CN104105352A - Manufacturing method of aluminum etching flexible circuit board - Google Patents
Manufacturing method of aluminum etching flexible circuit board Download PDFInfo
- Publication number
- CN104105352A CN104105352A CN201410289176.3A CN201410289176A CN104105352A CN 104105352 A CN104105352 A CN 104105352A CN 201410289176 A CN201410289176 A CN 201410289176A CN 104105352 A CN104105352 A CN 104105352A
- Authority
- CN
- China
- Prior art keywords
- base material
- laminating
- circuit board
- sensitive layer
- light sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 45
- 239000004411 aluminium Substances 0.000 claims description 18
- 239000005030 aluminium foil Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000011161 development Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract 3
- 230000001788 irregular Effects 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000000465 moulding Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- -1 (2) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of an aluminum etching flexible circuit board. The manufacturing method comprises the following steps of (1), covering a substrate, (2), spreading a photosensitive coating, (3), performing exposure, (4), performing developing, (5), performing etching, and (6), removing the photosensitive coating. According to the manufacturing method, a circuit pattern is formed on the substrate by an exposure and developing method, a produced circuit board pattern is identical with a pattern reserved on a shade negative, and the edge of the circuit board pattern is free from irregular shapes such as a sawtooth shape, so that the accuracy of the pattern is improved greatly. An exposure surface of the substrate clings to the shade negative in a motion process, and linear light passes through the shade negative and then directly radiates on the exposure surface, so that scattering after the light passes through the shade negative is avoided, and the forming definition of a circuit exposure pattern is improved. The manufacturing method can be used for producing single-sided and double-sided flexible circuit boards.
Description
Technical field
The present invention relates to wiring board manufacture method, particularly a kind of manufacture method of aluminium etching flexible circuit board.
Background technology
Conventional method for printing patterns comprises gravure method, and in roller, the good pattern that needs printing of engraving, re-uses special ink, prints the images on laminating material.Due to the technical limitations of engraving roller itself, the precision of printed patterns can be affected.
And at present, adopting etching method production flexible circuit board has been a kind of method extensively adopting.Etching method is all generally to adopt special ink printed patterns on laminating base material, then the electric conducting material not covered by ink is etched away, wash again ink, leave the electric conducting material that covered by ink and the laminating part of base material, obtain required flexible circuit board.On laminating material, with ink, generating required pattern is the key link of manufacturing flexible circuit board.
Adopting photosensitive material, using exposure method pattern generation is new approaches of engraving method, but current exposure method generally can only provide intermittent exposure, can not be applied in the production procedure of serialization.
Summary of the invention
The object of the invention is to deficiency and defect for existing line plate producing process, a kind of manufacture method of aluminium etching flexible circuit board is provided, this manufacture method has the advantages such as continuous production, line pattern is clear.
Technical problem solved by the invention can realize by the following technical solutions:
A manufacture method for aluminium etching flexible circuit board, is characterized in that, comprises the following steps:
(1), the laminating step of base material: aluminium foil electric conducting material is laminating on flexible parent metal surface, obtain laminating base material;
(2), coating light sensitive layer step: be coated with light sensitive layer on the aluminium foil electric conducting material surface of laminating base material;
(3), step of exposure: make laminating base material at the uniform velocity by rotation exposure source in exposure room, in described rotation exposure source, there is directed linear light sorurce, described laminating base material is coated with the one side laminating of light sensitive layer through on the shade egative film that offers circuit exposing patterns of described rotation exposure source, and the transporting velocity of described laminating base material equates with the rotational line speed of the shade egative film of described rotation exposure source;
(4), development step: remove the light sensitive layer that is not exposed part on laminating base material;
(5), etching step; The laminating base material obtaining in step (4) is carried out to etching, and the aluminium foil electric conducting material being covered by light sensitive layer can be not etched, stays and on flexible parent metal, form line pattern;
(6), remove light sensitive layer step: clean and remove the light sensitive layer on the laminating base material obtaining in step (5), obtain aluminium etching flexible circuit board.
In a preferred embodiment of the invention, between described step (1) and step (2), also comprise cleaning step, the oxide-film of the aluminium foil surface of the laminating base material that step (1) is obtained cleans and removes with sodium hydroxide solution.
In a preferred embodiment of the invention, between described step (2) and step (3), also comprise and dry light sensitive layer step.
In a preferred embodiment of the invention, described step (3) is carried out vacuumizing under environment.
Owing to having adopted technical scheme as above, the present invention adopts the method for exposure imaging on base material, to form line pattern, the wiring board pattern of producing is consistent with pattern reserved on shade egative film, and wiring board pattern edge there will not be zigzag etc. irregularly shaped, overcome the site restriction of traditional laser carving plate, greatly improve pattern precision.The plane of exposure of base material of the present invention is close on shade egative film in motion process, and linear light on plane of exposure, has been avoided the scattering of light after shade egative film through direct irradiation after shade egative film, has improved circuit exposing patterns moulding definition.The present invention not only can produce the flexible circuit board of one side, can also produce two-sided flexible circuit board.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach object and effect is easy to understand, below further set forth the present invention.
A kind of manufacture method of aluminium etching flexible circuit board, comprise the following steps: (1), the laminating step of base material, (2), coating light sensitive layer step, (3), step of exposure, (4), development step, (5), etching step, (6), remove light sensitive layer step, below are specifically described each step:
(1), the laminating step of base material: aluminium foil electric conducting material is laminating on flexible parent metal surface, obtain laminating base material; If need to manufacture double-faced flexible wiring board, can laminatingly on two surfaces of base material have aluminium foil electric conducting material, and aluminium foil electric conducting material can be replaced by the metallic conduction material that those skilled in the art easily expect, as Copper Foil.Adhesive force is better when making follow-up coating light sensitive layer, also comprises cleaning step after this step, and sodium hydroxide solution cleans and removes for the oxide-film of the aluminium foil surface of the laminating base material that step (1) is obtained.
(2), coating light sensitive layer step: be coated with light sensitive layer on the aluminium foil electric conducting material surface of laminating base material, light sensitive layer is easy cleaning and is difficult for etched photosensitive-ink.After being coated with light sensitive layer, can light sensitive layer be dried by drying plant.
(3), step of exposure: make laminating base material at the uniform velocity by rotation exposure source in exposure room, in rotation exposure source, there is directed linear light sorurce, directed linear light sorurce does not rotate with rotation exposure source, and the outer surface of rotation exposure source is surrounded with shade egative film, offers circuit exposing patterns on shade egative film.Laminating base material is coated with the one side laminating of light sensitive layer through on the shade egative film at rotation exposure source, the transporting velocity of laminating base material equates with the rotational line speed of the shade egative film of rotation exposure source, when the shade egative film of rotation exposure source is passed through in the arbitrfary point on laminating base material, the specified point fitting to shade egative film from it starts, to it, leave the shade egative film of rotation exposure source, both maintenances are relatively static, make directed linear source alignment be fitted in the light sensitive layer exposure of the circuit exposing patterns part on shade egative film.The advantage of this step maximum be exactly laminating base material be coated with light sensitive layer one side laminating through on the shade egative film at rotation exposure source, after making linear light pass shade egative film, direct irradiation is on plane of exposure, avoid the scattering of light after shade egative film, improved circuit exposing patterns moulding definition.Whole step of exposure can be under the environment vacuumizing, and the environment vacuumizing is conducive to the transfer of exposure figure on light sensitive layer.
Step (4) to step (6) is prior art:
(4), development step: remove the light sensitive layer that is not exposed part on laminating base material.
(5), etching step; The laminating base material obtaining in step (4) is carried out to etching, and the aluminium foil electric conducting material being covered by light sensitive layer can be not etched, stays and on flexible parent metal, form line pattern.
(6), remove light sensitive layer step: clean and remove the light sensitive layer on the laminating base material obtaining in step (5), obtain aluminium etching flexible circuit board.
The present invention adopts the method for exposure imaging on base material, to form line pattern, the wiring board pattern of producing is consistent with pattern reserved on shade egative film, and wiring board pattern edge there will not be zigzag etc. irregularly shaped, overcome the site restriction of traditional laser carving plate, greatly improve pattern precision.And utilize the circuit exposing patterns moulding definition of the produced aluminium etching of the inventive method flexible circuit board higher than additive method.
The present invention not only can manufacture one side aluminium etching flexible circuit board, also can produce two-sided flexible circuit board, after the base material of two-sided all laminating photosensitive materials is first obtained to one side aluminium etching flexible circuit board by said method, again unexposed other one side is obtained to another one side aluminium etching flexible circuit board by above-mentioned same method, two sides is one side aluminium etching flexible circuitry slab integral and has just become two-sided aluminium etching flexible circuit board.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (4)
1. a manufacture method for aluminium etching flexible circuit board, is characterized in that, comprises the following steps:
(1), the laminating step of base material: aluminium foil electric conducting material is laminating on flexible parent metal surface, obtain laminating base material;
(2), coating light sensitive layer step: be coated with light sensitive layer on the aluminium foil electric conducting material surface of laminating base material;
(3), step of exposure: make laminating base material at the uniform velocity by rotation exposure source in exposure room, in described rotation exposure source, there is directed linear light sorurce, described laminating base material is coated with the one side laminating of light sensitive layer through on the shade egative film that offers circuit exposing patterns of described rotation exposure source, and the transporting velocity of described laminating base material equates with the rotational line speed of the shade egative film of described rotation exposure source;
(4), development step: remove the light sensitive layer that is not exposed part on laminating base material;
(5), etching step; The laminating base material obtaining in step (4) is carried out to etching, and the aluminium foil electric conducting material being covered by light sensitive layer can be not etched, stays and on flexible parent metal, form line pattern;
(6), remove light sensitive layer step: clean and remove the light sensitive layer on the laminating base material obtaining in step (5), obtain aluminium etching flexible circuit board.
2. the manufacture method of a kind of aluminium etching flexible circuit board as claimed in claim 1, is characterized in that, also comprises the step of cleaning laminating base material aluminium foil surface oxide-film between described step (1) and step (2).
3. the manufacture method of a kind of aluminium etching flexible circuit board as claimed in claim 1, is characterized in that, also comprises and dry light sensitive layer step between described step (2) and step (3).
4. the manufacture method of a kind of aluminium etching flexible circuit board as described in claim 1 or 2 or 3, is characterized in that, described step (3) is carried out vacuumizing under environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410289176.3A CN104105352B (en) | 2014-06-24 | 2014-06-24 | A kind of aluminium etches the manufacture method of FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410289176.3A CN104105352B (en) | 2014-06-24 | 2014-06-24 | A kind of aluminium etches the manufacture method of FPC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104105352A true CN104105352A (en) | 2014-10-15 |
| CN104105352B CN104105352B (en) | 2017-07-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410289176.3A Active CN104105352B (en) | 2014-06-24 | 2014-06-24 | A kind of aluminium etches the manufacture method of FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104105352B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106444286A (en) * | 2016-08-31 | 2017-02-22 | 江门市阪桥电子材料有限公司 | Light-sensitive circuit material and preparation method thereof |
| CN110337189A (en) * | 2019-06-28 | 2019-10-15 | 惠州市星之光科技有限公司 | Circuit board etching method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000035677A (en) * | 1998-07-17 | 2000-02-02 | Adtec Engineeng:Kk | Aligner |
| JP2003215808A (en) * | 2002-01-25 | 2003-07-30 | Pentax Corp | Multi-exposure drawing device and its lighting mechanism |
| CN103229105A (en) * | 2010-11-23 | 2013-07-31 | 彩虹科技系统有限公司 | Photoimaging |
| CN103369451A (en) * | 2013-07-08 | 2013-10-23 | 裘华见 | Production technology of ribbon-type high-pitch diaphragm |
| CN103400812A (en) * | 2013-07-03 | 2013-11-20 | 华天科技（西安）有限公司 | FCQFN packaging part filled by underfill material and production process thereof |
-
2014
- 2014-06-24 CN CN201410289176.3A patent/CN104105352B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000035677A (en) * | 1998-07-17 | 2000-02-02 | Adtec Engineeng:Kk | Aligner |
| JP2003215808A (en) * | 2002-01-25 | 2003-07-30 | Pentax Corp | Multi-exposure drawing device and its lighting mechanism |
| CN103229105A (en) * | 2010-11-23 | 2013-07-31 | 彩虹科技系统有限公司 | Photoimaging |
| CN103400812A (en) * | 2013-07-03 | 2013-11-20 | 华天科技（西安）有限公司 | FCQFN packaging part filled by underfill material and production process thereof |
| CN103369451A (en) * | 2013-07-08 | 2013-10-23 | 裘华见 | Production technology of ribbon-type high-pitch diaphragm |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106444286A (en) * | 2016-08-31 | 2017-02-22 | 江门市阪桥电子材料有限公司 | Light-sensitive circuit material and preparation method thereof |
| CN110337189A (en) * | 2019-06-28 | 2019-10-15 | 惠州市星之光科技有限公司 | Circuit board etching method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104105352B (en) | 2017-07-18 |
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Address after: 201300 Shanghai city Pudong New Area Town Road No. 164 Xuan Xuan Applicant after: SHANGHAI INLAY LINK INC. Address before: 201300 Shanghai city Pudong New Area Town Road No. 164 Xuan Xuan Applicant before: Shanghai Yingnei Electronic Label Co., Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: Manufacturing method of aluminum etching flexible circuit board Effective date of registration: 20180816 Granted publication date: 20170718 Pledgee: Bank of Communications Ltd Shanghai Lingang Xincheng branch Pledgor: SHANGHAI INLAY LINK INC. Registration number: 2018310000050 |
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Date of cancellation: 20190826 Granted publication date: 20170718 Pledgee: Bank of Communications Ltd Shanghai Lingang Xincheng branch Pledgor: SHANGHAI INLAY LINK INC. Registration number: 2018310000050 |
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Denomination of invention: Manufacturing method of aluminum etching flexible circuit board Effective date of registration: 20190827 Granted publication date: 20170718 Pledgee: Bank of Communications Ltd Shanghai Lingang Xincheng branch Pledgor: SHANGHAI INLAY LINK INC. Registration number: Y2019310000012 |
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Date of cancellation: 20201224 Granted publication date: 20170718 Pledgee: Bank of Communications Ltd. Shanghai Lingang Xincheng branch Pledgor: SHANGHAI INLAY LINK Inc. Registration number: Y2019310000012 |
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Denomination of invention: A manufacturing method of aluminum etched flexible circuit board Effective date of registration: 20201225 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI INLAY LINK Inc. Registration number: Y2020310000049 |
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Application publication date: 20141015 Assignee: Internet of things technology Qidong Co.,Ltd. Assignor: SHANGHAI INLAY LINK Inc. Contract record no.: X2021980002130 Denomination of invention: A manufacturing method of aluminum etched flexible circuit board Granted publication date: 20170718 License type: Common License Record date: 20210325 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211230 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI INLAY LINK Inc. Registration number: Y2020310000049 |