CN107960017A - The processing method of wiring board solder mask - Google Patents
The processing method of wiring board solder mask Download PDFInfo
- Publication number
- CN107960017A CN107960017A CN201711425517.5A CN201711425517A CN107960017A CN 107960017 A CN107960017 A CN 107960017A CN 201711425517 A CN201711425517 A CN 201711425517A CN 107960017 A CN107960017 A CN 107960017A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- laser beam
- residual ink
- ablation
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The present invention relates to a kind of wiring board welding resistance layer processing method.Wiring board welding resistance layer processing method, including step：1) ink is sprayed in the circuit board, forms ink layer；2) pressing processing is carried out to the ink layer on the wiring board；3) wiring board is exposed successively, developed and curing process；4) ablation is carried out to the residual ink of the residual ink in the NPTH holes of the wiring board and/or targeting regions using laser beam.Above-mentioned wiring board welding resistance layer processing method, the residual ink of residual ink and/or targeting regions in using NPTH hole of the fuel factor of laser beam to wiring board is carried out by the way of ablation, the residual ink in NPTH holes can thoroughly be removed or the residual ink of targeting regions, Recession rate are fast；Also, developing powder need not be reduced, it is not necessary to bored after being carried out to NPTH holes.Therefore, the reliability of wiring board is not influenced, avoids and causes solder mask to rupture, and will not reduce the hole position precision of wiring board.
Description
Technical field
The present invention relates to wiring board manufacturing technology field, more particularly to a kind of processing method of wiring board solder mask.
Background technology
Wiring board is widely used in various electronic products as the carrier of electronic component.It is small with electronic product
The development trend of type and multifunction is, it is necessary to which wiring board is more integrated, more accurate.
However, in assist side actual production process, ink easily enters the NPTH holes (i.e. non-heavy copper hole) of wiring board
And cross drone region, and be very difficult to remove in subsequent treatment process, and form residual ink, cause product occur developing it is unnet
The defects of.
At present, the method for removing the residual ink in NPTH holes and cross drone region has two kinds.A kind of method is to reduce and show
Shadow speed, so as to increase developing time, preferably to remove residual ink.But production efficiency is this method reduce, and hold
Easily lead to that solder mask lateral erosion is excessive, influence the reliability of wiring board, and can not thoroughly remove residual ink.Another method
It is driller's sequence after increasing NPTH holes.This method be easy to cause solder mask rupture, and hole position precision can not ensure, so as to reduce
The precision of wiring board.
The content of the invention
Based on this, it is necessary to influence line caused by NPTH holes and targeting regions residual ink for removing in the prior art
Road plate reliability, be easy to cause solder mask rupture, circuit plate hole position precise decreasing and the problem of can not thoroughly remove residual ink,
There is provided it is a kind of can thoroughly remove the residual ink of NPTH holes and targeting regions, and do not influence wiring board reliability and Kong Weijing
Degree, and the processing method that the wiring board solder mask of solder mask rupture can be avoided.
The processing method of wiring board solder mask, including step：
1) ink is sprayed in the circuit board, forms ink layer；
2) pressing processing is carried out to the ink layer on the wiring board；
3) ink layer to the wiring board is exposed, develops and curing process successively, to form solder mask；
4) using laser beam be pointed to residual ink in the wiring board side or the NPTH holes of opposite sides and/or
The residual ink of targeting regions carries out ablation.
The processing method of above-mentioned wiring board solder mask, using the fuel factor of laser beam to residual in the NPTH holes of wiring board
Stay ink and/or the residual ink of targeting regions to carry out ablation, thoroughly remove residual ink in NPTH holes or targeting regions
Residual ink；Also, developing powder need not be reduced and bored after being carried out to NPTH holes.Therefore, the reliability of wiring board is not influenced,
Avoid causing solder mask to rupture, the hole position precision of wiring board will not be reduced.
In one embodiment, the step 4) specifically includes：
Using the NPTH holes to laser beam position；
It is used for using laser beam ablation to the residual ink in the NPTH holes of laser beam position；
Using ablation, the NPTH holes of residual ink are again to laser beam position；
Utilize the residual ink of wiring board described in laser beam ablation.
In one embodiment, the step 4) specifically includes step：
Using taking shape in the location hole of the wiring board to laser beam position；
And utilize the residual ink of wiring board described in laser beam ablation.
In one embodiment, step is further included before to laser beam position using the location hole for taking shape in the wiring board
Suddenly：
The wiring board is divided at least two machining areas, and each machining area is respectively provided with location hole.
In one embodiment, in the step 4), the residual ink described in laser beam ablation in NPTH holes is utilized
When, hole wall of the laser beam in the NPTH holes is circumferentially moved.
In one embodiment, specifically included in the step 4)：
The residual ink in the NPTH holes of the wiring board side and/or the target are pointed to using laser beam
The residual ink in region carries out ablation；
Overturn the wiring board；
The residual ink in the NPTH holes of the wiring board opposite side and/or the target are pointed to using laser beam
The residual ink for marking region carries out ablation.
In one embodiment, in the step 4), described in ablation during residual ink in NPTH holes, laser beam
Spot diameter is 70~90 μm, and the spot center of laser beam and the distance of NPTH holes hole wall are 5~15 μm.
In one embodiment, the step 4) further includes：
Using the ink layer of wiring board predeterminable area described in laser beam ablation, to realize the windowing of the wiring board
Processing.
In one embodiment, laser beam uses CO2Laser beam.
In one embodiment, step is further included after the step 4)：
The wiring board is washed or plasma cleaning.
Brief description of the drawings
Fig. 1 is the flow chart of the processing method of the wiring board solder mask in an embodiment of the present invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood implication of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in Figure 1, the wiring board welding resistance layer processing method in one embodiment of the invention, including step：
S100：Ink is sprayed in the circuit board, forms ink layer；
S200：Pressing processing is carried out to the ink layer on wiring board；
S300：The ink layer of wiring board is exposed successively, is developed and curing process, to form solder mask；
S400：Using laser beam be pointed to residual ink in wiring board side or the NPTH holes of opposite sides and/or
The residual ink of targeting regions carries out ablation.Specifically, pressing processing flattens technique using vacuum.Laser beam uses CO2
Laser beam.
Above-mentioned wiring board welding resistance layer processing method, using the fuel factor of laser beam to the residual in the NPTH holes of wiring board
Ink and/or the residual ink of targeting regions carry out ablation, so as to thoroughly remove residual ink and the targeting regions in NPTH holes
Residual ink；Also, developing powder need not be reduced and bored after being carried out to NPTH holes.Therefore, the reliable of wiring board is not influenced
Property, bored after avoiding and be easy to cause solder mask rupture, the hole position precision of wiring board will not be reduced.
Specifically, in step S400, during using residual ink in laser beam ablation NPTH holes, laser beam exists
The hole wall in NPTH holes is circumferentially moved.In this way, the part that ablation residual ink is connected with NPTH holes hole wall, so that the residual ink
Come off.
Further, in step S400, during residual ink in ablation NPTH holes, the spot diameter of laser beam is 70
~90 μm, and the spot center of laser beam and the distance of the hole wall in NPTH holes are 5~15 μm.Alternatively, the laser beam
Spot diameter is 80 μm, and the distance of the spot center of laser beam and the hole wall in NPTH holes is 10 μm.In this way, it ensure that laser light
Beam only carries out ablation to residual ink, can't carry out ablation to circuit board substrate.
In one embodiment, further included in step S400：
Using the ink layer of laser beam ablation wiring board predeterminable area, to realize that the windowing of wiring board is handled.Namely
Say that the ink layer in the region for needing to open a window by wiring board is ablated off by laser beam.Pass through exposed and developed place due to traditional
Manage and the influence that windowing is exposed machine and developing solution is carried out to wiring board, can not realize that width is less than 80 μm of windowing, can not
Meet design requirement.In this way, opened a window by the way of laser beam ablation, it can be achieved that width is less than 80 μm of windowing, energy
Enough meet design requirement.Further, after carrying out windowing processing to wiring board, tin ball can be implanted at windowing, for shaping
Pad.
In one embodiment, step S401 is further included after step S400：
Wiring board is cleaned.
Due to carrying out ablation to residual ink using laser beam, can in NPTH holes, the metal covering of targeting regions or hold
The foreign matters such as glue residue are remained on the metal covering in window region, seriously affect subsequent handling.In this way, by cleaning, it is online to remove residual
The foreign matters such as the glue residue of road plate so that the wiring board meets the requirement of subsequent handling, further lifts wiring board quality.
Further, step S401 is specifically included：
Wiring board is washed or plasma cleaning.
It is understood that due to targeting regions metal covering and windowed regions metal covering cleaning it is more demanding.Cause
This, can be in step S401 to line if only carrying out ablation to the residual ink in the NPTH holes of wiring board in step S400
Road plate is washed.If using laser beam the residual ink of targeting regions has been carried out in step S400 ablation or
Windowing processing has been carried out to wiring board, then plasma cleaning can be carried out in step S401.
In one embodiment, step S400 is specifically included：
The residual ink in the NPTH holes of wiring board side and/or the oil residues of targeting regions are pointed to using laser beam
Ink carries out ablation；
Flipflop plate；
The residual ink in the NPTH holes of wiring board opposite side and/or the residual of targeting regions are pointed to using laser beam
Ink carries out ablation.
In this way, eliminate the residual ink of the targeting regions of wiring board both sides.Also, for thicker wiring board, NPTH
Hole is deeper, and only carrying out ablation to its remaining residual ink in the side in NPTH holes can not remove completely, therefore, by by circuit
Plate is overturn, and ablation is carried out to the residual ink in NPTH holes from wiring board opposite side.It is remained at the both ends in NPTH holes
Residual ink carry out ablation, further ensure that the residual ink thoroughly removed in NPTH holes.
In one embodiment, step S400 is specifically included：
Using NPTH holes to laser beam position；
It is used for using laser beam ablation to the residual ink in the NPTH holes of laser beam position；
Using ablation, the NPTH holes of residual ink are again to laser beam position；
Utilize the residual ink of laser beam ablation wiring board.
Due to remaining residual ink in NPTH holes, the positioning accuracy of laser beam will be influenced as location hole, is unfavorable for
The accurately residual ink in ablation NPTH holes or in targeting regions.However, the present invention first selectes a NPTH holes first to laser light
Shu Jinhang Primary Locations, and pass through the residual ink in the laser beam ablation datum hole.There is no residual ink by this again
NPTH holes are accurately positioned laser beam, and then carry out ablation to other residual inks.In this way, it ensure that laser beam
Positioning accuracy, avoid laser beam ablation solder mask, and cause wiring board bad.
In another embodiment, step S400 is specifically included：
Using taking shape in the location hole of wiring board to laser beam position,
And utilize the residual ink of laser beam ablation wiring board.
The length of 250~300 μm general since the size of target is smaller, width is 50~80 μm, therefore for laser
The positioning accuracy request of light beam is higher.However, in the present invention by existing location hole in the circuit board come to laser beam into
Row positioning, improves the positioning accuracy of laser beam.
Further, step is further included before to laser beam position using the location hole for taking shape in wiring board：
Wiring board is divided at least two machining areas, and each machining area is respectively provided with location hole.
In this way, wiring board is divided at least two machining areas, each machining area of laser beam successively ablation is utilized
Residual ink, and further include the location hole using the region to laser beam before the residual ink of one machining area of ablation
Positioning.So as to reduce the influence of deformation due to wiring board to the positioning accuracy of laser beam.Specifically, wiring board is drawn
It is divided into 4~10 machining areas.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. the processing method of wiring board solder mask, it is characterised in that including step：
1) ink is sprayed in the circuit board, forms ink layer；
2) pressing processing is carried out to the ink layer on the wiring board；
3) ink layer to the wiring board is exposed, develops and curing process successively, to form solder mask；
4) residual ink and/or target being pointed to using laser beam in the wiring board side or the NPTH holes of opposite sides
The residual ink in region carries out ablation.
2. the processing method of solder mask according to claim 1, it is characterised in that the step 4) specifically includes：
Using the NPTH holes to laser beam position；
It is used for using laser beam ablation to the residual ink in the NPTH holes of laser beam position；
Using ablation, the NPTH holes of residual ink are again to laser beam position；
Utilize the residual ink of wiring board described in laser beam ablation.
3. the processing method of solder mask according to claim 1, it is characterised in that the step 4) specifically includes step：
Using taking shape in the location hole of the wiring board to laser beam position；
And utilize the residual ink of wiring board described in laser beam ablation.
4. the processing method of solder mask according to claim 3, it is characterised in that using taking shape in determining for the wiring board
Position hole before laser beam position to further including step：
The wiring board is divided at least two machining areas, and each machining area is respectively provided with location hole.
5. the processing method of solder mask according to claim 1, it is characterised in that in the step 4), utilize laser
Described in light beam ablation during residual ink in NPTH holes, hole wall of the laser beam in the NPTH holes is circumferentially moved.
6. the processing method of solder mask according to claim 1, it is characterised in that specifically included in the step 4)：
The residual ink in the NPTH holes of the wiring board side and/or the targeting regions are pointed to using laser beam
Residual ink carry out ablation；
Overturn the wiring board；
The residual ink in the NPTH holes of the wiring board opposite side and/or the target zones are pointed to using laser beam
The residual ink in domain carries out ablation.
7. the processing method of solder mask according to claim 1, it is characterised in that in the step 4), described in ablation
During residual ink in NPTH holes, the spot diameter of laser beam is 70~90 μm, and the spot center of laser beam with it is described
The distance of NPTH holes hole wall is 5~15 μm.
8. the processing method of solder mask according to claim 1, it is characterised in that the step 4) further includes：
Using the ink layer of wiring board predeterminable area described in laser beam ablation, to realize at the windowing of the wiring board
Reason.
9. the processing method of solder mask according to claim 1, it is characterised in that the laser beam uses CO2Laser light
Beam.
10. according to the processing method of solder mask according to any one of claims 1 to 9, it is characterised in that in the step 4)
Step is further included afterwards：
The wiring board is washed or plasma cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711425517.5A CN107960017B (en) | 2017-12-25 | 2017-12-25 | Processing method of circuit board solder mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711425517.5A CN107960017B (en) | 2017-12-25 | 2017-12-25 | Processing method of circuit board solder mask |
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| Publication Number | Publication Date |
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| CN107960017A true CN107960017A (en) | 2018-04-24 |
| CN107960017B CN107960017B (en) | 2020-12-18 |
Family
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| CN201711425517.5A Active CN107960017B (en) | 2017-12-25 | 2017-12-25 | Processing method of circuit board solder mask |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108419378A (en) * | 2018-05-09 | 2018-08-17 | 深圳市百柔新材料技术有限公司 | The production method of printed wiring board protective layer |
| CN108770226A (en) * | 2018-05-15 | 2018-11-06 | 惠州市金百泽电路科技有限公司 | It a kind of wiring board welding resistance lateral erosion position oozes golden short circuit and prevents processing method |
| CN109275277A (en) * | 2018-10-17 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of solder-resisting manufacturing methods for preventing PCB aperture from entering ink |
| CN110324983A (en) * | 2019-07-29 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The production method of wiring board |
| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN110774784A (en) * | 2019-11-05 | 2020-02-11 | 潘国占 | Strong-pressure-fused quadruple overprinting apple copybook printing method |
| CN110933854A (en) * | 2019-12-24 | 2020-03-27 | 武汉华工激光工程有限责任公司 | Process and production system for removing materials in plug hole of PCB (printed circuit board) |
| CN111083871A (en) * | 2018-10-18 | 2020-04-28 | 北大方正集团有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN111299842A (en) * | 2018-12-11 | 2020-06-19 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN112492763A (en) * | 2021-01-14 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Solder-resisting laser windowing and ink-removing method for packaging substrate |
| CN112672533A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board, board body and windowing processing method thereof |
| CN113993294A (en) * | 2020-07-27 | 2022-01-28 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN114501833A (en) * | 2020-10-23 | 2022-05-13 | 深南电路股份有限公司 | Method for processing solder mask on circuit board |
| CN115119416A (en) * | 2022-06-14 | 2022-09-27 | 湖北龙腾电子科技股份有限公司 | Method for solving NPTH hole side line oil thinness in PCB resistance welding process |
| CN114501833B (en) * | 2020-10-23 | 2024-05-14 | 深南电路股份有限公司 | Processing method of solder mask layer on circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108419378A (en) * | 2018-05-09 | 2018-08-17 | 深圳市百柔新材料技术有限公司 | The production method of printed wiring board protective layer |
| CN108770226A (en) * | 2018-05-15 | 2018-11-06 | 惠州市金百泽电路科技有限公司 | It a kind of wiring board welding resistance lateral erosion position oozes golden short circuit and prevents processing method |
| CN109275277A (en) * | 2018-10-17 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of solder-resisting manufacturing methods for preventing PCB aperture from entering ink |
| CN111083871A (en) * | 2018-10-18 | 2020-04-28 | 北大方正集团有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN111299842B (en) * | 2018-12-11 | 2022-04-05 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN111299842A (en) * | 2018-12-11 | 2020-06-19 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN110324983A (en) * | 2019-07-29 | 2019-10-11 | 广州兴森快捷电路科技有限公司 | The production method of wiring board |
| CN110774784A (en) * | 2019-11-05 | 2020-02-11 | 潘国占 | Strong-pressure-fused quadruple overprinting apple copybook printing method |
| CN110933854A (en) * | 2019-12-24 | 2020-03-27 | 武汉华工激光工程有限责任公司 | Process and production system for removing materials in plug hole of PCB (printed circuit board) |
| CN110933854B (en) * | 2019-12-24 | 2021-06-25 | 武汉华工激光工程有限责任公司 | Process and production system for removing materials in plug hole of PCB (printed circuit board) |
| CN113993294A (en) * | 2020-07-27 | 2022-01-28 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN113993294B (en) * | 2020-07-27 | 2024-03-22 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN114501833A (en) * | 2020-10-23 | 2022-05-13 | 深南电路股份有限公司 | Method for processing solder mask on circuit board |
| CN114501833B (en) * | 2020-10-23 | 2024-05-14 | 深南电路股份有限公司 | Processing method of solder mask layer on circuit board |
| CN112672533A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board, board body and windowing processing method thereof |
| CN112492763A (en) * | 2021-01-14 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Solder-resisting laser windowing and ink-removing method for packaging substrate |
| CN115119416A (en) * | 2022-06-14 | 2022-09-27 | 湖北龙腾电子科技股份有限公司 | Method for solving NPTH hole side line oil thinness in PCB resistance welding process |
| CN115119416B (en) * | 2022-06-14 | 2023-11-21 | 湖北龙腾电子科技股份有限公司 | Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process |
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