CN115194276A - Welding process of endoscope illumination module - Google Patents
Welding process of endoscope illumination module Download PDFInfo
- Publication number
- CN115194276A CN115194276A CN202210830378.9A CN202210830378A CN115194276A CN 115194276 A CN115194276 A CN 115194276A CN 202210830378 A CN202210830378 A CN 202210830378A CN 115194276 A CN115194276 A CN 115194276A
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- CN
- China
- Prior art keywords
- bonding pad
- solder paste
- red copper
- piece
- illumination module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Endoscopes (AREA)
Abstract
The invention provides a welding process of an endoscope illumination module, and belongs to the technical field of endoscopes. A welding process for an endoscope illumination module, comprising: s1, printing high-melting-point solder paste on a bonding pad on the front surface of a ceramic piece, and arranging an LED lamp at the bonding pad; s2, printing high-melting-point solder paste on the bonding pad on the front surface of the red copper part; s3, arranging a back bonding pad of the ceramic piece on a front bonding pad of the red copper piece, enabling the polar holes of the ceramic piece to correspond to the line holes of the red copper piece one by one, and welding at high temperature; s4, leading one end of a lead to a polar hole of the ceramic piece from a line hole of the red copper piece, enabling a line core of the lead to be attached to a bonding pad on the front surface of the ceramic piece, and enabling an insulating layer of the lead to enter the polar hole of the ceramic piece; and S5, coating low-melting-point solder paste on a bonding pad on the front side of the ceramic part, wrapping the wire core, and welding at low temperature.
Description
Technical Field
The invention belongs to the technical field of endoscopes, and particularly relates to a welding process of an endoscope illumination module.
Background
In the welding process of the existing endoscope lighting module, the LED is damaged by secondary heating or blue light is exposed, a high-temperature-resistant wire is broken and bent, welding spots with positive and negative polarities during power supply are irregularly formed or are higher than the surface height of the LED, a red copper piece is short-circuited or carries polarities at a contact position between a wire hole and a ceramic piece during power supply, the high-temperature-resistant wire ends with the positive and negative polarities are directly conducted with the copper piece, the lighting module is extremely low in yield, and the lighting module is partially incapable of being used or has the risk of oral electric shock in the use process.
Disclosure of Invention
The invention aims to solve the problems in the prior art, provides a welding process of an endoscope illumination module, and solves the problem of low yield in the welding process of the endoscope illumination module.
The purpose of the invention can be realized by the following technical scheme:
a welding process of an endoscope illumination module is characterized by comprising
S1, printing high-melting-point solder paste on a bonding pad on the front surface of a ceramic piece, and arranging an LED lamp at the bonding pad;
s2, printing high-melting-point solder paste on the bonding pad on the front surface of the red copper part;
s3, arranging a back bonding pad of the ceramic piece on a front bonding pad of the red copper piece, enabling the polar holes of the ceramic piece to correspond to the line holes of the red copper piece one by one, and welding at high temperature;
s4, leading one end of a lead to a polar hole of the ceramic piece from a line hole of the red copper piece, enabling a line core of the lead to be attached to a bonding pad on the front surface of the ceramic piece, and enabling an insulating layer of the lead to enter the polar hole of the ceramic piece;
and S5, coating low-melting-point solder paste on a bonding pad on the front side of the ceramic part, wrapping the wire core, and welding at low temperature.
In the welding process of the endoscope illumination module, a steel mesh printing method is adopted in the steps S1 and S2.
In the welding process of the endoscope illumination module, the difference between the melting points of the high-melting-point solder paste and the low-melting-point solder paste is more than 100 ℃, and the lowest melting point of the low-melting-point solder paste is required to be more than 150 ℃.
In the welding process of the endoscope illumination module, the highest melting point of the high-melting-point solder paste is 260 ℃, and the highest melting point of the low-melting-point solder paste is 160 ℃.
In the welding process of the endoscope illumination module, the temperature and humidity requirements of a workshop are as follows: the temperature is 20-28 ℃, and the humidity is 60-80%.
In the above-described welding process of the endoscope illumination module, in step S5, the outer end of the post polarity hole is covered with a low melting point solder paste.
In the welding process of the endoscope illumination module, after the step S5, the welded surface redundant wire core is cut off along the surface welding point, and the cut surface is coated with the solder paste and welded at low temperature.
In the welding process of the endoscope illumination module, the wire holes of the ceramic piece correspond to the wire holes of the red copper piece one by one, the polar holes are vertically arranged on the front surface of the bonding pad of the red copper piece, and the edge of the ceramic piece is aligned with the edge of the red copper piece.
Compared with the prior art, the invention has the following advantages:
1. by means of printing, the condition that the solder of the LED bonding pad, the ceramic part and the red copper part bonding pad overflows is reduced.
2. After penetrating into the polarity hole through the wire, the sinle silk of wire is at least partial to wear out the polarity hole, and the insulating layer of wire also gets into in the polarity hole to red copper spare appears the short circuit or carries polarity when effectual having reduced the power supply, at red copper spare wire hole and ceramic contact position, the sinle silk of the wire of positive and negative polarity and the direct problem of switching on of red copper spare.
3. Through adopting the setting of making up melting point tin cream and low melting point tin cream, can make and connect in batches between the different parts on same subassembly, reduced LED lamp, wire damage's possibility.
Drawings
Fig. 1 is a schematic view of an endoscope illumination module according to the present invention.
In the figure, the position of the first and second end faces,
2. a ceramic piece; 21. a polar pore;
3. a red copper member; 31. a wire hole;
4. an LED lamp;
5. a wire; 51. a wire core; 52. an insulating layer;
6. high melting point solder paste;
7. and (3) low-melting-point solder paste.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in the figure 1 of the drawings,
a welding process for an endoscope illumination module comprises
S1, printing high-melting-point solder paste 6 on a bonding pad on the front surface of a ceramic part 2, and arranging an LED lamp 4 at the bonding pad;
in the step, the LED lamp 4 is arranged at a preset position, and the front bonding pad of the ceramic part 2 comprises at least one positive bonding pad and at least one negative bonding pad, and can be adjusted according to actual conditions; the ceramic part 2 is the prior art, and the ceramic part 2 is provided with a front bonding pad and a back bonding pad;
the solder paste is arranged on the bonding pad on the front side of the ceramic part 2 in a printing mode, stability is achieved, precision is high, and the solder paste on the bonding pad overflows less.
S2, printing a high-melting-point solder paste 6 on a bonding pad on the front surface of the red copper piece 3;
the solder paste is arranged on the bonding pad on the front side of the red copper part 3 in a printing mode, so that the method is stable and high in precision, and the solder paste on the bonding pad overflows less;
s3, arranging a reverse bonding pad of the ceramic part 2 on a front bonding pad of the red copper part 3, enabling the polar holes 21 of the ceramic part 2 to correspond to the line holes 31 of the red copper part 3 one by one, and welding at high temperature;
in the step, the ceramic part 2 is placed on the red copper part 3, and then the assembly is sent to a reflow soldering social security for high-temperature soldering, so that the ceramic part 2 and the red copper part 3 are connected together; the polar hole 21 of the ceramic part 2 corresponds to the wire hole 31 of the red copper part 3, so that a subsequent wire 5 can conveniently penetrate;
s4, threading one end of the lead 5 from the wire hole 31 of the red copper piece 3 to the polar hole 21 of the ceramic piece 2, attaching the wire core 51 of the lead 5 to a bonding pad on the front surface of the ceramic piece 2, and enabling the insulating layer 52 of the lead 5 to enter the polar hole 21 of the ceramic piece 2;
in this step, after the wire 5 penetrates into the polar hole 21, at least part of the wire core 51 of the wire 5 penetrates out of the polar hole 21, and the insulating layer 52 of the wire 5 also enters into the polar hole 21, so that the problem that the red copper piece 3 is short-circuited or carries polarity when power is supplied is effectively reduced, and the wire core 51 of the wire 5 with positive and negative polarities is directly conducted with the red copper piece 3 at the contact position of the wire hole 31 of the red copper piece 3 and the ceramic piece 2.
And S5, coating the low-melting-point solder paste 7 on a bonding pad on the front surface of the ceramic part 2, wrapping the wire core 51 of the lead 5, and welding at low temperature. By adopting the low-temperature solder paste different from the solder paste in the previous steps, the high-temperature solder paste in the previous steps can not be melted under the condition that the solder paste is melted in the step, so that the connection and fixation of the wire core 51 of the lead 5 in the step are reduced, and the position relation among the ceramic piece 2, the LED lamp 4 and the red copper piece 3 can not be influenced. And, adopt low temperature tin cream, in the heating process, reduced the possibility that wire 5 external insulation 52 damaged, reduce the emergence of short circuit condition.
Specifically, in step S1 and step S2, a steel mesh printing method is adopted. The mode has the advantages of high precision, stability and low cost.
Specifically, the melting points of the high melting point solder paste 6 and the low melting point solder paste 7 are different by more than 100 ℃, and the lowest melting point of the low melting point solder paste 7 is required to be more than 150 ℃. By setting the melting point difference, different parts on the same assembly can be connected in batches. The assembly is more convenient. For example, in the invention, the LED lamp 4, the red copper member 3 and the ceramic member 2 are soldered and fixed in advance by using the high melting point solder paste, and then the lead 5 is connected with the front bonding pad of the ceramic member 2 by using the low melting point solder paste, and the possibility of damaging the insulating layer 52 of the lead 5 by temperature can be reduced.
Specifically, the high melting point solder paste 6 has a maximum melting point of 260 ℃ and the low melting point solder paste 7 has a maximum melting point of 160 ℃. The two melting points are selected, so that the connection strength can be ensured, and meanwhile, the subsequent welding temperature is reduced in the reflow soldering process, so that the influence on the preorder welding step is caused.
Specifically, the temperature and humidity requirements of the workshop are as follows: the temperature is 20-28 ℃, and the humidity is 60-80%. The best welding effect is achieved at the temperature and the humidity.
Specifically, in step S5, the outer ends of the post polarity holes 21 are covered with the low melting point solder paste 7. The welding method has better connecting effect after welding.
Specifically, after step S5, the soldered surface excess wire core 51 is cut along the surface solder joint, and solder paste is applied to the cut surface for soldering at a low temperature. The welding spots with positive and negative polarity for power supply are irregularly formed or the height of the welding spots is larger than the height of the surface of the LED lamp 4, the part higher than the surface of the LED lamp 4 can be cut off, then low-temperature tin paste is coated again, and the surface of the LED lamp is smooth and attractive after heating.
Specifically, the polar holes 21 of the ceramic piece 2 correspond to the line holes 31 of the red copper piece 3 one by one, the polar holes 21 are vertically arranged on the front pad of the red copper piece 3, and the edge of the ceramic piece 2 is aligned with the edge of the red copper piece 3. The design can make the endoscope lighting module more beautiful. And when placing ceramic member 2 on red copper spare 3, also align more easily, easy to assemble. And the polar holes 21 are in the same line with the red copper member 3.
It should be noted that all directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions relating to "first", "second", etc. in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Also, the meaning of "and/or" appearing throughout is to include three versions, exemplified by "A and/or B" including either version A, or version B, or versions in which both A and B are satisfied. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The above components are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (8)
1. A welding process for an endoscope illumination module is characterized by comprising
S1, printing high-melting-point tin paste (6) on a bonding pad on the front surface of a ceramic piece (2), and arranging an LED lamp (4) at the bonding pad;
s2, printing high-melting-point tin paste (6) on a bonding pad on the front surface of the red copper piece (3);
s3, arranging a back bonding pad of the ceramic piece (2) on a front bonding pad of the red copper piece (3), enabling the polar holes (21) of the ceramic piece (2) to correspond to the line holes (31) of the red copper piece (3) one by one, and welding at high temperature;
s4, one end of a lead (5) is led to the polar hole (21) of the ceramic piece (2) from the line hole (31) of the red copper piece (3) in a penetrating mode, a line core (51) of the lead (5) is attached to a bonding pad on the front face of the ceramic piece (2), and an insulating layer (52) of the lead (5) enters the polar hole (21) of the ceramic piece (2);
and S5, coating the low-melting-point solder paste (7) on a bonding pad on the front surface of the ceramic piece (2), wrapping a wire core (51) of the lead (5), and welding at low temperature.
2. The welding process for the endoscope illumination module according to claim 1, wherein in the steps S1 and S2, a steel mesh printing method is adopted.
3. The soldering process for an endoscope illumination module according to claim 1, characterized in that the melting points of the high melting point solder paste (6) and the low melting point solder paste (7) are different by more than 100 ℃, and the lowest melting point of the low melting point solder paste (7) is required to be more than 150 ℃.
4. The process for soldering an endoscope illumination module according to claim 3, characterized in that the high melting point solder paste (6) has a maximum melting point of 260 ℃ and the low melting point solder paste (7) has a maximum melting point of 160 ℃.
5. The welding process for an endoscope illumination module according to claim 1, characterized by workshop temperature and humidity requirements: the temperature is 20-28 ℃, and the humidity is 60-80%.
6. The soldering process for an endoscope illumination module according to claim 1, characterized in that in step S5, the outer end of the post polarity hole (21) is covered with a low melting point solder paste (7).
7. The bonding process of the endoscope illumination module according to the claim 1, characterized in that after the step S5, the bonded surface excess wire core (51) is cut along the surface bonding spot, and the cut surface is coated with solder paste and bonded at low temperature.
8. The welding process of the endoscope illumination module according to the claim 1, characterized in that the wire holes (31) of the ceramic piece (2) correspond to the wire holes (31) of the red copper piece (3) one by one, the polar holes (21) are vertically arranged on the front pad of the red copper piece (3), and the edge of the ceramic piece (2) is aligned with the edge of the red copper piece (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210830378.9A CN115194276B (en) | 2022-07-13 | 2022-07-13 | Welding process of endoscope illumination module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210830378.9A CN115194276B (en) | 2022-07-13 | 2022-07-13 | Welding process of endoscope illumination module |
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| Publication Number | Publication Date |
|---|---|
| CN115194276A true CN115194276A (en) | 2022-10-18 |
| CN115194276B CN115194276B (en) | 2023-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210830378.9A Active CN115194276B (en) | 2022-07-13 | 2022-07-13 | Welding process of endoscope illumination module |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110308847A1 (en) * | 2010-06-21 | 2011-12-22 | Randy Allen Normann | Method for high-temperature circuit board assembly |
| CN104042179A (en) * | 2014-07-04 | 2014-09-17 | 王刚 | Integrated medical endoscope system |
| CN213704921U (en) * | 2020-10-21 | 2021-07-16 | 上海龙旗科技股份有限公司 | Verification structure for printing high-low temperature solder paste on PCB |
| CN114192915A (en) * | 2021-12-27 | 2022-03-18 | 烟台台芯电子科技有限公司 | IGBT welding process method |
| CN114682870A (en) * | 2022-03-29 | 2022-07-01 | 联宝(合肥)电子科技有限公司 | POP hybrid welding process and system |
-
2022
- 2022-07-13 CN CN202210830378.9A patent/CN115194276B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110308847A1 (en) * | 2010-06-21 | 2011-12-22 | Randy Allen Normann | Method for high-temperature circuit board assembly |
| CN104042179A (en) * | 2014-07-04 | 2014-09-17 | 王刚 | Integrated medical endoscope system |
| CN213704921U (en) * | 2020-10-21 | 2021-07-16 | 上海龙旗科技股份有限公司 | Verification structure for printing high-low temperature solder paste on PCB |
| CN114192915A (en) * | 2021-12-27 | 2022-03-18 | 烟台台芯电子科技有限公司 | IGBT welding process method |
| CN114682870A (en) * | 2022-03-29 | 2022-07-01 | 联宝(合肥)电子科技有限公司 | POP hybrid welding process and system |
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| Publication number | Publication date |
|---|---|
| CN115194276B (en) | 2023-09-15 |
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