CN108541136A - A kind of plugging piece bracket structure of imitative surface mount elements - Google Patents
A kind of plugging piece bracket structure of imitative surface mount elements Download PDFInfo
- Publication number
- CN108541136A CN108541136A CN201810605084.XA CN201810605084A CN108541136A CN 108541136 A CN108541136 A CN 108541136A CN 201810605084 A CN201810605084 A CN 201810605084A CN 108541136 A CN108541136 A CN 108541136A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- plugging piece
- electrolysis
- piece bracket
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 239000003990 capacitor Substances 0.000 claims abstract description 22
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 17
- 239000011810 insulating material Substances 0.000 claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 239000006071 cream Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Abstract
The invention discloses a kind of plugging piece bracket structures of imitative surface mount elements, including electrolysis, the upper end of the electrolysis is fixed with pcb board, the upper end of the pcb board is set there are two copper sheet, two are filled with high temperature insulating material between copper sheet and pcb board, first opening there are two being set on the pcb board, the lower end both sides of the high temperature insulating material are equipped with hollow angle, the lower end of the hollow angle extends in the first opening, through-hole there are two being set in the high temperature insulating material, and two through-holes lower end and two hollow angles it is corresponding, it is equipped with the second opening on two copper sheets, there are two capacitor pins for the upper end connection of the electrolysis.The present invention is realized by the improvement to plugging piece bracket and is not needed manpower intervention when mounted, can once be completed the function of machine patch, improve production efficiency, reduce production cost, and stability is strong, and overall compactness is high, easy to operate, easy to use.
Description
Technical field
The present invention relates to imitative patch Element Technology field more particularly to a kind of plugging piece bracket structures of imitative surface mount elements.
Background technology
Printed circuit board, also known as printed circuit board, printed wiring board are important electronic unit, are the branch of electronic component
Support body is the supplier of electronic component connection.Since it is made of terahertz wave quasi-optics, therefore it is referred to as " print
Brush " circuit board, before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to and formed by electric wire
Whole circuit.Now, circuit bread board is intended only as effective experimental tool and exists, and printed circuit board is in the electronics industry
At the status for occupying empery.Early 20th century, people reduce electronic component to simplify the making of e-machine
Between wiring, reduce cost of manufacture the advantages that, then start to study intensively the method for replacing wiring in a manner of printing.Three during the decade,
Constantly there is engineer to propose that being subject to metallic conductor on the substrate of insulation makees wiring, due to the manufacturing method and assembling structure of PCBA
Diversification is applied to need the matched device of new invention, and existing plugging piece bracket structural stability is poor, be additionally required
Manpower installs mounting bracket and card base, improves cost, reduces production efficiency, and existing plugging piece bracket structure
Part can machine patch, and install often, compactedness is poor, for this purpose, we have proposed a kind of plugging piece bracket structures of imitative surface mount elements
To solve the above problems.
Invention content
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of imitative surface mount elements proposed is slotting
Part supporting structure.
To achieve the goals above, present invention employs following technical solutions：
A kind of plugging piece bracket structure of imitative surface mount elements, including electrolysis, the upper end of the electrolysis is fixed with pcb board, described
The upper end of pcb board is set there are two copper sheet, and two are filled with high temperature insulating material between copper sheet and pcb board, the pcb board is equipped with
Two first openings, the lower end both sides of the high temperature insulating material are equipped with hollow angle, the lower end of the hollow angle
Extend in the first opening, set in the high temperature insulating material there are two through-hole, and the lower end of two through-holes and two it is hollow fixed
Position foot is corresponding, the second opening is equipped on two copper sheets, there are two capacitor pin, the capacitances for the upper end connection of the electrolysis
The upper end of pin is open through hollow angle, through-hole and second and extends to the upper end of copper sheet, the upper end of the capacitor pin
Equipped with solder joint.
Preferably, tin or tin plating processing are sprayed on the copper sheet.
Preferably, the lower end of the copper sheet is coated with tin cream, and the lower end of the tin cream is covered in the upper end of pcb board.
Preferably, the pcb board is made of glass fibre material or metal aluminium material.
In the present invention, when in use, in advance by two copper sheet Ka Bao on high temperature insulating material, to form an entirety
Holder is regarded as an independent part that can be mounted, and integral support is placed in being somebody's turn to do on the PCB for being printed with tin cream by chip mounter
After the reserved location of element, hollow angle is also right through the reserved location hole of the holder on pcb board, to be risen to pcb board
The effect of fixed restriction, and subsequent capacitance pin is prevented to be in direct contact with pcb board, then wears capacitor pin out of through-hole
It crosses, the solder joint of plug-in unit is adjusted from the pcb board back side to front to facilitate, then capacitor pin is attached, connects it
Afterwards, it is welded and fixed by solder joint.The present invention realizes by the improvement to plugging piece bracket and does not need manpower Jie when mounted
Entering, can once complete the function of machine patch, improve production efficiency, reduce production cost, stability is strong, and overall compactness is high,
It is easy to operate, it is easy to use.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of the plugging piece bracket structure of imitative surface mount elements proposed by the present invention.
In figure：1 electrolysis, 2 pcb boards, 3 tin creams, 4 copper sheets, 5 high temperature insulating materials, 6 capacitor pins, 7 solder joints, 8 through-holes, 9
Hollow angle.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1, a kind of plugging piece bracket structure of imitative surface mount elements, including electrolysis 1, electrolysis 1 is that electric current is passed through electrolysis
Matter solution or molten state electrolyte, (also known as electrolyte) cause the process of redox reaction, electrolysis 1 on cathode and anode
Upper end be fixed with pcb board 2, the upper end of pcb board 2 is set there are two copper sheet 4, for prevent electrolytic capacitor vibrations damage pad and
PCB copper sheet cablings, thus copper sheet is substituted using copper sheet 4, the welding surface of structure and PCB is increased, original small pad is substituted, is improved steady
It is qualitative, high temperature insulating material 5 is filled between two copper sheets 4 and pcb board 2, capacitor pin 6 will insulate with aluminum substrate, again may be used
It is welded with SMT, therefore insulating temperature resistant meterial (PA6T+20% glasses) is selected to be used as main structure body, capacitor pin can be extended in this way
6 service life, improves the stability of capacitor pin 6, sets on PCB plates 2 there are two the first opening, under high temperature insulating material 5
End both sides are equipped with hollow angle 9, and the lower end of hollow angle 9 extends in the first opening, is equipped in high temperature insulating material 5
Two through-holes 8, and the lower end of two through-holes 8 and two hollow angles 9 are corresponding, and the second opening is equipped on two copper sheets 4,
There are two capacitor pins 6 for the upper end connection of electrolysis 1, are conveniently attached by capacitor pin 6, and electricity, which draws, holds foot 6 conveniently from electrolysis 1
The back side be connected to the front of electrolysis 1, the upper end of capacitor pin 6 is open and extends through hollow angle 9, through-hole 8 and second
To the upper end of copper sheet 4, the upper end of capacitor pin 6 is equipped with solder joint 7, is welded to capacitor pin 6 by solder joint 7, improves capacitance
The stability of pin 6 avoids capacitor pin 6 under external action, falls off from pcb board 2.
In the present invention, 4 electroplating surfaces with tin of copper sheet or spray tin processing, tin plating or spray tin have anti-oxidation, conductive, the spy easily welded
Point.The lower end of copper sheet 4 is coated with tin cream 3, and the lower end of tin cream 3 is covered in the upper end of pcb board 2, can be by copper sheet 4 by tin cream 3
Lower end is welded on the upper end of pcb board 2, there is conducting electrical resistance, pcb board 2 to be made of glass fibre or metallic aluminium, glass
Fiber is higher than organic fiber heatproof, non-ignitable, anti-corruption, heat-insulated, sound-proofing is good, and tensile strength is high, and electrical insulating property is good, meets very much PCB
Use demand.The advantages of aluminum PCB has high temperature resistant, is unlikely to deform, perfect heat-dissipating.
In the present invention, when in use, first by two 4 Ka Bao of copper sheet on high temperature insulating material 5, to form a branch
Two copper sheets 4 are welded on pcb board 2 on PCB by tin cream 3 by frame by Stent Implantation jointly by chip mounter, to so
Hollow angle 9 is also synchronized and is snap-fit in the location hole of pcb board 2 naturally, to pcb board 2 play fixed restriction effect with
And subsequently prevent capacitor pin from being contacted with PCB, then capacitor pin 6 is passed through out of through-hole 8, to facilitate plug-in unit from PCB
2 back side of plate is adjusted to front, is then attached to capacitor pin 6, after connecting, is welded and fixed by solder joint 7.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (4)
1. a kind of plugging piece bracket structure of imitative surface mount elements, including electrolysis (1), which is characterized in that the upper end of the electrolysis (1) is solid
Surely there is a pcb board (2), the upper end of the pcb board (2) sets that there are two copper sheets (4), is filled between two copper sheets (4) and pcb board (2)
Have high temperature insulating material (5), set on the pcb board (2) there are two first opening, the lower end two of the high temperature insulating material (5)
Side is equipped with hollow angle (9), and the lower end of the hollow angle (9) extends in the first opening, the high-temperature insulation material
It is set in material (5) there are two through-hole (8), and the lower end of two through-holes (8) and two hollow angles (9) are corresponding, two copper sheets
(4) the second opening is equipped on, the upper end of the electrolysis (1) is connected there are two capacitor pin (6), the capacitor pin (6)
Upper end is open through hollow angle (9), through-hole (8) and second and extends to the upper end of copper sheet (4), the capacitor pin (6)
Upper end be equipped with solder joint (7).
2. a kind of plugging piece bracket structure of imitative surface mount elements according to claim 1, which is characterized in that the copper sheet (4)
Spray tin or tin plating processing in surface.
3. a kind of plugging piece bracket structure of imitative surface mount elements according to claim 1, which is characterized in that the copper sheet (4)
Lower end be coated with tin cream (3), the lower end of the tin cream (3) is covered in the upper end of pcb board (2).
4. a kind of plugging piece bracket structure of imitative surface mount elements according to claim 1, which is characterized in that the pcb board (2)
It is made of glass fibre material or metal aluminium material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810605084.XA CN108541136B (en) | 2018-06-13 | 2018-06-13 | Plug-in support structure of imitation paster element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810605084.XA CN108541136B (en) | 2018-06-13 | 2018-06-13 | Plug-in support structure of imitation paster element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108541136A true CN108541136A (en) | 2018-09-14 |
| CN108541136B CN108541136B (en) | 2024-02-02 |
Family
ID=63469911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810605084.XA Active CN108541136B (en) | 2018-06-13 | 2018-06-13 | Plug-in support structure of imitation paster element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108541136B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203827604U (en) * | 2014-02-12 | 2014-09-10 | 天津市松正电动汽车技术股份有限公司 | Capacitor and circuit board connection structure |
| US9439292B1 (en) * | 2015-03-06 | 2016-09-06 | Kinsus Interconnect Technology Corp. | Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure |
| CN206921862U (en) * | 2017-04-28 | 2018-01-23 | 博罗承创精密工业有限公司 | The high-power package supports of high heat conduction LED |
| CN107787116A (en) * | 2017-11-16 | 2018-03-09 | 厦门利德宝电子科技股份有限公司 | A kind of aluminium base welded suitable for component piercing insert and preparation method thereof |
| CN208387017U (en) * | 2018-06-13 | 2019-01-15 | 江苏新安电器有限公司 | A kind of plugging piece bracket structure of imitative surface mount elements |
-
2018
- 2018-06-13 CN CN201810605084.XA patent/CN108541136B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203827604U (en) * | 2014-02-12 | 2014-09-10 | 天津市松正电动汽车技术股份有限公司 | Capacitor and circuit board connection structure |
| US9439292B1 (en) * | 2015-03-06 | 2016-09-06 | Kinsus Interconnect Technology Corp. | Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure |
| CN206921862U (en) * | 2017-04-28 | 2018-01-23 | 博罗承创精密工业有限公司 | The high-power package supports of high heat conduction LED |
| CN107787116A (en) * | 2017-11-16 | 2018-03-09 | 厦门利德宝电子科技股份有限公司 | A kind of aluminium base welded suitable for component piercing insert and preparation method thereof |
| CN208387017U (en) * | 2018-06-13 | 2019-01-15 | 江苏新安电器有限公司 | A kind of plugging piece bracket structure of imitative surface mount elements |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108541136B (en) | 2024-02-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215000 No. 111 Kangyuan Road, Xiangcheng Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: JIANGSU SIMAND ELECTRIC APPLIANCE Co.,Ltd. Country or region after: China Address before: 215100 No. 111 Kangyuan Road, Xiangcheng Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: JIANGSU XIN AN ELECTRIC APPLIANCE Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |