CN103582306B - The manufacture method of printed circuit board (PCB) - Google Patents
The manufacture method of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN103582306B CN103582306B CN201310007239.7A CN201310007239A CN103582306B CN 103582306 B CN103582306 B CN 103582306B CN 201310007239 A CN201310007239 A CN 201310007239A CN 103582306 B CN103582306 B CN 103582306B
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- Prior art keywords
- double
- piece
- copper foil
- button
- dry film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
nullThe present invention provides the manufacture method of printed circuit board (PCB)，It is included in one piece of double-faced flexible copper foil laminates ultraviolet laser brill or CNC bores the processing edge PTH hole (HOLE for BVH，1) the 1st operation (S10)，With the electroless electroless copper hole (HOLE to being formed on described one piece of double-faced flexible copper foil laminates，1) the 2nd operation (S20) of additional electric conductivity，The double spread dry film of described one piece of double-faced flexible copper foil laminates and the 3rd operation (S30) of release paper，The 4th operation (S40) of Partial exposure that the one side of the one piece of double-faced flexible copper foil laminates manufactured in described 3rd operation will be used for beyond the PTH of BVH，Remove dry film and the release paper of exposure in described 4th operation，Open PTH is impregnated with developer solution and removes the 5th operation (S50) of the dry film in another side coating，The one piece of double-faced flexible copper foil laminates formed in described 5th operation (S50) carries out the 6th operation (S60) of electro-coppering，In the 6th operation (S60), one piece of double-faced flexible copper foil laminates after copper facing peels off two-sided dry film and the 7th operation (S70) of release paper，The 8th operation (S80) of circuit is formed on the one piece of double-faced flexible copper foil laminates manufactured in the 7th operation (S70)，The most once form button (BUTTON) and the button (BUTTON) of sizes can be formed again，When forming button (BUTTON) with little size，Can the manufacture method of free designing printed circuit board.
Description
Technical field
The manufacture method of printed circuit board (PCB) of the present invention, more particularly, the present invention relate to lightweight day by day, thin type
Mobile phone or these products of LCD printed circuit board (PCB) on can improve fine pattern (FINE PATTERN) and bendability printing electricity
The manufacture method of road plate.
Background technology
Printed circuit board (PCB), such as, the flexible high-precision densification of (flexible) printed circuit board (PCB), very thinization and lightweight aspect
Achieving the progress of brilliance, the high-precision densification of the circuit pattern therefore formed (circuit pattern) and miniaturization are especially
Substantially.
And, printed circuit board (PCB) is formed much for turning on double-sided circuit pattern and installing the fine of semiconductor device
Via (through hole).
But, about manufacture and the conductingization (electrical of this via in the manufacturing process of printed circuit board (PCB)
Conduction), use representative method is the gold-plated method of full plate (panel plating method) and button always
Gold-plated method (button plating method).
" the gold-plated method of full plate "
In the gold-plated method of full plate, glue respectively at two-sided (surface and the back side) of insulation material (insulating material)
For the base material of copper-surfaced paper tinsel (copper foil), first, after getting out the perforation of multiple via, perforated inner is done and conducts electricity
After change processes (conductive process) (electrically conduct), whole base material is electro-coppering (copper
Electroplating), and, gold-plated according to this full plate, form the base material warp in order of conducting after perforated inner electro-coppering
Cross known exposure (exposure), development (development), etching (etching), peel off striping (stripping)
Route step (patterningstep) forms circuit pattern, thus manufactures printed circuit board (PCB).
But, this gold-plated method of full plate is noted, because not only perforated inner, two-sided Copper Foil is the most all by copper facing, system
The printed circuit board (PCB) double-sided circuit pattern produced is also by copper facing, and so relative its flexibility of reduction of meeting and bendability, additionally weigh
The difficult problem that amount is also incremented by, and be considered as a critically important problem for this point of flexible print wiring board.
" new, the gold-plated method of old button "
Therefore, a difficult problem for these autofrettages to be overcome, and develop the gold-plated method of button, pay attention to flexibility and bending at present
Property, even the field of light weight is just becoming main flow.
The gold-plated method of this button, after first getting out the perforation of multiple via on base material, does perforated inner and conducts electricity
Process, next base material is covered with photosensitive dry film (photosensitive dry film), plus negative photomask outside it
The light shield (photo mask) of (negative mask), thus as the photosensitive dry film of resist plating (plating resist)
After exposure, development, the perforated inner of opening becomes button with button (button) shape electro-coppering generally with around the opening of perforation
Portion.Further, according to the gold-plated method of this button, the base material of the copper facing such as perforation, circuit pattern is formed through Route step, thus
Manufacture printed circuit board (PCB).
But, for this gold-plated method of existing button (the gold-plated method of the oldest button), it is noted each of base material
On punch position and light shield, position (concrete electroplating site) the inconsistent situation of each corresponding position has a lot.
That is, it is difficult to the naked eye proofread between the two at the flexible of the gold-plated method of existing button, base material or light shield and operator
The reason such as the position situation that makes position inconsistent have a lot, it is bad that this position inconsistent becomes open circuit
Reasons such as (disconnection defect).
Fig. 1 to Fig. 2 is the artwork of existing board, printed circuit board manufacturing method.
Illustrate by Fig. 1, after first getting out the perforation of multiple via, in order to electric conductivity additional to described perforation is done
Electroless chemical copper processes.Next in both sides coating dry film and release paper exposure, the release paper on two-sided is then removed.Connect down
Remove after carrying out copper facing and there is no the dry film of hardening, complete the making of circuit board.
, although described existing manufacture method advantageously forms finely (FINE) pattern, but when being exposed it is
Preventing inclined hole, the size forming pad relative to the size in hole is relatively big, therefore has the shortcoming reducing design freedom.
Illustrate by Fig. 2, after first getting out the perforation of multiple via, in order to electric conductivity additional to described perforation is done
Electroless chemical copper processes.The most only at coated on one side dry film to develop, then being exposed, then removing release paper.Connect
The dry film of the coating overleaf development getting off same, then be exposed, then remove release paper.
After copper facing, remove the dry film not having hardening, complete the making of circuit board.
The not inclined hole of manufacture method as above, the size that can reduce pad has the advantage freely designed, but increases
Add process sequences and be unfavorable for stretching, there is the productive problem of reduction.
Prior art literature
Patent documentation
(patent documentation 1) Koran Office's registered patent announces No. 10-0700272
Summary of the invention
The technical problem to be addressed by invention
The present invention is to solve existing issue as above, it is an object of the present invention to provide and once form button (BUTTON)
The button (BUTTON) of sizes can be formed again, when forming button (BUTTON) with little size, can free design and printing
The manufacture method of circuit board.
It addition, the present invention provides when not removing back side release paper, carry out exposure and the copper plating treatment of one side, can
To release the manufacture method of the printed circuit board (PCB) producing copper facing deviation at the position that pad size is less.
Solve the technical scheme of problem
The present invention, in order to reach foregoing purpose, is realized by having the embodiment constituted as follows.
The invention is characterized in that being included in one piece of double-faced flexible copper foil laminates ultraviolet laser bores or CNC brill processing use
In the 1st operation (S10) of the edge PTH hole (HOLE, 1) of BVH, copper foil laminated to described one piece of double-faced flexible with electroless electroless copper
The 2nd operation (S20) of hole (HOLE, 1) additional electric conductivity formed on plate, described one piece of double-faced flexible copper foil laminates two-sided
Coating dry film and the 3rd operation (S30) of release paper, the one piece of double-faced flexible copper foil laminates manufactured in described 3rd operation
The 4th operation (S40) of Partial exposure that one side will be used for beyond the PTH of BVH, removes the dry film of exposure in described 4th operation
And release paper, open PTH is impregnated with developer solution and removes the 5th operation (S50) of the dry film in another side coating, the described 5th
The one piece of double-faced flexible copper foil laminates formed in operation (S50) carries out the 6th operation (S60) of electro-coppering, in the 6th operation
(S60) in, one piece of double-faced flexible copper foil laminates after copper facing peels off two-sided dry film and the 7th operation (S70) of release paper,
The 8th operation (S80) of circuit is formed on the one piece of double-faced flexible copper foil laminates manufactured in 7th operation (S70).
In described 4th operation (S40), it is characterized in that the egative film location being placed in one side makes the partial light permeability beyond PTH
It is exposed, in order to form the PTH of open form.
In described 5th operation (S50), it is characterized in that being impregnated with the operation of developer solution at PTH, described developer solution is impregnated with substrate
(E) PTH, in order to dissolve and remove the dry film (3) being positioned at another side, the most once form button (BUTTON) and can be formed again multiple
The button (BUTTON) of size.
In described 6th operation (S60), it is characterized in that carrying out copper facing, therefore when another side places release paper
It is possible to prevent at the position that pad size is little to form copper facing deviation.
Beneficial effect
The present invention provides following effect according to this most front composition.
The manufacture method of the printed circuit board (PCB) according to the present invention, has the stability in hole and forms button later draftsman
Skill can be formed the effect of fine pattern (FINE PATTERN), and copper-plated thickness deviation is little, by the plating of each model
Thickness is not significantly different from, and has the effect being prone to set early development product condition.
It addition, do not have inclined hole when the present invention is exposed, pad diminishes and has the effect freely designed, and Simplified flowsheet increases
Productive effect.
Accompanying drawing explanation
Fig. 1 to Fig. 2 is the artwork of the manufacture method of existing printed circuit board (PCB).
Fig. 3 is according to one embodiment of the invention, the flow chart of the manufacture method of printed circuit board (PCB).
Fig. 4 is according to one embodiment of the invention, the artwork of the manufacture method of printed circuit board (PCB).
<explanation of main graphical labelling>
1: hole 2: conductive membrane
3: dry film 4: release paper
5: copper facing
Detailed description of the invention
Below in conjunction with accompanying drawing, the manufacture method of the printed circuit board (PCB) according to the present invention is described in detail.It is noted that
It is that same element is represented by these accompanying drawings the most as far as possible with unified number.The additionally emphasis to the present invention
Can produce the unnecessary known function obscured and composition, the description thereof will be omitted.
Fig. 3 is that Fig. 4 is according to this according to one embodiment of the invention, the flow chart of the manufacture method of printed circuit board (PCB)
A bright embodiment, the artwork of the manufacture method of printed circuit board (PCB).
The manufacture method of printed circuit board (PCB) according to an embodiment of the invention, it is copper foil laminated that it is included in one piece of double-faced flexible
Plate bores with ultraviolet laser or CNC bores the processing the 1st operation (S10) for the edge PTH hole (HOLE, 1) of BVH, uses electroless chemistry
2nd operation (S20) of copper facing hole (HOLE, 1) the additional electric conductivity to being formed on described one piece of double-faced flexible copper foil laminates, institute
State the double spread dry film of one piece of double-faced flexible copper foil laminates and the 3rd operation (S30) of release paper, in described 3rd operation
The 4th operation (S40) of Partial exposure that the one side of the one piece of double-faced flexible copper foil laminates manufactured will be used for beyond the PTH of BVH,
Remove dry film and the release paper of exposure in described 4th operation, open PTH is impregnated with developer solution and removes in another side coating
5th operation (S50) of dry film, the one piece of double-faced flexible copper foil laminates formed in described 5th operation (S50) carries out electro-coppering
The 6th operation (S60), in the 6th operation (S60) one piece of double-faced flexible copper foil laminates after copper facing peel off two-sided dry film and
7th operation (S70) of release paper, the one piece of double-faced flexible copper foil laminates manufactured in the 7th operation (S70) is formed circuit
8th operation (S80).
Described 1st operation (S10) is that general printed circuit board (PCB) is at dielectric film in the operation in printed circuit board (PCB) processing hole
Two-sided lamination Copper Foil form (hereafter referred to collectively as " substrate ", as shown in Figure 4, the drawing symbol of substrate be referred to as (E)), in the 1st work
In sequence (S10) hole (HOLE, 1) of processing be formed in a printed circuit board run through two-sided (surface and the back side) (one side and
Another side) between most minute apertures (minutes pore).Further, described hole (HPOLE, 1) is for turning on two-sided electricity
Road pattern, or (and) it is used for the semiconductor device etc. that sticks together assembling (mounting) at circuit pattern.The aperture in hole (HOLE, 1)
Being the more and more of more than 0.2mm～below 0.5mm, also about the 0.1mm of appearance boring method, with laser drilling method
The hole of about 0.05mm.
Described 2nd operation (S20) is by the operation that chemical copper processes, and the substrate in processing hole (HOLE, 1) carries out chemistry
Copper treatment forms conductive membrane (2).Described chemical copper processes and refers to electroless plating process for copper, also referred to as chemistry or catalyst plating
Copper.The inwall in described hole (HOLE, 1) is covered with the additional electric conductivity of conductive copper, and copper-plated thickness is 0.3～1.0 μm, and catalyst is main
Use Pd.It addition, the 2nd operation (S20) of the present invention substitutes chemical copper carry out Direct Electrolysis copper facing (Direct plating)
Also it doesn't matter in process.
Described 3rd operation (S30) is coating dry film (3) and the operation of release paper (4), is making the substrate that chemical copper processes
(E) two-sided heat to specify and pressure compaction coating make dry film (3) and release paper (4) be close on printed circuit board (PCB).
Described 4th operation (S40) is substrate (E) work that is exposed of one side of double spread dry film (3) and release paper (4)
The upper coupling egative film of sequence, described dry film (3) and release paper (4), provides luminous energy, in order to the pattern image of needs shows during exposing
Shadow, the release paper the most do not hardened (4) is removed with medicine.
Described 5th operation (S50) is the operation that the PTH forming hole (HOLE, 1) additional electric conductivity is impregnated with developer solution, as
Described 4th operation is recorded, and dry film (3) and release paper (4) egative film placed over make the part beyond PTH can expose with printing opacity
Light, in order to form the described PTH of open form.Developer solution is utilized to peel off in order to remove the release paper (4) do not hardened, now,
Developer solution is impregnated with the PTH of substrate and makes to dissolve the dry film (3) being placed in the back side.
Described 6th operation (S60) is operation copper-plated to PTH, in order to the above formation copper facing of described conductive membrane (2)
(5).Electro-coppering is that the inwall in pattern and hole uses electroprecipitation method to plate 2 copper facing operations of specific thickness copper, its precipitation capacity
It is decided by electric current density and sedimentation time.Now, the dry film (3) at the developer solution back side owing to being impregnated with in described 5th operation (S50)
Dissolve, so copper facing is to the layers of copper of quilt cover after copper facing (5) process.
Described 7th operation (S70) is in the two-sided stripping dry film of flexible copper foil laminated plates and the operation of release paper, by such as
Upper described stripping removes dry film (3) and release paper (4) so that can easily form microfine circuit on the surface of copper laminated plates.
Described 8th operation (S80) is the operation that the final pad forming P/T and hole on substrate forms circuit.
Above, although be illustrated the various embodiments of the present invention, these embodiments only realize the present invention
One embodiment of technological thought, naturally, it is achieved any modification of the technology of the present invention thought or fixed case belong to
The scope of the present invention.
Claims (4)
1. the manufacture method of printed circuit board (PCB), is characterized in that comprising:
It is used for the edge PTH hole (HOLE, 1) of BVH with ultraviolet laser brill or CNC brill processing at one piece of double-faced flexible copper foil laminates
1st operation (S10), attached with the electroless electroless copper hole (HOLE, 1) to being formed on described one piece of double-faced flexible copper foil laminates
Add the 2nd operation (S20) of electric conductivity, the double spread dry film of described one piece of double-faced flexible copper foil laminates and the 3rd of release paper the
Operation (S30), the one side of the one piece of double-faced flexible copper foil laminates manufactured in described 3rd operation will be used for beyond the PTH of BVH
The 4th operation (S40) of Partial exposure, remove dry film and the release paper of exposure in described 4th operation, to open PTH leaching
Developer solution removes the 5th operation (S50) of the dry film in another side coating thoroughly, and a piece formed in described 5th operation (S50) is double
Face flexible copper foil laminated plates carries out the 6th operation (S60) of electro-coppering, one piece of double-faced flexible after copper facing in the 6th operation (S60)
Copper foil laminates peels off two-sided dry film and the 7th operation (S70) of release paper, and one piece manufactured in the 7th operation (S70) two-sided
The 8th operation (S80) of circuit is formed in flexible copper foil laminated plates.
The manufacture method of printed circuit board (PCB) the most according to claim 1, is characterized in that putting in described 4th operation (S40)
Make the partial light permeability beyond PTH is exposed in the egative film location of one side, in order to form the PTH of open form.
The manufacture method of printed circuit board (PCB) the most according to claim 1, is characterized in that described 5th operation (S50) is at PTH
Being impregnated with the operation of developer solution, described developer solution is impregnated with the PTH of substrate (E), in order to dissolves and removes the dry film (3) being positioned at another side,
The most once form button (BUTTON) and the button (BUTTON) of sizes can be formed again.
The manufacture method of printed circuit board (PCB) the most according to claim 1, is characterized in that described 6th operation (S60) is separately
Carry out copper facing under the state that one side places release paper, be therefore possible to prevent at the position that pad size is little to form copper facing deviation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0085597 | 2012-08-06 | ||
| KR1020120085597A KR101201948B1 (en) | 2012-08-06 | 2012-08-06 | The printed circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103582306A CN103582306A (en) | 2014-02-12 |
| CN103582306B true CN103582306B (en) | 2016-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310007239.7A Active CN103582306B (en) | 2012-08-06 | 2013-01-09 | The manufacture method of printed circuit board (PCB) |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101201948B1 (en) |
| CN (1) | CN103582306B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105714277B (en) * | 2014-12-03 | 2019-08-30 | 珠海方正科技多层电路板有限公司 | The circuit manufacturing method of dry film, the method for plating metal of electric elements and circuit board |
| CN106211600B (en) * | 2016-07-28 | 2019-03-05 | 陈国富 | The production method that the LED printed wiring board of copper etching area can be saved |
| CN114286526B (en) * | 2021-12-02 | 2023-08-25 | 宜兴硅谷电子科技有限公司 | Copper reduction process of printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1798484A (en) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
| CN100482046C (en) * | 2004-10-04 | 2009-04-22 | 株式会社丸和制作所 | Printed circuit board manufacturing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4099501B2 (en) | 2004-10-04 | 2008-06-11 | 株式会社丸和製作所 | Printed circuit board manufacturing method |
| KR100797719B1 (en) * | 2006-05-10 | 2008-01-23 | 삼성전기주식회사 | Process for build-up printed circuit board |
| KR20120007909A (en) * | 2010-07-15 | 2012-01-25 | 주식회사 에스아이 플렉스 | Printed wiring board manufacturing method |
-
2012
- 2012-08-06 KR KR1020120085597A patent/KR101201948B1/en active IP Right Grant
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2013
- 2013-01-09 CN CN201310007239.7A patent/CN103582306B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100482046C (en) * | 2004-10-04 | 2009-04-22 | 株式会社丸和制作所 | Printed circuit board manufacturing method |
| CN1798484A (en) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101201948B1 (en) | 2012-11-16 |
| CN103582306A (en) | 2014-02-12 |
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