JP2583702B2 - Manufacturing method of printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of printed wiring boards.
It is about the method .

[0002]

2. Description of the Related Art FIGS. 4 and 5 are a plan view and a side sectional view, respectively, showing a conventional printed wiring board.
Reference numeral 1 denotes a target mark for automatic mounting recognition (hereinafter simply referred to as a mark) provided on a first surface of the substrate 6, and 2 denotes a substrate 6
(The first surface and the second surface opposite to the first surface)
The solder resist 2a of the ultraviolet exposure type provided on the surface (1) is a clearance portion having no solder resist provided around the mark 1, 3 is a V cut line, and 4 is a discard plate portion cut from the V cut line 3. It is.

FIG. 6 is a side sectional view showing a step of forming the solder resist 2, wherein 7a and 7b are ultraviolet light sources, 8a and 8b are exposure films for masking the solder resist 2, and 8c is a film 8a. The mask pattern 2b for masking the clearance 2a is a remaining portion of the solder resist 2.

Next, the operation will be described. In FIG. 6A, after applying the solder resist 2 on both surfaces of the substrate 6, films 8a and 8b are arranged on both upper and lower sides of the substrate 6, and both surfaces are simultaneously exposed by the light sources 7a and 7b. After the exposure, by performing development and cleaning, a portion of the solder resist 2 that is not exposed by the mask pattern 8c is removed.

In this case, if the exposure is properly performed,
The unexposed solder resist 2 is removed by the mask pattern 8c to form a clearance 2a as shown in FIGS .

On the other hand, when performing the double-sided simultaneous exposure,
In FIG. 6A, when the light from the lower light source 7b passes through the substrate 6, the solder resist 2 on the first surface is exposed, and therefore, as shown in FIG. The remaining portion 2b of the solder resist 2 is formed, and the clearance portion 2a is not formed. The mark 1 is a reference coordinate when the circuit component is mounted by the automatic mounting device, and is made of copper foil or the like. After the circuit components are mounted, the discard plate 4
It is cut off from the cut line 3.

[0007]

Since the solder resist 2 of the conventional printed wiring board is formed by the above-described method, when the double-sided simultaneous exposure is performed by the light sources 7a and 7b, the upper light source 7b is used by the lower light source 7b. In some cases, the resist 2 is exposed, and the clearance 2a cannot be formed. Therefore, the mark 1 becomes unclear, and there is a problem that automatic mounting recognition becomes difficult.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and a printed wiring board capable of forming a clearance portion reliably even when two-sided simultaneous exposure is performed.
It is intended to obtain a manufacturing method of the.

[0009]

According to the present invention, there is provided a method of manufacturing a printed wiring board , comprising the steps of:
Providing a target mark; and forming the first mark on the substrate.
Target for automatic mounting recognition on a second surface opposite to the surface
Face the clearance to be formed around the
At a position that is approximately the same size as the clearance and has light
Forming a pattern to be masked; and
An ultraviolet exposure type solvent is provided on the first surface and the second surface.
Steps of applying resist and performing simultaneous exposure on both sides
Is provided .

[0010]

With the method for manufacturing a printed wiring board according to the present invention ,
Formed a target mark for automatic board placement recognition
An automatic mounting recognition target on a second surface opposite to the first surface;
Opposed to the clearance to be formed around the get mark
To have the same size as this clearance part
Since a pattern that masks light is formed,
Solder resist applied to the first surface even after exposure
The part where the clearance part should be formed is the light of the lower light source
Since there is no exposure, make sure the clearance
Can be achieved.

[0011]

[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. FIG.
1 to 3 are diagrams showing an embodiment of the present invention.
Target mark 1 for automatic mounting recognition, UV exposure
Optical type solder resist 2, clearance 2a, V
The cutting line 3, the discard plate 4, and the substrate 6 are shown in FIGS.
The description is omitted because it is the same as the conventional example shown. What
In the following explanation, the target
The mark is also called simply the mark. 1 and 2, reference numeral 5 denotes a mask pattern provided on the second surface of the substrate 6 for shielding light, which is made of copper foil or the like, and is located at a position facing the clearance 2a of the second surface. Provided and the above mark 1
Has the same size as or slightly larger than the same size as the clearance portion 2a. FIG. 3 is a side sectional view showing a step of forming the solder resist 2.

Next, the operation will be described. In FIG. 3 (a)
As shown, solder resist 2 is applied to both surfaces of substrate 6.
After exposure, the upper and lower sides of the substrate 6 on which the mark 1 is provided
Films 8a and 8b are arranged, and both light sources 7a and 7b are used.
Surface simultaneous exposure is performed. At this time, the light of the light source 7b is
5, this light transmits through the substrate 6 and
The solder resist 2 is not exposed. Of the light source 7a
The light is masked by the mask pattern 8c of the film 8a.
To shield the solder resist 2 from the solder resist 2 on the substrate 6
The area around the mark 1 is not exposed.

After exposure, development and washing remove the solder resist 2 at the portion masked by the mask pattern 8c, and as shown in FIG. 3B, FIG. 1 and FIG. It is formed.

Embodiment 2 FIG. Although the first embodiment shows the target mark for automatic mounting recognition provided on the discard plate portion 4 of the double-sided printed wiring board, the present invention relates to the target mark for automatic mounting recognition provided in the product part of the double-sided printed wiring board Can also be applied.

One or more mask patterns having substantially the same size as the clearance of the solder resist may be provided on the inner layer of the automatic mounting target mark provided in the discarded plate portion and the product portion of the multilayer printer wiring board.

[0016]

As is evident from the foregoing description, according to the present invention, pre
In the method of manufacturing a printed circuit board, an automatic
Providing a target mark for mounting recognition;
The automatic mounting recognition of the second surface opposite to the first surface of the
Clearance to be formed around the recognition target mark
At the position facing the part, approximately the same size as the clearance part
Forming a pattern for masking light, comprising:
An ultraviolet light exposure tool is provided on the first surface and the second surface of the substrate.
Step of applying solder resist and simultaneous double-sided exposure
And the step of performing
Form the clearance area of the applied solder resist.
Since the exposed part is not exposed by the light of the lower light source,
Clearance is formed with high precision even when both sides are exposed simultaneously
There is an effect that can be done .

[Brief description of the drawings]

FIG. 1 is a plan view showing a target mark part for automatic mounting recognition of a printed wiring board according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing a target mark portion for automatic mounting recognition of a printed wiring board according to an embodiment of the present invention.

FIG. 3 is a side sectional view showing a step of forming an ultraviolet exposure type solder resist in a target mark portion for automatic mounting recognition of a printed wiring board according to one embodiment of the present invention.

FIG. 4 is a plan view of a target mark section for automatic mounting recognition of a conventional printed wiring board.

FIG. 5 is a side sectional view of a target mark portion for automatic mounting recognition of a conventional printed wiring board.

FIG. 6 is a side sectional view showing a process of forming a conventional ultraviolet exposure type solder resist at a target mark portion for automatic mounting recognition of a printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Target mark for automatic mounting recognition 2 Ultraviolet exposure type solder resist 2a Clearance part 5 Pattern for mask 6 Substrate

Claims (1)

(57) [Claims] 1. A target for automatic mounting recognition on a first surface of a substrate.
Providing a set mark, and the first surface of the substrate.
Is the target mask for automatic mounting recognition on the second surface on the opposite side.
Position facing the clearance to be formed around the
A light mask having substantially the same size as the clearance portion
Forming a pattern to be formed on the substrate;
UV exposure type solder resist on the surface and the second surface
A process for applying a strike and a process for performing simultaneous exposure on both sides.
Method of manufacturing printed wiring boards.