KR20010056862A - Method for plugged via hole in flexible substrate - Google Patents

Method for plugged via hole in flexible substrate Download PDF

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Publication number
KR20010056862A
KR20010056862A KR1019990058512A KR19990058512A KR20010056862A KR 20010056862 A KR20010056862 A KR 20010056862A KR 1019990058512 A KR1019990058512 A KR 1019990058512A KR 19990058512 A KR19990058512 A KR 19990058512A KR 20010056862 A KR20010056862 A KR 20010056862A
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KR
South Korea
Prior art keywords
photosensitive polyimide
via hole
foil
flexible substrate
glass mask
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KR1019990058512A
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Korean (ko)
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위홍복
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이형도
삼성전기주식회사
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Priority to KR1019990058512A priority Critical patent/KR20010056862A/en
Publication of KR20010056862A publication Critical patent/KR20010056862A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/48—Protective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/92—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof prepared from printing surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/18—Coating curved surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]

Abstract

PURPOSE: A method for forming a via hole of a flexible substrate is provided which forms a fine sized via hole by an exposing process of a photosensitive polyimide through a glass mask, easily changes the pattern of the via hole of the flexible substrate by simply changing he glass mask, and prevents a copper foil from getting off. CONSTITUTION: The method comprises steps of: (i) laminating a copper foil(120) on the top side of a cover film(110) consisting of an epoxy resin by interposing an adhesive between them; (ii) coating the top side of the copper foil with a photosensitive polyimide(130) in a regular thickness by using a roller; (iii) drying the photosensitive polyimide coated on the top side of the copper foil in a drying furnace at a 150-200 deg.C; and (iv) after putting a glass mask on the top side of the dried photosensitive polyimide, exposing the photosensitive polyimide to the light to form a micro via hole(160) on the photosensitive polyimide.

Description

연성기판의 비아홀 형성방법{METHOD FOR PLUGGED VIA HOLE IN FLEXIBLE SUBSTRATE}Via-hole formation method of flexible substrate {METHOD FOR PLUGGED VIA HOLE IN FLEXIBLE SUBSTRATE}

본 발명은 연성기판(FLEXIBLE SUBSTRATE)의 감광성 폴리이미드(polyimide)를 이용한 마이크로 비아홀(Via Hole)의 형성방법에 관한 것으로 이는 특히, 에폭시 수지로 구성되는 커버필름 상측으로 Cu 포일이 접착제를 개재하여 적층 부착토록 되고, 상기 Cu포일 상측에는 일정한 두께의 감광성 폴리이미드가 롤러를 이용하여 코팅토록 되며, 상기 감광성 폴리이미드 상측에는 글래스 마스크(Glass Mask)를 개재하여 노광작업에 의해 감광성 폴리이미드에 마이크로 비아홀을 형성토록 함으로 인하여, 연성기판의 폴리이미드에 미세한 크기의 비아홀 가공이 가능토록 되며, 연성기판의 비아홀 패턴 변경시, 글래스 마스크를 교환하는 간단한 작업에 의해 마이크로 비아홀을 손쉽고, 용이하게 형성할 수 있도록한 연성기판의 비아홀 형성방법에 관한 것이다.The present invention relates to a method for forming a micro via hole using a photosensitive polyimide of a flexible substrate (FLEXIBLE SUBSTRATE), in particular, Cu foil laminated on the cover film consisting of an epoxy resin through an adhesive On the upper side of the Cu foil, a photosensitive polyimide having a predetermined thickness is coated using a roller, and on the upper side of the photosensitive polyimide, a micro via hole is applied to the photosensitive polyimide by an exposure operation through a glass mask. Due to the formation, it is possible to process the via hole of minute size in the polyimide of the flexible substrate, and to easily and easily form the micro via hole by changing the glass mask when changing the via hole pattern of the flexible substrate. The present invention relates to a via hole forming method of a flexible substrate.

일반적으로 알려져있는 종래의 연성기판의 비아홀 형성방법에 있어서는, 필름상의 폴리이미드 테이프의 상측으로 접착재를 개재하여 에폭시 계로 구성되는 필름상의 커버필름을 부착한후, 금형 또는 레이져를 이용하여 폴리이미드 테이프에 비아홀을 형성하는 것이다.In the conventionally known method for forming a via hole of a flexible substrate, a film-like cover film composed of an epoxy system is attached to the polyimide tape by using a mold or a laser after attaching an epoxy-based film to the upper side of the film-like polyimide tape. To form a via hole.

이와같은 기술과 관련된 종래의 연성기판의 비아홀 형성방법에 있어서는 도 1에 도시한 바와같이, 필름상의 연성기판 재료인 폴리이미드 테이프(10)의 상측으로 접착제(20)를 개재하여 에폭시계 수지로 구성되는 커버필름(30)을 적층 부착토록 한후, 상기 커버필름(30)과 일체로 폴리이미드 테이프(10)를 펀치다이를 이용한 펀칭작업이나, 또는 레이져 작업에 의해 도 2에서와같은 비아홀(40)을 형성한후,상기 폴리이미드 테이프(10)의 커버필름(30)을 벗겨내고 이를 건조로에서 건조시켜, 상기 폴리이미드 테이프(10)에 동박을 코팅토록 함으로써, 연성기판(50)의 제작이 완료되는 것이다.In the conventional method of forming a via hole of a flexible substrate related to such a technique, as shown in FIG. 1, an epoxy resin is formed on an upper side of a polyimide tape 10, which is a film-like flexible substrate material, through an adhesive 20. After the cover film 30 is laminated, the polyimide tape 10 is integrally formed with the cover film 30 by punching work using a punch die, or by a laser work. After forming, the cover film 30 of the polyimide tape 10 is peeled off and dried in a drying furnace to coat copper foil on the polyimide tape 10, thereby producing the flexible substrate 50. Will be.

그러나, 상기와같은 종래의 연성기판(50)에 비아홀(40)을 형성할 경우에는, 폴리이미드 필름(10)의 건조후, 그 상측에 동박의 코팅시 내부에 잔존하는 습기등에 의해 기포가 발생하거나, 동박의 들뜸현상이 발생하여 불량이 생기게 되는 단점이 있는 것이다.However, in the case where the via holes 40 are formed in the conventional flexible substrate 50 as described above, after the polyimide film 10 is dried, bubbles are generated due to moisture remaining inside when the copper foil is coated on the upper side thereof. Or, there is a disadvantage in that the lifting of the copper foil occurs, which causes a defect.

또한, 상기 연성기판(50)에 형성되는 비아홀(40)은 펀치 또는 레이져 등과같은 기구물에 의해 제작되어 비이홀의 크기에 한계(0.2mm이상 가능)가 있는 관계로 미세한 크기의 비아홀 가공은 불가능하게 되고, 특히 칩의 실장을 위해 비아홀의 패턴이 병경되는 경우에는 별도의 펀치 금형을 제작함에 따른 경제적 손실이 가중되는등 많은 문제점이 있었던 것이다.In addition, since the via hole 40 formed in the flexible substrate 50 is manufactured by a mechanism such as a punch or a laser, the size of the via hole is limited (0.2 mm or more), and thus, the processing of the via hole having a minute size becomes impossible. In particular, when the via hole pattern is changed for mounting the chip, there are many problems such as economic loss due to the manufacture of a separate punch mold.

본 발명은 상기한 바와같은 종래의 여러 문제점들을 개선하기 위한 것으로서 그 목적은, 연성기판의 감광성 폴리이미드에 글래스 마스크를 통한 노광 작업에 의해 미세한 크기의 비아홀 가공이 가능토록 되며, 상기 연성기판의 비아홀 패턴 변경시, 글래스 마스크를 교환하는 간단한 작업에 의해 마이크로 비아홀을 손쉽고, 용이하게 형성할 수 있도록 함은 물론, Cu 포일에 인쇄된 감광성 폴리이미드의 건조후 노광 처리에 의해 Cu 포일의 들뜸 및 기포등이 전혀 발생되지 않는 연성기판의 비아홀 형성방법을 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. The object of the present invention is to enable the processing of via holes of a fine size by exposing a photomask to a photosensitive polyimide of a flexible substrate through a glass mask. When the pattern is changed, the micro via hole can be easily and easily formed by simply changing the glass mask, and the post-drying exposure process of the photosensitive polyimide printed on the Cu foil allows the Cu foil to be lifted and bubbled, etc. The present invention provides a method for forming a via hole of a flexible substrate which does not occur at all.

도 1은 일반적인 연성기판의 개략 구성도.1 is a schematic configuration diagram of a general flexible substrate.

도 2는 종래 비아홀이 형성된 연성기판의 평면 구조도.Figure 2 is a plan view of a conventional flexible substrate formed via hole.

도3 A ∼ D는 본 발명에 따른 연성기판의 비아홀 형성방법을 설명하기 위한 개략 공정도.3A to 3D are schematic process diagrams for explaining a method for forming via holes in a flexible substrate according to the present invention.

도 4는 본 발명의 비아홀이 형성된 연성기판의 정단면 구조도.Figure 4 is a front cross-sectional structure diagram of a flexible substrate on which a via hole of the present invention is formed.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

100...연성기판 110...커버필름100 ... flexible substrate 110 ... cover film

120...Cu 포일 130...감광성 폴리이미드120 ... Cu foil 130 ... Photosensitive polyimide

140...롤러 150...글래스 마스크140 ... roller 150 ... glass mask

160...비아홀160 ... Via Hall

상기 목적을 달성하기 위한 기술적인 구성으로서 본 발명은, 에폭시 수지로 구성되는 커버필름 상측으로 Cu 포일이 접착제를 개재하여 적층토록 되는 Cu포일 적층단계와;The present invention as a technical configuration for achieving the above object, Cu foil laminated step to be laminated on the cover film consisting of epoxy resin via an adhesive;

상기 Cu포일 상측에는 일정한 두께의 감광성 폴리이미드를 롤러를 이용하여 코팅토록 하는 감광성 폴리이미드 코팅단계와;A photosensitive polyimide coating step of coating a photosensitive polyimide having a predetermined thickness on the Cu foil by using a roller;

상기 Cu포일 상측으로 인쇄된 감광성 폴리이미드를 건조로에서 150 ∼ 200℃로 건조하는 건조단계와;A drying step of drying the photosensitive polyimide printed on the Cu foil at 150 to 200 ° C. in a drying furnace;

상기 건조 완료된 감광성 폴리이미드의 상측에는 글래스 마스크를 개재하여 노광작업에 의해 감광성 폴리이미드에 마이크로 비아홀을 형성하는 비아홀 형성단계를 포함하는 연성기판의 비아홀 형성방법을 마련함에 의한다.By providing a via hole forming method of the flexible substrate comprising a via hole forming step of forming a micro via hole in the photosensitive polyimide by an exposure operation through a glass mask on the dried photosensitive polyimide.

이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도3 A ∼ D는 본 발명에 따른 연성기판의 비아홀 형성방법을 설명하기 위한 개략 공정도이고, 도 4는 본 발명의 비아홀이 형성된 연성기판의 정단면 구조도로서, 에폭시 수지로 구성되는 커버필름(110) 상측으로 15 ∼ 50㎛의 두께로 Cu 포일(120)을 접착제를 이용하여 부착시키게 되고, 이때 상기 커버필름(110)은 박형Cu 포일(120)을 지지하는 지지대의 역할을 수행하게 된다.(도3 A)3A to 3D are schematic process diagrams for explaining a method of forming a via hole of a flexible substrate according to the present invention, and FIG. 4 is a cross sectional front view of the flexible substrate on which a via hole of the present invention is formed, and is made of an epoxy resin. Cu foil 120 is attached to the upper side by using an adhesive to the thickness of 15 ~ 50㎛, wherein the cover film 110 serves as a support for supporting the thin Cu foil (120). Figure 3 A)

상기 커버필름(110) 상측에 Cu포일(120)의 부착이 완료되면 도3 B에 도시한 바와같이, Cu포일(120)의 상측으로 액상 또는 건조된 고체상태의 감광성 폴리이미드(130)를 25 ∼ 50㎛의 두께로 롤러(140)를 이용하여 코팅토록 하여 상기 감광성 폴리이미드(130)가 Cu포일(120) 상측에 골고루 코팅토록 한다.When the adhesion of the Cu foil 120 is completed on the upper side of the cover film 110, as shown in FIG. 3B, the photosensitive polyimide 130 in a liquid state or dried solid state is formed on the upper side of the Cu foil 120. The photosensitive polyimide 130 is coated on the upper side of the Cu foil 120 by coating the roller 140 with a thickness of ˜50 μm.

계속해서, 상기 Cu포일(120) 상측으로 인쇄된 감광성 폴리이미드(130)는 건조로(미도시)를 통과시켜 150 ∼ 200℃로 건조하여 내부의 수분등을 제거하게 되며, 이때 상기 건조온도가 150℃ 이하에서는 제대로 건조가 이루어지지 않게되고, 200℃ 이상에서는 감광성 폴리이미드(130)가 열화되는 관계로 본 발명에서는 약 180℃가 적당하다.Subsequently, the photosensitive polyimide 130 printed above the Cu foil 120 is dried through a drying furnace (not shown) to be dried at 150 to 200 ° C. to remove moisture therein, and the drying temperature is In the present invention, the drying is not performed properly at 150 ° C or lower, and the photosensitive polyimide 130 is deteriorated at 200 ° C or higher, so about 180 ° C is suitable in the present invention.

한편, 상기와같이 건조 완료된 감광성 폴리이미드(130)의 상측에는 미세 비아홀이 형성된 글래스 마스크(150)를 이용하여 노광작업에 의해 감광성 폴리이미드(130)에 마이크로 비아홀(160)을 형성하게 되며,(도3 C) 상기와같이 노광 처리된 폴리이미드(130)에는 도3 D에서와 같이 다수의 비아홀(160)이 형성되는 연성기판을 제작할 수 있게 되는 것이다.On the other hand, the micro via hole 160 is formed in the photosensitive polyimide 130 by exposure using the glass mask 150 having fine via holes formed on the dried photosensitive polyimide 130 as described above. 3C) In the polyimide 130 exposed as described above, a flexible substrate having a plurality of via holes 160 is formed as shown in FIG. 3D.

다른한편, 도 4에서와 같이 연성기판(100)의 감광성 폴리이미드(130)에 형성되는 비아홀(160)의 패턴이 다를 경우에는 상기 노광 작업을 위한 글래스 마스크(150)만을 바꾸어주는 동작에 의해 다양한 패턴의 비아홀 형성작업이 가능하게 되는 것이다.On the other hand, when the pattern of the via hole 160 formed in the photosensitive polyimide 130 of the flexible substrate 100, as shown in Figure 4 is different by various operations by changing only the glass mask 150 for the exposure operation It is possible to form via holes in a pattern.

이상과 같이 본 발명에 따른 연성기판의 비아홀 형성방법에 의하면, 연성기판의 감광성 폴리이미드에 글래스 마스크를 통한 노광 작업에 의해 미세한 크기의 비아홀 가공이 가능토록 되며, 상기 연성기판의 비아홀 패턴 변경시, 글래스 마스크를 교환하는 간단한 작업에 의해 마이크로 비아홀을 손쉽고, 용이하게 형성할 수 있게 됨은 물론, Cu 포일에 인쇄된 감광성 폴리이미드의 건조후 노광 처리에 의해 Cu 포일의 들뜸 및 기포등이 전혀 발생되지 않는 우수한 효과가 있다.As described above, according to the method of forming a via hole of a flexible substrate according to the present invention, through the exposure operation through a glass mask on the photosensitive polyimide of the flexible substrate, a via hole processing of a fine size is possible, and when the via hole pattern of the flexible substrate is changed, The micro via hole can be easily and easily formed by a simple operation of replacing the glass mask, and the floating and foaming of the Cu foil is not generated at all by the post-drying exposure process of the photosensitive polyimide printed on the Cu foil. Excellent effect.

본 발명은 특정한 실시예에 관련하여 도시하고 설명하였지만, 이하의 특허 청구범위에 의해 마련되는 본 발명의 정신이나 분야를 벗어나지 않는 한도내에서 본 발명이 다양하게 개조 및 변화될 수 있다는 것을 당업계에서 통상의 지식을 가진자는 용이하게 알수 있음을 밝혀 두고자 한다.While the invention has been shown and described with respect to specific embodiments thereof, it will be appreciated that the invention can be varied and modified without departing from the spirit or scope of the invention as set forth in the claims below. It will be clear to those skilled in the art that it can be easily understood.

Claims (5)

연성기판의 비아홀 형성방법에 있어서,In the method of forming a via hole of a flexible substrate, 에폭시 수지로 구성되는 커버필름 상측으로 Cu 포일이 접착제를 개재하여 적층토록 되는 Cu포일 적층단계와;Cu foil lamination step in which the Cu foil is laminated to the cover film consisting of an epoxy resin via an adhesive; 상기 Cu포일 상측에는 일정한 두께의 감광성 폴리이미드를 롤러를 이용하여 코팅토록 하는 감광성 폴리이미드 코팅단계와;A photosensitive polyimide coating step of coating a photosensitive polyimide having a predetermined thickness on the Cu foil by using a roller; 상기 Cu포일 상측으로 인쇄된 감광성 폴리이미드를 건조로에서 150 ∼ 200℃로 건조하는 건조단계와;A drying step of drying the photosensitive polyimide printed on the Cu foil at 150 to 200 ° C. in a drying furnace; 상기 건조 완료된 감광성 폴리이미드의 상측에는 글래스 마스크를 개재하여 노광작업에 의해 감광성 폴리이미드에 마이크로 비아홀을 형성하는 비아홀 형성단계를 포함하여 구성됨을 특징으로 하는 연성기판의 비아홀 형성방법.And a via hole forming step of forming a micro via hole in the photosensitive polyimide by an exposure operation through a glass mask on an upper side of the dried photosensitive polyimide. 제 1항에 있어서, 상기 커버필름의 상측으로 접착제를 이용하여 부착되는 Cu 포일은, 15 ∼ 50㎛의 두께로 적층됨을 특징으로 하는 연성기판의 비아홀 형성방법.The method of claim 1, wherein the Cu foil attached to the upper side of the cover film by using an adhesive is laminated to a thickness of 15 to 50 μm. 제 1항에 있어서, 상기 Cu포일의 상측으로 도포되는 감광성 폴리이미드는액상으로 구성됨을 특징으로 하는 연성기판의 비아홀 형성방법.The method of claim 1, wherein the photosensitive polyimide coated on the Cu foil is formed in a liquid phase. 제 1항에 있어서, 상기 Cu포일의 상측으로 도포되는 감광성 폴리이미드는 고체상태로 구성됨을 특징으로 하는 연성기판의 비아홀 형성방법.The method of claim 1, wherein the photosensitive polyimide coated on the Cu foil is formed in a solid state. 제 1항에 있어서, 상기 Cu포일의 상측으로 도포되는 감광성 폴리이미드는 25 ∼ 50㎛의 두께로 코팅됨을 특징으로 하는 연성기판의 비아홀 형성방법.The method of claim 1, wherein the photosensitive polyimide applied to the upper side of the Cu foil is coated with a thickness of 25 to 50㎛.
KR1019990058512A 1999-12-17 1999-12-17 Method for plugged via hole in flexible substrate KR20010056862A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140036815A (en) * 2012-09-18 2014-03-26 김정식 Method of manufacturing the printed electronic circuit boards utilizing photoresist pillars

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198561A (en) * 1992-01-22 1993-08-06 Toray Ind Inc Method of forming polyimide pattern
JPH06216502A (en) * 1993-01-13 1994-08-05 Nec Ibaraki Ltd Process of photosensitive polyimide precursor pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198561A (en) * 1992-01-22 1993-08-06 Toray Ind Inc Method of forming polyimide pattern
JPH06216502A (en) * 1993-01-13 1994-08-05 Nec Ibaraki Ltd Process of photosensitive polyimide precursor pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140036815A (en) * 2012-09-18 2014-03-26 김정식 Method of manufacturing the printed electronic circuit boards utilizing photoresist pillars

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