WO2022151013A1 - High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating - Google Patents
High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating Download PDFInfo
- Publication number
- WO2022151013A1 WO2022151013A1 PCT/CN2021/071398 CN2021071398W WO2022151013A1 WO 2022151013 A1 WO2022151013 A1 WO 2022151013A1 CN 2021071398 W CN2021071398 W CN 2021071398W WO 2022151013 A1 WO2022151013 A1 WO 2022151013A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gold plating
- electroless gold
- selective
- ink
- gold
- Prior art date
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 239000010931 gold Substances 0.000 title claims abstract description 36
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 36
- 238000007639 printing Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000007747 plating Methods 0.000 title abstract 10
- 238000012545 processing Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 5
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 238000001311 chemical methods and process Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Definitions
- the invention relates to the technical field of printed circuit board manufacturing, in particular to a high-process-capacity gold-forming process that selectively uses inkjet printing ink.
- the high-end HDI surface treatment produced by the PCB board factory is OSP + chemical gold process, which are all traditional screen printing/dry film attachment modes, and use thermosetting chemical-resistant gold ink/dry film for printing protection on the OSP area.
- the specific steps are generally: making a screen printing screen, printing the first side, four-stage baking, printing the second side, gold melting, and ink stripping.
- the main purpose of the present invention is to provide a high-process-capacity gold chemical process that selectively uses inkjet printing ink, which can improve the process capability of the PCB board.
- the present invention achieves the above-mentioned object through the following technical solutions: a kind of selective and selective use of high-process-capable gold-forming technology of jet printing ink, the steps include:
- the protection range of chemical gold is determined after processing by the jet printer program
- the chemical gold protection range is obtained according to a preset width of the edge of the chemical gold region determined by the actual target position, and the preset width is 2-3 mils.
- the particle size of the particles in the selected ink is 100-1000 nm.
- the invention saves the time cost and economic cost of making the screen printing screen, and has higher printing precision and faster speed, and comprehensively improves the process capability of the circuit board.
- the protection range of chemical gold is determined after processing by the jet printer program
- the viscosity of the ink should be as low as the range suitable for spraying.
- the positional accuracy of the ink coating obtained by spraying itself is high, because it can be directly cured by ultraviolet light, so it does not need to be baked for a long time, and the deformation of the plate caused by thermal expansion and contraction for a long time is avoided. Therefore, the present invention saves the time cost and economic cost of making the screen printing screen, and has higher printing precision, and comprehensively improves the process capability of the circuit board.
- the chemical gold protection range is obtained according to the preset width of the edge of the chemical gold region determined by the actual target position, and the preset width is 2 to 3 mils. Because the spraying accuracy is easy to control, when designing the inkjet area online, only a width of 2 to 3 mils is required, and no larger distance is required to ensure the effect of gold. The narrowing of the inkjet area is also conducive to the design of the circuit can also be developed in the direction of higher density.
- the particle size of the particles in the selected ink is 100-1000 nm. In this way, the components in the selected ink have a smaller fineness, and will not leave serious unevenness on the PCB board and affect the effect of the gold.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention belongs to the technical field of manufacturing printed circuit boards (PCBs), and relates to a high-process-capability electroless gold plating process based on the application of jet printing ink in selective electroless gold plating, the process comprising the steps of: (1) photographing a target area of a PCB; (2) according to a photographed actual target position, determining an electroless gold plating protection range by means of jet printing machine program processing; (3) with reference to the electroless gold plating protection range, spraying selective electroless gold plating ink, which can be cured by ultraviolet light, onto the PCB by using a jet printing machine under the irradiation of a UV lamp, wherein the viscosity of the selective electroless gold plating ink is 5 to 20 mPa·s; (4) conducting electroless gold plating processing on the PCB; and (5) stripping the selective electroless gold plating ink from the PCB. By means of the present invention, the time and economic costs of manufacturing a screen printing forme are reduced, and the precision and speed of jet printing are higher, thereby fully improving the process capability of a circuit board.
Description
本发明涉及印刷电路板制造技术领域，特别涉及一种选化运用喷印油墨的高制程能力化金工艺。The invention relates to the technical field of printed circuit board manufacturing, in particular to a high-process-capacity gold-forming process that selectively uses inkjet printing ink.
目前PCB板厂生产高阶HDI表面处理为OSP+化金工艺，均为传统网印/干膜贴附模式，对OSP区域使用热固型抗化金油墨/干膜进行印刷保护。具体步骤一般为：制作丝印网版、印刷第一面、四段烘烤、印刷第二面、化金、剥墨。这种方法存在诸多问题：At present, the high-end HDI surface treatment produced by the PCB board factory is OSP + chemical gold process, which are all traditional screen printing/dry film attachment modes, and use thermosetting chemical-resistant gold ink/dry film for printing protection on the OSP area. The specific steps are generally: making a screen printing screen, printing the first side, four-stage baking, printing the second side, gold melting, and ink stripping. There are a number of problems with this approach:
(1)每印刷一种产品都要制作一次丝印网版，还要考虑损耗，需要付出网版制作成本，而且效率很慢，产品越大，成本越高；(1) Every time a product is printed, a screen printing screen must be produced, and the loss must be considered. The screen production cost needs to be paid, and the efficiency is very slow. The larger the product, the higher the cost;
(2)丝网印刷需要一面一面地印刷，每次印刷完都要等到烤干才能再印刷另一个面，费时很长；(2) Screen printing needs to be printed side by side. After each printing, it takes a long time to wait until the other side is dried before printing the other side;
(3)PCB板经过烘烤后会产生不确定的涨缩，对加工的质量控制产生了很大的困难。(3) After the PCB board is baked, it will produce uncertain expansion and contraction, which brings great difficulties to the quality control of processing.
因此有必要开发一种新的工艺来解决以上问题。Therefore, it is necessary to develop a new process to solve the above problems.
发明内容SUMMARY OF THE INVENTION
本发明的主要目的在于提供一种选化运用喷印油墨的高制程能力化金工艺，能够提升PCB板的制程能力。The main purpose of the present invention is to provide a high-process-capacity gold chemical process that selectively uses inkjet printing ink, which can improve the process capability of the PCB board.
本发明通过如下技术方案实现上述目的：一种选化运用喷印油墨的高制程能力化金工艺，步骤包括：The present invention achieves the above-mentioned object through the following technical solutions: a kind of selective and selective use of high-process-capable gold-forming technology of jet printing ink, the steps include:
①对PCB板的标靶区域进行拍摄；① Take pictures of the target area of the PCB board;
②根据拍摄到的实际标靶位置，经过喷印机程序处理，确定化金保护范围；②According to the actual target position photographed, the protection range of chemical gold is determined after processing by the jet printer program;
③参照化金保护范围，在UV灯照射下利用喷印机向PCB板喷涂可紫外固化的选化油墨，所述选化油墨的粘度5～20mPa·s；③ Referring to the protection range of chemical gold, use a jet printer to spray UV-curable selective ink on the PCB under UV lamp irradiation, and the viscosity of the selective ink is 5-20 mPa·s;
④对PCB板进行化金加工；④Chemical gold processing of PCB board;
⑤将选化油墨从PCB板上剥离。⑤ Peel off the selected ink from the PCB board.
具体的，所述化金保护范围是根据实际标靶位置确定的化金区域的边缘外偏预设的宽度得到，所述预设的宽度为2～3mil。Specifically, the chemical gold protection range is obtained according to a preset width of the edge of the chemical gold region determined by the actual target position, and the preset width is 2-3 mils.
具体的，所述选化油墨中颗粒物粒径为100～1000nm。Specifically, the particle size of the particles in the selected ink is 100-1000 nm.
本发明技术方案的有益效果是：The beneficial effects of the technical solution of the present invention are:
本发明节省了制作丝印网版的时间成本和经济成本，而且喷印精度更高，速度更快，全面提升了线路板的制程能力。The invention saves the time cost and economic cost of making the screen printing screen, and has higher printing precision and faster speed, and comprehensively improves the process capability of the circuit board.
下面结合具体实施例对本发明作进一步详细说明。The present invention will be further described in detail below in conjunction with specific embodiments.
实施例：Example:
本发明的一种选化运用喷印油墨的高制程能力化金工艺，其步骤包括：A kind of selective and selective use of high process capability of spray printing ink of the present invention gold process, the steps include:
①对PCB板的标靶区域进行拍摄；① Take pictures of the target area of the PCB board;
②根据拍摄到的实际标靶位置，经过喷印机程序处理，确定化金保护范围；②According to the actual target position photographed, the protection range of chemical gold is determined after processing by the jet printer program;
③参照化金保护范围，在UV灯照射下利用喷印机向PCB板喷涂可紫外固化的选化油墨，所述选化油墨的粘度5～20mPa·s；③ Referring to the protection range of chemical gold, use a jet printer to spray UV-curable selective ink on the PCB under UV lamp irradiation, and the viscosity of the selective ink is 5-20 mPa·s;
④对PCB板进行化金加工；④ Chemical gold processing of PCB board;
⑤将选化油墨从PCB板上剥离。⑤ Peel off the selected ink from the PCB board.
因为本方法中采用喷印的方法给PCB板的化金范围外涂上选化油墨，所以油墨的粘度要低至适宜喷涂的范围。喷涂本身得到的油墨涂层位置精度高，因为可以直接进行紫外固化，所以不需要经过长时间的烘烤，又避免了板材长时间受热涨缩导致的变形。所以本发明节省了制作丝印网版的时间成本和经济成本，而且喷印精度更高，全面提升了线路板的制程能力。对本公司制造的一种PCB板，用丝网印刷80片产品在选化阶段需要210min，而用喷印机同样印刷80片产品在选化阶段只需要80min，而每片产品的成本降低约2％。Because the method of spray printing is used in this method to coat the selective ink outside the chemical gold range of the PCB board, the viscosity of the ink should be as low as the range suitable for spraying. The positional accuracy of the ink coating obtained by spraying itself is high, because it can be directly cured by ultraviolet light, so it does not need to be baked for a long time, and the deformation of the plate caused by thermal expansion and contraction for a long time is avoided. Therefore, the present invention saves the time cost and economic cost of making the screen printing screen, and has higher printing precision, and comprehensively improves the process capability of the circuit board. For a PCB manufactured by our company, it takes 210 minutes to print 80 pieces of products with screen printing in the selection stage, while printing 80 pieces of products with an inkjet printer takes only 80 minutes in the selection stage, and the cost of each piece of product is reduced by about 2 %.
化金保护范围是根据实际标靶位置确定的化金区域的边缘外偏预设的宽度得到，预设的宽度为2～3mil。因为喷涂精度方便控制，所以在在线设计喷墨区域时，只需要2～3mil的宽度即可，而不需要留更大的距离来保证化金效果。喷墨区域变窄也有利于使线路的设计也可以往更高密度的方向发展。The chemical gold protection range is obtained according to the preset width of the edge of the chemical gold region determined by the actual target position, and the preset width is 2 to 3 mils. Because the spraying accuracy is easy to control, when designing the inkjet area online, only a width of 2 to 3 mils is required, and no larger distance is required to ensure the effect of gold. The narrowing of the inkjet area is also conducive to the design of the circuit can also be developed in the direction of higher density.
选化油墨中颗粒物粒径为100～1000nm。这样选化油墨中的成分有更小的细度，不会在PCB板上留下严重的凹凸不平而影响化金效果。The particle size of the particles in the selected ink is 100-1000 nm. In this way, the components in the selected ink have a smaller fineness, and will not leave serious unevenness on the PCB board and affect the effect of the gold.
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。The foregoing are merely some of the embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention.
Claims (3)
- 一种选化运用喷印油墨的高制程能力化金工艺，其特征在于步骤包括：A high-process-capacity gold chemical process for selectively utilizing jet printing ink, characterized in that the steps include:①对PCB板的标靶区域进行拍摄；① Take pictures of the target area of the PCB board;②根据拍摄到的实际标靶位置，经过喷印机程序处理，确定化金保护范围；②According to the actual target position photographed, the protection range of chemical gold is determined after processing by the jet printer program;③参照化金保护范围，在UV灯照射下利用喷印机向PCB板喷涂可紫外固化的选化油墨，所述选化油墨的粘度5～20mPa·s；③ Referring to the protection range of chemical gold, use a jet printer to spray UV-curable selective ink on the PCB under UV lamp irradiation, and the viscosity of the selective ink is 5-20 mPa·s;④对PCB板进行化金加工；④ Chemical gold processing of PCB board;⑤将选化油墨从PCB板上剥离。⑤ Peel off the selected ink from the PCB board.
- 根据权利要求1所述的选化运用喷印油墨的高制程能力化金工艺，其特征在于：所述化金保护范围是根据实际标靶位置确定的化金区域的边缘外偏预设的宽度得到，所述预设的宽度为2～3mil。The high-process-capability chemical gold process for selective use of inkjet printing ink according to claim 1, wherein the chemical gold protection range is a preset width of the edge of the chemical gold region determined according to the actual target position. It is obtained that the preset width is 2-3 mils.
- 根据权利要求1所述的选化运用喷印油墨的高制程能力化金工艺，其特征在于：所述选化油墨中颗粒物粒径为100～1000nm。The high-process-capability gold chemical process for selective and selective use of inkjet printing ink according to claim 1, characterized in that: the particle size of the particles in the selective ink is 100-1000 nm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/071398 WO2022151013A1 (en) | 2021-01-13 | 2021-01-13 | High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating |
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| PCT/CN2021/071398 WO2022151013A1 (en) | 2021-01-13 | 2021-01-13 | High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating |
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2021
- 2021-01-13 WO PCT/CN2021/071398 patent/WO2022151013A1/en active Application Filing
Patent Citations (6)
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| KR101679697B1 (en) * | 2016-04-19 | 2016-11-25 | 주식회사재인써키트 | A printed circuit board manufacturing method |
| CN108575058A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of half bore plate producing process |
| CN106993378A (en) * | 2017-05-04 | 2017-07-28 | 东莞联桥电子有限公司 | A kind of pcb board selective surface handling process |
| CN110248470A (en) * | 2019-04-29 | 2019-09-17 | 惠州中京电子科技有限公司 | A kind of production method of the unmanned electromechanical source printed circuit board of civilian high-speed transfer |
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