CN103917057A - Manufacturing method of printed circuit board small windowing pad - Google Patents
Manufacturing method of printed circuit board small windowing pad Download PDFInfo
- Publication number
- CN103917057A CN103917057A CN201210593683.7A CN201210593683A CN103917057A CN 103917057 A CN103917057 A CN 103917057A CN 201210593683 A CN201210593683 A CN 201210593683A CN 103917057 A CN103917057 A CN 103917057A
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- Prior art keywords
- solder mask
- windowing
- laser
- pad
- printed substrate
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention belongs to the field of printed circuit board manufacturing, and especially relates to a manufacturing method of a printed circuit board small windowing pad. The method comprises the following steps: preparing a printed circuit board, the printed circuit board being printed with a conductive line formed by copper metal; according to a design requirement, forming a line figure on Fiering; uniformly smearing the surface, which is printed with a conductive circuit board, on the printed circuit board to form a solder mask; fixedly arranging the Fiering with a line connection figure formed thereon on the solder mask; and according to the line figure formed on the Fiering, performing exposure and development. According to the invention, the solder mask disposed right above a small windowing pad is etched by use of laser, and a portion, which is etched by the laser, on the solder mask is gasified so as to expose the small windowing pad needing conduction on the printed circuit board. The solder mask is etched by use of the laser and the etched portion of the solder mask is rapidly gasified to form windowing so that the problems of pad collapse and not clear development of a small windowing fine pad are solved, and the requirement for refinement of a pad is satisfied.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, relate in particular to a kind of printed substrate windowing method.
Background technology
Along with the develop rapidly of current electronic technology, in electronic product, almost the manufacturing process of requisite printed substrate has also obtained huge development.At present, along with the develop rapidly of semiconductor microelectronic technology, impel semiconductor packages to develop to densification.The live width line-spacing, aperture, more tinyization of pad that make base plate for packaging, pad diameter develops into 50um by 200um, and live width line-spacing develops to 15um.
And the currently used technique of utilizing film making welding resistance to window is limited to the restriction of resolution, the development resolution of ink etc. of exposure sources contraposition accuracy, the harmomegathus of product own, the film, smaller szie pad (disk track <100um) welding resistance is prone to crash while windowing, the defect such as unclean of developing making to make this technique, is restricting further developing of its technology.And high-precision exposure machine often price is higher, be unfavorable for application.
Summary of the invention
The object of the present invention is to provide the manufacture method of the little pad of windowing of a kind of printed substrate, be intended to solve make in prior art and when smaller szie pad welding resistance is windowed, be prone to crash, the unclean problem of developing.
The present invention is achieved in that the manufacture method of the little pad of windowing of a kind of printed substrate, comprise with
Lower step:
Prepare a printed substrate, on described printed substrate, be printed with the conducting wire being formed by copper metal;
By designing requirement, on the film, form line pattern;
On described printed substrate, be printed with on the face of conducting wire plate and evenly smear and form a solder mask;
By the described film fixed placement that is formed with connection figure on described solder mask;
Exposure, so that part sensitization polymerization on described solder mask;
Develop, with by described solder mask not sensitization polymeric part utilize chemical reaction to be removed;
Solidify, by baking, sensitization polymeric part on described solder mask is solidified;
Described solder mask on utilizing directly over the little pad of windowing of laser-induced thermal etching, by the partial gasification of described laser-induced thermal etching, exposes the little pad of windowing that needs conducting on described printed substrate on described solder mask.
Further, the thickness of described solder mask is 8 ~ 12um.
Further, described laser is CO2 laser or UV laser.
Further, described line pattern is printed on the described film by mask aligner.
Further, described solder resist material is liquid photosensitive ink or uv curing ink.
Compared with prior art, utilize the absorptivity difference of unlike material to ripple in the present invention, adopt solder mask described in laser-induced thermal etching, etched solder mask part moment gasification is windowed, and exposes the conducting wire that need to be communicated with other copper plates.Because laser is meticulous, etching is accurate, and whole windowing in process do not need to use chemical agent to develop, and is not subject to the impact of film resolution and solder mask development resolution, has avoided crash and the unclean problem of developing, and has met the requirement that pad becomes more meticulous.
Accompanying drawing explanation
Fig. 1 is the generalized section that is printed with the printed substrate of conducting wire in the embodiment of the present invention;
Fig. 2 is that solder mask described in the embodiment of the present invention is applied in the generalized section on the conducting wire of described printed substrate;
Fig. 3 is the exposure schematic diagram of solder mask described in the embodiment of the present invention;
Fig. 4 is the development schematic diagram of solder mask described in the embodiment of the present invention;
Fig. 5 is the curing schematic diagram of solder mask described in the embodiment of the present invention;
Fig. 6 be in the embodiment of the present invention on described solder mask the laser schematic diagram of windowing;
Fig. 7 is the generalized section after the cleaning of solder mask described in the embodiment of the present invention.
Description of symbols:
1 printed substrate 11 conducting wires
Not sensitization part on 2 solder mask 21 solder masks
Laser-induced thermal etching part on 3 film 22 solder masks
4 laser
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Below in conjunction with concrete accompanying drawing, realization of the present invention is described in detail.
Referring to shown in Fig. 1 to Fig. 7, the manufacture method of the little pad of windowing of a kind of printed substrate 1 provided by the invention, comprises the following steps:
Prepare a printed substrate 1, on described printed substrate 1, be printed with the conducting wire 11 being formed by copper metal;
By designing requirement, on the film 3, form line pattern;
On described printed substrate 1, be printed with on the face of conducting wire 11 plates and evenly smear and form a solder mask 2;
By the described film 3 fixed placement that are formed with connection figure on described solder mask 2;
Exposure, so that part sensitization polymerization on solder mask 2;
Develop, with by described solder mask 2 not sensitization polymeric part 21 utilize chemical reaction to be removed;
Solidify, by baking, sensitization polymeric part on described solder mask 2 is solidified;
Described solder mask 2 on utilizing directly over the little pad of windowing of laser 4 etchings, by the partial gasification of described laser 4 etchings, exposes the little pad of windowing that needs conducting on described printed substrate 1 on described solder mask 2.
Compared with prior art, in the present invention, utilize the absorptivity difference of unlike material to ripple, adopt solder mask 2 described in laser 4 etchings, by laser-induced thermal etching part 22 rapidly gasification window, expose need to the little pad of windowing of other copper plate conductings.Because laser 4 is meticulous, etching is accurate, and whole windowing in process do not need to use chemical agent to develop, and is not subject to the impact of film resolution and solder mask development resolution, has avoided crash and the unclean problem of developing, and has met the requirement that pad becomes more meticulous.
Particularly, described exposure utilizes the energy of ultraviolet light, makes the photoactive substance in described solder mask 2 carry out photochemical reaction, to reach the effect of selective local crane span structure sclerosis, and completes the object of image transfer.Described development, on described solder mask 2, the photosensitive material of unexposed portion does not have polymerization reaction take place, meets weak base Na
2cO
3(1.0%) dissolve and rinse out.On described solder mask 2, the photosensitive material of polymerization is stayed on plate face, and the not etched liquid medicine of protection copper face below dissolves.
Further, the thickness of described solder mask 2 is 8 ~ 12um.Described solder mask 2 is located to this scope, can effectively insulate and welding resistance on the one hand, there is protection circuit and increase effect attractive in appearance, on the other hand, can reduce the uptake to described laser 4, saved machining energy, improved working (machining) efficiency.
Preferably, described laser 4 is CO
2laser 4 or UV laser 4.Described CO
2in laser 4, CO
2molecule is linear symmetric molecule, and two oxygen atoms are respectively in the both sides of carbon atom, and the each atom in molecule is moving all the time, ceaselessly vibrate around its equilbrium position.Carbon dioxide can send infrared light.Infrared energy is larger, is easy to be absorbed gasification by solder mask 2.Described UV laser 4 produces ultraviolet radiation, and emittance is high, is easy to absorbed by solder mask 2 and described solder mask 2 is gasified rapidly.
Particularly, described line pattern is printed on the described film 3 by mask aligner.Described mask aligner graphing precision is high, can accurate Drawing line pattern, and what guaranteed to window becomes more meticulous.
Solder resist material is the seal material printing on finished product printed circuit board (PCB).Shelter selectively wire pattern injury-free, in the time of welding, can not be short-circuited, simultaneously film forming matter chemical proof, resistance to solvent, heat-resisting, insulation property are good, there are protection against the tide, mildew-resistant, anti-salt fog, prevent that scolding tin from sticking to unwanted part and preventing the function of the pollution of copper to solder bath, and printed board is played to beauty function.In the present invention, described solder resist material is liquid photosensitive ink or uv curing ink.
Described uv curing ink is also referred to as the solid type solder mask ink of light.Described uv curing ink is that the rear rapid gasification of absorbing laser 4, is beneficial to automated production under laser 4 irradiations of certain wave-length coverage.Described uv curing ink is made up of unsaturated-resin, sensitization monomer, emulsion, filler and the auxiliary agent with two keys.
Described liquid photosensitive ink is also referred to as liquid photosensitive solder mask ink, and this liquid photosensitive solder mask ink has sensitization and hot curing dual-use function.Gloss is full, and color is beautiful, and adhesive force is good, and film forming compactness is good, and thermal endurance, electrical insulating property and chemical-resistance are good, is specially adapted to surface the solderability processing with high precision printed boards such as printed boards is installed, and purposes is more and more extensive.
This liquid photosensitive solder mask ink is mainly main body by photoresist and thermosetting resin, and the composition such as emulsion, thermal curing agents, thermal polymerization inhibitor, filler, auxiliary agent, pigment, solvent, point host (green) and auxiliary agent (white) two parts.There is high absorptance, laser 4 energy can be absorbed rapidly and gasify.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. a manufacture method for the little pad of windowing of printed substrate, is characterized in that comprising the following steps:
Prepare a printed substrate, on described printed substrate, be printed with the conducting wire being formed by copper metal;
By designing requirement, on the film, form line pattern;
On described printed substrate, be printed with on the face of conducting wire plate and evenly smear and form a solder mask;
By the described film fixed placement that is formed with connection figure on described solder mask;
Exposure, so that part sensitization polymerization on described solder mask;
Develop, with by described solder mask not sensitization polymeric part utilize chemical reaction to be removed;
Solidify, by baking, sensitization polymeric part on described solder mask is solidified;
Described solder mask on utilizing directly over the little pad of windowing of laser-induced thermal etching, by the partial gasification of described laser-induced thermal etching, exposes the little pad of windowing that needs conducting on described printed substrate on described solder mask.
2. the manufacture method of the little pad of windowing of a kind of printed substrate according to claim 1, is characterized in that: the thickness of described solder mask is 8 ~ 12um.
3. the manufacture method of the little pad of windowing of a kind of printed substrate according to claim 1 and 2, is characterized in that: described laser is CO2 laser or UV laser.
4. the manufacture method of the little pad of windowing of a kind of printed substrate according to claim 1 and 2, is characterized in that: described line pattern is printed on the described film by mask aligner.
5. the manufacture method of the little pad of windowing of a kind of printed substrate according to claim 1 and 2, is characterized in that: described solder resist material is liquid photosensitive ink or uv curing ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210593683.7A CN103917057A (en) | 2012-12-31 | 2012-12-31 | Manufacturing method of printed circuit board small windowing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210593683.7A CN103917057A (en) | 2012-12-31 | 2012-12-31 | Manufacturing method of printed circuit board small windowing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103917057A true CN103917057A (en) | 2014-07-09 |
Family
ID=51042351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210593683.7A Pending CN103917057A (en) | 2012-12-31 | 2012-12-31 | Manufacturing method of printed circuit board small windowing pad |
Country Status (1)
| Country | Link |
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| CN (1) | CN103917057A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907706A (en) * | 2015-04-27 | 2015-09-16 | 上海空间电源研究所 | Integrated flexible flat cable automatic double-sided high-precision windowing system and method |
| CN107333394A (en) * | 2017-07-03 | 2017-11-07 | 瑞声科技(新加坡)有限公司 | Preparation method, circuit board and the electronic equipment of circuit board |
| CN107466163A (en) * | 2017-08-18 | 2017-12-12 | 深圳光韵达激光应用技术有限公司 | A kind of high-reliability new pattern laser etch process |
| CN107960017A (en) * | 2017-12-25 | 2018-04-24 | 广州兴森快捷电路科技有限公司 | The processing method of wiring board solder mask |
| CN108419378A (en) * | 2018-05-09 | 2018-08-17 | 深圳市百柔新材料技术有限公司 | The production method of printed wiring board protective layer |
| TWI681572B (en) * | 2018-11-26 | 2020-01-01 | 諾沛半導體有限公司 | High covering rate led carrier board |
| CN111215765A (en) * | 2018-11-26 | 2020-06-02 | 大族激光科技产业集团股份有限公司 | Processing method for processing precise photosensitive hole by ultraviolet laser and laser equipment |
| CN111244254A (en) * | 2018-11-29 | 2020-06-05 | 诺沛半导体有限公司 | High-coverage-rate light-emitting diode carrier plate |
| CN112601374A (en) * | 2020-11-16 | 2021-04-02 | 淮安特创科技有限公司 | Laser oil burning reworking method for circuit board |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| CN113015315A (en) * | 2021-02-22 | 2021-06-22 | 深圳拓邦股份有限公司 | Circuit board capable of improving wiring overcurrent capacity and manufacturing method thereof |
| CN113141723A (en) * | 2021-03-18 | 2021-07-20 | 深圳市景旺电子股份有限公司 | Surface treatment method of printed circuit board and printed circuit board |
| CN113473718A (en) * | 2021-07-06 | 2021-10-01 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board solder resist pattern |
| CN113630978A (en) * | 2021-08-13 | 2021-11-09 | 富创智能设备(深圳)有限公司 | Method for completing PCB resistance welding based on laser technology |
| CN113795087A (en) * | 2021-11-15 | 2021-12-14 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
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| CN101534609A (en) * | 2008-03-12 | 2009-09-16 | 欣兴电子股份有限公司 | Circuit structure of circuit board and method for manufacture same |
| CN102036505A (en) * | 2009-09-29 | 2011-04-27 | 欣兴电子股份有限公司 | Welding pad structure of circuit board and manufacturing method of welding pad structure |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907706A (en) * | 2015-04-27 | 2015-09-16 | 上海空间电源研究所 | Integrated flexible flat cable automatic double-sided high-precision windowing system and method |
| CN107333394A (en) * | 2017-07-03 | 2017-11-07 | 瑞声科技(新加坡)有限公司 | Preparation method, circuit board and the electronic equipment of circuit board |
| CN107466163A (en) * | 2017-08-18 | 2017-12-12 | 深圳光韵达激光应用技术有限公司 | A kind of high-reliability new pattern laser etch process |
| CN107960017B (en) * | 2017-12-25 | 2020-12-18 | 广州兴森快捷电路科技有限公司 | Processing method of circuit board solder mask |
| CN107960017A (en) * | 2017-12-25 | 2018-04-24 | 广州兴森快捷电路科技有限公司 | The processing method of wiring board solder mask |
| CN108419378A (en) * | 2018-05-09 | 2018-08-17 | 深圳市百柔新材料技术有限公司 | The production method of printed wiring board protective layer |
| CN111215765A (en) * | 2018-11-26 | 2020-06-02 | 大族激光科技产业集团股份有限公司 | Processing method for processing precise photosensitive hole by ultraviolet laser and laser equipment |
| TWI681572B (en) * | 2018-11-26 | 2020-01-01 | 諾沛半導體有限公司 | High covering rate led carrier board |
| CN111244254A (en) * | 2018-11-29 | 2020-06-05 | 诺沛半导体有限公司 | High-coverage-rate light-emitting diode carrier plate |
| CN112601374A (en) * | 2020-11-16 | 2021-04-02 | 淮安特创科技有限公司 | Laser oil burning reworking method for circuit board |
| CN112601374B (en) * | 2020-11-16 | 2021-12-07 | 淮安特创科技有限公司 | Laser oil burning reworking method for circuit board |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| CN113015315A (en) * | 2021-02-22 | 2021-06-22 | 深圳拓邦股份有限公司 | Circuit board capable of improving wiring overcurrent capacity and manufacturing method thereof |
| CN113015315B (en) * | 2021-02-22 | 2022-07-19 | 深圳拓邦股份有限公司 | Circuit board capable of improving wiring overcurrent capacity and manufacturing method thereof |
| CN113141723A (en) * | 2021-03-18 | 2021-07-20 | 深圳市景旺电子股份有限公司 | Surface treatment method of printed circuit board and printed circuit board |
| CN113473718A (en) * | 2021-07-06 | 2021-10-01 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board solder resist pattern |
| CN113630978A (en) * | 2021-08-13 | 2021-11-09 | 富创智能设备(深圳)有限公司 | Method for completing PCB resistance welding based on laser technology |
| CN113795087A (en) * | 2021-11-15 | 2021-12-14 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
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Application publication date: 20140709 |