CN114682870A - POP hybrid welding process and system - Google Patents
POP hybrid welding process and system Download PDFInfo
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- CN114682870A CN114682870A CN202210319836.2A CN202210319836A CN114682870A CN 114682870 A CN114682870 A CN 114682870A CN 202210319836 A CN202210319836 A CN 202210319836A CN 114682870 A CN114682870 A CN 114682870A
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- 238000003466 welding Methods 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims abstract description 48
- 230000008569 process Effects 0.000 title claims abstract description 44
- 229910000679 solder Inorganic materials 0.000 claims abstract description 131
- 238000005507 spraying Methods 0.000 claims abstract description 30
- 238000007639 printing Methods 0.000 claims abstract description 28
- 238000005476 soldering Methods 0.000 claims abstract description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims description 21
- 238000001514 detection method Methods 0.000 claims description 20
- 238000004321 preservation Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 abstract description 7
- 230000004907 flux Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Abstract
The invention discloses a POP hybrid welding process and a system, wherein the process comprises the following steps: printing low-temperature solder paste on the welding points on the PCB surface of the printed circuit board; mounting a bottom layer Ball Grid Array (BGA) chip on a bonding pad on the surface of the PCB, wherein a high-temperature solder ball is implanted into the bottom surface of the bottom layer BGA chip; spraying low-temperature solder paste on the bonding pad on the surface of the bottom BGA chip; mounting a stacked BGA chip on the surface of the bottom BGA chip to obtain an assembled element, wherein a high-temperature solder ball is implanted into the bottom surface of the stacked BGA chip; and welding the assembly element to melt the low-temperature solder paste, so as to wrap the high-temperature solder ball by the low-temperature solder paste. The automatic tin spraying process can replace the traditional POP (post office automation) soldering flux dipping mode, meets the requirements of the mixed soldering process in the low-temperature solder paste era, and has the effects of high primary yield and high soldering strength.
Description
Technical Field
The invention relates to the technical field of surface assembly, in particular to a POP hybrid welding process and system.
Background
Surface Mount Technology (SMT) is a new generation of electronic assembly Technology developed from hybrid integrated circuit Technology, and is characterized by adopting component Surface Mount Technology and reflow soldering Technology, and is an assembly Technology in electronic product manufacturing. The SMT production line may use a Package On Package (POP) process, where the POP process is a new way of stacking two or more Ball Grid Array (BGA) chips in a vertical direction for SMT assembly, and the POP process is a new way of miniaturized high-density assembly of devices developed to improve logic operation functions and memory space.
At present, the solder paste adopted by the surface assembly technology used in the preparation of the computer mainboard is high-temperature solder paste (the melting point is 217 ℃), and because the high-temperature solder paste has high melting point and large energy consumption and does not accord with the concept of green manufacturing, the solder paste adopted by the surface assembly technology in the field of consumer electronics can gradually transit to low-temperature solder paste (the melting point is 138 ℃). In order to strike a balance between solder reliability and green manufacturing, surface mount technology is currently in a common stage for both high and low temperature solder pastes.
The traditional POP process in the surface assembly industry mostly adopts a mode of dipping soldering flux to realize the welding of tin paste between component devices, but the traditional process is only suitable for the condition that the tin balls and the tin paste between the components of an upper BGA chip and a lower BGA chip are the same in melting point, the traditional process is not suitable for the mode of hybrid welding of high-temperature tin balls and low-temperature tin paste, and the mode of dipping the soldering flux cannot form effective welding spots.
Disclosure of Invention
The invention provides a POP hybrid welding process and a POP hybrid welding system, which at least solve the technical problems in the prior art.
One aspect of the present invention provides a POP hybrid welding process, including:
printing low-temperature solder paste on the welding points on the PCB surface of the printed circuit board;
mounting a bottom layer Ball Grid Array (BGA) chip on a bonding pad on the surface of the PCB, wherein a high-temperature solder ball is implanted into the bottom surface of the bottom layer BGA chip;
spraying low-temperature solder paste on the bonding pad on the surface of the bottom BGA chip;
mounting a stacked BGA chip on the surface of the bottom BGA chip to obtain an assembled element, wherein a high-temperature solder ball is implanted into the bottom surface of the stacked BGA chip;
and welding the assembly element to melt the low-temperature solder paste, so as to wrap the high-temperature solder ball by the low-temperature solder paste.
In an embodiment, the printing of the low temperature solder paste on the solder points on the surface of the PCB includes:
printing low-temperature solder paste on the surface of the PCB through a steel mesh;
and carrying out solder paste detection on the low-temperature solder paste printed on the surface of the PCB.
In an embodiment, before the printing the low temperature solder paste on the solder points on the surface of the PCB, the process further includes:
PCB surface treatment: and arranging an organic solderable protective film OSP on the surface of the PCB.
In an implementation mode, the bonding pads on the surface of the PCB are further mounted with other surface mount devices SMD, and the SMD components are soldered on the bonding pads on the surface of the PCB.
In an embodiment, the soldering the assembly component to melt the low-temperature solder paste to package the high-temperature solder ball with the low-temperature solder paste includes:
the assembly elements sequentially enter a preheating zone, a heat preservation zone, a welding zone and a cooling zone;
the preheating temperature of the preheating zone is 160-170 ℃, the preheating time of the preheating zone is 40-70s, and the heating rate of the preheating zone is 1.7-2.3 ℃/s; the temperature of the heat preservation area is 177-; the peak temperature of the welding zone is 190-; the cooling rate of the cooling zone is 1-3 ℃/s.
Another aspect of the present invention provides a POP hybrid welding system, including:
the printing equipment is used for printing low-temperature solder paste on the welding points on the surface of the PCB;
the chip mounting equipment is used for mounting a bottom layer Ball Grid Array (BGA) chip on a bonding pad on the surface of the PCB, and a high-temperature solder ball is implanted into the bottom surface of the bottom layer BGA chip; the chip mounting equipment is also used for mounting a stacked BGA chip on the surface of the bottom BGA chip to obtain an assembled element, and a high-temperature solder ball is implanted into the bottom surface of the stacked BGA chip;
the automatic tin spraying equipment is used for spraying low-temperature tin paste on the bonding pad on the surface of the bottom BGA chip;
and the welding equipment is used for welding the assembly element so as to melt the low-temperature solder paste and package the high-temperature solder balls by the low-temperature solder paste.
In an embodiment, the system further comprises:
the solder paste detection equipment is used for carrying out solder paste detection on the low-temperature solder paste printed on the surface of the PCB;
and the method is also used for detecting the low-temperature solder paste sprayed on the surface of the bottom layer BGA chip.
In one embodiment, a preheating zone, a heat preservation zone, a welding zone and a cooling zone are sequentially arranged in the welding device.
In one embodiment, the preheating temperature of the preheating zone is 160-170 ℃, the preheating time of the preheating zone is 40-70s, and the heating rate of the preheating zone is 1.7-2.3 ℃/s;
the temperature of the heat preservation area is 177-;
the peak temperature of the welding zone is 190-;
the cooling rate of the cooling zone is 1-3 ℃/s.
In an embodiment, the chip mounting device is further configured to mount other surface mount devices SMD on the pads on the surface of the PCB, and the SMD components are soldered on the pads on the surface of the PCB.
According to the scheme, the low-temperature solder paste is printed on the surface of the PCB, the bottom BGA chip high-temperature solder balls are pasted on the bonding pads on the surface of the PCB, the low-temperature solder paste is sprayed on the bonding pads on the surface of the bottom BGA chip, then the stacked BGA chips are pasted on the surface of the BGA chip, the assembly element is obtained, and the assembly element is welded, so that the low-temperature solder paste is melted to wrap the high-temperature solder balls.
This scheme possesses following beneficial effect:
1. the process itself comprises the following steps: the automatic tin spraying process can replace the traditional POP (post office automation) soldering flux dipping mode, and meets the requirements of the mixed welding process in the low-temperature tin paste era;
2. the primary yield is high: the automatic tin spraying process can greatly improve the primary yield of the POP process;
3. the welding strength is high: the automatic tin spraying process adopts tin spraying instead of dipping soldering flux, so that the welding strength of welding spots and welding seams of the BGA chip with the stacked layers can be enhanced, and the welding reliability is ensured;
4. the manufacturing cost is low: the automatic tin spraying process can shorten the production period, reduce the manufacturing cost, relieve the inventory pressure and realize the flexible stacking and mounting of the BGA chip in the POP process.
Drawings
Fig. 1 shows a flow diagram of a POP hybrid welding process;
fig. 2 shows a schematic diagram of a POP hybrid welding system.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a flow diagram of a POP hybrid welding process provided as an example of the disclosure is applicable to the SMT industry, and the process includes:
and S101, printing low-temperature solder paste on the welding points on the surface of the PCB.
The low temperature tin cream is printed on the surface of the PCB board through the steel mesh with a certain opening size, and the steel mesh is favorable for printing the low temperature tin cream with accurate quantity onto the welding point position of the PCB board.
S102, mounting a bottom layer Ball Grid Array (BGA) chip on a bonding pad on the surface of the PCB, wherein a high-temperature solder ball is implanted into the bottom surface of the bottom layer BGA chip;
the bottom BGA chip is Mounted on the Surface of the PCB, belongs to one of Surface Mounted Devices (SMD), and can be used for mounting other SMD components on the Surface of the PCB besides the bottom BGA chip. High-temperature solder balls are uniformly implanted into the bottom surface of the bottom BGA chip, namely the surface of the bottom BGA chip opposite to the PCB, and the high-temperature solder balls are distributed on the bottom surface of the bottom BGA chip in a matrix form.
And S103, spraying low-temperature solder paste on the bonding pad on the surface of the bottom layer BGA chip.
The low-temperature solder paste is sprayed and printed on the bonding pad area on the surface of the bottom BGA chip in a spraying mode, and the efficiency and yield of the POP process can be improved by adopting an automatic spraying mode.
And S104, mounting a stacked BGA chip on the surface of the bottom BGA chip to obtain an assembled element, wherein a high-temperature solder ball is implanted into the bottom surface of the stacked BGA chip.
The bottom BGA chip and the stacked BGA chip are different chips and are arranged to meet different functions of an assembled element, wherein the stacked BGA chip is located above the bottom BGA chip.
S105, welding the assembly element to melt the low-temperature solder paste, and wrapping the high-temperature solder balls by the low-temperature solder paste.
The soldering method includes, but is not limited to, reflow soldering, and in this embodiment, reflow soldering is taken as an example for description, an assembly original is placed into a reflow soldering device, and soldering of an assembly component is achieved by setting parameters of the reflow soldering device.
In the scheme of the invention, the low-temperature solder paste is printed on the surface of the PCB, the bottom BGA chip high-temperature solder balls are pasted on the bonding pads on the surface of the PCB, the low-temperature solder paste is sprayed on the bonding pads on the surface of the bottom BGA chip, then the stacked BGA chips are pasted on the surface of the BGA chip to obtain the assembly element, and the assembly element is welded, so that the low-temperature solder paste is melted to wrap the high-temperature solder balls. This scheme possesses following beneficial effect: 1. the process itself comprises the following steps: the automatic tin spraying process can replace the traditional POP (post office automation) soldering flux dipping mode, and meets the requirements of the mixed welding process in the low-temperature tin paste era; 2. the primary yield is high: the automatic tin spraying process can greatly improve the primary yield of the POP process; 3. the welding strength is high: the automatic tin spraying process adopts tin spraying instead of dipping soldering flux, so that the welding strength of welding spots and welding seams of the BGA chip with the stacked layers can be enhanced, and the welding reliability is ensured; 4. the manufacturing cost is low: the automatic tin spraying process can shorten the production period, reduce the manufacturing cost, relieve the inventory pressure and realize the flexible stacking and mounting of the BGA chip in the POP process.
In one example, before the printing the low temperature solder paste on the solder joints on the surface of the printed circuit board PCB, the process further comprises:
PCB surface treatment: an Organic Solderability Preservative (OSP) is provided on the surface of the PCB board.
Because the bonding pad is exposed in the environment and is easy to oxidize, the acting force between the low-temperature solder paste and the bonding pad is influenced, and the OSP is arranged on the surface of the PCB, so that the copper bonding pad can be protected, the oxidation of the bonding pad is avoided, and the adhesive force of the low-temperature solder paste on the bonding pad is improved.
In one example, the printing of the low-temperature solder paste on the solder points on the surface of the printed circuit board PCB includes:
printing low-temperature solder paste on the surface of the PCB through a steel mesh;
and carrying out solder paste detection on the low-temperature solder paste printed on the surface of the PCB.
After the low-temperature Solder Paste is printed on the welding sites on the surface of the PCB through the steel mesh with a certain mesh size, the low-temperature Solder Paste printed on the surface of the PCB is subjected to Solder Paste detection (SPI), the SPI detection comprises the detection of the printing volume, the printing area and the printing height of the low-temperature Solder Paste, and if the SPI detection meets the requirements of the printing volume, the printing area and the printing height, the step S2 is continuously executed. If the SPI is detected to be unqualified, the low-temperature solder paste printed on the surface of the PCB needs to be subjected to post-treatment, for example, the printing height is insufficient or too high, the low-temperature solder paste needs to be scraped, the low-temperature solder paste is printed again after the surface of the PCB is cleaned, and the subsequent steps can be continuously executed until the SPI is detected to be qualified.
In one example, after spraying low-temperature solder paste on the bonding pads on the surface of the bottom layer BGA chip, the method further comprises the following steps:
and carrying out solder paste detection on the low-temperature solder paste sprayed on the bonding pad on the surface of the bottom BGA chip.
And performing SPI detection on the low-temperature solder paste sprayed on the BGA chip bonding pad, wherein the SPI detection comprises detection of the spraying volume, the spraying area and the spraying height of the low-temperature solder paste, and when the SPI detection shows that the spraying volume, the spraying area and the spraying height meet the requirements, continuously executing the step S4.
In one example, the soldering the assembly component to melt the low-temperature solder paste to package the high-temperature solder ball by the low-temperature solder paste includes:
the assembly elements sequentially enter a preheating zone, a heat preservation zone, a welding zone and a cooling zone;
the preheating temperature of the preheating zone is 160-170 ℃, the preheating time of the preheating zone is 40-70s, and the heating rate of the preheating zone is 1.7-2.3 ℃/s; the temperature of the heat preservation area is 177-; the peak temperature of the welding zone is 190-; the cooling rate of the cooling zone is 1-3 ℃/s.
The assembling elements sequentially enter the preheating area, the heat preservation area, the welding area and the cooling area, parameters are set according to the characteristics of the low-temperature solder paste under the welding condition, the low-temperature solder paste is molten in the welding process, the high-temperature solder balls cannot be molten, the molten low-temperature solder paste wraps the high-temperature solder balls, and the PCB, the bottom BGA chip and the stacked BGA chip are welded.
The present invention also provides a POP hybrid welding system, as shown in fig. 2, comprising:
the printing equipment 21 is used for printing low-temperature solder paste on the welding points on the surface of the PCB;
the printing equipment is a printer, and low-temperature solder paste is printed on the PCB through a steel mesh with a certain mesh size.
The chip mounting device 22 is used for mounting a bottom ball grid array package BGA chip on a bonding pad on the surface of the PCB, and a high-temperature solder ball is implanted into the bottom surface of the bottom BGA chip; the chip mounting device 22 is further configured to mount a stacked layer BGA chip on the surface of the bottom layer BGA chip to obtain an assembled component, where a high temperature solder ball is implanted on the bottom surface of the stacked layer BGA chip;
the automatic tin spraying equipment 23 is used for spraying low-temperature tin paste on the bonding pad on the surface of the bottom BGA chip;
and the welding equipment 24 is used for welding the assembly element so as to melt the low-temperature solder paste and package the high-temperature solder balls by the low-temperature solder paste.
In one example, the soldering device 24 is a reflow soldering machine, a preheating zone, a heat preservation zone, a soldering zone and a cooling zone are sequentially arranged inside the reflow soldering machine, the assembly components are placed in the soldering jig, and then the soldering jig is placed in the reflow soldering machine and sequentially passes through the preheating zone, the heat preservation zone, the soldering zone and the cooling zone. The preheating temperature of the preheating zone is 160-170 ℃, the preheating time of the preheating zone is 40-70s, and the heating rate of the preheating zone is 1.7-2.3 ℃/s; the temperature of the heat preservation area is 177-; the peak temperature of the welding zone is 190-; the cooling rate of the cooling zone is 1-3 ℃/s. And after cooling to room temperature, taking out the welding jig, and then taking out the welded assembly element.
In one example, the chip device 22 is further configured to mount other SMD components on the pads on the PCB surface, and the SMD components are soldered on the pads on the PCB surface.
In one example, the system further comprises:
the solder paste detection equipment 25 is used for carrying out solder paste detection on the low-temperature solder paste printed on the surface of the PCB;
the solder paste detection equipment 25 is also used for performing solder paste detection on the low-temperature solder paste sprayed on the surface of the bottom layer BGA chip.
In the description of the present disclosure, it is to be understood that the orientation or positional relationship indicated by the orientation terms is generally based on the orientation or positional relationship shown in the drawings, and is for convenience only to facilitate the description of the present disclosure and to simplify the description, and in the case of not having been stated to the contrary, these orientation terms are not intended to indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be taken as limiting the scope of the present disclosure; the terms "inner" and "outer" refer to the interior and exterior of the respective components as they relate to their own contours.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe the spatial relationship of one or more components or features shown in the figures to other components or features. It is to be understood that the spatially relative terms are intended to encompass not only the orientation of the component as depicted in the figures, but also different orientations of the component in use or operation. For example, if an element in the drawings is turned over in its entirety, the articles "over" or "on" other elements or features will include the articles "under" or "beneath" the other elements or features. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". Further, these components or features may also be positioned at various other angles (e.g., rotated 90 degrees or other angles), all of which are intended to be encompassed herein.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, elements, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the foregoing drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are capable of operation in sequences other than those illustrated or otherwise described herein.
The present disclosure has been illustrated by the above embodiments, but it should be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the present disclosure to the scope of the described embodiments. Furthermore, it will be understood by those skilled in the art that the present disclosure is not limited to the embodiments described above, and that many variations and modifications may be made in light of the teaching of the present disclosure, all of which fall within the scope of the claimed disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof.
Claims (10)
1. A POP hybrid welding process, comprising:
printing low-temperature solder paste on the welding points on the PCB surface of the printed circuit board;
mounting a bottom layer Ball Grid Array (BGA) chip on a bonding pad on the surface of the PCB, wherein a high-temperature solder ball is implanted into the bottom surface of the bottom layer BGA chip;
spraying low-temperature solder paste on the bonding pad on the surface of the bottom BGA chip;
mounting a stacked BGA chip on the surface of the bottom BGA chip to obtain an assembled element, wherein a high-temperature solder ball is implanted into the bottom surface of the stacked BGA chip;
and welding the assembly element to melt the low-temperature solder paste, so as to wrap the high-temperature solder ball by the low-temperature solder paste.
2. The POP hybrid welding process of claim 1, wherein the printing of low temperature solder paste on solder points on the PCB surface comprises:
printing low-temperature solder paste on the surface of the PCB through a steel mesh;
and carrying out solder paste detection on the low-temperature solder paste printed on the surface of the PCB.
3. The POP hybrid soldering process according to claim 1 or 2, wherein before the printing of the low temperature solder paste to the solder sites on the surface of the printed circuit board PCB, the process further comprises:
PCB surface treatment: and arranging an organic solderable protective film OSP on the surface of the PCB.
4. The POP hybrid welding process of claim 1, wherein other Surface Mounted Devices (SMD) are further mounted on the bonding pads on the surface of the PCB, and the SMD components are welded on the bonding pads on the surface of the PCB.
5. The POP hybrid welding process of claim 1, wherein the welding of the assembly element to melt the low-temperature solder paste to package the high-temperature solder balls by the low-temperature solder paste comprises the following steps:
the assembly elements sequentially enter a preheating zone, a heat preservation zone, a welding zone and a cooling zone;
the preheating temperature of the preheating zone is 160-170 ℃, the preheating time of the preheating zone is 40-70s, and the heating rate of the preheating zone is 1.7-2.3 ℃/s; the temperature of the heat preservation area is 177-; the peak temperature of the welding zone is 190-; the cooling rate of the cooling zone is 1-3 ℃/s.
6. A POP hybrid welding system, comprising:
the printing equipment is used for printing low-temperature solder paste on the welding points on the surface of the PCB;
the chip mounting equipment is used for mounting a bottom layer Ball Grid Array (BGA) chip on a bonding pad on the surface of the PCB, and a high-temperature solder ball is implanted into the bottom surface of the bottom layer BGA chip; the chip mounting equipment is also used for mounting a stacked BGA chip on the surface of the bottom BGA chip to obtain an assembled element, and a high-temperature solder ball is implanted into the bottom surface of the stacked BGA chip;
the automatic tin spraying equipment is used for spraying low-temperature tin paste on the bonding pad on the surface of the bottom BGA chip;
and the welding equipment is used for welding the assembly element so as to melt the low-temperature solder paste and package the high-temperature solder balls by the low-temperature solder paste.
7. The POP hybrid welding system of claim 6, further comprising:
the solder paste detection equipment is used for carrying out solder paste detection on the low-temperature solder paste printed on the surface of the PCB;
and the method is also used for detecting the low-temperature solder paste sprayed on the surface of the bottom layer BGA chip.
8. The POP hybrid welding system of claim 6, wherein a preheating zone, a holding zone, a welding zone, and a cooling zone are provided in sequence within the welding equipment.
9. The POP hybrid welding system of claim 8, wherein the preheating zone preheating temperature is 160-170 ℃, the preheating zone preheating time is 40-70s, and the preheating zone heating rate is 1.7-2.3 ℃/s;
the temperature of the heat preservation area is 177-;
the peak temperature of the welding zone is 190-;
the cooling rate of the cooling zone is 1-3 ℃/s.
10. The POP hybrid welding system of claim 6, wherein the chip device is further used for mounting other Surface Mounted Devices (SMD) on the pads on the surface of the PCB, and the SMD components are welded on the pads on the surface of the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210319836.2A CN114682870A (en) | 2022-03-29 | 2022-03-29 | POP hybrid welding process and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210319836.2A CN114682870A (en) | 2022-03-29 | 2022-03-29 | POP hybrid welding process and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114682870A true CN114682870A (en) | 2022-07-01 |
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| CN202210319836.2A Pending CN114682870A (en) | 2022-03-29 | 2022-03-29 | POP hybrid welding process and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115194276A (en) * | 2022-07-13 | 2022-10-18 | 旻芯半导体(嘉兴)有限公司 | Welding process of endoscope illumination module |
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| CN115194276A (en) * | 2022-07-13 | 2022-10-18 | 旻芯半导体(嘉兴)有限公司 | Welding process of endoscope illumination module |
| CN115194276B (en) * | 2022-07-13 | 2023-09-15 | 旻芯半导体(嘉兴)有限公司 | Welding process of endoscope illumination module |
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