KR101679697B1 - A printed circuit board manufacturing method - Google Patents

Abstract

Provided are a method of manufacturing a printed circuit board (PCB) and a film to prepare the printed circuit board. The method of manufacturing the printed circuit board comprises: a step of preparing plate net and exposure films to which a pattern and a marker are applied in a state which a pattern and the marker to be applied to the PCB are determined respectively; a step of applying the pattern and the marker to a plate net using one of a plurality of films; a step of printing photosensitive solution on the PCB in a pattern using the plate net to which the pattern and the marker are applied; a step of radiating ultraviolet rays to the PCB to apply the pattern formed on an exposure working film to the PCB in a state which the film and the PCB are aligned to a position of the pattern using the marker; a step of immersing a non-patterned copper foil of the PCB exposed to ultraviolet rays in a ferric chloride solution to melt the non-patterned copper foil; and a step of drying the PCB from which the non-patterned copper foil is removed. According to the related art, when the PCB is manufactured through light exposure in accordance with a related art since the film and the PCB are aligned with each other with a pin, it is difficult to precisely align them, thus an error rate is about 0.1-0.15% or more. However, in accordance with the present invention, when the PCB is exposed using the film to which the marker is applied, the positions are primarily aligned through a pin like the related art and the film, and the PCB are secondarily aligned with each other through the marker such that the error rate of the PCB is greatly decreased to be 0.1% or less.

Description

[0001] The present invention relates to a method of manufacturing a printed circuit board,

The present invention relates to a method of manufacturing a printed circuit board, and more particularly, to a method of manufacturing a printed circuit board by mixing a printed circuit board with an IR method and an exposure method, And more particularly, to a method of manufacturing a printed circuit board.

A masking printing technique using a screen printing plate is used to fabricate a coating layer or a printed circuit board.

As an example of the application of masking printing technique, the printed circuit board is solidifying its position as one of the electronic components at the same time as the development of semiconductors and electronic devices. It is used in various electronic and electrical products such as radio, television, PCB, And is widely used as a component for realizing circuits of all electric and electronic devices.

Recently, as technological advances in this field have become remarkable, a high quality of a printed circuit board has been demanded, which has led to a rapid increase in density.

The manufacturing process of the printed circuit board will be described with reference to the manufacturing process of the printed circuit board, such as the outer shaping step, the multilayer substrate forming step, the outer layer exposure step, the copper plating step, the solder plating step comprising the tin and lead alloy, the surface treatment step, the first PSR (photo solder resist) A second PSR step, a marking printing step, a terminal plating step, and a horizontal HASL (hot air solder leveling) step.

A printed circuit board is formed on the insulating substrate together with a plurality of fine conductor patterns together with a through hole, and a large number of various kinds of small electronic parts are grounded on one side of the through hole. The conductor pattern plated with the fine copper of the substrate is composed of a through hole for connecting a plurality of terminals to each end in addition to the circuit of the substrate.

In the hard gold plating step corresponding to the terminal plating step performed for excellent connection of electronic components during the manufacturing process of the printed circuit board, only a necessary portion of the wiring pattern formed with the conductor pattern and the fine through- It is very important to select a protective ink for screen printing masking which can obtain a gold-plated surface which can be plated and which can be easily peeled off after the work and can be easily removed.

In the composition of the protective ink for peelable printing masking used to expose only a certain portion of the circuit board known so far and the use method of the peelable protective ink used conventionally, These volatile solvents are vaporized and diffused, which is one of the factors that adversely affects the atmosphere. Thus, the use of the volatile solvents is regulated in terms of environment.

Therefore, in the case of the present domestic, in particular, when the gold plating is performed, the masking tape is adhered manually around the periphery excluding the portion to be plated. Further, when the shape of the conductor pattern is complicated or the size of the through hole is different, Since the tape must be cut to fit each shape, it is inefficient, requires a lot of time and manpower, and has limitations in reducing the generation of defective products.

Moreover, in order to prevent the plating solution from penetrating, it is difficult to peel off after plating, since the tape must be attached and pressed by a roller after heat treatment to completely adhere to the substrate. In order to remove the adhesive remaining on the substrate, In this case, since it is highly volatile, it is inconvenient to use a large amount of medicines.

On the other hand, when a solvent-type (two-part type) screen printing ink which can be peeled off and used for preventing scratching of a gold-plated layer is replaced with a protective ink for gold plating, When a large number of protruding protrusions that flow into a through hole of a fine inner diameter of a printed circuit board are peeled and removed together with a film form film, the protrusions in the coat film and the through holes are broken and the remnant protrusions in the through- It is troublesome to manually remove each of them. When the through-hole inner diameter is as small as 1 mm or less, it is difficult to manually remove the protruding portion which is short-circuited in the film, There is a problem in the use as a protective ink for printed circuit boards for gold plating of circuit boards There are many in the domestic industry at present is not available at all.

Recently, vacuum deposition and plasma vacuum deposition techniques have been utilized as techniques for coating and depositing a surface. Plasma vacuum deposition is a method of forming a plasma around a target made of a material to be deposited on a substrate disposed in a vacuum chamber so that a substance emitted from the target is deposited on the substrate by ion bombardment in the plasma.

In recent years, a magnetron sputtering source which can obtain a high deposition rate at a relatively low pressure is widely used. The source for forming the plasma is already well known. Normally, a negative voltage is applied to the target to attract ions from the plasma to accelerate it to the target surface. When such ions impinge on the target surface, a momentum is supplied to the target atoms to emit in a direction opposite to the direction of ion incidence . The emitted target atoms are moved from the target to a substrate disposed nearby and coated on the surface thereof.

The sputtering process as described above is widely used for metal wiring layer forming processes of semiconductors, reflective layers of compact discs and CD-ROMs, active layers of hard disks for computer memories, and coating of metal layers for other functional and decorative applications.

As a prior art for solving the above-mentioned problems, a " fine pattern coating method using a masking frit and a vacuum deposition " in Laid-Open Patent Application No. 2016-1113634 (published on May 2, 2015) determines a design for coating a coating layer step; Preparing protective inks for masking comprising 18 to 30% by weight of polyvinyl alcohol, 2 to 8% by weight of monoacrylic ester, 10 to 15% by weight of acrylic acid, 16 to 24% by weight of ethanol and 30 to 50% ; Applying a film and a screen printing plate to a portion of the film other than a portion to be designed with the protective ink for masking; Vacuum-depositing a coating liquid on the coated layer on which the protective ink for masking is applied; And removing the protective ink for masking with water.

Prior art processes in which the remaining portions except for the portion desired to be designed are printed with a protective ink for masking and then subjected to a vacuum deposition or a plasma vacuum deposition and then treated with water are subjected to a protective ink printing for masking, Since the coating solution is vacuum-deposited again, the work process is doubled, resulting in a problem that the production is reduced by twice as compared with the conventional method.

Patent Document: Published Patent Publication No. 2016-1113634 (published on Feb.

In order to solve the above problems, the present invention provides a printed circuit board which can reduce the risk of the soldering of the printed circuit board by combining the IR system and the exposure system on the printed circuit board, A method for manufacturing a substrate, and a film for producing a printed circuit board.

The present invention also provides a method for manufacturing a printed circuit board and a method for manufacturing a printed circuit board, which are capable of reducing the amount of photosensitive liquid and reducing the risk of cold soldering on a printed circuit board, The purpose of this paper is to provide

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board, the method comprising the steps of: preparing a patterning and exposure film to which a pattern and a marker are applied together with a pattern to be applied to a PCB and a marker pattern; Preparing a pattern and a marker to be applied to a test grid by using one of a plurality of films; Printing a sensitizing solution on the PCB in the form of a pattern using a test network to which a pattern and a marker are applied; Irradiating the ultraviolet ray to apply the pattern formed on the film to the PCB in a state where the pattern of the exposure work film and the PCB to be exposed are precisely aligned with the markers; Dissolving a copper chloride solution in which a pattern is not formed on a PCB irradiated with ultraviolet rays; And peeling the copper foil from the portion where no pattern is formed on the PCB and drying the same.

The resist printing film of the present invention is characterized in that the solder pad area is formed by enlarging the area of the PCB by 1 mm to 5 mm from the area to which the photosensitive liquid is applied.

The PCB printing film of the present invention is formed to have the same size as that of the pattern formed on the PCB, thereby performing exposure.

The markers of the present invention are formed on a plurality of films, a test panel made of the film, and a PCB panel, respectively, and the positions of the film, the plate network, the test board, the PCB, .

The film for manufacturing a printed circuit board according to the present invention forms a film for a protective film for applying a marker and a pattern to a test network, and a film for exposure for exposure on a PCB to which a marker and a pattern are applied, Pattern is applied.

The present invention can implement printing on a printed circuit board from 0.1 mm to a maximum of 0.08 mm on a printed circuit board, and also facilitates management of tolerances within +/- 0.05.

The present invention relates to a method of manufacturing a photomask, which comprises preparing a plurality of films for use in a test network and a photomask for use in PCB exposure, respectively, and forming patterns of different thicknesses on the film, Thereby forming a PCB pattern, thereby reducing the amount of the photosensitive liquid that is unnecessarily discarded.

Further, since the probability that the photosensitive liquid is separated from the PCB panel when the photosensitive liquid is cured is remarkably less than that of the prior art, the cured photosensitive liquid is prevented from mounting the component by placing the cured photosensitive liquid in the solder pad There is an effect of solving the problem of the problem.

In addition, since the printed circuit board of the present invention aligns the positions of the film and the PCB through the pins when the PCB is manufactured by conventional exposure, the defective rate is about 0.1 to 0.15% or more since the precision alignment can not be performed. However, When a marker is applied to a PCB to expose it to the PCB, the position is firstly aligned through the pins as in the conventional case, and the film is finally aligned with the PCB through the marker again, so that the PCB defect rate is remarkably lower than 0.1% There is an effect of lowering.

1 is a block diagram showing a method of manufacturing a printed circuit board according to the present invention;
FIG. 2 is a schematic view showing a state in which the marking and the pattern of the present invention are applied to a test network using a film for a protective film. FIG.
FIG. 3 is a schematic view showing a state of printing on a PCB using a marking and pattern network of the present invention. FIG.
4 is a schematic view showing a state in which a film for a PCB of the present invention is exposed in a state of being aligned on a PCB.
5 is a view showing a state in which markers are integrally formed on the film of the present invention.
6 is a view showing a state in which markers are integrally formed in a trial network of the present invention.
7 is a view showing an actual developed state of the PCB of the present invention after exposure.
8 to 10 are test reports showing the results of EDS analysis of PCBs produced by the method of manufacturing a printed circuit board of the present invention.
11 is a photograph showing a result of analyzing a PCB generated through a general printed circuit board manufacturing method through EDS.
FIG. 12 is a photograph showing a result of analysis of a PCB generated through a general printed circuit board manufacturing method through an SEM. FIG.

Hereinafter, a method of manufacturing a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention. FIG. 2 is a schematic view illustrating a state in which the film is applied to a test network using a marker film and a patterned film according to the present invention. FIG. 3 is a schematic view showing a state of printing on a PCB using a marking and patterning network of the present invention. FIG. 4 is a schematic view showing a state in which the PCB film of the present invention is exposed on a PCB, FIG. 5 is an embodiment showing a state in which markers are integrally formed on the film of the present invention, FIG. 6 is an embodiment showing a state in which markers are integrally formed in a test grid according to the present invention, FIGS. 8 to 10 are test results showing the results of EDS analysis of PCBs produced by the method of manufacturing a printed circuit board of the present invention.

Referring to FIGS. 1 to 10, a method for manufacturing a printed circuit board and a film for manufacturing a printed circuit board according to the present invention first determines a design for printing a pattern on a PCB 40, A plurality of films 10 to be used in the exposure work and the screen 30 are formed (S10).

The dicer includes not only the pattern but also a marker 20 for precisely aligning the film and the PCB when the PCB is exposed to light using a film.

One of the plurality of films 10 is used to print the markers 20 and the pattern on the test grid 30 in the test grid 30 and the other is used to apply the pattern to the PCB 40 by exposure .

The film 10 used for printing the screen grid 30 among the plurality of films 10 may have a size of the solder pad formed on the PCB 40 when the solder pad area (area where the components are soldered) And more preferably about 1 mm to 5 mm.

It is preferable that the pattern of the film 10 used for exposure of the PCB 40 is formed in the same size as the pattern size of the PCB 40 so that the PCB 40 is exposed.

Since the patterns formed on the film 10 for the screen grid 30 have a larger pattern size formed on the PCB 40 as described above, the consumption of the photosensitive liquid can be remarkably reduced and, at the same time, Which is located on the pad, prevents the problem of obstructing the mounting of the component, and has an advantage that the precise pattern is applied to the PCB.

A plurality of films 10 are formed on a PCB 40 to form a test net 30 for applying a sensitizing solution to the PCB 40. A plurality of films 10 having a solder pad portion of 1 mm to 5 mm (S20) is performed to fabricate the trial net 30 to be applied.

The photoresist solution is applied to the PCB 40 in the form of a pattern through the test strip 30 so that the markers 20 for precisely matching the positions of the test strip 30 and the PCB 40 are applied together S30).

The markers 20 are applied together with the grid 30 when the pattern of the film 10 is formed in the grid 30 and the pattern of the grid 30 is applied to the PCB 40, To precisely match the position of the film and the PCB when exposing the PCB to light.

The marker 20 may be formed in a separate form such as a coupon or a card. However, when the PCB 40 is exposed using the film 10, the positions of the patterns must be precisely aligned. It is not preferable to use it in the form of a film.

The markers 20 are not only formed as shown in FIGS. 4 to 7, but may be variously formed as long as they can precisely align the film and the PCB. For example, a circle may be formed in a square shape, a circle or a square may be formed in a cross shape, a hexagon may be applied in a square shape, and the like.

Since the position of the grid 30 and the PCB 40 can be precisely aligned by the marker 20, a problem that the recycled photosensitive liquid is separated from the solder pad by applying a precise pattern to the PCB 40 is solved There is an advantage that the defect rate is close to '0'.

It is preferable that the pattern formed on the PCB 40 is coated with a photosensitive liquid so that the pattern is formed to be about 1 mm to about 5 mm larger than the pattern of the film 10 used for exposure.

A pattern formed on the film 10 on the PCB 40 to which the photosensitive liquid is applied using the other film 10 of the plurality of films 10 after applying the photosensitive liquid to the PCB 40 using the test net 30; (S40) is performed so that a pattern is formed on the PCB 40 so that ultraviolet rays are generated so as to apply the ultraviolet rays.

The film 10 applied when the PCB 40 is exposed is actually made to have the same size as the pattern finally applied to the PCB 40 so that the portion of the photosensitive solution to be washed away during etching is significantly reduced Therefore, unnecessary consumption of the photosensitive liquid can be prevented.

In addition, since the phenomenon that the cured photosensitive liquid falls off is remarkably smaller than in the conventional art, the problem that components are not mounted on the solder pad can be prevented.

In step S40, the PCB 40 is exposed using a film, and a process of dissolving the untreated copper foil of the PCB 40 in the softened ferric solution for a predetermined time is performed (S50).

The process of peeling the copper foil can be easily implemented by a person having ordinary skill in the art, so a detailed description thereof will be omitted.

Then, in step S50, unnecessary copper foil is peeled off to dry the PCB 40 to which the first determined pattern is applied (S60), and the PCB 40 to which the design of the original pattern is applied is produced.

The drying process is generally applied to a process of manufacturing a printed circuit board (PCB), so a detailed description thereof will be omitted.

As described above, according to the present invention, a plurality of films 10 are formed for forming the test pattern 30 and for exposure of the PCB 40, respectively, and the thickness of the pattern formed on the film 10 is measured So that the pattern is formed on the PCB 40 by different sizes when the photosensitive liquid is applied and exposed, thereby preventing unnecessary consumption of the photosensitive liquid.

Further, since the probability of the cold soldering phenomenon that the component is not mounted when the photosensitive liquid is cured is located at the solder pad portion of the PCB 40, the probability of the occurrence of the cold soldering phenomenon is remarkably lower than that of the prior art, The problem that the cured photosensitive liquid is located and hinders the mounting of the parts can be solved.

In other words, EDS (Energy Dispersive Spectrometry) is an excited state in which electrons are injected into an atom by injecting an electron beam into the sample. When excited electrons are stabilized, specific X-rays are emitted, Since the intrinsic energy emitted by the line is different, the results are shown in Fig.

11, dewetting is confirmed in a soldering portion in a PCB produced through a general PCB manufacturing process, and there is a problem that exposure of the Au layer occurs sporadically rather than in a specific portion of the product.

In addition, as a result of enlarging the soldering portion in a PCB produced through a process of manufacturing a PCB by printing on a PCB using a test network, or a process of exposing a PCB using a master film, As a result of checking the content of impurities on the surface of the PCB through SEM (Scanning Electron Microscope), the organic contamination source on Au surface after ENIG (Electroless Ni / immersion Au) The results were confirmed.

However, the present invention analyzes the EDS (Energy Dispersive Spectrometer) component of a PCB produced through a method of manufacturing a printed circuit board.

As a result of the above-described component analysis, the results shown in FIGS. 8 to 10 were obtained.

As a result, it was confirmed that the component of the plating layer Ni was detected as a result of the EDS analysis of the area 1 and 2 of the pattern formed part on the PCB, and it was confirmed that the '0' component such as oxidation was not detected .

That is, as shown in FIGS. 11 and 12, when the content of impurities was checked on the surface of the PCB 40, the organic contamination did not remain on the Au surface after ENIG (Electroless Ni / immersion Au) It is possible to eliminate the disturbing dewetting defect, and the defect of the PCB 40 can be reduced to less than 0.1%.

In addition, since the printed circuit board produced by the above-described manufacturing process aligns the positions of the film 10 and the PCB 40 through the pins when the PCB 40 is manufactured by conventional exposure, precise alignment is performed However, in the present invention, when exposure is performed on the PCB 40 using the film 10 to which the markers 20 are applied, the position is firstly aligned through the pins as in the conventional case, Since the second film and the PCB are finally aligned with each other through the markers, there is an advantage that the defective ratio (less than 0.1%) of the PCB can be remarkably lowered.

10: Film
20: Marker
30: The trial network
40: PCB

Claims (7)

A method of manufacturing a printed circuit board,
(S10) of fabricating a reticle and a photographic film (10) to which a pattern and a marker (20) are applied together while a pattern to be applied to the PCB (40) and a pattern of the marker (20) are determined;
(S20) of fabricating the test grid (30) so that the pattern and the markers (20) are applied to the test grid (30) using the test film (10);
A step (S30) of printing the sensitizing solution in the form of a pattern on the PCB 40 using the pattern and the grid 30 to which the marker 20 is applied;
A process of irradiating the PCB 40 with ultraviolet rays so that the pattern formed on the film for exposure 10 is applied in a state where the pattern of the exposure work film 10 and the PCB 40 to be exposed are precisely aligned using the markers 20 (S50);
A process (S60) of dissolving a copper chloride solution in which a pattern is not formed on a PCB 40 irradiated with ultraviolet rays, by immersing the solution in a ferric chloride solution;
A step (S70) of peeling the copper foil on the part where the pattern is not formed on the PCB 40 and drying it;
Wherein the step of forming the printed circuit board comprises the steps of:
The method according to claim 1,
The solder pad region of the film for protective film (10)
Is formed to have a thickness of 1 mm to 5 mm larger than a region of the solder pad formed on the PCB (40).
The method according to claim 1,
The PCB (40) for exposure film (40)
Wherein the pattern is formed to have the same size as that of the pattern formed on the PCB (40) so that exposure is performed.
The method according to claim 1,
The marker (20)
The protective film 10 and the protective film 10 are respectively formed on the protective net 30 and the PCB 40 manufactured using the film for protective film 10,
Wherein the position of the pattern is adjusted by adjusting the position of the exposure film (10) and the PCB (40).
A film for producing a printed circuit board,
The film (10)
The marker 20 and the film for exposure and the film 10 to which the pattern is applied,
The film for protective film 10 allows the marker 20 and the pattern to be applied to the test net 30,
The positions of the markers 20 of the PCB 40 to be exposed are precisely adjusted by the exposure work film 10 so that the pattern formed on the exposure film 10 is applied to the PCB 40 Wherein the film is a film for producing a printed circuit board.
6. The method of claim 5,
The test strip (30) printing film (10)
Wherein the solder pad area is formed by enlarging the solder pad area by 1 mm to 5 mm from the initially set design.
6. The method of claim 5,
The PCB (40) for exposure film (40)
Wherein the pattern is formed to have the same size as that of the pattern formed on the PCB (40) so that exposure is performed.

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