CN210866441U - Coplanar waveguide transmission line - Google Patents
Coplanar waveguide transmission line Download PDFInfo
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- CN210866441U CN210866441U CN201921979336.1U CN201921979336U CN210866441U CN 210866441 U CN210866441 U CN 210866441U CN 201921979336 U CN201921979336 U CN 201921979336U CN 210866441 U CN210866441 U CN 210866441U
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- dielectric plate
- clamp
- coplanar waveguide
- lead
- transmission line
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Abstract
The utility model provides a coplanar waveguide transmission line, including coplanar waveguide dielectric slab and anchor clamps subassembly, wherein: the surface of the coplanar waveguide dielectric slab is provided with a first lead, a second lead and a third lead, the second lead is arranged in the middle of the coplanar waveguide dielectric slab along the transmission direction, and the first lead, the third lead and the second lead are arranged in parallel and symmetrically distributed on two sides of the second lead; the clamp assembly comprises a first clamp dielectric plate and a second clamp dielectric plate which are arranged on two sides of the coplanar waveguide dielectric plate along the transmission direction, and a gap between the first clamp dielectric plate and the second clamp dielectric plate is suitable for placing a joint part to be welded; the first clamp dielectric plate and the second clamp dielectric plate are insulating. The utility model discloses an above scheme can improve the not enough of reflow soldering in-process technique, when the solder melts, because the effect of two anchor clamps medium plates in the anchor clamps subassembly, can the fixed solder shape.
Description
Technical Field
The utility model relates to a signal transmission line technical field, in particular to novel coplane waveguide transmission line
Background
In the aspect of processing the connection problem of the radio frequency coaxial connector and the coplanar waveguide transmission line, the most common scheme at present is direct soldering tin connection, and an electric soldering iron is directly used for melting a tin wire to achieve the effect of electrically connecting the coaxial connector and the coplanar waveguide transmission line, but the direct soldering tin connection has the problems that the soldering quality is determined by manual experience, the consistency of the welding shape of the connection part cannot be ensured, the consistency of impedance characteristics caused by welding cannot be ensured, and metal smoke generated in the welding process is harmful to a human body.
With the improvement of the technology, the reflow soldering technology appears, which is characterized in that solder paste is coated on a joint, and a reflow soldering machine is controlled to carry out gradient temperature change of firstly heating and then cooling so that the solder paste is firstly melted and then solidified to realize the purpose of soldering. However, this technique has problems in that:
the solder is in a liquid state after melting, so that the drift phenomenon is easy to occur, and the solder is easy to drop on a vertical plane so that the shape of a welding point cannot be controlled. And with the increase of the requirement on the transmission rate, the working frequency of the device also increases, and the width of the transmission line is even narrower than the diameter of the probe, thereby bringing greater difficulty to the fixation of the solder in the reflow soldering technology.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a aim at providing a coplane waveguide transmission line to there is the technical problem that the solder flows easily after fixed difficulty, the solder liquefaction in the joint when solving prior art and welding coplanar waveguide transmission line.
Therefore, the utility model provides a coplanar waveguide transmission line, including coplanar waveguide dielectric slab and anchor clamps subassembly, wherein:
the surface of the coplanar waveguide dielectric slab is provided with a first lead, a second lead and a third lead, the second lead is arranged in the middle of the coplanar waveguide dielectric slab along the transmission direction, and the first lead and the third lead are arranged in parallel with the second lead and symmetrically distributed on two sides of the second lead;
the clamp assembly comprises a first clamp dielectric plate and a second clamp dielectric plate which are arranged on two sides of the coplanar waveguide dielectric plate along the transmission direction, and a gap between the first clamp dielectric plate and the second clamp dielectric plate is suitable for placing a joint component to be welded; the first clamp dielectric plate and the second clamp dielectric plate are insulating.
Optionally, in the coplanar waveguide transmission line, inner surfaces of the first clamp dielectric plate and the second clamp dielectric plate are both flat plate structures, and the inner surface is a surface facing the second wire.
Optionally, in the coplanar waveguide transmission line, the first clamp dielectric slab and the second clamp dielectric slab have the same rectangular frustum pyramid structure.
Optionally, in the coplanar waveguide transmission line, edges of inner surfaces of the first clamp dielectric plate and the second clamp dielectric plate respectively coincide with two edges of the second wire.
Optionally, in the coplanar waveguide transmission line, the first clamp dielectric plate is attached to the first conductor through an insulating sealant;
and the second clamp dielectric plate is adhered to the third conducting wire through an insulating sealant.
Optionally, in the coplanar waveguide transmission line, the first clamp dielectric slab, the second clamp dielectric slab and the coplanar waveguide dielectric slab are in an integrally formed structure.
Optionally, in the coplanar waveguide transmission line, the lengths of the first clamp dielectric plate and the second clamp dielectric plate are smaller than the length of the coplanar waveguide dielectric plate.
Optionally, in the coplanar waveguide transmission line, the first end of the first clamp dielectric plate and the first end of the second clamp dielectric plate are coplanar with the first end of the coplanar waveguide dielectric plate, where the first end is a starting end along a transmission direction.
Optionally, in the coplanar waveguide transmission line, outer surfaces of the first clamp dielectric plate and the second clamp dielectric plate are coplanar with an outer wall of the coplanar waveguide dielectric plate, where the outer surface is a surface facing away from the second wire.
The utility model provides an above technical scheme compares with prior art, has following beneficial effect at least:
the utility model provides a coplanar waveguide transmission line, including coplanar waveguide dielectric slab and anchor clamps subassembly, wherein: the surface of the coplanar waveguide dielectric slab is provided with a first lead, a second lead and a third lead, the second lead is arranged in the middle of the coplanar waveguide dielectric slab along the transmission direction, and the first lead, the third lead and the second lead are arranged in parallel and symmetrically distributed on two sides of the second lead; the clamp assembly comprises a first clamp dielectric plate and a second clamp dielectric plate which are arranged on two sides of the coplanar waveguide dielectric plate along the transmission direction, and a gap between the first clamp dielectric plate and the second clamp dielectric plate is suitable for placing a joint part to be welded; the first clamp dielectric plate and the second clamp dielectric plate are insulating.
The technical defects in the reflow soldering process can be improved by the scheme, when the solder melts, the shape of the solder can be fixed due to the action of the two clamp medium plates in the clamp assembly, so that the solder cannot overflow to influence the electrical property or even short circuit, the operation is greatly simplified, and the welding fixture has great practicability particularly under the condition that a second lead is smaller than a lead of a joint component to be welded; meanwhile, aiming at the problem of reflow soldering drift of the small module, the scheme can also provide positioning for the small module, has simple structure and can be realized by directly arranging the clamp component on the existing coplanar waveguide transmission line.
Drawings
Fig. 1 is a schematic view of an overall structure of a coplanar waveguide transmission line according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a coplanar waveguide transmission line assembled with a joint component to be soldered according to an embodiment of the present invention.
Wherein, the meaning of each reference numeral in the above figures is respectively:
100-coplanar waveguide dielectric slab, 101-first wire, 102-second wire;
103-a third wire; 201-a first clamp dielectric slab, 202-a second clamp dielectric slab;
300-parts to be welded, 301-joint parts.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or component to which the reference is made must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the following embodiments of the present invention may be combined according to actual needs as long as the solutions do not conflict with each other.
The present embodiment provides a coplanar waveguide transmission line, as shown in fig. 1, comprising a coplanar waveguide dielectric slab 100 and a jig assembly, wherein:
a first wire 101, a second wire 102 and a third wire 103 are arranged on the surface of the coplanar waveguide dielectric slab 100, the second wire 102 is arranged in the middle of the coplanar waveguide dielectric slab 100 along the transmission direction, and the first wire 101 and the third wire 103 are arranged in parallel with the second wire 102 and symmetrically distributed on two sides of the second wire 102; the clamp assembly comprises a first clamp dielectric plate 201 and a second clamp dielectric plate 202 which are arranged on two sides of the coplanar waveguide dielectric plate 100 along the transmission direction, and a gap between the first clamp dielectric plate 201 and the second clamp dielectric plate 202 is suitable for placing a joint component to be welded; wherein the first jig dielectric plate 201 and the second jig dielectric plate 202 have an insulating property.
In the above scheme, the first clamp dielectric plate 201 and the second clamp dielectric plate 202 may be prepared by selecting the same material as that of the coplanar waveguide dielectric plate 100, so that only the first conducting wire 101, the second conducting wire 102 and the third conducting wire 103 in the device can realize the conductive performance, and the rest is made of an insulating material. Referring to fig. 2, the joint member 301 of the component 300 to be welded may be directly placed in the gap defined by the first jig medium plate 201 and the second jig medium plate 202, and then the solder is provided, and when the solder is soldered by the reflow soldering technique, even if the solder melts into a liquid state, the solder is confined by the first jig medium plate 201 and the second jig medium plate 202 and does not overflow, and the second conductive wire 102 is located in the middle portion of the space defined by the first jig medium plate 201 and the second jig medium plate 202, and the joint member 301 to be welded is inevitably soldered to the second conductive wire 102 via the solder, and connects the two. In addition, because the first clamp dielectric plate 201 and the second clamp dielectric plate 202 are used as fixing parts of the devices in the scheme, the whole mass production can be realized during production, the first clamp dielectric plate 201 and the second clamp dielectric plate 202 in different devices have the same structure and size, and the specific shape and structure of the solder defined by the first clamp dielectric plate 201 and the second clamp dielectric plate 202 can be ensured to have good consistency, so that the conductivity of each device after welding has good consistency.
In the above solution, the inner surfaces of the first clamp dielectric plate 201 and the second clamp dielectric plate 202 are both flat plate structures, and the inner surface is a surface facing the second lead wire 102. The shape of the solder can be further limited by the flat inner surface, and the solder is more suitable for placing various shapes of connector parts, so that the device has good universality. Preferably, the first fixture dielectric slab 201 and the second fixture dielectric slab 202 are of the same rectangular frustum structure. The quadrangular frustum structure can be more conveniently disposed on the coplanar waveguide dielectric slab 100.
In the above solution, preferably, edges of the inner surfaces of the first jig dielectric plate 201 and the second jig dielectric plate 202 respectively coincide with two edges of the second conductive wire 102. In order to avoid the situation that the solder flows between the first jig dielectric plate 201 and the second jig dielectric plate 202 after melting into liquid and causes unnecessary short circuit due to contact with the first lead wire 101 or the third lead wire 103, the edges of the inner surfaces of the first jig dielectric plate 201 and the second jig dielectric plate 202 are limited to be just overlapped with the two edges of the second lead wire 102, and the solder is ensured to be only electrically connected with the second lead wire 102 and not to be in contact with the first lead wire 101 and the third lead wire 103. Moreover, the amount of the used solder can be ensured to be less in the scheme, and the material saving effect is realized.
As mentioned above, in the above solution, the first clamp dielectric plate 201 and the second clamp dielectric plate 202 are made of insulating materials and can be conveniently fixed on the coplanar waveguide dielectric plate 100, and the solution can be implemented in the following two manners:
the first method is as follows: the first clamp dielectric plate 201 is adhered to the first lead 101 through an insulating sealant; the second clamp dielectric plate 202 is adhered to the third conductive wire 103 by an insulating sealant. The first lead wire 101 is covered by the first jig dielectric plate 201 in width, and the third lead wire 103 is covered by the second jig dielectric plate 202 in width.
The second method comprises the following steps: the first clamp dielectric plate 201 and the second clamp dielectric plate 202 are integrally formed with the coplanar waveguide dielectric plate 100. As mentioned above, the first clamp dielectric plate 201 and the second clamp dielectric plate 202 may be made of the same material as that of the coplanar waveguide dielectric plate 100, and in practical application, a mold may be directly designed to implement the above three parts integrally.
Further, in the above scheme, as shown in fig. 1 and fig. 2, the lengths of the first jig dielectric plate 201 and the second jig dielectric plate 202 are smaller than the length of the coplanar waveguide dielectric plate 100. In fact, the lengths of the first jig medium plate 201 and the second jig medium plate 202 need only be longer than the length of the general joint member 301, and it is sufficient to ensure that a sufficient solder space is reserved to achieve that the joint member 301, the solder, and the second lead wire 102 are firmly soldered. On this basis, the lengths of the first clamp dielectric plate 201 and the second clamp dielectric plate 202 are made as short as possible, so that the using amount of solder can be reduced, and the resistance value of a welded device is prevented from being influenced by too much solder.
In addition, preferably, as shown in the figure, the first end of the first clamp dielectric plate 201 and the first end of the second clamp dielectric plate 202 are coplanar with the first end of the coplanar waveguide dielectric plate 100, wherein the first end refers to the beginning along the transmission direction. Further, the outer surfaces of the first clamp dielectric plate 201 and the second clamp dielectric plate 202 are coplanar with the outer wall of the coplanar waveguide dielectric plate 100, wherein the outer surface is a surface facing away from the second wire 102. The structure of the device can be more beautiful through the treatment, and the edge parts are smooth structures, so that the device is matched with other parts.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (9)
1. A coplanar waveguide transmission line comprising a coplanar waveguide dielectric slab and a clamp assembly, wherein:
the surface of the coplanar waveguide dielectric slab is provided with a first lead, a second lead and a third lead, the second lead is arranged in the middle of the coplanar waveguide dielectric slab along the transmission direction, and the first lead and the third lead are arranged in parallel with the second lead and symmetrically distributed on two sides of the second lead;
the clamp assembly comprises a first clamp dielectric plate and a second clamp dielectric plate which are arranged on two sides of the coplanar waveguide dielectric plate along the transmission direction, and a gap between the first clamp dielectric plate and the second clamp dielectric plate is suitable for placing a joint component to be welded; the first clamp dielectric plate and the second clamp dielectric plate are insulating.
2. Coplanar waveguide transmission line according to claim 1, characterized in that:
the inner surfaces of the first clamp dielectric plate and the second clamp dielectric plate are both flat plate structures, and the inner surface refers to one surface facing the second lead.
3. Coplanar waveguide transmission line according to claim 2, characterized in that:
the first clamp dielectric slab and the second clamp dielectric slab are of the same quadrangular frustum pyramid structure.
4. Coplanar waveguide transmission line according to any one of claims 1 to 3, characterized in that:
the edges of the inner surfaces of the first clamp dielectric slab and the second clamp dielectric slab are respectively superposed with the two edges of the second lead.
5. Coplanar waveguide transmission line according to claim 4, characterized in that:
the first clamp dielectric plate is adhered to the first conducting wire through insulating sealant;
and the second clamp dielectric plate is adhered to the third conducting wire through an insulating sealant.
6. Coplanar waveguide transmission line according to claim 4, characterized in that:
the first clamp dielectric plate, the second dielectric plate and the coplanar waveguide dielectric plate are of an integrally formed structure.
7. Coplanar waveguide transmission line according to any one of claims 1 to 3, characterized in that:
the lengths of the first clamp dielectric plate and the second clamp dielectric plate are smaller than that of the coplanar waveguide dielectric plate.
8. Coplanar waveguide transmission line according to claim 7, characterized in that:
the first end of the first clamp dielectric plate and the first end of the second clamp dielectric plate are coplanar with the first end of the coplanar waveguide dielectric plate, wherein the first end is the starting end along the transmission direction.
9. Coplanar waveguide transmission line according to claim 8, characterized in that:
and the outer surfaces of the first clamp dielectric slab and the second clamp dielectric slab are coplanar with the outer wall of the coplanar waveguide dielectric slab, wherein the outer surface is a surface back to the second lead.
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CN201921979336.1U CN210866441U (en) | 2019-11-15 | 2019-11-15 | Coplanar waveguide transmission line |
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CN201921979336.1U CN210866441U (en) | 2019-11-15 | 2019-11-15 | Coplanar waveguide transmission line |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113745785A (en) * | 2021-09-17 | 2021-12-03 | 上海交通大学 | Back-to-back transition structure from coplanar waveguide to dielectric waveguide |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113745785A (en) * | 2021-09-17 | 2021-12-03 | 上海交通大学 | Back-to-back transition structure from coplanar waveguide to dielectric waveguide |
CN113745785B (en) * | 2021-09-17 | 2022-04-15 | 上海交通大学 | Back-to-back transition structure from coplanar waveguide to dielectric waveguide |
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