CN100482046C - Printed circuit board manufacturing method - Google Patents
Printed circuit board manufacturing method Download PDFInfo
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- CN100482046C CN100482046C CNB2005101125147A CN200510112514A CN100482046C CN 100482046 C CN100482046 C CN 100482046C CN B2005101125147 A CNB2005101125147 A CN B2005101125147A CN 200510112514 A CN200510112514 A CN 200510112514A CN 100482046 C CN100482046 C CN 100482046C
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Abstract
The invention proposes a manufacturing method of a printed circuit board in which primarily, flexibility and flexuosity are excellent, secondarily, lightweightness and ultrathinning can be realized and densification and microfabrication can be also realized, thirdly, processes are more simplified to reduce a cost, and fourthly, accuracy or the like is improved. In the method, a plurality of through holes 5 are first provided, and conductive treatment is performed on internal sides of the holes 5 in a substrate 3 in which a copper foil 2 is each attached to both sides of an insulating material 1. Next, after one side of the substrate 3 is covered with a photosensitive dry film 16 provided with a masking outer layer 17, a developer is impregnated in the holes 5 from an opposite side, thereby developing the film 16 as a plating resist. Thereafter, the film 16 is cured by exposure, the layer 17 is next removed, and electrolytic copper plating 6 is performed on internal sides of the holes 5 or the like. A circuit pattern 7 is formed after the film 16 is removed.
Description
Technical field
The present invention relates to the manufacture method of printed substrate.That is, relate to the manufacture method that on the two sides of insulating material, is formed with the printed substrate of circuitous pattern.
Background technology
Printed substrate for example possesses the flexibility printed circuit board of flexibility and bendability, its high precision int, high performance, ultra-thinization, and light-weighted progress remarkable, and the densification of formed circuitous pattern and granular are remarkable.
And, the connection that printed substrate is formed with the circuitous pattern that is used for carrying out the two sides with and the installation usefulness of semiconductor device etc. be a plurality of through holes of tiny through hole.In addition, in the manufacturing process of printed substrate, used whole plate galvanoplastic and button galvanoplastic (button plating) to carry out the manufacturing of this type of through hole typically.
Fig. 4 be used for carrying out this kind conventional example printed substrate manufacture method explanation and enlarged the key diagram of the normal cross-section of pith.Wherein: (1) figure has showed the printed substrate by whole plate galvanoplastic manufacturing; (2) figure has showed the covering process of button galvanoplastic; (3) figure has showed the exposure process of button galvanoplastic; (4) figure has showed the printed substrate by the manufacturing of button galvanoplastic.
In the whole plate galvanoplastic shown in Fig. 4 (1) figure, at first, post the base material 3 of Copper Foil 2 for the two sides (surface and the inside) of insulating material 1, in through hole 5 backs of perforate processing through hole 4 usefulness to the internal face conduction processing of through hole 5.
Then, base material 3 integral body are carried out electro-coppering 6.Here, with through hole 5 internal faces of the processing of conduction of base material 3 and Copper Foil 2 electro-coppering integrally 6 on two sides.
And, base material 3 can make through hole 5 conductionizations by this type of electro-coppering 6 and make the two sides conduction therefrom, then by carrying out in turn knownly for example exposing, develop, and etching, step such as peel off and form circuitous pattern 7, but the flexibility printed circuit board for example of the printed substrate A shown in (1) figure of shop drawings 4 thus.
In the button galvanoplastic shown in Fig. 4 (2) figure, (3) figure, (4) figure, at first, same with above-mentioned whole plate galvanoplastic, post the base material 3 of Copper Foil 2 for the two sides (surface and the inside) of insulating material 1, in through hole 5 backs of perforate processing through hole 4 usefulness to the internal face conduction processing of through hole 5.
Then, shown in Fig. 4 (2), with the two sides of base material 3 with have separate additional photo-conductive film 8 and cover after, will press close to as the mask blank 9 aligned in position ground of negative mask shown in Fig. 4 (3) in these photo-conductive film 8 outsides again, expose then and use developing liquid developing.
Then, to substrate 3, remove near the opening with through hole 5 as so and will photo-conductive film 8 residual and that hardened as anti-plated resist with enforcement electro-coppering 6.Therefore, electro-coppering 6 can be selectively only in the internal face of the processing of conduction of through hole 5 and the peristome periphery enforcement on through hole 5 two sides.Here, to base material 3, form electro-coppering 6 at the internal face of the processing of conduction of through hole 5 (through hole 4) and the peristome periphery on through hole 5 (through hole 4) two sides.That is, make electro-coppering 6 form the C of button portion that is roughly the button shape.
Like this, behind conducting through hole 5 and conducting two sides, therefore base material 3, shown in (4) figure of Fig. 4, can make for example flexibility printed circuit board of printed substrate B by form circuitous pattern 7 according to known steps.
Conventional example as these type of button galvanoplastic for example can be enumerated, the example shown in the following patent documentation 1 (spy opens flat 11-No. 195849 communiques).
But, the problem below existing in this type of conventional example.
The first, in the manufacture method of the printed substrate A that is undertaken by whole plate galvanoplastic, the printed substrate A of manufacturing particularly flexibility printed circuit board is pointed out existing problems on flexibility and bendability.
That is, with whole plate galvanoplastic such as above-mentioned as the through hole 5 of base material 3 and the Copper Foil 2 on two sides are carried out electro-coppering 6.In other words, in this base material 3, for the conducting of through hole 5 (through hole 4), Copper Foil 2 outer peripheral faces that are used to form the two sides of circuitous pattern 7 have been separated out copper all fully.
Here, the printed substrate A of manufacturing, the outer surface that is formed with whole circuitous pattern 7 on its two sides has carried out electro-coppering 6 all fully, and flexibility and bendability have just descended like this.
Therefore, with the printed substrate A of this type of whole plate galvanoplastic manufacturing in use its for example the crooked wiring part 10 shown in the plane overview diagram of Fig. 5 be difficult to bending, thereby produced flexible problem.And this problem is obvious especially to flexibility printed circuit board.
Second, in the manufacture method of the printed substrate A that is undertaken by whole plate galvanoplastic, also have, existing problems are pointed out in the weight aspect of the printed substrate A of manufacturing and thickness aspect, and the densification of circuitous pattern 7 and granular are also pointed out existing problems.
That is, in whole plate galvanoplastic, described in above-mentioned first as, to the printed substrate A of manufacturing, the outer surface that two sides (surface and the inside) goes up formed whole circuitous pattern 7 carries out electro-coppering 6 all fully.Like this, thickness also becomes greatly when just having been pointed out that it exists in weight and becomes big, and with the lightweight of substrate and the contrary problem of progress of ultra-thinization.
And, pointed out that it exists in the final operation when forming the circuitous pattern 7 that leads to the two sides, formed electro-coppering 6 becomes the obstacle of etching etc. on Copper Foil 2 outer surfaces of base material 3, thereby is difficult to form the problem of the circuitous pattern 7 of high density granular.
The 3rd, in the manufacture method of the printed substrate B that is undertaken by the button galvanoplastic, manufacturing process head and complicated and yield poorly, and pointed out to exist the problem of cost aspect.
That is, in the button galvanoplastic, as mentioned above, before the electro-coppering 6 of base material 3, added photo-conductive film 8 and the operation of mask blank 9 used as anti-plated resist, thereby made the complicated trouble of manufacturing process to expose and to develop.
And though the aligned in position of the position of the corresponding position of the position of the through hole 5 of base material 3 sides and mask blank 9 sides can be finished by visual usually, this aligned in position operation also is not easy and complicated trouble.
Like this, the button galvanoplastic have been improved the shortcoming of above-mentioned whole plate galvanoplastic, and are only carrying out electro-coppering 6 near the through hole 4 and do not existing aspect the weight when flexibility and bendability are superior and the problem of thickness aspect, also can corresponding densification and granular.But this button galvanoplastic complex procedures bothers and yields poorly, and is also pointed out to exist the big problem of cost aspect.
The 4th, in the manufacture method of the printed substrate B that is undertaken by the button galvanoplastic, also have, the printed substrate of manufacturing is pointed out the existing problems such as positional precision in the electro-coppering 6 of through hole 4.
That is, in the button galvanoplastic, as above-mentioned thirdly as described in as, carried out the aligned in position of through hole 5 with the mask blank 9 of base material 3, but easily produced position deviation between the two.That is, this aligned in position is many is undertaken by visual operation, simultaneously, owing to have the flexible of base material 3 and mask blank 9, and so the aligned position that must correctly overlap is very difficult.
Here, pointed out on the positional precision of leading near the electro-coppering 6 the through hole 5, to have difficult point with the printed substrate B of button galvanoplastic manufacturing, therefore unbecoming with the significant substrate of the progress of high precision int.
Have again, the cause of the problem of this type of positional precision is, shown in the plane key diagram of (2) figure of Fig. 3, the electro-coppering 6 that forms with the button shape on the peristome periphery of through hole 4 is the granular difficulty of the C of button portion, in any case and the C of button portion also to have 0.2mm than major diameter.Like this, the button diameter of the C of button portion is than the major diameter shape, so corresponding with circuitous pattern 7 sides and the terminal pad diameter terminal pad 13 that forms also has than major diameter.
Here, printed substrate B by the manufacturing of button galvanoplastic is pointed out, shown in the plane key diagram of (4) figure of Fig. 3, its distribution strip number by the circuitous pattern 7 of 13 of terminal pads is defined lessly, so distribution density is defined lowlyer, so remarkable that substrate is unbecoming with the high performance progress.
Summary of the invention
The manufacture method of printed substrate of the present invention is succeeded in developing by inventor's research with keen determination for the problem that solves above-mentioned conventional example in view of this type of fact.
And, for base material, it is characterized in that: behind the perforation hole electricity conduction that through hole is used,, in through hole, inject developer solution then, photo-conductive film is developed as anti-plated resist with coverings such as photo-conductive films, and then with copper facing such as through holes.
Therefore, the objective of the invention is to propose the manufacture method of printed substrate, it comprises: the first, and flexibility and bendability are good; The second, can realize lightweight and ultra-thinization, densification and granular; The 3rd, operation simplification and cost aspect are good; The 4th, precision etc. are higher.
The technological means of the present invention that solves this type of problem is as follows.At first, scheme 1 is as follows.
In the manufacture method of the printed substrate of scheme 1, for copper clad laminate, a plurality of through holes that through hole is used at first are set, after the conduction processing in carrying out this through hole, with single face with covering with covering outer field photo-conductive film, in this through hole of opposite face side direction, inject developer solution then, with this photo-conductive film as anti-plated resist with develop and make it the sclerosis after, remove this and cover skin.
It is characterized in that: then,, after removing this photo-conductive film, form circuitous pattern this through hole and the electro-coppering of peristome periphery thereof.
Secondly, with opposite face with after covering outer field other photo-conductive film with this and covering, and inject developer solution from this through hole of single face side direction, after this photo-conductive film being developed as anti-plated resist and make it to harden, remove this and cover skin.
It is characterized in that: then, the peristome periphery electro-coppering with this through hole and two sides thereof after removing this photo-conductive film, forms circuitous pattern.
Be equipped with: at first, in the operation of a plurality of through holes that perforate processing through hole on the base material that the two sides copper clad laminate that is pasted with Copper Foil on the two sides by insulating material is constituted is used, and secondly form the operation of conductive film covering on the internal face at this through hole.
Be equipped with: the single face of this base material comprehensively with covering the operation that outer field photo-conductive film covers, and is injected developer solution and near this photo-conductive film the opening of the single face side of this through hole removed with this developing solution dissolution and with its operation of developing and making it to harden as anti-plated resist from this through hole of opposite face side direction of this base material then.
Then, possess have peel off this cover outer field operation and thereafter to this base material implement electro-coppering and by this conductive film covering of this Copper Foil of opposite face side, this through hole internal face, and the peristome periphery of the single face side of this through hole separate out the operation that copper makes this through hole conducting.
It is characterized in that: thereafter, after removing the stripping process of this photo-conductive film, on the two sides of this base material, utilize the formation operation of the circuitous pattern of this Copper Foil.
Formation of the present invention is as follows.In this manufacture method,, forming a plurality of through holes and after forming conductive film covering on each through hole internal face, at first, covering single face with photo-conductive film for the base material of copper clad laminate.Then, for base material, in opposite face side direction through hole, inject developer solution, and photo-conductive film is developed as anti-plated resist.Thereafter, for base material, also available photo-conductive film covers opposite face and inject developer solution in single face side direction through hole, and photo-conductive film is developed as anti-plated resist.
Then, in this manufacture method, base material is carried out electro-coppering.That is, at the peristome periphery of the single face side of the conductive film covering of through hole internal face, through hole, also have the peristome periphery of the opposite face side of through hole to separate out copper, thereby make the through hole conducting.
And, make Copper Foil form figure, and form circuitous pattern, like this, just having made printed substrate is flexibility printed circuit board or rigidity printed substrate.
Therefore, manufacturing method according to the invention is as follows.
(1) first, this manufacture method is being carried out the laggard electroplating copper of mask with photo-conductive film.Therefore, the Copper Foil on single face or two sides only carries out electro-coppering at through hole peristome periphery.
Therefore, the Copper Foil that the printed substrate of manufacturing is used for its single face or two sides is that circuitous pattern does not carry out electro-coppering, so the situation of all carrying out electro-coppering with the two sides relatively, flexibility and bendability are good.So this printed substrate can make the place that becomes crooked wiring part crooked smoothly.
(2) second, in this manufacture method, printed substrate is not because the circuitous pattern on its single face or two sides carries out electro-coppering, so the situation of all carrying out electro-coppering with the two sides relatively, can form the circuitous pattern of densification and granular in light weight and thin thickness.
(3) the 3rd, in this manufacture method, photo-conductive film is used as anti-plated resist to develop by the mode of injecting developer solution.Therefore, the manufacture method that is used as anti-plated resist with photo-conductive film with mask blank relatively, operation obtains simplifying, and for example, does not need the loaded down with trivial details aligned in position operation of trouble.
(4) the 4th, this manufacture method is made of the mode of injecting developer solution.Therefore, photo-conductive film is near correctly dissolved equably the removing through hole opening only, and can develop accurately as anti-plated resist.
Therefore, this printed substrate is that the peristome periphery of through hole has formed the obstructed flexible influence of looking over so as to check and regarding industry as, not being subjected to base material and mask blank at through hole, and the button portion of the good electro-coppering of positional precision and dimensional accuracy.Therefore, owing to can form the button portion of minor diameter, so the distribution strip number of the terminal pad of circuitous pattern side and distribution density also can increase or change.
The manufacture method of printed substrate of the present invention, it is characterized in that: so for base material, behind the perforation hole electricity conduction that through hole is used, with coverings such as photo-conductive films, in through hole, inject developer solution then, photo-conductive film is developed as anti-plated resist, then through hole etc. is carried out electro-coppering.
Therefore, the present invention has following effect.
The first, can obtain the good printed substrate of flexibility and bendability.That is, in manufacture method of the present invention, owing to implement electro-coppering after covering base material, the Copper Foil on single face or two sides does not carry out electro-coppering fully.
Be not as this conventional example of above-mentioned whole plate galvanoplastic in the table of the Copper Foil of base material the two sides carry out electro-coppering.Therefore, thus the printed substrate of manufacturing owing to be imbued with flexibility and bendability warpage smoothly.
This is effective especially for the flexibility printed circuit board that with flexible is key property.
The second, can obtain lightweight and ultra-thinization, and the printed substrate of densification and granular.
That is, in manufacture method of the present invention, described in above-mentioned first, its Copper Foil that will form the circuitous pattern of single face side or two sides side of the printed substrate of manufacturing does not carry out electro-coppering.
Therefore, together carry out this conventional example of the above-mentioned whole plate galvanoplastic of electro-coppering with the circuitous pattern on two sides all sidedly and compare, can obtain the printed substrate of lightweight and ultra-thinization, therefore can fully adapt to the lightweight of wiring board and the progress of ultra-thinization.Have, owing to do not implement electro-coppering when the formation of circuitous pattern, institute is so that smoothings such as etchings again, and can form the circuitous pattern of high density granular.
The 3rd, operation simplification and cost aspect are good.That is, in manufacture method of the present invention, adopted, photo-conductive film has been developed as anti-plated resist by this mode in that base material is injected into mode in the through hole with developer solution after with coverings such as photo-conductive films.
Like this, owing to do not use mask blank as this conventional example of above-mentioned button galvanoplastic, to form anti-plated resist, bother loaded down with trivial details aligned in position operation so when operation is simplified, saved.
Therefore, by manufacture method of the present invention, can improve output and reduce cost with realization.
The 4th, precision also has raising.Promptly, in the manufacture method of the present invention, as above-mentioned thirdly described in owing to adopted the mode of injecting developer solution, so can correctly develop equably as photosensitive resist agent, anti-plated resist, so just having formed the bead shape at the peristome periphery is the electro-coppering of protruding eaves shape.
Like this, printed substrate with this manufacture method manufacturing, as this conventional example of above-mentioned button galvanoplastic, having formed at the peristome periphery of through hole need not visual operation and influence of not stretched and the high button portion of precision, can fully adapt to the development of the high precision int of wiring board like this.And, owing to formed the minor diameterization that button portion trickle and that diameter is little reaches the terminal pad of also having realized the circuitous pattern side thus,, like this, can adapt to the development of the high performance of wiring board so also leave enough and to spare to the distribution of the circuitous pattern between terminal pad.
Like this, existing problem all solves in this conventional example, and can enlarge markedly effect that the present invention brings into play.
Description of drawings
Fig. 1 provides the explanation of the preferred embodiment that is used to carry out an invention for the manufacture method of printed substrate of the present invention, and is the normal cross-section key diagram with the pith amplification of an one example.And its (1) figure has showed that base material, (2) figure of having prepared have showed that perforate operation, (3) have showed that conductive film covering forms operation, (4) figure and showed that soft etching work procedure, (5) figure have showed that covering process, (6) have showed developing procedure.
Fig. 2 provides the explanation of the preferred embodiment that is used to implement same invention, and is the normal cross-section key diagram of the pith that enlarged this example.And, showed through its (1) exposure map operation, (2) figure stripping process, (3) figure electroplating work procedure, (4) figure stripping process, (5) figure pattern to form operation and the printed substrate made.
Fig. 3 provides the explanation of the preferred embodiment that is used to implement same invention, and (1) figure is the plane key diagram by the expansion of the pith of an example of the printed substrate of manufacturing of the present invention, (2) figure is the plane key diagram of expansion of pith of planting the printed substrate of conventional example manufacturing thus, (3) figure is the plane key diagram by the expansion of the pith of an example of the printed substrate of manufacturing of the present invention, and (4) figure is the plane key diagram of expansion of pith of planting the printed substrate of conventional example manufacturing thus.(5) figure has showed other example of the present invention, and is the front key diagram of expansion of pith of the printed substrate of manufacturing.
Fig. 4 provides the explanation of the preferred embodiment that is used to implement same invention, and is the normal cross-section key diagram of the pith that enlarged this example.And (1) figure has showed the printed substrate by whole plate galvanoplastic manufacturing.(2) figure has showed the covering process of button galvanoplastic, and (3) figure has showed the exposure process of button galvanoplastic, and (4) have showed the plane synoptic diagram by the manufacturing of button galvanoplastic.
Fig. 5 has showed printed substrate, and is the plane synoptic diagram of diagram extension.
Among the figure:
1 insulating material, 2 Copper Foils, 3 base materials
6 electro-copperings of 4 through holes, 5 through holes
7 circuitous patterns, 8 photo-conductive films, 9 mask blanks
12 distribution ends, 10 crooked wiring part 11 distribution ends
13 terminal pads (conventional example), 14 terminals
15 terminal pads (conventional example), 16 photo-conductive films
17 cover outer 18 developer solutions
19 conductive film coverings, 20 palladiums or carbon
21 peristomes
A printed substrate (conventional example)
B printed substrate (conventional example)
C button portion (the present invention)
D button portion (the present invention)
F printed substrate (the present invention)
Embodiment
To describe the manufacture method of printed substrate of the present invention according to the preferred embodiment that is used to implement invention shown in the drawings in detail below.Fig. 1, Fig. 2, Fig. 3 provide the explanation that is used for implementing the preferred embodiments of the present invention.
And, Fig. 1 is the normal cross-section key diagram that has enlarged the pith of this example, and (1) figure has showed that base material, (2) figure of having prepared have showed that perforate operation, (3) have showed that conductive film covering forms operation, (4) figure and showed that soft etching work procedure, (5) figure have showed that covering process, (6) have showed developing procedure.
Fig. 2 is the normal cross-section key diagram that has enlarged the pith of this example, has showed through (1) exposure map operation, (2) figure stripping process, (3) figure electroplating work procedure, (4) figure stripping process, (5) figure pattern to form operation and the printed substrate made.
(1) figure of Fig. 3 is the plane key diagram by the expansion of the pith of an example of the printed substrate of manufacturing of the present invention, (2) figure is the plane key diagram of expansion of pith of planting the printed substrate of conventional example manufacturing thus, (3) figure is the plane key diagram by the expansion of the pith of an example of the printed substrate of manufacturing of the present invention, and (4) figure is the plane key diagram of expansion of pith of planting the printed substrate of conventional example manufacturing thus.(5) figure has showed other example of the present invention, and is the front key diagram of expansion of pith of the printed substrate of manufacturing.
Fig. 5 has showed printed substrate, and is the plane overview diagram of diagram extension.
At first, with reference to Fig. 5 printed substrate is described.Though printed substrate F is divided into the soft flexibility printed circuit board (FPC) and the rigidity printed substrate of hard, both all on the two sides of the outer surface of insulating material 1 or single face be formed with circuitous pattern 7 as conductor layer.
And, as the flexibility printed circuit board of the typical example of printed substrate F, its stock by the insulating material of softness for example the polyimides made membrane constitute, and how on its two sides (surface and the inside two sides), to be formed with circuitous pattern 7.And, the rigidity printed substrate, it is fabric by glass epoxy resin system for example, glass as the insulating material 1 of stock, ceramic etc. constitutes, and be formed with circuitous pattern 7 on its two sides (surface and the inside two sides) (that is, single face and opposite face two sides thereof) or the single face (either party in surface or the inside).
The thickness of insulating material 1, for example, though be generally below above-60 μ m of 20 μ m, 12 μ m also occur.The thickness that forms the Copper Foil 2 of circuitous pattern 7 is generally for example below above-35 μ m of 4 μ m.And the space for example also becomes below above-30 μ m of 10 μ m between the circuit that circuitous pattern is 7, and has the granular tendency.
Below, in this specification, will describe with the example of flexibility printed circuit board as printed substrate F.This printed substrate F is the film like that has flexibility and bendability on the whole, and three-dimensional ground is crooked and folding to use, itself and rigidity printed substrate are same, high precision int, high performance, art up, ultra-thinization, and progress such as lightweight significantly, and the densification of formed circuitous pattern 7 and granular are remarkable.
Fig. 5 has showed the flexibility printed circuit board as the example of this type of printed substrate F, and structure realm roughly is divided into distribution end 11, crooked wiring part 10, distribution end 12.And the crooked wiring part 10 of central authorities is that part is used in bending, and is furnished with terminal 14 on the end of distribution end 11,12.And, form circuitous pattern 7 on crooked wiring part 10 general only any in the two sides, and distribution end 11 also is furnished with through hole 4 and terminal pad 15 when being formed with the double-sided printed portion of circuitous pattern 7 on becoming the two sides.
This printed substrate F shown in Figure 5 for example be used in CD player and DVD player as read with and write the light sensor of usefulness.
Printed substrate F substantially so.
An example of the manufacture method of printed substrate F of the present invention is described below with reference to Fig. 1, Fig. 2, Fig. 3.
In this manufacture method, to copper clad laminate formed base material 3 in two sides is arranged, a plurality of through holes 5 of through hole 4 usefulness at first are set, and with conduction processing in each through hole 5, then after the single face of base material 3 being used with photo-conductive film 16 coverings of covering skin 17, in the opposite face side direction through hole 5 of base material 3, immerse developer solution 18, and photo-conductive film 16 is developed as anti-plated resist.
Then, in this manufacture method, after making photo-conductive film 16 exposures and sclerosis, remove and cover skin 17 and, afterwards, remove photo-conductive film 16 to form circuitous pattern 7 to carrying out electro-coppering 6 in the through hole 5.
Below with this type of manufacture method of more detailed description.
In the manufacture method of this printed substrate F, at first, shown in (1) figure of Fig. 1, prepare base material 3.
Base material 3 (being called film substrate during flexibility printed circuit board) has been puted up Copper Foil 2 respectively to constitute the two sides copper clad laminate on insulating material 1 two sides of (being called insulation film during flexibility printed circuit board).Insulating material 1 promptly as the insulating substrate of stock under the situation of flexibility printed circuit board by polyimide resin made membrane, aromatic polyamide resin made membrane, liquid crystal polymer made membrane, and other resin-made membrane that possesses flexibility and insulating properties constitute.Can use rolling paper tinsel, electrolysis paper tinsel, special electrolysis paper tinsel or anodized foil to be used as Copper Foil 2.
Moreover, as this type of base material 3 the trilaminate material type arranged with the two layers of material type.In trilaminate material, on the two sides of insulating material 1 by bonding agent respectively lamination Copper Foil 2 is arranged.Can use epoxy resin, halogen epoxy resin, high Tg epoxy resin etc. to be used as bonding agent.In two layers of material, the two sides of insulating material 1 is directly pasted respectively and lamination has Copper Foil 2.Two layers of material can be made by casting method, laminating or metaliding (sputtering method).
Have, said here two sides copper clad laminate broad sense is explained and is comprised various widely embodiment again.For example, also comprise, be pressed with the type of Copper Foil at the opposite face of this single face with bond layer for so-called singlesided copperclad laminate.
So just formed base material 3.
Secondly, in this manufacture method, shown in (2) figure of Fig. 1, the base material 3 of preparation like this is carried out perforate processing to form the through hole 5 of through hole 4 usefulness.
Through hole 4 is made of the minute aperture between the two sides (surface and the inside) (single face and opposite face) that connects printed substrate F, and can form a plurality of to a printed substrate F.And through hole 4 as the conducting of 7 of the circuitous patterns on two sides connect with, and the installation of the semiconductor device of actual installation to the circuitous pattern 7 etc. use.That through hole 4 diameters mostly are 0.5mm is above-below the 0.2mm, and can realize the through hole of 0.1mm by the drill bit processing method, can realize the through hole of 0.05mm by laser processing.
This type of is as through hole 4 and will process a plurality of by perforate at first for base material 3 at the through hole 5 that uses subsequently.In this perforate, use drill bit or laser etc. by NC control processing to every or multi-disc.
So just finished perforate processing.
Then, in this manufacture method, shown in Fig. 1 (2) figure, (3) figure, the base material 3 of through hole 5 has been processed in perforate like this, on the internal face of through hole 5, formed conductive film covering 19 by Direct Electroplating method or electroless plating copper.
Under the situation of Direct Electroplating method shown in Figure 1, at first, shown in Fig. 1 (3), to base material 3 all surfaces is that Copper Foil 2 outer surfaces on base material 3 two sides and through hole 5 internal faces carry out that comprehensively continuous palladium is handled or carbon is handled, and the trickle concavo-convex of palladium or carbon 20 imposed on as conductive film covering 19.
Like this, shown in (4) figure of Fig. 1, carry out soft etching, to remove the conductive film covering 19 of Copper Foil 2 outer surfaces.Here, conductive film covering 19 directly only imposes on the internal face of through hole 5, and correct is only imposes on 1 of the insulating material that exposes on the internal face of through hole 5, is so paying and residual state to become.
Have again, in this Direct Electroplating method, also can use other conductive materials such as graphitic carbon to replace palladium or carbon 20.And, forming with electroless plating copper under the situation of conductive film covering 19 without this Direct Electroplating method, just Copper Foil 2 outer surfaces of through hole 5 internal faces the inside have not carried out electroless plating copper yet.
So just formed conductive film covering 19.
Then, in this manufacture method, shown in (5) figure of Fig. 1, the whole single face of base material 3 its outer surfaces that is formed with conductive film covering 19 as so in through hole 5 is covered outer 17 and covers by appended by photo-conductive film 16.Be that base material 3 its single faces (promptly following for the inside in the accompanying drawings) are covered fully by pasting photo-conductive film 16.
And, so the outer surface of the photo-conductive film of pasting 16 (the inside promptly below) also by before or after pasted cover and outer 17 cover.Can use separating device, the PET resin film that scribbles little adhesiveness bonding agent that the surface of photo-conductive film 16 guarantees or have other fusible transparent raw material and be used as this type of and cover outer 17.
The single face of base material 3 is covered by photo-conductive film 16 like this, and also outer 17 coverings of crested of this outer surface.
So just implemented the covering undertaken by photo-conductive film 16 grades.
And, in this manufacture method, shown in (6) figure of Fig. 1, the base material 3 with coverings such as photo-conductive films 16 as is so developed.That is, from the opposite face side direction through hole 5 of base material 3, immerse developer solution 18, and remove near the photo-conductive film 16 of opening of the single face side of through hole 5, be developed as anti-plated resist at the residual photo-conductive film 16 of single face side like this with developer solution 18 dissolvings.
That is, from as the opposite face of base material 3 (surface promptly above) side, promptly do not have the open surface side spray spray developing liquid 18 of the non-coverage rate of covering whatever, or base material 3 is integrally soaked in developer solution 18 grooves.
Here, in opposite face (surface promptly above) side direction through hole 5, immerse developer solutions 18, and via in the through hole 5 partly dissolving remove the photo-conductive film 16 of single face (the inside is promptly following) side.That is, open space and these peristome 21 peripheries of the single face side of through hole 5 are removed in developer solution 18 dissolvings.Have, the predetermined portions that so dissolves the single face side of removing through hole 5 waits in suitable size, width, zone by concentration, temperature, expulsion pressure, the injecting time (soak time) of controlling developer solution 18 to be implemented again.
Photo-conductive film 16 utilizes so-called immersion developing to develop processing as the necessary hole shape of anti-plated resist as so, and forms the opening that has big slightly diameter than through hole 5 diameters in the single face side of through hole 5.
So just finished photo-conductive film 16 is developed.
Then, in this manufacture method, shown in (1) figure of Fig. 2, base material 3 so makes photo-conductive film 16 exposures and the sclerosis of having developed.
That is, to being as the photo-conductive film 16 direct irradiation light of the necessary hole shape of anti-plated resist carrying out the UV exposure, thereby hardening and develop by photopolymerization.
Like this, just make photo-conductive film 16 exposures.
Secondly, in this manufacture method, shown in Fig. 2 (2), will cover outer 17 and peel off from base material 3.
That is, the base material 3 that photo-conductive film 16 has developed is different with photo-conductive film 16, and covering of the surperficial shape of non-existent stripped shapes such as retaining hole outer 17 peeled off from the outer surface of the photo-conductive film 16 that becomes anti-plated resist and to be removed.
So just peeled off and covered outer 17.
Then, in this manufacture method, shown in Fig. 2 (3), implement electro-copperings 6 to covering outer 17 base materials of peeling off 3 so, so the conductive film covering 19 of the Copper Foil 2 of opposite face side, through hole 5 internal faces, and peristome 21 peripheries of the single face side of through hole 5 separated out copper.And the conducting through hole 5 thus.
That is, to base material 3, being that object is implemented electro-coppering 6 with the part that does not have crested on the photo-conductive film 16 that develops and harden as anti-plated resist.
Therefore, for base material 3, through hole 5 peristomes 21 peripheries with the outer surface of the Copper Foil 2 of opposite face (in Fig. 2 example serve as surface promptly above) side, the conductive film covering 19 that forms through hole 5 internal faces, single face (being below the inside is in Fig. 2 example) side are object, separate out copper all sidedly, continuously to carry out electro-coppering 6.Through hole 5 single face sides ground peristome 21 peripheries the plated copper that forms 6 form the D of button portion that the bead shape is protruding eaves shape with through hole 5 with being concentric shape.
So just implemented electro-coppering 6.
Secondly, in this manufacture method, shown in (4) figure of Fig. 2, peeled off photo-conductive film 16.
That is, the base material 3 that has carried out electro-coppering 6 passes through the spray injection stripper, is stripped from as the photo-conductive film 16 of anti-plated resist use and removes.
This manufacture method after finishing this type of each operation, shown in (5) figure of Fig. 2, for the two sides of base material 3, forms circuitous pattern 7 by finishing known step.
Promptly, for example, for the two sides of base material 3, the stickup by photo-conductive film covers it, has used the exposure as the mask blank of the negative mask of circuitous pattern 7 then, be the print of circuitous pattern 7, then remove the development and the drying of the photo-conductive film of unexposed portion, and, carry out the etching of the part of photo-conductive film opening for Copper Foil, finish known steps such as peeling off of photo-conductive film at last by order, form circuitous pattern 7 with Copper Foil 2 respectively on the two sides of base material 3.
So for example, (5) figure and shown in Figure 5 as Fig. 2 has made printed substrate F.And so the printed substrate F that makes is equipped with semiconductor device etc. for use.
Have again,, promptly film-type and glass mould (glass negative) arranged as the negative mask of circuit mask as the mask blank that is used to form this type of circuitous pattern 7.
Like this, just implemented pattern formation.
The Figure 1 and Figure 2 example of the manufacture method of printed substrate F of the present invention has formation discussed above.Therefore, as follows.
In the manufacture method of this Figure 1 and Figure 2, at first, for the base material 3 (with reference to (1) figure of Fig. 1) of two sides copper clad laminate, form the through hole 5 (with reference to (2) figure of Fig. 1) of a plurality of through hole 4 usefulness, on the internal face of each through hole 4, formed conductive film covering 19 backs ((3) figure of Fig. 1, (4) figure), with this single face with photo-conductive film 16 and cover outer 17 and cover (scheme (5) with reference to Fig. 1).
Then, for base material 3, inject developer solution 18 from opposite face side direction through hole 5, like this, for photo-conductive film 16, near the part the opening of single face side of through hole 5 has been removed in dissolving, photo-conductive film 16 is developed as anti-plated resist, and expose and harden (scheming with reference to (6) figure of Fig. 1, (1) of Fig. 2).
Then, base material 3 is carried out electro-coppering 6.Promptly, peel off back (with reference to (2) figure of Fig. 2) will covering outer 17, peristome 21 peripheries to the single face side of the conductive film covering 19 of the Copper Foil 2 of opposite face side, copper facing card 5 internal faces, through hole 5 limit ground, separate out copper to carry out electro-coppering 6 continuously, like this, make through hole 5 conducting between single face and opposite face side (with reference to (3) figure of Fig. 2).
Secondly,,, make the Copper Foil 2 of base material 3 form figure, like this, formed circuitous pattern 7 (with reference to (5) figure of Fig. 2) peeling off photo-conductive film 16 backs (with reference to (4) figure of Fig. 2) for base material 3.
Here, by Fig. 1 of the present invention, manufacture method shown in Figure 2, can become following first, second, third, fourth.
The first, in this manufacture method, the photo-conductive film 16 that the single face of base material 3 is used as anti-plated resist covers and covers, and like this, has carried out electro-coppering 6 when limiting regionally.Therefore, the Copper Foil 2 of the single face of base material 3 has not been separated out copper and has not been carried out electro-coppering 6 fully except peristome 21 peripheries of through hole 5.
Like this, the printed substrate F that makes by this manufacture method has formed circuitous pattern 7 with this type of Copper Foil 2 on its two sides, this single face side (for example, the inside, promptly below) circuitous pattern 7 integrally do not carried out electro-coppering 6, and do not separate out copper.
Have again, this printed substrate F is when using this type of single face as flexure plane, (promptly, as forming circuitous pattern 7 on any in inside of more than 10 of crooked wiring part as above-mentioned, and by so making the single face that does not carry out electro-coppering 6 become circuitous pattern 7 sides), compare with the situation that the Copper Foil 2 and the circuitous pattern 7 on two sides together carry out electro-coppering 6, flexibility that it is whole and bendability are flexible better.
Therefore, for example, the place that is positioned at central portion and becomes crooked wiring part 10 can be bent (with reference to Fig. 5) smoothly with respect to the distribution end 11 that is positioned at the end and is furnished with through hole 4 with the printed substrate F of this manufacture method manufacturing.
(2) second, by the printed substrate F of this manufacture method manufacturing, the circuitous pattern of its single face side 6 does not carry out electro-coppering 6 as so fully.
Therefore, this printed substrate F situation of together carrying out electro-coppering 6 with the circuitous pattern 7 on two sides and separating out copper is compared its in light weight and thin thickness.
And, this printed substrate F is not because the Copper Foil 2 of single face side carries out electro-coppering 6, so compare with the situation of carrying out electro-coppering 6 and separating out copper, owing to can carry out etching etc. to this single face side more glossily, so can form the circuitous pattern 7 of more densification and granular.
The 3rd, in this manufacture method, for base material 3, since adopted with this single face with photo-conductive film 16 and after covering outer 17 coverings, from opposite face side direction through hole 5, inject the mode of developer solution 18, removed so near the part the opening of the single face side of the through hole 5 of photo-conductive film 16 correctly and equably dissolves, like this, can be used as anti-plated resist and suitably develop.
Therefore, this manufacture method compare with the situation of using mask blank 9 to form the mode of anti-plated resist (with reference to (2) figure, (3) figure of Fig. 4, (4) figure etc.), when can omitting simplification manufacturing process, trouble and loaded down with trivial details mask blank 9 are operated with the aligned in position of through hole 5 and have not also been needed.
The 4th, in this manufacture method, owing to adopted so from the opposite face side direction through hole 5 of the photo-conductive film 16 that covers single face and injected developer solution 18 modes, so can be correctly and equably dissolving remove near the opening of single face side of through hole 5 of photo-conductive film 16 part, but and develop highly as anti-plated resist precision.
Therefore, be that the peristome 21 periphery places of single face side of through hole 4 are correct and be formed uniformly the D of button portion that carries out electro-coppering 6 that the bead shape is protruding eaves shape at through hole 5 by the printed substrate F of this manufacture method manufacturing.That is, this printed substrate F is not formed by can not on the flexible influence ground (with reference to (2) figure, (3) figure, (4) figure of Fig. 4) of the flexible and mask blank 9 of base material 3 to have the D of button portion that is connected with circuitous pattern 7 sides (terminal pad portion 15) of being used for of good positional precision and dimensional accuracy yet by visual operation.
And this printed substrate F is based on this high accuracy, for example, shown in (1) figure of Fig. 3, can form the minor diameterization of 50 μ m the trickle button D of portion (with the 0.2mm of this conventional example shown in (2) figure of Fig. 3 mutually according to).Therefore, the terminal pad 15 of circuitous pattern 7 sides of this printed substrate F also can correspondingly be realized minor diameterization.
Therefore, in this printed substrate 11 (with reference to Fig. 5), leave the space enough and to spare 15 of terminal pads, therefore, distribution strip number and the distribution density at the circuitous pattern 7 of 15 connections of terminal pad also can increase comfortablely or change ((3) figure of comparative control Fig. 3 and (4) figure of this conventional example Fig. 3) easily.
, the manufacture method of printed substrate F of the present invention is not limited to Fig. 1 discussed above, reaches the example of Fig. 2, promptly, make the D of button portion be formed at the single face example of base material 3, for example, shown in the example shown in (5) figure of Fig. 3, can make the D of button portion be formed at the two sides of base material 3.
Promptly, in the example of this Fig. 3 (5) figure, by repeating the middle operation of a part, can form the good D of button portion of this type of precision in not only single face side but also in the opposite face side, the result, shown in (5) figure of Fig. 3, can be on the two sides (surface and the inside two sides) (that is, single face and opposite face two sides) to form the good and minor diameterization of precision simultaneously be the D of button portion of granular.
That is, in the manufacture method of this Fig. 3 (5) figure, at first, by photo-conductive film 16 grades to implementing covering process, developing procedure as the example of the single face of base material 3 such as Fig. 1, Fig. 2 in turn, and exposure process, covering outer 17 stripping process.Then, to the opposite face of base material 3 also be the standard covering process of implementing photo-conductive film 16 in turn, developing procedure, and exposure process, cover outer 17 stripping process.And, advance to electroplating work procedure then.
To will be described in more detail.At first, the single face for the base material 3 that the through hole 5 of having pasted conductive film covering 19 is set covers, develops and harden as anti-plated resist with photo-conductive film 16, then this is covered outer 17 and peels off and remove.
Then, for the opposite face of base material 3 also correspondingly with photo-conductive film 16 as anti-plated resist to cover, to develop and to harden (at this moment, developer solution 18 being injected into the through hole 5 from the single face side), then this is covered outer 17 and peels off removal.
Then, carry out electro-coppering 6.And this electro-coppering 6 is only carried out through hole 5 the peristomes 21 interior and the inside in the example difference of above-mentioned Fig. 1, Fig. 2.
Then, after the photo-conductive film 16 on two sides is peeled off removal, base material 3 is carried out figure form.
Like this, in the manufacture method of the example of this Fig. 3 (5) figure, through hole 5 at base material 6 is to carry out electro-coppering 6 in the through hole 4, simultaneously, only around being the peristome 21 of single face side and opposite face, the two sides of through hole 4 side carries out electro-coppering 6 (in the example of Fig. 1, Fig. 2, as mentioned above, in the through hole 4, around the peristome 21 of single face side, and the Copper Foil 2 of opposite face side all carry out electro-coppering 6).Like this, on the two sides, form terminal pad D as so, and made printed substrate F.
And, the printed substrate F of manufacturing is because the Copper Foil 2 on two sides is that circuitous pattern 7 does not together carry out electro-coppering 6, so when flexibility above-mentioned first and bendability were better, above-mentioned second weight and thickness and aspects such as densification and granular were also better.
At last, in above-mentioned illustrated example, though be that example has illustrated printed substrate F with the flexibility printed circuit board, the manufacture method of printed substrate F of the present invention is not restricted, even be suitable for for the rigidity printed substrate yet.
Claims (8)
1. the manufacture method of a printed substrate is characterized in that:
For copper clad laminate, a plurality of through holes that through hole is used at first are set, after the conduction processing in carrying out this through hole, with single face with covering with covering outer field photo-conductive film, in this through hole of opposite face side direction, inject developer solution then, with this photo-conductive film as anti-plated resist with develop and make it the sclerosis after, remove this and cover skin;
Then, this through hole and peristome periphery thereof are carried out electro-coppering, after removing this photo-conductive film, form circuitous pattern.
2. the manufacture method of a printed substrate is characterized in that:
For copper clad laminate, a plurality of through holes that through hole is used at first are set, after the conduction processing in carrying out this through hole, with single face with covering with covering outer field photo-conductive film, in this through hole of opposite face side direction, inject developer solution then, with this photo-conductive film as anti-plated resist with develop and make it the sclerosis after, remove this and cover skin;
Secondly, with opposite face with after covering outer field other photo-conductive film with this and covering, and inject developer solution from this through hole of single face side direction, after this photo-conductive film being developed as anti-plated resist and make it to harden, remove this and cover skin;
Then, the peristome periphery electro-coppering with this through hole and two sides thereof after removing this photo-conductive film, forms circuitous pattern.
3. the manufacture method of a printed substrate is characterized in that:
At first, the operation of a plurality of through holes that perforate processing through hole is used on the base material that the two sides copper clad laminate that is pasted with Copper Foil on the two sides by insulating material is constituted;
Secondly on the internal face of this through hole, form the operation of conductive film covering;
The single face of this base material is covered the operation that outer field photo-conductive film covers with having comprehensively;
Inject developer solution and near this photo-conductive film the opening of the single face side of this through hole removed with this developing solution dissolution and from this through hole of the opposite face side direction of this base material then its operation of developing and making it to harden as anti-plated resist;
Peel off this and cover outer field operation;
Thereafter to this base material implement electro-coppering and by this conductive film covering of this Copper Foil of opposite face side, this through hole internal face, and the peristome periphery of the single face side of this through hole separate out the operation that copper makes this through hole conducting;
Remove the stripping process of this photo-conductive film after, on the two sides of this base material utilize the formation operation of the circuitous pattern of this Copper Foil thereafter.
4. the manufacture method of printed substrate according to claim 1 is characterized in that:
This printed substrate is made of the flexibility printed circuit board of the film like that possesses flexibility.
5. the manufacture method of printed substrate according to claim 1 is characterized in that:
This printed substrate is made of the rigidity printed substrate of hard.
6. the manufacture method of printed substrate according to claim 1 is characterized in that:
Conduction processing in this through hole is by forming palladium, carbon, and the Direct Electroplating method of the overlay film of other conductive materials, or implements with the electroless plating copper method of electroless plating copper formation overlay film.
7. the manufacture method of printed substrate according to claim 1 is characterized in that:
Inject developer solution by to base material internal spraying spray developing liquid to this through hole, maybe this base material is immersed in the dipper and implement.
8. the manufacture method of printed substrate according to claim 1 is characterized in that:
The formation of this circuitous pattern by after covering this base material, using the circuit mask with photo-conductive film so that exposure of this photo-conductive film and sclerosis and develop, then with the Copper Foil etching of this base material and peel off residual photo-conductive film and implement.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004291202 | 2004-10-04 | ||
| JP2004291202 | 2004-10-04 | ||
| JP2005259069 | 2005-09-07 |
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| Publication Number | Publication Date |
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| CN1758832A CN1758832A (en) | 2006-04-12 |
| CN100482046C true CN100482046C (en) | 2009-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005101125147A Expired - Fee Related CN100482046C (en) | 2004-10-04 | 2005-09-30 | Printed circuit board manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582306A (en) * | 2012-08-06 | 2014-02-12 | Si弗莱克斯有限公司 | Printed circuit board manufacturing method |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466167C (en) * | 2007-02-05 | 2009-03-04 | 友达光电股份有限公司 | Making method of pliable active component array base board |
| CN101593705B (en) * | 2008-05-29 | 2011-07-13 | 欣兴电子股份有限公司 | Manufacturing method of chip support plate |
| CN102209438B (en) * | 2010-10-29 | 2012-12-26 | 博罗县精汇电子科技有限公司 | High-density flexible circuit board and manufacturing method thereof |
| CN108770244B (en) * | 2018-08-06 | 2019-08-06 | 重庆科技学院 | A kind of production method of compound pcb plate |
| TWI704852B (en) * | 2018-11-28 | 2020-09-11 | 先豐通訊股份有限公司 | Plating method for circuit board and circuit board made therefrom |
| CN109714890A (en) * | 2019-01-22 | 2019-05-03 | 广州安费诺诚信软性电路有限公司 | A method of preparing the acyclic electric hole of flexible circuit thin plate |
| CN113597142B (en) * | 2021-07-24 | 2022-08-02 | 勤基电路板（深圳）有限公司 | Processing technology for increasing copper thickness of conducting hole of circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582306A (en) * | 2012-08-06 | 2014-02-12 | Si弗莱克斯有限公司 | Printed circuit board manufacturing method |
| CN103582306B (en) * | 2012-08-06 | 2016-08-10 | Si弗莱克斯有限公司 | The manufacture method of printed circuit board (PCB) |
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| CN1758832A (en) | 2006-04-12 |
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