CN104105352B - A kind of aluminium etches the manufacture method of FPC - Google Patents
A kind of aluminium etches the manufacture method of FPC Download PDFInfo
- Publication number
- CN104105352B CN104105352B CN201410289176.3A CN201410289176A CN104105352B CN 104105352 B CN104105352 B CN 104105352B CN 201410289176 A CN201410289176 A CN 201410289176A CN 104105352 B CN104105352 B CN 104105352B
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- Prior art keywords
- base material
- sensitive layer
- shade
- light sensitive
- exposure
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000004411 aluminium Substances 0.000 title claims abstract description 18
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000010030 laminating Methods 0.000 claims abstract description 48
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000011161 development Methods 0.000 claims abstract description 5
- 230000008569 process Effects 0.000 claims abstract description 4
- 239000005030 aluminium foil Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims 1
- 238000010301 surface-oxidation reaction Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 abstract description 3
- 230000001788 irregular Effects 0.000 abstract description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002305 electric material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- -1 (2) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses the manufacture method that a kind of aluminium etches FPC, comprise the following steps：(1), the laminating step of base material；(2), it is coated with light sensitive layer step；(3), step of exposure；(4), development step；(5), etching step；(6) light sensitive layer step, is removed.The present invention forms line pattern using the method for exposure imaging on base material, and the wiring board pattern of production is consistent with the pattern reserved on shade egative film, and wiring board pattern edge is not in the irregular shapes such as zigzag, greatly improves pattern accuracy.The plane of exposure of base material of the present invention is close in motion process on shade egative film, linear light passes through after shade egative film direct irradiation on plane of exposure, it is to avoid scattering of the light after shade egative film, improves circuit exposing patterns shaping definition.The present invention can not only produce the FPC of one side, moreover it is possible to produce two-sided FPC.
Description
Technical field
The present invention relates to circuit board fabrication method, more particularly to a kind of aluminium etches the manufacture method of FPC.
Background technology
Conventional method for printing patterns includes gravure method, the good pattern for needing to print is carved in roller, it is special to reuse
Ink, print the images on laminating material.Due to engraving roller technology restriction in itself, the precision of printed patterns can be by
Influence.
And it is current, it has been a kind of widely used method using etching method production flexibility wiring board.Etching method is general all
It is, in laminating printing on substrates pattern, then to etch away the conductive material not covered by ink using special ink, then
Ink is washed, the laminating part of the conductive material covered by ink and base material is left, that is, obtains required FPC.
Pattern needed for being generated on laminating material with ink is the key link for manufacturing FPC.
The new approaches that pattern is engraving method, but current exposure are generated using photosensitive material, using exposure method
Method can only typically provide intermittent exposure, it is impossible to applied in the production procedure of serialization.
The content of the invention
Etched it is an object of the invention to deficiency and defect for existing line plate producing process there is provided a kind of aluminium flexible
The manufacture method of wiring board, the manufacture method has the advantages that continuous production, line pattern are clear.
Technical problem solved by the invention can be realized using following technical scheme：
A kind of aluminium etches the manufacture method of FPC, it is characterised in that comprise the following steps：
(1), the laminating step of base material：Aluminium foil conductive material is laminating on flexible parent metal surface, obtain laminating base material；
(2), it is coated with light sensitive layer step：Light sensitive layer is coated with the aluminium foil conductive material surface of laminating base material；
(3), step of exposure：Make laminating base material at the uniform velocity by rotating in exposure source, the rotation exposure source in exposure room
With orientation linear light sorurce, the laminating base material is coated with the one side laminating of light sensitive layer by opening in the rotation exposure source
On shade egative film provided with circuit exposing patterns, the transporting velocity of the laminating base material and the shade egative film of the rotation exposure source
Rotation linear velocity it is equal；
(4), development step：Remove the light sensitive layer for not being exposed part on laminating base material；
(5), etching step；The laminating base material obtained in step (4) is etched, the aluminium foil covered by light sensitive layer is led
Electric material will not be etched, and stay in and line pattern is formed on flexible parent metal；
(6) light sensitive layer step, is removed：The light sensitive layer on laminating base material obtained in cleaning removing step (5), is obtained
Aluminium etches FPC.
In a preferred embodiment of the invention, cleaning step is also included between the step (1) and step (2), will
The oxide-film of the aluminium foil surface for the laminating base material that step (1) is obtained cleans removal with sodium hydroxide solution.
In a preferred embodiment of the invention, drying light sensitive layer is also included between the step (2) and step (3)
Step.
In a preferred embodiment of the invention, the step (3) is carried out in the case where vacuumizing environment.
As a result of technical scheme as above, the present invention forms line map using the method for exposure imaging on base material
Case, the wiring board pattern of production is consistent with the pattern reserved on shade egative film, and wiring board pattern edge is not in zigzag
Etc. irregular shape, overcome the site of traditional laser carving plate to limit, greatly improve pattern accuracy.The exposure of the base material of the present invention
Smooth surface is close in motion process on shade egative film, and linear light is through direct irradiation after shade egative film on plane of exposure, it is to avoid
Scattering of the light after shade egative film, improves circuit exposing patterns shaping definition.The present invention can not only produce list
The FPC in face, moreover it is possible to produce two-sided FPC.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to understand, enter below
One step illustrates the present invention.
A kind of aluminium etches the manufacture method of FPC, comprises the following steps：(1), the laminating step of base material, (2), coating
Light sensitive layer step, (3), step of exposure, (4), development step, (5), etching step, remove light sensitive layer step, below at (6)
Specifically each step is described：
(1), the laminating step of base material：Aluminium foil conductive material is laminating on flexible parent metal surface, obtain laminating base material；If
Need to manufacture double-faced flexible wiring board, laminating on two surfaces of base material there can be aluminium foil conductive material, and aluminium foil conductive material can
To be replaced by the conductive metal material that those skilled in the art are readily apparent that, such as Copper Foil.Light sensitive layer is subsequently coated with order that obtaining
When adhesive force more preferably, after this step also include cleaning step, the oxidation of the aluminium foil surface for the laminating base material that step (1) is obtained
Film cleans removal with sodium hydroxide solution.
(2), it is coated with light sensitive layer step：Light sensitive layer is coated with the aluminium foil conductive material surface of laminating base material, it is photosensitive
Coating is the photosensitive-ink that easy cleaning and being difficult is etched.After light sensitive layer has been coated with, it can be incited somebody to action by drying plant
Light sensitive layer is dried.
(3), step of exposure：Laminating base material is set at the uniform velocity to have by rotating in exposure source, rotation exposure source in exposure room
Linear light sorurce is oriented, orientation linear light sorurce is not rotated with rotation exposure source, and the outer surface of rotation exposure source is surrounded with screening
Circuit exposing patterns are offered on cover egative film, shade egative film.Laminating base material is coated with the one side laminating of light sensitive layer by rotation
Turn on the shade egative film of exposure source, the rotation linear velocity phase of shade egative film of the transporting velocity of laminating base material with rotating exposure source
Deng when the arbitrfary point on laminating base material is by the shade egative film that rotates exposure source, being fitted to from it specific on shade egative film
Point starts, and the shade egative film of rotation exposure source is left to it, both keep geo-stationary so that the linear source alignment laminating of orientation
The light sensitive layer exposure of circuit exposing patterns part on shade egative film.The step biggest advantage is exactly laminating base material coating
There is the one side laminating of light sensitive layer by the shade egative film of rotation exposure source so that linear light is passed through after shade egative film directly
It is radiated on plane of exposure, it is to avoid scattering of the light after shade egative film, improves circuit exposing patterns shaping definition.It is whole
Individual step of exposure can be in the environment of vacuumizing, and the environmental benefits vacuumized are in the transfer for being exposed on figure on light sensitive layer.
Step (4) to step (6) is prior art：
(4), development step：Remove the light sensitive layer for not being exposed part on laminating base material.
(5), etching step；The laminating base material obtained in step (4) is etched, the aluminium foil covered by light sensitive layer is led
Electric material will not be etched, and stay in and line pattern is formed on flexible parent metal.
(6) light sensitive layer step, is removed：The light sensitive layer on laminating base material obtained in cleaning removing step (5), is obtained
Aluminium etches FPC.
The present invention forms line pattern, wiring board pattern and the shade bottom of production using the method for exposure imaging on base material
The pattern reserved on piece is consistent, and wiring board pattern edge is not in the irregular shapes such as zigzag, overcomes traditional laser
The site limitation of cut, greatly improves pattern accuracy.And the aluminium manufactured using the inventive method etches FPC
Circuit exposing patterns shaping definition be higher than other method.
The present invention can not only manufacture one side aluminium etching FPC, can also produce two-sided FPC, will
The base material of two-sided laminating photosensitive material is first passed through after the above method obtains one side aluminium etching FPC, then will be unexposed
Other one side another one side aluminium obtained by above-mentioned same method etch FPC, it is soft that two sides is the etching of one side aluminium
Property wiring board integrally become two-sided aluminium etching FPC.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appending claims and its
Equivalent thereof.
Claims (2)
1. a kind of aluminium etches the manufacture method of FPC, it is characterised in that comprise the following steps：
(1), the laminating step of base material：Aluminium foil conductive material is laminating on flexible parent metal surface, obtain laminating base material；
(2), it is coated with light sensitive layer step：Light sensitive layer is coated with the aluminium foil conductive material surface of laminating base material；
(3), step of exposure：Laminating base material is set at the uniform velocity to have by rotating in exposure source, the rotation exposure source in exposure room
Orient linear light sorurce, the laminating base material be coated with light sensitive layer one side be close in motion process offer circuit exposure
On the shade egative film of pattern, the transporting velocity of the laminating base material and the rotation linear velocity of the shade egative film of the rotation exposure source
It is equal；When the arbitrfary point on laminating base material is by the shade egative film that rotates exposure source, the spy fitted to from it on shade egative film
Fixed point starts, and the shade egative film of rotation exposure source is left to it, both keep geo-stationary so that the linear source alignment patch of orientation
Close the light sensitive layer exposure of the circuit exposing patterns part on shade egative film；The step (3) is carried out in the case where vacuumizing environment；
(4), development step：Remove the light sensitive layer for not being exposed part on laminating base material；
(5), etching step；The laminating base material obtained in step (4) is etched, the aluminium foil conduction material covered by light sensitive layer
Material will not be etched, and stay in and line pattern is formed on flexible parent metal；
(6) light sensitive layer step, is removed：The light sensitive layer on laminating base material obtained in cleaning removing step (5), obtains aluminium erosion
Carve FPC；
Also include drying light sensitive layer step between the step (2) and step (3).
2. a kind of aluminium as claimed in claim 1 etches the manufacture method of FPC, it is characterised in that the step (1)
The step of also including cleaning laminating base material aluminium foil surface oxidation film between step (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410289176.3A CN104105352B (en) | 2014-06-24 | 2014-06-24 | A kind of aluminium etches the manufacture method of FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410289176.3A CN104105352B (en) | 2014-06-24 | 2014-06-24 | A kind of aluminium etches the manufacture method of FPC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104105352A CN104105352A (en) | 2014-10-15 |
| CN104105352B true CN104105352B (en) | 2017-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410289176.3A Active CN104105352B (en) | 2014-06-24 | 2014-06-24 | A kind of aluminium etches the manufacture method of FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104105352B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106444286A (en) * | 2016-08-31 | 2017-02-22 | 江门市阪桥电子材料有限公司 | Light-sensitive circuit material and preparation method thereof |
| CN110337189B (en) * | 2019-06-28 | 2020-12-22 | 惠州市星之光科技有限公司 | Circuit board etching method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003215808A (en) * | 2002-01-25 | 2003-07-30 | Pentax Corp | Multi-exposure drawing device and its lighting mechanism |
| CN103229105A (en) * | 2010-11-23 | 2013-07-31 | 彩虹科技系统有限公司 | Photoimaging |
| CN103369451A (en) * | 2013-07-08 | 2013-10-23 | 裘华见 | Production technology of ribbon-type high-pitch diaphragm |
| CN103400812A (en) * | 2013-07-03 | 2013-11-20 | 华天科技（西安）有限公司 | FCQFN packaging part filled by underfill material and production process thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000035677A (en) * | 1998-07-17 | 2000-02-02 | Adtec Engineeng:Kk | Aligner |
-
2014
- 2014-06-24 CN CN201410289176.3A patent/CN104105352B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003215808A (en) * | 2002-01-25 | 2003-07-30 | Pentax Corp | Multi-exposure drawing device and its lighting mechanism |
| CN103229105A (en) * | 2010-11-23 | 2013-07-31 | 彩虹科技系统有限公司 | Photoimaging |
| CN103400812A (en) * | 2013-07-03 | 2013-11-20 | 华天科技（西安）有限公司 | FCQFN packaging part filled by underfill material and production process thereof |
| CN103369451A (en) * | 2013-07-08 | 2013-10-23 | 裘华见 | Production technology of ribbon-type high-pitch diaphragm |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104105352A (en) | 2014-10-15 |
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Denomination of invention: Manufacturing method of aluminum etching flexible circuit board Effective date of registration: 20180816 Granted publication date: 20170718 Pledgee: Bank of Communications Ltd Shanghai Lingang Xincheng branch Pledgor: SHANGHAI INLAY LINK INC. Registration number: 2018310000050 |
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Denomination of invention: Manufacturing method of aluminum etching flexible circuit board Effective date of registration: 20190827 Granted publication date: 20170718 Pledgee: Bank of Communications Ltd Shanghai Lingang Xincheng branch Pledgor: SHANGHAI INLAY LINK INC. Registration number: Y2019310000012 |
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Denomination of invention: A manufacturing method of aluminum etched flexible circuit board Effective date of registration: 20201225 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI INLAY LINK Inc. Registration number: Y2020310000049 |
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Application publication date: 20141015 Assignee: Internet of things technology Qidong Co.,Ltd. Assignor: SHANGHAI INLAY LINK Inc. Contract record no.: X2021980002130 Denomination of invention: A manufacturing method of aluminum etched flexible circuit board Granted publication date: 20170718 License type: Common License Record date: 20210325 |
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