KR970078781A

KR970078781A - Manufacturing method of printed circuit board

Info

Publication number: KR970078781A
Application number: KR1019960016762A
Authority: KR
Inventors: 권이장; 이성규; 안충선
Original assignee: 김연혁; 대덕산업 주식회사
Priority date: 1996-05-17
Filing date: 1996-05-17
Publication date: 1997-12-12

Abstract

본 발명은 인쇄회로 기판의 제조 방법에 관한 것으로, 양면에 동박이 접착된 기판에 다수의 홀을 형성하고, 동박이 형성된 상기 기판의 표면과 홀의 전체에 금속의 도금층을 얇게 형성하과, 상기 기판의 도금층이 형성된 상면과 하면의 표면과 홀의 전체에 자외선 경화형 잉크를 로울러, 디핑 또는 스프레이의 방법으로 골고루 도포하고, 회로 필름을 이용하여 회로가 되는 부분에 빛이 비추도록하는 노광을 수행하고, 빛이 안 비추어진 자외선 경화형 잉크를 현상의 공정을 통해 제거하고, 상기의 자외선 경화형 잉크가 제거된 부분의 도금층을 에칭의 공정을 통하여 부식시켜 제거한 다음 회로가 되는 부분의 자외선 경화형 잉크를 제거하는 과정에 의해 수행되도록 함으로써 공정의 단축과 생산성의 향상 및 원가 절감의 효과를 얻도록 한 것이다.The present invention relates to a method of manufacturing a printed circuit board, which comprises forming a plurality of holes on a substrate having a copper foil adhered on both surfaces thereof, thinly forming a metal plating layer on the entire surface of the substrate on which the copper foil is formed, An ultraviolet curable ink is uniformly applied to the entire upper and lower surfaces of the plated layer and the holes by the method of roller, dipping or spraying, and exposure is performed by using a circuit film so that light is projected onto a circuit portion, By removing the ultraviolet curable ink that is not exposed through the developing process, etching the plating layer of the portion from which the ultraviolet curable ink is removed through the etching process to remove the ultraviolet curable ink, So as to shorten the process, improve the productivity, and reduce the cost.

Description

Manufacturing method of printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명의 실시예에 따른 인쇄회로 기판의 제조 과정을 나타낸 개략도.FIG. 2 is a schematic view showing a manufacturing process of a printed circuit board according to an embodiment of the present invention; FIG.

Claims

A method of manufacturing a printed circuit board in which a plurality of holes are formed on a substrate to which copper foils are bonded on both surfaces thereof by a method of hole processing of CNCs and a thin metal plating layer is formed on the entire surfaces and holes, Forming a photosensitive layer by uniformly coating an upper surface and a lower surface of the hole formed with the plating layer and a hole in the hole and exposing the photosensitive layer of the substrate with a desired circuit pattern; A step of removing the ultraviolet curable ink layer by etching, a step of removing the ultraviolet curable ink layer by etching, a step of removing the ultraviolet curable ink layer by etching, Wherein the method comprises the steps of:

The method of manufacturing a printed circuit board according to claim 1, wherein a photosensitive layer of ultraviolet curable ink is simultaneously formed on the surface and the hole of the substrate.

※ Note: It is disclosed by the contents of the first application.