CN107660085B

CN107660085B - Circuit board assembly and manufacturing method thereof, circuit board jointed board and mobile terminal

Info

Publication number: CN107660085B
Application number: CN201710844200.9A
Authority: CN
Inventors: 王聪; 谷一平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-09-18
Filing date: 2017-09-18
Publication date: 2020-03-31
Anticipated expiration: 2037-09-18
Also published as: CN107660085A

Abstract

The application provides a manufacturing method of a circuit board assembly, a circuit board spliced plate, the circuit board assembly and a mobile terminal. The manufacturing method comprises the steps of providing a circuit board jointed board, wherein the circuit board jointed board comprises a circuit board and a limiting plate connected to the circuit board, and the circuit board is provided with a bonding pad; applying solder to the pad; pasting the surface mount device on the bonding pad; the circuit board jointed board with the surface mounted device is subjected to overheating treatment, the surface mounted device is electrically connected with the circuit board jointed board through solder, and the limiting plate is used for limiting the movement of the surface mounted device on the plane of the circuit board; and removing the limiting plate to obtain the circuit board assembly. This application can be accurate restriction paster components and parts's position, is showing the welding precision who improves paster components and parts.

Description

Circuit board assembly and manufacturing method thereof, circuit board jointed board and mobile terminal

Technical Field

The present disclosure relates to the field of circuit board assembly technologies, and in particular, to a method for manufacturing a circuit board assembly, a circuit board splice, a circuit board assembly, and a mobile terminal.

Background

At present, when the chip component is welded automatically, the position of the chip component is not limited, so the chip component can move in the automatic welding process, the position deviates, and when the chip component needs to be accurately matched with other chip components, the change of the position can cause poor contact of a product, and the normal use of the product is seriously influenced.

Disclosure of Invention

The application provides a manufacturing method of a circuit board assembly, which comprises the steps of providing a circuit board jointed board, wherein the circuit board jointed board comprises a circuit board and a limiting plate connected to the circuit board, and the circuit board is provided with a bonding pad; applying solder to the pad; pasting the surface mount device on the bonding pad; the circuit board jointed board with the surface mounted device is subjected to overheating treatment, the surface mounted device is electrically connected with the circuit board jointed board through solder, and the limiting plate is used for limiting the movement of the surface mounted device on the plane of the circuit board; and removing the limiting plate to obtain the circuit board assembly.

The application also provides a circuit board jointed board, which comprises a circuit board and a limiting plate connected with the circuit board; the circuit board is provided with a bonding pad, the bonding pad is used for installing a chip component, and the limiting plate is used for limiting the movement of the chip component connected with the bonding pad in a matching mode on the plane where the bonding pad is located.

The application also provides a circuit board assembly which comprises a circuit board and a patch component, wherein the circuit board is provided with a bonding pad, the patch component is inserted into the bonding pad and connected with the circuit board, and the circuit board assembly is manufactured by the manufacturing method.

The application also provides a mobile terminal which comprises the circuit board assembly.

This application circuit board makeup sets up the limiting plate, and on chip components pasted the pad, chip components and parts contacted with the limiting plate to limiting plate restriction chip components and parts are at the planar removal in pad place, under the prerequisite that does not additionally increase the cost, and the welding precision that improves chip components and parts is showing to the position of accurate restriction chip components and parts.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic flow chart diagram illustrating one embodiment of a method for manufacturing a circuit board assembly according to the present application;

FIG. 2 is a top view of one embodiment of a circuit board panel of the method embodiment of FIG. 1;

FIG. 3 is a top view of one embodiment of the circuit board panel and chip component assembly of the embodiment of the method of FIG. 1;

FIG. 4 is a cross-sectional view taken along the line A in FIG. 3;

FIG. 5 is a top view of one embodiment of a circuit board assembly of the method embodiment of FIG. 1;

FIG. 6 is a top view of another embodiment of circuit board panels of the method embodiment of FIG. 1;

FIG. 7 is a top view of another embodiment of the circuit board panel and chip component assembly of the embodiment of the method of FIG. 1;

FIG. 8 is a top view of another embodiment of a circuit board panel of the method embodiment of FIG. 1;

FIG. 9 is a top view of yet another embodiment of the circuit board panel and chip component assembly of the method embodiment of FIG. 1;

FIG. 10 is a top view of another embodiment of a circuit board panel of the method embodiment of FIG. 1;

FIG. 11 is a top view of another embodiment of the circuit board panel and chip component assembly of the embodiment of the method of FIG. 1;

FIG. 12 is a top view of yet another embodiment of a circuit board panel of the embodiment of the method of FIG. 1;

FIG. 13 is a top view of yet another embodiment of the circuit board panel and chip component assembly of the embodiment of the method of FIG. 1;

FIG. 14 is a top view of another embodiment of a circuit board panel of the method embodiment of FIG. 1;

FIG. 15 is a top view of yet another embodiment of the circuit board panel and chip component assembly of the method embodiment of FIG. 1;

fig. 16 is a block diagram of an embodiment of a mobile terminal according to the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The mobile terminal provided by the embodiment of the application comprises electronic equipment such as a smart phone, a tablet personal computer, intelligent wearable equipment, a digital audio and video player, an electronic reader, a handheld game machine and vehicle-mounted electronic equipment.

The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. Such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The factory can select the automatic welding of the machine when welding and installing a large number of patch components, for example: reflow soldering or wave soldering. However, in the process of automatically melting the welding material, the chip component can drift, so that the position of the chip component moves. This phenomenon can lead to three problems: 1, the phenomenon of poor contact with a bonding pad, namely empty welding, caused by dislocation between the chip component and the bonding pad; 2, the position of the chip component is deviated to generate unnecessary electrical contact with the adjacent electronic component, namely, short circuit or electromagnetic interference phenomenon; 3, the position of the chip component is deviated and the chip component cannot be normally assembled with other electronic devices, namely, the phenomenon of poor contact. In order to solve the above problems, the present application provides the following technical solutions.

Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a manufacturing method of a circuit board assembly according to an embodiment of the present application.

M101, a circuit board jointed board is provided, the circuit board jointed board comprises a circuit board and a limiting plate connected to the circuit board, and the circuit board is provided with a welding disc.

In order to reasonably utilize the material space of the board, different circuit boards or the same circuit board can be connected together through a connecting board during design, so that a circuit board spliced board is formed, and the circuit board spliced board is removed after the electronic components are installed, so that a circuit board assembly required by the mobile terminal assembly is obtained. The technical scheme of this application makes the limiting plate with the connecting plate, and circuit board and limiting plate act on electronic components jointly to reach the mesh of restriction electronic components position.

Referring to fig. 2, fig. 2 is a top view of an embodiment of a circuit board panel of the embodiment of the method of fig. 1. In the present embodiment, the circuit board assembly 10 includes a circuit board 12 and a limiting plate 14 connected to the circuit board 12, the circuit board 12 has a pad 122, the pad 122 is used for mounting a chip component (refer to the chip component 20 in fig. 3), and the limiting plate 14 is used for limiting the chip component connected to the pad 122 to move on a plane (refer to a plane 126 in fig. 4) where the pad 122 is located. Optionally, the limiting plate 14 includes a connecting portion 142 and a protruding portion 144, the connecting portion 142 is connected to the circuit board 12 and the protruding portion 144, and the protruding portion 144 is located on one side of the pad 122 for contacting a chip component that is connected to the pad 122 in a matching manner.

And M102, applying solder to the bonding pad.

The solder of this embodiment can be the tin cream, specifically, can utilize the tin cream mixer fully to the tin cream stirring, put the circuit board makeup under the steel mesh template, and aim at the corresponding hole of steel mesh template with the pad, then place the tin cream with the stirring and deviate from circuit board makeup one side at the steel mesh template, the scraper blade compresses tightly the steel mesh template downwards, use the scraper to scrape the tin cream, it is accurate to do not remain the tin cream after scraping the steel mesh with the scraper, the scraper angle can be controlled to 45 degrees, the pressure control of the scraper that uses is about 5kg, the scraper that uses is squeegee.

The solder paste is a medium for welding the electronic component and the circuit board, the form of the solder paste begins to change after the solder paste is heated to 183 ℃, the solder paste is changed from a paste form to a molten state at the moment, the solder paste in the molten state flows between the electronic component and the bonding pad, and the solder paste in the molten state becomes a solid body after the temperature of the solder paste is reduced, so that the electronic component is fixed, and the electronic component is electrically connected with the circuit board.

And M103, attaching the chip component to the bonding pad.

Referring to fig. 3 and 4, fig. 3 is a top view of one embodiment of the circuit board panel and chip component assembly of the embodiment of the method of fig. 1, and fig. 4 is a cross-sectional view taken along direction a of fig. 3.

The chip component 20 includes a main body portion 22 and pins 24, the main body portion 22 is connected to the pins 24, the chip component 20 is electrically connected to the circuit board 12 through the pins 24, and the main body portion 22 can be electrically connected to other electronic components or the circuit board to achieve functions such as turning on or off, and the like, for example, adjusting sound volume and turning on or off.

The circuit board 12 may be a single-layer circuit board or a multi-layer circuit board, the pad 122 may be in any shape such as a circle, a square, or a polygon, the pad 122 is provided with exposed copper 124, and the pin 24 of the chip component 20 is attached to the pad 122 and connected with the exposed copper 124 to generate electrical connection. The facing sides 222 of the main body portion 22 of the chip component 20 are in contact with the adjacent projections 144, and the main body portion 22 of the chip component 20 is entirely attached to the plane 126 on which the pads 122 are located or spaced apart from the plane 126.

And M104, performing overheating treatment on the circuit board spliced board on which the chip component is attached, and enabling the chip component to be electrically connected with the circuit board spliced board through solder, wherein the limiting plate is used for limiting the movement of the chip component on the plane where the bonding pad is located.

And (3) heating the circuit board jointed board 10 processed in the step M103, melting the solder paste by heating to enter a gap between the pin 24 of the chip component 20 and the exposed copper 124, and connecting and conducting the pin 24 of the chip component 20 and the exposed copper 124 arranged in the bonding pad 122 after cooling the solder paste.

In the melting process, since the solder paste is in a molten state, the chip component 20 may drift due to external force, such as wind blowing or shaking of the machine itself. However, since the opposing sides 222 of the main body 22 of the chip component 20 contact the bosses 144 of the stopper plate 14, the chip component 20 is not shifted on the plane 126 where the lands 122 are located by the restraining action of the bosses 144, and the opposing sides 222 of the main body 22 of the chip component 20 contact the bosses 144, friction is generated in the contact, and the friction force further prevents the chip component 20 from moving relative to the contact surface.

Optionally, the heating method is reflow soldering or wave soldering. Reflow soldering is to heat air or nitrogen to a high enough temperature and blow the heated air or nitrogen to the circuit board with electronic components attached, so that the solder on the two sides of the electronic components is melted and then is bonded with the circuit board. The process has the advantages of easy temperature control, no oxidation during welding and easy control of the manufacturing cost. Wave soldering refers to the soldering of soldering in which molten solder is jetted by an electric pump or an electromagnetic pump into a solder wave required by design, or nitrogen is injected into a solder pool, so that a circuit board with electronic components mounted in advance passes through the solder wave, and the mechanical and electrical connection between the soldering end or pin of the electronic component and the pad of the circuit board is realized.

And M105, removing the limiting plate to obtain the circuit board assembly.

Referring to fig. 5, fig. 5 is a top view of an embodiment of a circuit board assembly of the method embodiment of fig. 1. The board assembly 30 is obtained by removing the board 14, and the board assembly 30 includes a circuit board 12 and a chip component 20, and the chip component 20 is attached to a pad (not shown) of the circuit board 12 and connected to the circuit board 12. The removal may be by machining, such as CNC cutting or die cutting. The circuit board can be removed manually, a groove (not shown in the figure) can be arranged at the joint of the limiting plate 14 and the circuit board 12 in order to reduce the labor intensity of the manual operation, and the groove can effectively give force to the tip part concentrated on the groove, so that the groove can effectively avoid the phenomenon that the circuit board damages the structure of the circuit board 12 due to uneven manual force.

The circuit board jigsaw 10 of the embodiment is provided with the limiting plate 14, the pins 24 of the chip component 20 are attached to the bonding pads 122, and the two opposite sides 222 of the chip component 20 are in contact with the limiting plate 14, so that the limiting plate 14 limits the movement of the chip component 20 on the plane 126 where the bonding pads 122 are located, the position of the chip component 20 is accurately limited on the premise that the cost is not additionally increased, and the assembly accuracy of the chip component 20 and other electronic components is remarkably improved.

Further, in another embodiment of a method for manufacturing a circuit board assembly, please refer to fig. 6 and 7, in which fig. 6 is a top view of another embodiment of a circuit board panel in the embodiment of fig. 1, and fig. 7 is a top view of another embodiment of an assembly of the circuit board panel and a chip component in the embodiment of fig. 1. The circuit board jointed board 10a includes a circuit board 12 and a limiting board 14 connected to the circuit board 12, the circuit board 12 is provided with pads 122, the circuit board jointed board 10a of this embodiment is different from the circuit board jointed board 10 of the previous embodiment in that the number of the pads 122 is N and adjacent to each other, the corresponding number of chip components 20 are correspondingly attached, and N is greater than or equal to 2 and is an integer. The chip components 20 may be of the same type or different types, the chip components 20 of the same type may have different shapes at the contact positions of the chip components 20 and the protruding portions 144 due to different mounting positions, and the chip components 20 of different types may have different shapes at the contact positions of the chip components 20 and the protruding portions 144. The number of the protruding portions 144 is N +1, wherein two opposite sides 146 of N-1 protruding portions 144 are in contact with the chip component 20 at an adjacent position. Specifically, in the present embodiment, two pads 122 are used, two chip components 20 are correspondingly mounted, and the number of the corresponding protruding portions 144 is illustrated as three. One of the convex portions 144 of the position limiting plate 14 is located between two chip components 20, two opposite sides 146 of the convex portion 144 are in contact with the chip component 20 at the adjacent position, the other two convex portions are located at two sides of the two chip components 20, two opposite sides 222 of the main body portion 22 of the chip component 20 are in contact with the convex portion 144 at the adjacent position, the convex portion 144 limits the chip component 20 from moving on the plane where the bonding pad 122 is located, the shape of the convex portion 144 is determined according to the specific shape of the contact position where the chip component 20 is in contact with the convex portion 144, and the shape which can be used for limiting the contact position can be accepted, for example, a circular shape, an oval shape, a rectangular.

The beneficial effects of this embodiment are that, making full use of the opposite two sides 146 of part of the protruding portions 144 of the limiting plate 14, the chip components 20 can contact with the opposite two sides 146 of part of the protruding portions 144, and when the same number of chip components 20 need to be limited, the number of the protruding portions 144 of the limiting plate 14 can be reduced, and the space utilization rate of the circuit board splicing plate 10a can be increased.

Further, referring to fig. 8 and 9 in still another embodiment of a method for manufacturing a circuit board assembly, fig. 8 is a top view of a further embodiment of a circuit board panel in the embodiment of fig. 1, and fig. 9 is a top view of a further embodiment of an assembly of a circuit board panel and a chip component in the embodiment of fig. 1. The circuit board assembly 10b includes a circuit board 12 and a limiting plate 14 connected to the circuit board 12, the circuit board 12 has a plurality of pads 122, the pads 122 are disposed adjacent to each other, and a corresponding number of chip components 20 are correspondingly inserted into the pads, and the circuit board assembly 10b of this embodiment is different from the circuit board assembly 10 of the previous embodiment in that the connecting portion 142 contacts the main portion 22 of the chip component 20. The connection portion 142 and the protrusion portion 144 cooperate to limit the movement of the chip component 20 in the plane of the circuit board 12.

The beneficial effects of this embodiment are that, make full use of the connecting portion 142 of the limiting plate 14, the chip components 20 can contact with the connecting portion 142, and when the same number of chip components 20 need to be limited, the number of the protrusions 144 of the limiting plate 14 can be reduced, and the space utilization rate of the circuit board jointed board 10b can be increased.

Alternatively, in yet another embodiment of a method for manufacturing a circuit board assembly, please refer to fig. 10 and 11, fig. 10 is a top view of yet another embodiment of a circuit board panel in the embodiment of fig. 1, and fig. 11 is a top view of yet another embodiment of an assembly of a circuit board panel and a chip component in the embodiment of fig. 1. The circuit board assembly 10b includes a circuit board 12 and a limiting plate 14 connected to the circuit board 12, the circuit board 12 has a pad 122, and the circuit board assembly 10c of this embodiment is different from the circuit board assembly 10b of the previous embodiment in that a connecting portion is located between the chip components 20, and two opposite sides (not shown) of the connecting portion 142 are in contact with the main body 22 of the chip component 20 located adjacent to each other. The opposite sides of the connecting portion 142 and the protruding portion 144 together limit the movement of the chip component 20 on the plane of the circuit board 12.

The beneficial effects of this embodiment lie in, make full use of connecting portion 142 both sides in opposite directions of limiting plate 14, and connecting portion are located between chip components 20, and chip components 20 can contact with connecting portion 142 both sides in opposite directions, when the same quantity of chip components 20 need spacing, can reduce the bellying 144 quantity of limiting plate 14, increase the space utilization of circuit board makeup 10 c. In addition, because the connecting portion 142 is located between the chip components 20 and the position is closer to the middle, the overall structure of the circuit board imposition 10c is more uniform, and the overall stability is significantly improved.

In the above embodiment, the stopper plate includes the connecting portion and the protruding portion. In some embodiments, the limiting plate does not include the connecting portion and the protruding portion, and the limiting plate directly contacts with the main body portion of the chip component and cooperates with the pad to limit the movement of the chip component on the plane of the circuit board.

Optionally, in yet another embodiment of a method for manufacturing a circuit board assembly, please refer to fig. 12 and 13, fig. 12 is a top view of yet another embodiment of a circuit board panel in the embodiment of the method of fig. 1, and fig. 13 is a top view of yet another embodiment of an assembly of a circuit board panel and a chip component in the embodiment of the method of fig. 1. The circuit board assembly 10d includes a circuit board 12 and a plurality of limiting plates 14 connected to the circuit board 12, the circuit board 12 has a plurality of pads 122, the circuit boards 12 may have the same structure or different structures, the structure and number of the actual circuit boards 12 are determined according to actual production requirements and utilization efficiency of the boards, and the limiting plates 14 are located between the circuit boards 12 to connect the circuit boards 12. The chip component 20 includes a main body 22 and leads (not shown), the main body 22 is connected to the leads, and the leads are mounted on the pads 122. The facing sides of the body portion 22 of the chip component 20 contact the adjacent ones of the stopper plates 14 to restrict movement of the chip component 20 in the plane of the land 122.

The beneficial effect of this embodiment is that the limiting plate 14 not only serves the purpose of limiting the movement of the chip component 20 on the plane where the bonding pad 122 is located, but also can be connected to each circuit board 12, so that the structure of the whole circuit board makeup 10d is more stable and firm.

Further, referring to fig. 14 and 15, in yet another embodiment of a method for manufacturing a circuit board assembly, fig. 14 is a top view of yet another embodiment of a circuit board panel in the embodiment of the method of fig. 1, and fig. 15 is a top view of yet another embodiment of an assembly of a circuit board panel and a chip component in the embodiment of the method of fig. 1. The circuit board jointed board 10e includes a circuit board 12 and a limiting board 14 connected to the circuit board 12, the circuit board 12 is provided with pads 122, the circuit board jointed board 10e of the present embodiment is different from the circuit board jointed board 10d of the previous embodiment in that the number of the pads 122 is N and adjacent to each other, the corresponding number of chip components 20 are correspondingly mounted, and N is greater than or equal to 2 and is an integer. The number of the limiting plates 14 is N +1, wherein two opposite sides of N-1 limiting plates 14 are in contact with the chip components 20 at adjacent positions. Specifically, in the present embodiment, two pads 122 are used, two chip components 20 are correspondingly mounted, and the number of the corresponding limiting plates 14 is illustrated as three. One of the limiting plates 14 is located between two chip components 20, two opposite sides 148 of the limiting plate 14 are in contact with the chip components 20 in the adjacent positions, the other two limiting plates are located on two sides of the chip components 20, two opposite sides of the main body portion 22 of the chip component 20 are in contact with the limiting plate 14 in the adjacent position, the limiting plate 14 limits the movement of the chip components 20 on the plane where the bonding pads 122 are located, the shape of the limiting plate 14 is determined according to the specific shape of the contact position of the chip components 20 and the limiting plate 14, and the shape of the limiting plate 14 can be accepted as long as the shape plays a role of limiting contact, such as a circular shape, an oval.

The beneficial effects of this embodiment lie in, make full use of the both sides in opposite directions of limiting plate 14, chip components 20 can contact with the both sides in opposite directions of some limiting plates 14, when needing spacing the same quantity of chip components 20, can reduce the quantity of limiting plate 14, increase the space utilization of circuit board makeup 10 e.

In the above embodiments, various types of circuit board panels have been proposed.

Referring to fig. 2, the circuit board assembly 10 includes a circuit board 12 and a position-limiting plate 14 connected to the circuit board 12. The circuit board 12 has a pad 122, the pad 122 is used for mounting a chip component (see the chip component 20 in fig. 3), and the limiting plate 14 is used for limiting the movement of the chip component connected to the pad 122 in a plane where the pad 122 is located.

Optionally, the limiting plate 14 of the circuit board panel 10 includes a connecting portion 142 and a protruding portion 144, the connecting portion 142 is connected to the circuit board 12 and the protruding portion 144, and the protruding portion 144 at an adjacent position is used for contacting two opposite sides of the chip component connected to the pad 122 in a matching manner, so as to limit the movement of the chip component on the plane where the pad 122 is located.

Further, referring to fig. 6, the number of the pads 122 of the circuit board jointed board 10a is N and the pads are adjacently disposed, and the number of the protrusions 144 is N +1, wherein two opposite sides of N-1 protrusions 144 are used for contacting with the chip components at adjacent positions connected with the pads 122 in a matching manner, and N is greater than or equal to 2 and is an integer.

Further, referring to fig. 8, the connecting portion 142 of the circuit board panel 10b is used for contacting the chip component connected to the pad 122.

Further, referring to fig. 10, the connecting portions 142 of the circuit board panels 10c are located between the pads 122, and opposite sides of the connecting portions 142 are used for contacting the chip components at adjacent positions in matching connection with the pads 122.

Optionally, referring to fig. 12, the circuit boards 12 of the circuit board assembly board 10d are multiple, and the limiting plates 14 at adjacent positions are used for limiting the opposite sides of the chip components connected in a matching manner with the pads 122 to contact, so as to limit the movement of the chip components connected in a matching manner with the pads 122 on the plane where the pads 122 are located.

Further, referring to fig. 14, the number of the pads 122 of the circuit board jointed board 10e is N and the adjacent pads are arranged adjacently, and the number of the limiting plates 14 is N +1, wherein two opposite sides of N-1 limiting plates 14 are used for contacting with the chip components at the adjacent positions connected with the pads 122 in a matching manner, and N is greater than or equal to 2 and is an integer.

Referring to fig. 5, the present application provides an embodiment of a circuit board assembly, the circuit board assembly 30 is manufactured by processing the

circuit board panels

10, 10a, 10b, 10c, 10d, or 10e by the above-mentioned manufacturing method of the circuit board assembly to obtain the circuit board assembly 30 shown in fig. 5. Circuit board assembly 30 includes circuit board 12 and chip component 20, where circuit board 12 is provided with pads (not shown) and chip component 20 is inserted into the pads to connect with circuit board 12.

Referring to fig. 16, the present application provides an embodiment of a mobile terminal, where the mobile terminal includes the above-mentioned circuit board assembly 30, a mobile phone screen assembly 40 and a rear case 50, the mobile phone screen assembly 40 and the rear case 50 are connected to form a sealed space, and the circuit board assembly 30 is accommodated in the sealed space and electrically connected to a circuit main board (not shown) or other electronic components (not shown) in the mobile terminal, so that the mobile terminal can implement different functions.

The above description is only for the purpose of illustrating embodiments of the present invention and is not intended to limit the scope of the present invention, and all modifications, equivalents, and equivalent structures or equivalent processes that can be used directly or indirectly in other related fields of technology shall be encompassed by the present invention.

Claims

1. A method of making a circuit board assembly, comprising:

providing a circuit board jointed board, wherein the circuit board jointed board comprises a circuit board and a limiting plate connected to the circuit board, a groove is formed at the joint of the limiting plate and the circuit board, the circuit board is provided with a bonding pad, the limiting plate comprises a connecting part and a protruding part, and the connecting part is respectively connected with the circuit board and the protruding part;

applying solder to the pad;

pasting a chip component on the bonding pad, wherein two opposite sides of the chip component are in contact with the limiting plate;

the circuit board jointed board on which the chip component is stuck is subjected to overheating treatment, the solder enables the chip component to be electrically connected with the circuit board jointed board, and the limiting plate is used for limiting the movement of the chip component on the plane where the bonding pad is located;

removing the limiting plate to obtain the circuit board assembly;

wherein the connecting portion is in contact with the patch component.

2. The method of manufacturing according to claim 1,

the connecting portion are located between the patch components, and two opposite sides of the connecting portion are in contact with the patch components at adjacent positions.

3. The method of manufacturing according to claim 1, comprising:

the solder is solder paste, and the overheating treatment is reflow soldering.

4. A circuit board panel, comprising:

the circuit board comprises a circuit board and a limiting plate connected to the circuit board;

the circuit board is provided with a bonding pad, the bonding pad is used for mounting a chip component, the limiting plate is used for limiting the movement of the chip component which is connected with the bonding pad in a matched manner on the plane where the bonding pad is located, and a groove is formed in the connection position of the limiting plate and the circuit board;

wherein, the limiting plate includes connecting portion and bellying, connecting portion respectively with the circuit board with the bellying is connected, connecting portion be used for with the pad cooperation is connected the paster components and parts contact, adjacent position the bellying be used for with the pad cooperation is connected paster components and parts's both sides contact in opposite directions, in order to restrict paster components and parts are in the planar removal in pad place.

5. Circuit board panel according to claim 4,

the connecting parts are located between the bonding pads, and two opposite sides of the connecting parts are used for contacting the chip components at adjacent positions where the bonding pads are connected in a matched mode.

6. A circuit board assembly, comprising:

a circuit board provided with a pad;

the chip component is attached to the bonding pad and connected with the circuit board;

wherein the circuit board assembly is made by the method of manufacture of any one of claims 1 to 3.

7. A mobile terminal, comprising:

the circuit board assembly of claim 6.