, gold-plated processing is carried out in needs electrogilding zone;
S6, will cover the photosensitive-ink that does not need electrogilding zone and move back and wash off, accomplish the selective electroplating gold.
Describe in detail to above-mentioned steps respectively below.
At first for pcb board is carried out pre-treatment, in the present embodiment, said pre-treatment comprises removes pcb board face oxide and impurity, and the pcb board 10 after it is handled is as shown in Figure 2.
After the pre-treatment, being that pcb board is printed and preliminary drying, specifically is photosensitive-ink to be coated to the pcb board face and to drying processing, wherein, the temperature and time of baking is set based on used photosensitive-ink with serigraphy.Said photosensitive-ink is meant the purple line responsive, and can be through a kind of printing ink of ultraviolet curing.
With the golden figure of predefined electricity (setting based on customer demand), transfer on the pcb board face through contraposition, exposure, visualization way then, reaching simultaneously to spill needs the electrogilding zone, and will need not the purpose that the electrogilding zone covers with green oil.
Adopt the roasting plate mode of high temperature that photosensitive-ink is solidified again; It can play the effect of anti-coating; Then gold-plated processing is carried out in needs electrogilding zone; Said photosensitive-ink effectively solves dry film and can't resist thick metal platedly to fall the film plating and can't make thick metal plated problem, and its pcb board 10 of accomplishing electrogilding is as shown in Figure 3.
At last, do not need the photosensitive-ink in electrogilding zone to move back covering and wash off, accomplish the selective electroplating gold.It moves back the mode of washing and can adopt multiplely, and the finished product pcb board 10 that forms at last (promptly accomplishing the electrogilding process) is as shown in Figure 4.
In sum, pcb board selective electroplating gold processing procedure of the present invention and anti-coating wherein are in selective electroplating gold process; Adopt photosensitive-ink to make anti-coating; Effectively solve dry film and can't resist thick metal platedly to fall the film plating and can't make thick metal plated problem, and, also need not new material of extra exploitation and equipment because the photosensitive-ink of using is to adopt in the PCB processing procedure; Practiced thrift cost; At last, can make things convenient for through contraposition exposure imaging mode and accurately to carry out figure transfer, satisfy the requirement of selecting electrogilding.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, concerning those of ordinary skills, can improve or conversion that all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.
Claims (4)
1. a pcb board selective electroplating gold processing procedure is characterized in that, may further comprise the steps:
ST1, pcb board is carried out pre-treatment;
ST2, adopt silk screen printing that photosensitive-ink is coated to the pcb board face and to drying processing;
ST3, with the golden figure of predefined electricity, transfer on the pcb board face through contraposition, exposure, visualization way, satisfy to spill needs electrogilding zone, and will need not the requirement that the electrogilding zone covers with green oil;
ST4, the roasting plate mode of employing are solidified photosensitive-ink;
ST5, gold-plated processing is carried out in needs electrogilding zone;
ST6, will cover the photosensitive-ink that does not need electrogilding zone and move back and wash off, accomplish the selective electroplating gold.
2. printed substrate selective electroplating gold processing procedure according to claim 1 is characterized in that the thickness of said selective electroplating gold is greater than 1 micron.
3. printed substrate selective electroplating gold processing procedure according to claim 2 is characterized in that, the pre-treatment among the said step ST1 comprises removes pcb board face oxide and impurity.
4. the anti-coating in the pcb board selective electroplating gold processing procedure is characterized in that the material of said anti-coating is a photosensitive-ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102469787A CN102752964A (en) | 2012-07-17 | 2012-07-17 | Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012102469787A CN102752964A (en) | 2012-07-17 | 2012-07-17 | Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein |
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| CN102752964A true CN102752964A (en) | 2012-10-24 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
| CN104470233A (en) * | 2014-11-21 | 2015-03-25 | 广州杰赛科技股份有限公司 | Printed wiring board containing gold at different thicknesses and manufacturing method thereof |
| CN106255333A (en) * | 2016-08-18 | 2016-12-21 | 苏州市惠利华电子有限公司 | A kind ofization gold adds the hybrid process technique of gold finger plate |
| CN106676596A (en) * | 2017-01-09 | 2017-05-17 | 鹏南科技（厦门）有限公司 | Processing method for selected electroplating area of bismuth telluride thermoelectric cooling chip |
| CN107509317A (en) * | 2017-08-02 | 2017-12-22 | 深圳市景旺电子股份有限公司 | A kind of PCB anti-welding processing methods and pcb board |
| CN114872466A (en) * | 2022-03-29 | 2022-08-09 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold plating process applying selective jet printing technology |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402607A (en) * | 2001-08-13 | 2003-03-12 | 实密科技股份有限公司 | Method for selectively plating metal by screen printing |
| US20090163615A1 (en) * | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| CN101534612A (en) * | 2009-04-10 | 2009-09-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
| CN101562943A (en) * | 2008-04-15 | 2009-10-21 | 珠海方正科技多层电路板有限公司 | Method for melting nickel alloy by selective ink instead of dry film |
-
2012
- 2012-07-17 CN CN2012102469787A patent/CN102752964A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402607A (en) * | 2001-08-13 | 2003-03-12 | 实密科技股份有限公司 | Method for selectively plating metal by screen printing |
| US20090163615A1 (en) * | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| CN101562943A (en) * | 2008-04-15 | 2009-10-21 | 珠海方正科技多层电路板有限公司 | Method for melting nickel alloy by selective ink instead of dry film |
| CN101534612A (en) * | 2009-04-10 | 2009-09-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
Non-Patent Citations (1)
| Title |
|---|
| 李学魁: "PCE-2002系列感光成像抗电镀、抗蚀刻油墨", 《材料与设备》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
| CN103997860B (en) * | 2014-04-23 | 2017-04-12 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
| CN104470233A (en) * | 2014-11-21 | 2015-03-25 | 广州杰赛科技股份有限公司 | Printed wiring board containing gold at different thicknesses and manufacturing method thereof |
| CN106255333A (en) * | 2016-08-18 | 2016-12-21 | 苏州市惠利华电子有限公司 | A kind ofization gold adds the hybrid process technique of gold finger plate |
| CN106676596A (en) * | 2017-01-09 | 2017-05-17 | 鹏南科技（厦门）有限公司 | Processing method for selected electroplating area of bismuth telluride thermoelectric cooling chip |
| CN106676596B (en) * | 2017-01-09 | 2019-01-29 | 鹏南科技（厦门）有限公司 | A kind of selection plating area processing method of bismuth telluride thermoelectric cooling chip |
| CN107509317A (en) * | 2017-08-02 | 2017-12-22 | 深圳市景旺电子股份有限公司 | A kind of PCB anti-welding processing methods and pcb board |
| CN107509317B (en) * | 2017-08-02 | 2020-01-17 | 深圳市景旺电子股份有限公司 | PCB solder mask processing method and PCB |
| CN114872466A (en) * | 2022-03-29 | 2022-08-09 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold plating process applying selective jet printing technology |
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Address after: 518102, Guangdong, Shenzhen province Baoan District Xixiang iron Gang Reservoir Road No. 167 Applicant after: Shenzhen Kinwong Electronic Co., Ltd. Address before: 518102, Guangdong, Shenzhen province Baoan District Xixiang iron Gang Reservoir Road No. 167 Applicant before: Kinwong Electronic (Shenzhen) Co., Ltd. |
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Application publication date: 20121024 |