CN110548948B - Method, device and system for welding printed board assembly with fine-pitch connector - Google Patents
Method, device and system for welding printed board assembly with fine-pitch connector Download PDFInfo
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- CN110548948B CN110548948B CN201910816800.3A CN201910816800A CN110548948B CN 110548948 B CN110548948 B CN 110548948B CN 201910816800 A CN201910816800 A CN 201910816800A CN 110548948 B CN110548948 B CN 110548948B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A method, apparatus and system for soldering a printed board assembly having fine pitch connectors, comprising: determining that the printed board assembly contains a fine pitch connector with a screw, the distance between the fine pitch connector and a pin of the fine pitch connector is smaller than a preset first distance threshold; taking down the self-carrying screw of the fine-pitch connector and replacing the self-carrying screw with a process screw for assembly; carrying out process welding on the pins of the fine pitch connector by adopting a selective wave soldering mode; and after welding is qualified, removing the process screw of the fine pitch connector and assembling the self-carrying screw to the fine pitch connector. By adopting the scheme in the application, the traditional manual welding and common wave soldering methods are changed, the welding quality of the fine-pitch connector is improved, and the welding efficiency is greatly improved.
Description
Technical Field
The application relates to printed board welding technology, in particular to a method, a device and a system for welding a printed board assembly with a fine-pitch connector.
Background
Along with electronic product's miniaturization, the packing density of printed board subassembly components and parts is bigger and bigger, and the printed board subassembly has presented the high density equipment mode that through-hole, paster mixed loading, and has chooseed for use in a large number novel miniature rectangle fine pitch connector, and the solder joint of through-hole device, pin interval are littleer and more, and this type of connector characteristics are multirow contact pin, pin interval only 1.27mm, and traditional manual welding process can produce even welding, can not satisfy the welding requirement of fine pitch connector of microspur shape.
Problems existing in the prior art:
the conventional manual welding of fine pitch connectors can cause defects such as continuous welding, cold welding and the like.
Disclosure of Invention
The embodiment of the application provides a method, a device and a system for welding a printed board assembly with a fine-pitch connector, so as to solve the technical problem.
According to a first aspect of embodiments of the present application, there is provided a method of soldering a printed board assembly including fine pitch connectors, comprising:
determining that the printed board assembly contains a fine pitch connector with a screw, the distance between the fine pitch connector and a pin of the fine pitch connector is smaller than a preset first distance threshold;
taking down the self-carrying screw of the fine-pitch connector and replacing the self-carrying screw with a process screw for assembly;
carrying out process welding on the pins of the fine pitch connector by adopting a selective wave soldering mode;
and after welding is qualified, removing the process screw of the fine pitch connector and assembling the self-carrying screw to the fine pitch connector.
According to a second aspect of the embodiments of the present application, there is provided an apparatus for soldering a printed board assembly including a fine pitch connector, comprising:
the first determining module is used for determining that the printed board assembly contains a fine pitch connector with a screw, the distance between the fine pitch connector and the pin of the fine pitch connector is smaller than a preset first distance threshold value;
the first execution module is used for taking down the self-carrying screws of the fine pitch connector and replacing the self-carrying screws with process screws for assembly;
the first welding control module is used for carrying out process welding on the pins of the fine pitch connector in a selective wave soldering mode;
and the second execution module is used for taking off the process screw of the fine pitch connector and assembling the self-carrying screw to the fine pitch connector after welding is qualified.
According to a third aspect of the embodiments of the present application, there is provided a soldering system for a printed board assembly including a fine pitch connector, characterized by including a soldering apparatus for a printed board assembly including a fine pitch connector as described above, and a selective wave soldering apparatus which performs a soldering operation under control of the soldering apparatus for the printed board assembly including a fine pitch connector.
By adopting the method, the device and the system for welding the printed board assembly with the fine-pitch connector, provided by the embodiment of the application, the traditional manual welding method and the common wave soldering method are changed, the welding quality of the fine-pitch connector is improved, and the welding efficiency is greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic flow chart illustrating an exemplary method for soldering a printed board assembly including fine pitch connectors according to an embodiment of the present disclosure;
fig. 2 is a schematic structural view showing a soldering apparatus of a printed board assembly including a fine pitch connector according to a second embodiment of the present application;
FIG. 3 is a schematic structural diagram of an electronic device in a fourth embodiment of the present application;
fig. 4 is a schematic structural diagram illustrating a soldering system of a printed board assembly including a fine pitch connector according to a fifth embodiment of the present application;
FIG. 5 is a schematic diagram illustrating a welding process in the sixth embodiment of the present application;
FIG. 6 is a schematic diagram showing the positions of screws of a connector according to the sixth embodiment of the present application;
fig. 7 shows a schematic position diagram of an interference patch device in the sixth embodiment of the present application.
Detailed Description
In the process of implementing the present application, the inventors found that:
in the traditional wave soldering, all devices adopt the same welding program, the optimization cannot be carried out on the devices, all surface-mounted components on a printed board assembly can be subjected to two different thermal shocks, and more clamps are needed; the manual welding has the defects of large workload, low working efficiency, great influence on welding quality due to human factors, incapability of meeting the requirement of the thicker multilayer printed board for tin penetration and the like.
The selective wave soldering technology is a mode of soldering each component pin on a circuit board according to a specified path, a specified method and specific process parameters aiming at different welding spots, so that the soldering effect of each welding spot is optimal, the welding spots of adjacent components and printed board assembly areas are not heated and melted during soldering, glue dispensing is not needed for a surface mounted device, secondary melting of the surface mounted device is avoided, spraying of soldering flux is carried out on the points to be soldered by selective wave soldering instead of the whole printed board, the amount of ionic pollution is greatly reduced, the cleanliness is greatly improved, a large amount of soldering tin and soldering flux is saved, the production efficiency is improved, and the production cost is reduced.
The current high-density printed board assembly contains a plurality of fine-pitch connectors, all pins of the connectors are subjected to one-time drag welding by adopting a selective wave soldering process method if the connector is subjected to drag welding, most of the fine-pitch connectors are provided with screws, when the distance from the screws to the pins of the connectors is short (the shortest distance is only about 1 mm), the nozzles of selective wave soldering equipment can touch the screws of the connectors when the connectors are subjected to the drag welding process method, and the pins at the tail ends of the connectors cannot be soldered if the pins do not touch the screws of the connectors.
Therefore, aiming at the technical problems in the prior art, the embodiment of the application provides a method, a device and a system for welding a printed board assembly with a fine-pitch connector, wherein when the fine-pitch connector with a self-carrying screw is subjected to selective wave soldering, the connector is assembled by using a process screw, so that the problems that a nozzle touches the self-carrying screw of the connector during soldering and the pin at the tail end of the connector is not soldered completely can be solved.
The scheme in the embodiment of the application can be implemented by adopting various computer languages, such as object-oriented programming language Java and transliterated scripting language JavaScript.
In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Example one
Fig. 1 is a flow chart illustrating an implementation of a method for soldering a printed board assembly including fine pitch connectors according to an embodiment of the present application.
As shown, the method of soldering a printed board assembly including fine pitch connectors includes:
102, taking down screws of the fine pitch connector and replacing the screws with process screws for assembly;
103, carrying out process welding on the pins of the fine pitch connector in a selective wave soldering mode;
and 104, removing the process screw of the fine pitch connector after welding is qualified, and assembling the self-carrying screw to the fine pitch connector.
A Printed Circuit Board (PCB), also called a Printed Circuit Board or a Printed Circuit Board, is a carrier for electrical connection of electronic components.
Connectors, which may refer to components that connect any active device, bridge a communication between isolated or non-isolated circuits within a circuit, thereby allowing current to flow and the circuit to perform a predetermined function.
The fine pitch connector can be also called a small pitch connector or a narrow pitch connector, belongs to a compact connector, and can be a connector with a pin pitch of less than or equal to 1.27 mm.
The process screw can comprise screws of various types, such as an oblate head screw, a cylindrical head screw and the like, the screw is arranged on the thin-spacing connector in a non-contact mode in order to weld a nozzle of pin welding equipment at the tail end of the connector during welding, the screw arranged on the thin-spacing connector is taken down and replaced by another screw to be assembled, and the original screw arranged on the thin-spacing connector is replaced after the welding is finished.
The selective wave soldering mode in the embodiment of the application can refer to a mode of soldering pins of each component on the circuit board according to a specified path, method and process parameters aiming at different welding spots, so that the soldering effect of each welding spot is optimal, the welding spots of adjacent components and printed board assembly areas cannot be heated and melted during soldering, the surface mounted device does not need to be subjected to glue dispensing, and the surface mounted device is prevented from being secondarily melted. The selective wave soldering carries out the spraying of the soldering flux aiming at the points to be soldered instead of the whole printed board, so that the ion pollution amount is greatly reduced, the cleanliness is greatly improved, a large amount of soldering tin and the soldering flux are saved, the production efficiency is improved, and the production cost is reduced.
Specifically, the first distance threshold according to the embodiment of the present application may be determined according to actual needs, and may be set to about 2mm, for example.
According to the method for welding the printed board assembly with the fine-pitch connector, when selective wave soldering is carried out on the fine-pitch connector with the screw, the connector is assembled by using the process screw, the traditional manual welding and common wave soldering method is changed, the problems that the connector with the screw is touched by a nozzle during traditional welding and the pin at the tail end of the connector is not welded completely are solved, the welding quality of the fine-pitch connector is improved, and the welding efficiency is greatly improved.
Considering that the distance between the pins of the through-hole devices of the fine pitch connector and the adjacent chip devices is only 1mm at the minimum in the high-density printed board assembly, the solder of the nozzle is likely to melt the solder points of the chip devices adjacent to the through-hole devices and even to cause the devices to fall off when the selective wave soldering is performed, and therefore, the present application can also be implemented as follows.
In one embodiment, before the performing process soldering on the pins of the fine pitch connector by using the selective wave soldering method, the method further comprises the following steps:
determining a fine pitch connector containing chip device interference near a through hole device of the fine pitch connector;
and processing the chip device according to the distance between the chip device and the pin of the through hole device.
The method includes the steps of firstly determining a fine-pitch connector containing chip device interference near a through hole device of the fine-pitch connector, and processing the chip device according to the distance between the chip device and a pin of the through hole device.
Specifically, the vicinity described in the embodiments of the present application may refer to a patch device adjacent to a pin of a through-hole device of the fine pitch connector.
In a specific implementation, the preset second distance threshold may be 2 mm.
In one embodiment, the processing the chip device according to the distance between the chip device and the pin of the through-hole device includes:
when the distance between the through hole device pin and the nearby chip device is larger than a preset second distance threshold, adhering a high-temperature-resistant protective adhesive tape on the chip device;
welding pins of the through hole device in a selective wave soldering mode;
and after the pins of the through hole device are welded, taking down the high-temperature resistant protective adhesive tape on the surface mounted device.
In specific implementation, when the distance between the pin of the through-hole device and the nearby interference chip device is more than 2mm, the welded chip device can be protected by adhering a high-temperature-resistant protective tape 110u-TM, and after the through-hole device is subjected to selective wave soldering, the high-temperature-resistant protective tape 110u-TM is taken down.
In one embodiment, the processing the chip device according to the distance between the chip device and the pin of the through-hole device includes:
when the distance between the pin of the through hole device and the nearby patch device is smaller than a preset second distance threshold value, welding the pin of the through hole device of the fine pitch connector in a selective wave soldering mode;
and after the pins of the through hole device are welded, welding the patch device.
In the embodiment of the application, if the distance between the pin of the through hole device and the side interference surface-mounted device is less than 2mm, a process method for afterloading the side interference surface-mounted device is adopted, namely after the selective wave soldering of the through hole device is completed, the welding of the nearby surface-mounted device is carried out.
In one embodiment, the process soldering the pins of the fine pitch connector by using a selective wave soldering method includes:
determining welding parameters of the selective wave soldering device;
placing the fine pitch connector into the selective wave soldering apparatus;
and starting the selective wave soldering equipment, spraying soldering flux on all pins of the fine pitch connector by adopting a drag soldering process method according to the soldering parameters, preheating and then performing selective wave soldering.
In specific implementation, different welding parameters can be set according to different welding points, and specifically, the welding parameters can include preheating temperature, preheating time, drag welding temperature, drag welding speed and the like.
The drag welding generally refers to a process method of uniformly spraying soldering flux on pins of a connector, and dragging the soldering tin towards one direction for welding after the soldering tin is completely melted.
The soldering tin can be divided into lead and lead-free, and during specific soldering, the temperature of the lead is about 280 ℃, and the temperature of the lead-free solder is about 300 ℃; flux generally refers to a chemical substance which can help and promote a welding process in a welding process, has a protection effect and prevents an oxidation reaction, and can be divided into a solid form, a liquid form, a gas form and the like, and specific selection of soldering tin and flux is not limited in the application.
In one embodiment, the process screw is assembled at one end of the fine pitch connector pin by using a nut, and the height of the nut from the printed board is lower than the height of the fine pitch connector pin exposed out of the printed board.
During specific implementation, the process screw can be assembled at any end of the pin of the fine pitch connector, the process screw is taken down and assembled to the other end after the pin is welded to continue welding, the pin of the fine pitch connector can be replaced by the process screw, and the original self-provided screw is replaced after welding is completed.
Specifically, the height of the nut of the replaced process screw from the printed board may be lower than the height of the printed board exposed by the pin of the fine pitch connector.
Through the scheme that this application embodiment provided, can make all high-density printed board subassemblies that contain the through-hole device at present can both carry out selectivity wave soldering to and all through-hole devices on the high-density printed board subassembly can both weld qualified, reach the national military standard requirement, improved work efficiency greatly, improved welding quality.
Example two
Based on the same inventive concept, the embodiment of the application provides a welding device for a printed board assembly with a fine-pitch connector, the principle of the device for solving the technical problem is similar to the welding method for the printed board assembly with the fine-pitch connector, and repeated parts are not repeated.
Fig. 2 is a schematic structural diagram showing a soldering apparatus for a printed board assembly including a fine pitch connector according to a second embodiment of the present application.
As shown, the soldering apparatus for a printed board assembly including fine pitch connectors includes:
a first determining module 201, configured to determine that the printed board assembly includes a fine pitch connector with a screw, where a distance from a pin of the fine pitch connector is smaller than a preset first distance threshold;
a first execution module 202, configured to remove a self-screwed screw of the fine pitch connector and replace the self-screwed screw with a process screw for assembly;
the first welding control module 203 is used for carrying out process welding on the pins of the fine pitch connector in a selective wave soldering mode;
and a second execution module 204, configured to remove the process screws of the fine pitch connector and assemble the self-contained screws to the fine pitch connector after the welding is qualified.
The printed board assembly welding device with the fine-pitch connector provided by the embodiment of the application is used for assembling the connector by using the process screw when selective wave soldering is carried out on the fine-pitch connector with the screw, the traditional manual welding and common wave soldering method is changed, the problems that the connector with the screw is touched by a nozzle during traditional welding and the pin welding of the tail end of the connector is incomplete are solved, the welding quality of the fine-pitch connector is improved, and the welding efficiency is greatly improved.
In one embodiment, the apparatus further comprises:
the second determining module is used for determining the fine-pitch connector containing the interference of the chip device near the through hole device of the fine-pitch connector;
the third execution module is used for pasting a high-temperature-resistant protective adhesive tape on the chip device when the distance between the through hole device pin and the chip device beside the through hole device pin is larger than a preset second distance threshold;
the second welding control module is used for welding the pins of the through hole device in a selective wave soldering mode;
and the fourth execution module is used for taking down the high-temperature resistant protective adhesive tape on the patch device after the pins of the through hole device are welded.
In one embodiment, the apparatus further comprises:
the third welding control module is used for welding the pins of the through hole devices of the fine pitch connector in a selective wave soldering mode when the distance between the pins of the through hole devices and the nearby patch devices is smaller than a preset second distance threshold value; and after the pins of the through hole device are welded, welding the patch device.
In one embodiment, the first weld control module includes:
a setting unit for determining welding parameters of the selective wave soldering device;
an execution unit to place the fine pitch connector into the selective wave soldering apparatus;
and the starting unit is used for starting the selective wave soldering equipment, spraying soldering flux on all pins of the fine pitch connector by adopting a drag soldering process method according to the soldering parameters, preheating and then carrying out selective wave soldering.
In one embodiment, the process screw is assembled at one end of the fine pitch connector pin by using a nut, and the height of the nut from the printed board is lower than the height of the fine pitch connector pin exposed out of the printed board.
EXAMPLE III
Based on the same inventive concept, embodiments of the present application further provide a computer storage medium, which is described below.
The computer storage medium has stored thereon a computer program which, when executed by a processor, performs the steps of a method of soldering a printed board assembly with fine pitch connectors as described in one embodiment.
The computer storage medium provided by the embodiment of the application is used for assembling the connector by using the process screw when selective wave soldering is carried out on the fine-pitch connector with the screw, the traditional manual soldering and common wave soldering method is changed, the problems that the nozzle is collided with the screw on the connector and the pin at the tail end of the connector is not soldered completely in the traditional soldering process are solved, the soldering quality of the fine-pitch connector is improved, and the soldering efficiency is greatly improved.
Example four
Based on the same inventive concept, the embodiment of the present application further provides an electronic device, which is described below.
Fig. 3 shows a schematic structural diagram of an electronic device in the fourth embodiment of the present application.
As shown, the electronic device includes memory 301 for storing one or more programs, and one or more processors 302; the one or more programs, when executed by the one or more processors, implement the method of soldering a printed board assembly with fine pitch connectors as described in embodiment one.
The electronic equipment provided by the embodiment of the application carries out selective wave soldering on the fine-pitch connector with the screw, the connector is assembled by using the process screw, the traditional manual soldering and common wave soldering method is changed, the difficult problems that the screw is arranged on the connector and the pin at the tail end of the connector is not completely soldered when the nozzle is collided with the connector in the traditional soldering process are solved, the soldering quality of the fine-pitch connector is improved, and the soldering efficiency is greatly improved.
EXAMPLE five
Based on the same inventive concept, the embodiment of the application also provides a welding system of the printed board assembly with the fine-pitch connector.
Fig. 4 is a schematic structural diagram illustrating a soldering system of a printed board assembly including a fine pitch connector according to a fifth embodiment of the present application.
As shown in the drawing, the soldering system of the printed board assembly with the fine pitch connector includes a soldering apparatus 401 of the printed board assembly with the fine pitch connector according to embodiment two and a selective wave soldering apparatus 402 which performs a soldering operation under the control of the soldering apparatus of the printed board assembly with the fine pitch connector.
The welding system of printed board subassembly that contains thin interval connector that this application embodiment provided when carrying out selectivity wave-soldering to containing the thin interval connector from taking the screw, uses the technology screw to assemble the connector, has changed traditional manual welding and ordinary wave-soldering method, and it is from taking the screw to touch the connector and the incomplete difficult problem of connector tail end pin welding when having solved traditional welding, has improved the welding quality of thin interval connector, has improved welding efficiency greatly.
EXAMPLE six
In order to facilitate the implementation of the present application, the embodiments of the present application are described with a specific example.
Fig. 5 shows a schematic diagram of a welding process in the sixth embodiment of the present application.
As shown, the present application provides a selective wave soldering method for a high-density printed board assembly including a fine pitch connector (hereinafter referred to as a connector), including the steps of:
according to the embodiment of the application, the self-carrying screws of the fine-pitch connector with the self-carrying screws in the identified high-density printed board are taken down and temporarily replaced by the process screws, so that the process screws do not collide and interfere with the nozzle of the selective wave soldering equipment during the welding of the drag welding process, and the process screws are shown in fig. 6.
if the distance between the pin of the through hole device and the adjacent chip device is less than 2mm, a process method of afterloading the adjacent chip device is adopted;
specifically, the solder may be ZHLSN60PbA, the flux may be IF-2040, and the selective wave soldering parameters may include: preheating temperature is 160 ℃, preheating time is 60S, drag welding temperature is 280 ℃, and drag welding speed is 4 mm/S;
505, putting the fine-pitch connector processed by the process screw and through-hole devices such as the fine-pitch connector with the high-temperature resistant protective tape 110u-TM adhered to the nearby chip devices into selective wave soldering equipment to perform process soldering by adopting a drag soldering process;
in the embodiment of the application, the thin-pitch connector adopts a dragging welding process method instead of a method of welding the thin-pitch connector for many times by adopting a spot welding process, so that the situation that the packaging glue of the thin-pitch connector is damaged due to repeated welding of spot welding in the welding process can be prevented.
specifically, the inspecting the solder joints of the through hole device after the selective wave soldering is completed may include: the appearance of the welding spot is glossy, burr-free, no tip, no bridge, no air hole, no tin hanging, no tin piling and no sharp edge, the welding spot is smooth, continuous, uniform and good in wetting, and the tin penetration rate requirement on the metallized hole after welding at least reaches over 75 percent of that of the hole column.
and step 508, taking down the high-temperature resistant protective adhesive tape 110u-TM adhered to the chip devices near the through hole devices such as the fine-pitch connector and the like, and checking whether the body of the chip device is damaged or not and whether the welding points are qualified or not.
The embodiment of the application has the following advantages:
1. the embodiment of the application solves the problem that the printed board assembly of a double-sided BGA (Ball Grid Array) and Quad Flat Package (QFP) device cannot be subjected to ordinary wave soldering, welding spots of adjacent devices and the area of the printed board assembly cannot be heated and melted during soldering, secondary melting of surface-mounted devices is avoided, spraying of soldering flux is carried out on points needing to be soldered by selective wave soldering instead of the whole printed board, ion pollution is greatly reduced, cleanliness is greatly improved, a large amount of soldering tin and soldering flux is saved, production efficiency is improved, soldering quality is improved, and production cost is reduced.
2. The embodiment of the application overcomes the defects of continuous welding, insufficient welding and the like caused by manual welding of the fine-pitch connector (pin pitch is 1.27mm) in the prior art, so that the fine-pitch connector (pin pitch is 1.27mm) can be welded by adopting selective wave soldering equipment, the efficiency is improved, the welding quality is improved, and the standard requirement is met.
3. The embodiment of the application solves the problem that when the connector is subjected to selective wave soldering drag welding, the connector is close to the pin of the connector due to the fact that the screw is arranged, the minimum distance is only 1mm, the equipment nozzle and the connector collide with each other due to the screw during welding, if the nozzle does not collide with the screw, the pin at the tail end of the connector cannot be welded, and the like, so that selective wave soldering can be carried out on all the connectors containing the fine pitch connector with the screw, the welding quality of the connector containing the fine pitch connector with the screw is improved, and the national military standard requirement is met.
4. The embodiment of the application solves the problem that selective wave soldering cannot be carried out due to the fact that the chip devices are arranged near the pins of the through hole devices such as the connector when the high-density printed board is subjected to selective wave soldering, so that all the through hole devices in the high-density printed board can be subjected to selective wave soldering, the working efficiency is greatly improved, the soldering quality is improved, and the national military standard requirement is met.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (11)
1. A method of soldering a printed board assembly having fine pitch connectors, comprising:
determining that the printed board assembly contains a fine pitch connector with a screw, the distance between the fine pitch connector and a pin of the fine pitch connector is smaller than a preset first distance threshold;
taking down the self-carrying screw of the fine-pitch connector and replacing the self-carrying screw with a process screw for assembly;
carrying out process welding on the pins of the fine pitch connector by adopting a selective wave soldering mode;
after welding is qualified, taking off the process screw of the fine pitch connector and assembling the self-carrying screw to the fine pitch connector;
the process screw is assembled at one end of the pin of the fine-pitch connector by adopting a nut, and the distance between the nut and the printed board is lower than the height of the pin of the fine-pitch connector exposed out of the printed board.
2. The method of claim 1, further comprising, prior to said process soldering the fine pitch connector pins using selective wave soldering,:
determining a fine pitch connector containing chip device interference near a through hole device of the fine pitch connector;
and processing the chip device according to the distance between the chip device and the pin of the through hole device.
3. The method of claim 2, wherein processing the chip device according to the distance of the chip device from the through-hole device pins comprises:
when the distance between the through hole device pin and the nearby chip device is larger than a preset second distance threshold, adhering a high-temperature-resistant protective adhesive tape on the chip device;
welding the through hole device in a selective wave soldering mode;
and after the pins of the through hole device are welded, taking down the high-temperature resistant protective adhesive tape on the patch device.
4. The method of claim 2, wherein processing the chip device according to the distance of the chip device from the through-hole device pins comprises:
when the distance between the pin of the through hole device and the nearby patch device is smaller than a preset second distance threshold value, welding the pin of the through hole device of the fine-pitch connector in a selective wave soldering mode;
and after the pins of the through hole device are welded, welding the patch device.
5. The method of claim 1, wherein said process soldering the fine pitch connector pins using selective wave soldering comprises:
determining welding parameters of the selective wave soldering device;
placing the fine pitch connector into the selective wave soldering apparatus;
and starting the selective wave soldering equipment, spraying soldering flux on all pins of the fine pitch connector by adopting a drag soldering process method according to the soldering parameters, preheating and then performing selective wave soldering.
6. An apparatus for soldering a printed board assembly including a fine pitch connector, comprising:
the first determining module is used for determining that the printed board assembly contains a fine pitch connector with a screw, the distance between the fine pitch connector and the pin of the fine pitch connector is smaller than a preset first distance threshold value;
the first execution module is used for taking down the self-carrying screws of the fine pitch connector and replacing the self-carrying screws with process screws for assembly;
the first welding control module is used for carrying out process welding on the pins of the fine pitch connector in a selective wave soldering mode;
the second execution module is used for taking off the process screw of the fine pitch connector and assembling the self-carrying screw to the fine pitch connector after welding is qualified;
the process screw is assembled at one end of the pin of the fine-pitch connector by adopting a nut, and the distance between the nut and the printed board is lower than the height of the pin of the fine-pitch connector exposed out of the printed board.
7. The apparatus of claim 6, further comprising:
the second determining module is used for determining the fine-pitch connector containing the interference of the chip device near the through hole device of the fine-pitch connector;
the third execution module is used for pasting a high-temperature-resistant protective adhesive tape on the chip device when the distance between the through hole device pin and the chip device beside the through hole device pin is larger than a preset second distance threshold;
the second welding control module is used for welding the through hole device in a selective wave soldering mode;
and the fourth execution module is used for taking down the high-temperature resistant protective adhesive tape on the patch device after the pins of the through hole device are welded.
8. The apparatus of claim 7, further comprising:
the third welding control module is used for welding the pins of the through hole devices of the fine pitch connector in a selective wave soldering mode when the distance between the pins of the through hole devices and the nearby patch devices is smaller than a preset second distance threshold value; and after the pins of the through hole device are welded, welding the patch device.
9. A system for soldering a printed board assembly including a fine pitch connector, comprising a soldering apparatus for a printed board assembly including a fine pitch connector according to any one of claims 6 to 8, and a selective wave soldering apparatus which performs a soldering operation under the control of the soldering apparatus for a printed board assembly including a fine pitch connector.
10. A computer storage medium having a computer program stored thereon, which when executed by a processor, performs the steps of the method of soldering a printed board assembly having fine pitch connectors as claimed in any one of claims 1 to 5.
11. An electronic device comprising one or more processors, and memory for storing one or more programs; the one or more programs, when executed by the one or more processors, implement the method of soldering a printed board assembly with fine pitch connectors as recited in any of claims 1 to 5.
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| CN201910816800.3A CN110548948B (en) | 2019-08-30 | 2019-08-30 | Method, device and system for welding printed board assembly with fine-pitch connector |
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| CN110548948B true CN110548948B (en) | 2020-09-11 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0266862A (en) * | 1988-08-31 | 1990-03-06 | Sumitomo Electric Ind Ltd | Connector installing method to printed substrate |
| JP2006245451A (en) * | 2005-03-07 | 2006-09-14 | Fujikura Ltd | Electronic component mounting body, and method of mounting electronic component |
| CN2901612Y (en) * | 2006-02-10 | 2007-05-16 | 华为技术有限公司 | Connector for connecting PCB board |
| CN203013978U (en) * | 2012-12-11 | 2013-06-19 | 四川华丰企业集团有限公司 | Terminating structure of micro-space connector |
| CN103401121A (en) * | 2013-08-13 | 2013-11-20 | 中国科学院长春光学精密机械与物理研究所 | Connection method for laminated circuit boards of moonlet three-line-array camera |
| CN103944038A (en) * | 2014-04-15 | 2014-07-23 | 北京卫星制造厂 | Assembling method of high-density inter-board electric connectors |
-
2019
- 2019-08-30 CN CN201910816800.3A patent/CN110548948B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0266862A (en) * | 1988-08-31 | 1990-03-06 | Sumitomo Electric Ind Ltd | Connector installing method to printed substrate |
| JP2006245451A (en) * | 2005-03-07 | 2006-09-14 | Fujikura Ltd | Electronic component mounting body, and method of mounting electronic component |
| CN2901612Y (en) * | 2006-02-10 | 2007-05-16 | 华为技术有限公司 | Connector for connecting PCB board |
| CN203013978U (en) * | 2012-12-11 | 2013-06-19 | 四川华丰企业集团有限公司 | Terminating structure of micro-space connector |
| CN103401121A (en) * | 2013-08-13 | 2013-11-20 | 中国科学院长春光学精密机械与物理研究所 | Connection method for laminated circuit boards of moonlet three-line-array camera |
| CN103944038A (en) * | 2014-04-15 | 2014-07-23 | 北京卫星制造厂 | Assembling method of high-density inter-board electric connectors |
Non-Patent Citations (2)
| Title |
|---|
| SMT印制电路板设计常见问题及解决方法;马丽琴;《电子工艺技术》;20130131;第34卷(第1期);第40-43页 * |
| 基于5mm厚母板的选择焊工艺控制;魏斌 等;《电子产品可靠性与环境试验》;20190630;第37卷(第3期);第33-37页 * |
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