CN108541136B - Plug-in support structure of imitation paster element - Google Patents
Plug-in support structure of imitation paster element Download PDFInfo
- Publication number
- CN108541136B CN108541136B CN201810605084.XA CN201810605084A CN108541136B CN 108541136 B CN108541136 B CN 108541136B CN 201810605084 A CN201810605084 A CN 201810605084A CN 108541136 B CN108541136 B CN 108541136B
- Authority
- CN
- China
- Prior art keywords
- pcb
- insulating material
- copper sheets
- plug
- temperature insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 239000011810 insulating material Substances 0.000 claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 abstract description 20
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 11
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 6
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a plug-in support structure imitating a patch element, which comprises an electrolytic assembly, wherein the upper end of the electrolytic assembly is fixedly provided with a PCB (printed circuit board), the upper end of the PCB is provided with two copper sheets, a high-temperature insulating material is filled between the two copper sheets and the PCB, the PCB is provided with two first openings, both sides of the lower end of the high-temperature insulating material are respectively provided with a hollow locating pin, the lower ends of the hollow locating pins extend into the first openings, the high-temperature insulating material is internally provided with two through holes, the lower ends of the two through holes correspond to the two hollow locating pins, the two copper sheets are respectively provided with a second opening, and the upper end of the electrolytic assembly is connected with two capacitor pins. According to the invention, through improvement of the plug-in support, the function of completing the machine paste at one time without human intervention during installation is realized, the production efficiency is improved, the production cost is reduced, the stability is strong, the overall compactness is high, the operation is simple, and the use is convenient.
Description
Technical Field
The invention relates to the technical field of imitated paster elements, in particular to an insert bracket structure of imitated paster elements.
Background
Printed circuit boards, also known as printed circuit boards, are important electronic components, which are supports for electronic components, and which are providers for the wiring connections of electronic components. Because it is made by electronic printing technology, it is called "printed" circuit board, and before the printed circuit board appears, the interconnections between electronic components are directly connected by wires to form a complete circuit. Circuit boards are now only available as an effective experimental tool, while printed circuit boards have become an absolute dominant place in the electronics industry. In the beginning of the 20 th century, in order to simplify the fabrication of electronic devices, reduce wiring between electronic components and reduce fabrication costs, methods of replacing wiring by printing have been under development. Over thirty years, engineers have proposed to use metal conductors as wiring on an insulated substrate, and because of the diversification of the manufacturing method and the assembly structure of PCBA, a new invention of matched devices is needed to apply, the stability of the existing plug-in support structure is poor, and the installation support and the clamping pins are additionally required to be installed by manpower, so that the cost is increased, the production efficiency is reduced, and the existing plug-in support structure can be attached mechanically, and the installation times are more and the compactness is poor.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides an insert bracket structure imitating a patch element.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides an imitative plug-in components supporting structure of paster component, includes electrolytic assembly, electrolytic assembly's upper end is fixed with the PCB board, the upper end of PCB board is equipped with two copper sheets, and it has high temperature insulating material to fill between two copper sheets and the PCB board, be equipped with two first openings on the PCB board, high temperature insulating material's lower extreme both sides all are equipped with hollow locating pin, hollow locating pin's lower extreme extends to in the first opening, be equipped with two through-holes in the high temperature insulating material, and two through-hole's lower extreme and two hollow locating pin are corresponding, all are equipped with the second opening on two copper sheets, electrolytic assembly's upper end is connected with two electric capacity pins, the upper end of electric capacity pin runs through hollow locating pin, through-hole and second opening and extends to the upper end of copper sheet, the upper end of electric capacity pin is equipped with the solder joint.
Preferably, the copper sheet is sprayed with tin or tinned.
Preferably, the lower end of the copper sheet is coated with solder paste, and the lower end of the solder paste is attached to the upper end of the PCB.
Preferably, the PCB is made of glass fiber material or metal aluminum material.
In the invention, when in use, two copper sheets are clamped and wrapped on a high-temperature insulating material in advance, so that an integral bracket is formed and is regarded as a single part which can be attached, after the integral bracket is arranged at a reserved position of the element on a PCB printed with solder paste through a chip mounter, a hollow positioning pin just passes through a reserved positioning hole of the bracket on the PCB, thereby playing a role in fixing and limiting the PCB, preventing a subsequent capacitor pin from directly contacting the PCB, and then passing the capacitor pin through a through hole, thereby conveniently adjusting a welding point of an insert from the back surface of the PCB to the front surface, then connecting the capacitor pin, and after connection, carrying out welding fixation through the welding point. According to the invention, through improvement of the plug-in support, the function of completing the machine paste at one time without human intervention during installation is realized, the production efficiency is improved, the production cost is reduced, the stability is strong, the overall compactness is high, the operation is simple, and the use is convenient.
Drawings
Fig. 1 is a schematic structural diagram of an insert support structure imitating a patch element according to the present invention.
In the figure: 1 electrolytic component, 2PCB board, 3 tin paste, 4 copper sheet, 5 high temperature insulating material, 6 capacitor pin, 7 welding spot, 8 through hole and 9 hollow positioning pin.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1, a patch element-imitating plug-in support structure comprises an electrolytic component 1, wherein the electrolytic component 1 is a process of passing current through electrolyte solution or molten electrolyte, (also called electrolyte), and causing oxidation-reduction reaction on a cathode and an anode, a PCB board 2 is fixed at the upper end of the electrolytic component 1, two copper sheets 4 are arranged at the upper end of the PCB board 2, in order to prevent vibration damage of an electrolytic capacitor to a bonding pad and wiring of the PCB copper sheets, the copper sheets 4 are adopted to replace the copper sheets, the welding surface of the structure and the PCB is enlarged, the original small bonding pad is replaced, the stability is improved, a high-temperature insulating material 5 is filled between the two copper sheets 4 and the PCB board 2, the capacitor pins 6 are insulated from the aluminum substrate, and the SMT welding is performed, so that insulating and temperature-resistant materials (PA 6T+20% glass fibers) are selected as a structural main body, the service life of the capacitor pins 6 is prolonged, the stability of the capacitor pins 6 is improved, two first openings are arranged on the PCB 2, two sides of the lower end of the high-temperature insulating material 5 are respectively provided with a hollow positioning pin 9, the lower ends of the hollow positioning pins 9 extend into the first openings, two through holes 8 are arranged in the high-temperature insulating material 5, the lower ends of the two through holes 8 correspond to the two hollow positioning pins 9, two copper sheets 4 are respectively provided with a second opening, the upper end of the electrolytic assembly 1 is connected with the two capacitor pins 6, the connection is convenient through the capacitor pins 6, the capacitor pins 6 are conveniently connected to the front surface of the electrolytic assembly 1 from the back surface of the electrolytic assembly 1, the upper ends of the capacitor pins 6 penetrate through the hollow positioning pins 9, the through holes 8 and the second openings and extend to the upper ends of the copper sheets 4, welding spots 7 are arranged at the upper ends of the capacitor pins 6, the capacitor pins 6 are welded through the welding spots 7, the stability of the capacitor pins 6 is improved, the capacitor pins 6 are prevented from falling off the PCB 2 under the external action.
In the invention, the surface of the copper sheet 4 is tinned or sprayed with tin, and the tinned or sprayed tin has the characteristics of oxidation resistance, conductivity and easiness in welding. The lower extreme coating of copper sheet 4 has solder paste 3, and the lower extreme of solder paste 3 pastes the upper end at PCB board 2, can weld the lower extreme of copper sheet 4 at the upper end of PCB board 2 through solder paste 3, has to switch on the gas property, and PCB board 2 adopts glass fiber or metallic aluminium to make, and glass fiber is high than organic fiber temperature resistant, incombustible, anticorrosive, and thermal-insulated, sound insulation nature is good, and tensile strength is high, and the electrical insulation is good, satisfies PCB's user demand very much. The aluminum PCB has the advantages of high temperature resistance, difficult deformation and good heat dissipation performance.
In the invention, when in use, two copper sheets 4 are clamped and wrapped on a high-temperature insulating material 5 to form a bracket, the bracket is arranged on a PCB (printed circuit board) through a chip mounter, the two copper sheets 4 are welded on the PCB 2 together through solder paste 3, so that a hollow positioning pin 9 is naturally and synchronously clamped in a positioning hole of the PCB 2, thereby fixing and limiting the PCB 2 and preventing a capacitor pin from contacting the PCB later, then the capacitor pin 6 passes through a through hole 8, thereby conveniently adjusting an insert from the back surface of the PCB 2 to the front surface, connecting the capacitor pin 6, and performing welding fixation through a welding spot 7 after the connection is finished.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (4)
1. The utility model provides an imitative plug-in components supporting structure of paster component, includes electrolytic component (1), its characterized in that, electrolytic component (1)'s upper end is fixed with PCB board (2), PCB board (2)'s upper end is equipped with two copper sheets (4), and it has high temperature insulating material (5) to fill between two copper sheets (4) and PCB board (2), be equipped with two first openings on PCB board (2), high temperature insulating material (5)'s lower extreme both sides all are equipped with hollow locating foot (9), hollow locating foot (9)'s lower extreme extends to in the first opening, be equipped with two through-holes (8) in high temperature insulating material (5), and the lower extreme of two through-holes (8) and two hollow locating foot (9) are corresponding, all be equipped with the second opening on two copper sheets (4), electrolytic component (1)'s upper end is connected with two electric capacity pins (6), electric capacity pin (6) upper end runs through hollow locating foot (9), through-hole (8) and second opening and extends to copper sheet (4) upper end (6), electric capacity pin (7) upper end is equipped with solder joint.
2. A patch element-like insert support structure according to claim 1, characterized in that the copper sheet (4) is surface-tin-plated or tin-plated.
3. The plug-in bracket structure of the simulated patch element according to claim 1, wherein the lower end of the copper sheet (4) is coated with solder paste (3), and the lower end of the solder paste (3) is adhered to the upper end of the PCB (2).
4. The card support structure of the imitated paster element according to claim 1, wherein the PCB (2) is made of glass fiber material or metal aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810605084.XA CN108541136B (en) | 2018-06-13 | 2018-06-13 | Plug-in support structure of imitation paster element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810605084.XA CN108541136B (en) | 2018-06-13 | 2018-06-13 | Plug-in support structure of imitation paster element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108541136A CN108541136A (en) | 2018-09-14 |
| CN108541136B true CN108541136B (en) | 2024-02-02 |
Family
ID=63469911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810605084.XA Active CN108541136B (en) | 2018-06-13 | 2018-06-13 | Plug-in support structure of imitation paster element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108541136B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203827604U (en) * | 2014-02-12 | 2014-09-10 | 天津市松正电动汽车技术股份有限公司 | Capacitor and circuit board connection structure |
| US9439292B1 (en) * | 2015-03-06 | 2016-09-06 | Kinsus Interconnect Technology Corp. | Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure |
| CN206921862U (en) * | 2017-04-28 | 2018-01-23 | 博罗承创精密工业有限公司 | The high-power package supports of high heat conduction LED |
| CN107787116A (en) * | 2017-11-16 | 2018-03-09 | 厦门利德宝电子科技股份有限公司 | A kind of aluminium base welded suitable for component piercing insert and preparation method thereof |
| CN208387017U (en) * | 2018-06-13 | 2019-01-15 | 江苏新安电器有限公司 | A kind of plugging piece bracket structure of imitative surface mount elements |
-
2018
- 2018-06-13 CN CN201810605084.XA patent/CN108541136B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203827604U (en) * | 2014-02-12 | 2014-09-10 | 天津市松正电动汽车技术股份有限公司 | Capacitor and circuit board connection structure |
| US9439292B1 (en) * | 2015-03-06 | 2016-09-06 | Kinsus Interconnect Technology Corp. | Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure |
| CN206921862U (en) * | 2017-04-28 | 2018-01-23 | 博罗承创精密工业有限公司 | The high-power package supports of high heat conduction LED |
| CN107787116A (en) * | 2017-11-16 | 2018-03-09 | 厦门利德宝电子科技股份有限公司 | A kind of aluminium base welded suitable for component piercing insert and preparation method thereof |
| CN208387017U (en) * | 2018-06-13 | 2019-01-15 | 江苏新安电器有限公司 | A kind of plugging piece bracket structure of imitative surface mount elements |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108541136A (en) | 2018-09-14 |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 No. 111 Kangyuan Road, Xiangcheng Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: JIANGSU SIMAND ELECTRIC APPLIANCE Co.,Ltd. Country or region after: China Address before: 215100 No. 111 Kangyuan Road, Xiangcheng Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: JIANGSU XIN AN ELECTRIC APPLIANCE Co.,Ltd. Country or region before: China |