CN114872466A - High-processing-capacity gold plating process applying selective jet printing technology - Google Patents
High-processing-capacity gold plating process applying selective jet printing technology Download PDFInfo
- Publication number
- CN114872466A CN114872466A CN202210323238.2A CN202210323238A CN114872466A CN 114872466 A CN114872466 A CN 114872466A CN 202210323238 A CN202210323238 A CN 202210323238A CN 114872466 A CN114872466 A CN 114872466A
- Authority
- CN
- China
- Prior art keywords
- pcb
- gold plating
- processing
- jet printing
- selective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 239000010931 gold Substances 0.000 title claims abstract description 43
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 43
- 238000007747 plating Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000007639 printing Methods 0.000 title claims abstract description 24
- 238000005516 engineering process Methods 0.000 title claims abstract description 8
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 239000007921 spray Substances 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0081—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Abstract
The invention belongs to the technical field of printed circuit board manufacturing, and relates to a high-processing-capacity gold plating process applying a selective jet printing technology, which comprises the following steps: shooting a target area of a PCB, and carrying out chemical gold processing on the PCB according to the shot actual target position; shooting a target area of the PCB, and determining a gold plating protection range through the program processing of a jet printing machine; thirdly, spraying ultraviolet-curable selective ink to the PCB by using a spray printing machine under the irradiation of a UV lamp according to the protection range of gold plating, wherein the viscosity of the selective ink is 5-20 mPa & s; fourthly, carrying out gold plating processing on the PCB; peeling off the selective ink from the PCB. The invention saves the steps of pasting blue gel, uncovering the blue gel and stripping the blue gel, has higher jet printing precision and higher speed, and comprehensively improves the processing capability of the circuit board.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a high-processing-capacity gold plating process applying a selective jet printing technology.
Background
At present, the surface treatment of products with high-order gold and thicker thickness produced by PCB factories is a gold melting and gold plating process, wherein the gold melting is to form a thin conductive plane on the non-conductive surface of a plate, then metal is continuously plated on a specific area on the conductive plane to increase the thickness, and the non-plated area is shielded by a blue film in the process to avoid thickening. The traditional process flow is as follows: printing anti-gold-plating ink, baking, gold plating, flattening the whole blue gel, manually opening a cover of an area needing gold plating, plating gold for the second time and tearing off the blue gel.
The problems that may occur with the above processes are:
1) the blue glue needs manual pressing, and the operation requirement is high;
2) the cover opening by blue gel is completed by a blade of a worker, so that the precision is low, and the ink surface is easy to scratch;
3) tearing off the blue glue can lead to glue remaining on the board surface, and the processing is required, so that the yield is low, and the cost is high.
Therefore, it is necessary to develop a new process to solve the above problems.
Disclosure of Invention
The invention mainly aims to provide a high-processing-capacity gold plating process applying a selective jet printing technology, which can improve the processing capacity of a PCB with thicker gold.
The invention realizes the purpose through the following technical scheme: a high process capability gold plating process applying a selective jet printing technology comprises the following steps:
shooting a target area of a PCB, and carrying out chemical gold processing on the PCB according to the shot actual target position;
shooting a target area of the PCB, and determining a gold plating protection range through the program processing of a jet printing machine;
thirdly, spraying ultraviolet-curable selective ink to the PCB by using a spray printing machine under the irradiation of a UV lamp according to the protection range of gold plating, wherein the viscosity of the selective ink is 5-20 mPa & s;
fourthly, carrying out gold plating processing on the PCB;
peeling off the selective ink from the PCB.
Specifically, the gold plating protection range is obtained by determining the edge of a gold plating area according to the actual target position and deviating from the edge by a preset width, and the preset width is 2-3 mil.
Specifically, the particle size of the particles in the selective ink is 100-1000 nm.
The technical scheme of the invention has the beneficial effects that:
the invention saves the steps of sticking the blue glue, opening the cover of the blue glue and stripping the blue glue, has higher jet printing precision and higher speed, and comprehensively improves the processing capability of the circuit board.
Detailed Description
The present invention will be described in further detail with reference to specific examples.
Example (b):
the invention relates to a high-processing-capacity gold plating process applying a selective jet printing technology, which comprises the following steps of:
shooting a target area of a PCB, and carrying out chemical gold processing on the PCB according to the shot actual target position;
shooting a target area of the PCB, and determining a gold plating protection range through the program processing of a jet printing machine;
thirdly, spraying ultraviolet-curable selective ink to the PCB by using a spray printing machine under the irradiation of a UV lamp according to the protection range of gold plating, wherein the viscosity of the selective ink is 5-20 mPa & s;
fourthly, carrying out gold plating processing on the PCB;
peeling off the selective ink from the PCB.
Because the method adopts the spray printing method to coat the chemical ink outside the gold plating range of the PCB, the viscosity of the ink is reduced to a range suitable for spraying. The ink coating obtained by spraying is high in position accuracy, and can be directly subjected to ultraviolet curing, so that the plate does not need to be baked for a long time, and the deformation caused by the expansion and shrinkage of the plate due to long-time heating is avoided. The invention saves the steps of pasting blue gel, uncovering the blue gel and stripping the blue gel, has higher jet printing precision and higher speed, and comprehensively improves the processing capability of the circuit board. For a PCB manufactured by the company, screen printing 80 pieces of products requires 370min in the selecting stage, and printing 80 pieces of products by a jet printer also requires 80min in the selecting stage, so that the cost of each piece of product is reduced by about 2%.
The gold plating protection range is obtained by determining the edge of a gold plating area according to the actual target position and deviating the preset width, and the preset width is 2-3 mil. Because the spraying precision is convenient to control, so when designing the inkjet region on line, only need 2 ~ 3 mil's width can, and need not leave bigger distance and guarantee the gold melting effect. The narrowing of the ink ejection area is also advantageous in that the design of the wiring can also be developed in the direction of higher density.
The particle size of the particles in the selective ink is 100-1000 nm. The components in the selective ink have smaller fineness, so that the gold plating effect cannot be influenced by serious unevenness left on a PCB.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (3)
1. A high-process-capacity gold plating process applying a selective jet printing technology is characterized by comprising the following steps of:
shooting a target area of a PCB, and carrying out chemical gold processing on the PCB according to the shot actual target position;
shooting a target area of the PCB, and determining a gold plating protection range through the program processing of a jet printing machine;
thirdly, spraying ultraviolet-curable selective ink to the PCB by using a spray printing machine under the irradiation of a UV lamp according to the protection range of gold plating, wherein the viscosity of the selective ink is 5-20 mPa & s;
fourthly, carrying out gold plating processing on the PCB;
peeling off the selective ink from the PCB.
2. The process of claim 1, wherein the selective jet printing technique is applied to a high process capability gold plating process, the process comprising: the gold melting protection range is obtained by determining the edge of the gold melting area according to the actual target position and deviating from the preset width, and the preset width is 2-3 mil.
3. The process of claim 1, wherein the selective jet printing technique is applied to a high process capability gold plating process, the process comprising: the particle size of the particles in the selective ink is 100-1000 nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210323238.2A CN114872466A (en) | 2022-03-29 | 2022-03-29 | High-processing-capacity gold plating process applying selective jet printing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210323238.2A CN114872466A (en) | 2022-03-29 | 2022-03-29 | High-processing-capacity gold plating process applying selective jet printing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114872466A true CN114872466A (en) | 2022-08-09 |
Family
ID=82670465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210323238.2A Withdrawn CN114872466A (en) | 2022-03-29 | 2022-03-29 | High-processing-capacity gold plating process applying selective jet printing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114872466A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000208898A (en) * | 1999-01-19 | 2000-07-28 | Ibiden Co Ltd | Printed wiring board and its manufacture |
| CN102752964A (en) * | 2012-07-17 | 2012-10-24 | 景旺电子（深圳）有限公司 | Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein |
| KR101845205B1 (en) * | 2017-10-24 | 2018-04-05 | 전형민 | Method of manufacturing printing plate for preventing forgery using secondarily plated metal layer by an exposure technique, Method of manufacturing metal foil for anti-falsification using the printing plate and Metal foil for anti-falsification using the same |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
| CN110049625A (en) * | 2019-04-24 | 2019-07-23 | 珠海中京电子电路有限公司 | It is a kind of with gold-plated and immersion process PCB plate production method |
| CN112770523A (en) * | 2021-01-13 | 2021-05-07 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold melting process for selectively applying jet printing ink |
-
2022
- 2022-03-29 CN CN202210323238.2A patent/CN114872466A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000208898A (en) * | 1999-01-19 | 2000-07-28 | Ibiden Co Ltd | Printed wiring board and its manufacture |
| CN102752964A (en) * | 2012-07-17 | 2012-10-24 | 景旺电子（深圳）有限公司 | Selective PCB (Printed Circuit Board) gold-electroplated manufacturing procedure and anti-plating layer therein |
| KR101845205B1 (en) * | 2017-10-24 | 2018-04-05 | 전형민 | Method of manufacturing printing plate for preventing forgery using secondarily plated metal layer by an exposure technique, Method of manufacturing metal foil for anti-falsification using the printing plate and Metal foil for anti-falsification using the same |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
| CN110049625A (en) * | 2019-04-24 | 2019-07-23 | 珠海中京电子电路有限公司 | It is a kind of with gold-plated and immersion process PCB plate production method |
| CN112770523A (en) * | 2021-01-13 | 2021-05-07 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold melting process for selectively applying jet printing ink |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220809 |
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| WW01 | Invention patent application withdrawn after publication |