CN203057706U - Solder paste coating device for metal substrate - Google Patents
Solder paste coating device for metal substrate Download PDFInfo
- Publication number
- CN203057706U CN203057706U CN 201220690565 CN201220690565U CN203057706U CN 203057706 U CN203057706 U CN 203057706U CN 201220690565 CN201220690565 CN 201220690565 CN 201220690565 U CN201220690565 U CN 201220690565U CN 203057706 U CN203057706 U CN 203057706U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- tin cream
- solder paste
- tin
- transmission plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a solder paste coating device for a metal substrate, comprising a tray clamp and a solder paste transferring plate. An installation groove for placing the metal substrate is opened in the tray clamp; the solder paste transferring plate is mutually buckled with the tray clamp so that the metal substrate is clamped between the tray clamp and the solder paste transferring plate; and multiple transferring holes for coating solder paste onto the metal substrate are opened in the solder paste transferring plate. The solder paste coating device for the metal substrate can uniformly distribute the solder paste onto the metal substrate so that soldering intensity of a printed circuit board and the metal substrate which are soldered together is uniform and stable; and melted solder paste does not overflow from the periphery of the printed circuit board or flow into portions needless of solder paste soldering, thereby avoiding short circuit of pins of electronic components after soldering, and eventually protecting the whole printed circuit board.
Description
[technical field]
The utility model relates to and a kind ofly printed circuit board (PCB) is being welded to the Metal Substrate scrubbing brush tin device that uses in the technology of metal substrate, is used for tin cream is uniformly coated on metal substrate.
[background technology]
In printed circuit board (PCB) manufacturing technology field, for thereby the ground connection property that satisfies high-power printed circuit board (PCB), the heat dispersion that improves module guarantee the requirement that the long-term reliability of module moves, usually fix a certain thickness in the bottom of printed circuit board (PCB), area, the metal substrate that shape is identical with printed circuit board (PCB) can be worked under specified safe working temperature with components and parts and high performance components on assurance circuit board itself, the plate.
In order to satisfy the radiating requirements of high-power components, offer window for high-power components usually on printed circuit board (PCB) simultaneously, high-power components can pass window and directly be welded on the metal substrate.This structure is except having good heat-sinking capability, and power amplifier and printed circuit board (PCB) and metal substrate one-body molded improves homogeneity of product, and the microstrip circuit loss reduces, and the power amplifier performance improves.
The integrated welding procedure of printed circuit board (PCB) generally includes following steps:
Printed circuit board (PCB) is carried out the SMT paster; Brush tin in metallic substrate surfaces, and brush tin at the solder side of power amplifier; With the metal substrate pressing behind the printed circuit board (PCB) behind the paster and the brush tin; The power amplifier of brush behind the tin passed the window on the printed circuit board (PCB) and be affixed on the metal substrate; Place reflow ovens to heat above-mentioned parts, make tin cream fusing back cool off, and then printed circuit board (PCB) and metal substrate are welded mutually, and power amplifier is welded on the metal substrate.
In the prior art, utilize usually roller directly with tin cream large tracts of land scrubbing brush on metal substrate.This Metal Substrate scrubbing brush process of tin that is undertaken by roller causes the skewness of tin cream on metal substrate easily, and very thick such as the position possibility tin cream that has on the metal substrate, then the possibility tin cream is very thin at the position that has.Cause the printed circuit board (PCB) that welds together and the weld strength inequality between the metal substrate like this.
In addition, another serious consequence that the tin cream skewness causes is: after through the reflow ovens welding, the flowability of tin cream can make unnecessary tin cream overflow or flow into some and do not need to brush the position that soldering connects around printed circuit board (PCB), thereby cause the pin short circuit of the electronic devices and components after the welding, finally cause the monoblock printed circuit board (PCB) to be scrapped because of the pin short circuit of electronic devices and components.
Therefore, be necessary to provide a kind of improved Metal Substrate scrubbing brush tin device, in order to overcome the shortcoming and deficiency of above-mentioned prior art.
[utility model content]
The purpose of this utility model is to provide a kind of Metal Substrate scrubbing brush tin device, and it can realize that tin cream is evenly distributed on the metal substrate, thereby makes that the printed circuit board (PCB) and the weld strength between the metal substrate that weld together are even, stable; And tin cream when fusing can not overflowed or flow into some around the printed circuit board (PCB) not to be needed to brush the position that soldering connects, and then has avoided the phenomenon of the electronic devices and components generation pin short circuit after the welding, has finally protected the monoblock printed circuit board (PCB).
For realizing this purpose, the utility model adopts following technical scheme:
A kind of Metal Substrate scrubbing brush tin device comprises: pallet grippers, offer on it for the mounting groove of placing metal substrate; And the tin cream transmission plate, itself and described pallet grippers fasten mutually, in order to described metal substrate is clamped between described pallet grippers and the described tin cream transmission plate, offer a plurality of for the transfer hole that tin cream is applied on the described metal substrate on the described tin cream transmission plate.
Compared with prior art, the utility model possesses following advantage: owing to offer a plurality of transfer holes with certain pore size and spaced-apart certain distance in the tin cream transmission plate, therefore tin cream can be delivered on the metal substrate by these transfer holes, thereby form the equally distributed tin cream of point-like at metal substrate, when placing reflow ovens to heat with printed circuit board (PCB) and the mutual pressing of metal substrate and with both, the soldering of molten condition connects material can slowly flow to position, space between adjacent two tin creams, make soldering connect material thickness and be covered with whole printed circuit board (PCB) equably, thereby guarantee that the printed circuit board (PCB) and the weld strength between the metal substrate that weld together are even, stable; And equally distributed soldering connects material and can not overflow or flow into some and do not need to brush the position that soldering connects around printed circuit board (PCB), and then avoided the phenomenon of the electronic devices and components generation pin short circuit after the welding, finally protected the monoblock printed circuit board (PCB).
[description of drawings]
Fig. 1 has showed the structure chart of pallet grippers of the Metal Substrate scrubbing brush tin device of an embodiment of the utility model;
Fig. 2 has showed the structure chart of tin cream transmission plate of the Metal Substrate scrubbing brush tin device of an embodiment of the utility model;
Fig. 3 has showed need be with the structure chart of tin cream coating metal substrate thereon; And
Fig. 4 has showed the sectional structure chart after the assembling of the pallet grippers shown in Fig. 1-2 and tin cream transmission plate, has showed the metal substrate that is clamped between pallet grippers and the tin cream transmission plate simultaneously, and to the state of Metal Substrate scrubbing brush tin.
[embodiment]
The Metal Substrate scrubbing brush tin device that the utility model provides is used for equably tin cream being coated on metal substrate, so as can to allow the printed circuit board (PCB) that welds together and the weld strength between the metal substrate evenly, stable; And avoid in welding process tin cream to overflow around the printed circuit board (PCB) or flow into the position that some do not need to brush tin, and then avoided the phenomenon of the electronic devices and components generation pin short circuit after the welding, finally protected the monoblock printed circuit board (PCB).
Be described below with reference to structure and the operation principle of accompanying drawing to Metal Substrate scrubbing brush tin device.
With reference to figure 1-4, according to an embodiment of the present utility model, a kind of Metal Substrate scrubbing brush tin device 100 comprises pallet grippers 10.The top of described pallet grippers 10 offers mounting groove 12, in metal substrate 30 (with reference to figure 3) is placed on.In addition, when brushing the tin operation, described pallet grippers 10 plays support metal substrate 30 on the one hand and tin cream transmission plate 20 is positioned, and guarantees that on the other hand printed circuit board (PCB) is pressed together on the metal substrate 20 equably.
Metal Substrate scrubbing brush tin device 100 further comprises the tin cream transmission plate 20 that fastens mutually with described pallet grippers 10.Offer a plurality of transfer holes 22 on the described tin cream transmission plate 20, be used for via these transfer holes 22 tin cream being delivered to metal substrate 30 surfaces of needs brush tin.
Metal substrate 30 is placed in the described pallet grippers 10, and is clamped between pallet grippers 10 and the tin cream transmission plate 20, and the solder side of described metal substrate is away from the top of described pallet grippers.
Step to metal substrate 30 brush tin is described below.
At first metal substrate 30 is placed on the pallet grippers 10; Then tin cream transmission plate 20 is positioned on the pallet grippers 10, and guarantees the solder side of the base abuts metal substrate 30 of tin cream transmission plate 20; Next tin cream 40 is brushed on tin cream transmission plate 20 such as scraper by suitable instrument, this process need brush tin dynamics is even, with the full tin cream of transfer hole 22 brushes on the tin cream transmission plate 20; Take off tin cream transmission plate 20 from pallet grippers 10 at last, thereby form the equally distributed circular tin cream 40 of one deck at the upper surface of metal substrate 30.
The area of described metal substrate 30 is consistent with the area of printed circuit board.In addition, with respect to traditional module base, this metal substrate 30 has following characteristics:
1, therefore the solder side of metal substrate 30 has good solderability and ground connection property through copper facing and silver-plated processing; And
2, the flatness of metal substrate 30 is less than 0.2mm, and fineness is less than 1.6 μ m.
The aperture of the transfer hole 22 on the described tin cream transmission plate 20 and the selection of pitch of holes are determined according to actual conditions.Preferably, the diameter of the transfer hole 22 of described tin cream transmission plate 20 is 3mm, and has a determining deviation between adjacent two transfer holes 22.
The thickness of tin cream transmission plate 20 is directly related with the required tin cream consumption of welding, selects thinner tin cream transmission plate 20 to realize according to opening diameter and pitch of holes here.The preferred thickness of described tin cream transmission plate 20 is 0.15mm.
After the good printed circuit board (PCB) of paster and metal substrate are fastened to each other by anchor clamps, when in reflow ovens, heating, the tin cream of fusion is to flowing all around, join with other circular tin creams of periphery, thereby join together, form one deck evenly and be covered with the tin cream of whole printed circuit board, the disposable welding of finishing like this, the production efficiency height, circuit board high conformity, reliability height.
Generally, the utility model provides a kind of Metal Substrate scrubbing brush tin device, comprising: pallet grippers, offer on it for the mounting groove of placing metal substrate; And the tin cream transmission plate, itself and described pallet grippers fasten mutually, in order to described metal substrate is clamped between described pallet grippers and the described tin cream transmission plate, offer a plurality of for the transfer hole that tin cream is applied on the described metal substrate on the described tin cream transmission plate.
Compared with prior art, the utility model possesses following advantage: owing to offer a plurality of transfer holes with certain pore size and spaced-apart certain distance in the tin cream transmission plate, therefore tin cream can be delivered on the metal substrate by these transfer holes, thereby form the equally distributed tin cream of point-like at metal substrate, when placing reflow ovens to heat with printed circuit board (PCB) and the mutual pressing of metal substrate and with both, the soldering of molten condition connects material can slowly flow to position, space between adjacent two tin creams, make soldering connect material thickness and be covered with whole printed circuit board (PCB) equably, thereby guarantee that the printed circuit board (PCB) and the weld strength between the metal substrate that weld together are even, stable; And equally distributed soldering connects material and can not overflow or flow into some and do not need to brush the position that soldering connects around printed circuit board (PCB), and then avoided the phenomenon of the electronic devices and components generation pin short circuit after the welding, finally protected the monoblock printed circuit board (PCB).
Preferably, in order to realize the accurate location between pallet grippers 10 and the tin cream transmission plate 20, can reference column 14 be set in pallet grippers 10, and offer the location hole 24 that cooperates with reference column 14 in tin cream transmission plate 20.Perhaps, can the reference column (not shown) be set in tin cream transmission plate 20, and offer the location hole (not shown) that cooperates with reference column in pallet grippers 10.
Preferably, in order to realize the hard-cover location between pallet grippers 10 and the metal substrate 30, can in the mounting groove 12 of described pallet grippers 10, alignment pin 122 be set, and offer corresponding mating holes 34 in the bottom of metal substrate 30.Cooperate the accurate location of guaranteeing between pallet grippers 10 and the metal substrate 30 by alignment pin 122 with insertion between the mating holes 34.Because the positioning accuracy between pallet grippers 10 and the tin cream transmission plate 20 is very high, and the positioning accuracy between pallet grippers 10 and the metal substrate 30 is also very high, therefore guarantee that tin cream transmission plate 20 accurately aims at up and down with metal substrate 30, thereby assurance tin cream 40 can be delivered to the tram of metal substrate 30.
Preferably, offer power amplifier avoiding hollow groove 26 on the described tin cream transmission plate 20, and offer the power amplifier holddown groove 32 corresponding with described power amplifier avoiding hollow groove 26 on the described metal substrate 30.Behind the power amplifier relevant with printed circuit board (PCB) brush tin, can allow power amplifier behind the brush tin pass described power amplifier avoiding hollow groove 26 and be placed in the power amplifier holddown groove 32.After tin cream 40 fusings and cooling subsequently, power amplifier will be welded in the power amplifier holddown groove 32.In addition, preferably, it is less than 0.8 μ m that the fineness of described power amplifier holddown groove 32 requires.
Therefore; above-described embodiment is the utility model preferred implementation; but not merely be restricted to the described embodiments; other any do not deviate from change, the modification done under spiritual essence of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, all be included within the protection range of the present utility model.
Claims (7)
1. Metal Substrate scrubbing brush tin device is characterized in that comprising:
Pallet grippers is offered on it for the mounting groove of placing metal substrate; And
The tin cream transmission plate, itself and described pallet grippers fasten mutually, in order to described metal substrate is clamped between described pallet grippers and the described tin cream transmission plate, offer a plurality of for the transfer hole that tin cream is applied on the described metal substrate on the described tin cream transmission plate.
2. Metal Substrate scrubbing brush tin device according to claim 1 is characterized in that: on one of them of described pallet grippers and tin cream transmission plate reference column is set, then offers the location hole that cooperates with described reference column on another.
3. Metal Substrate scrubbing brush tin device according to claim 1, it is characterized in that: the diameter of the transfer hole of described tin cream transmission plate is 3mm, and has a determining deviation between adjacent two transfer holes.
4. Metal Substrate scrubbing brush tin device according to claim 1, it is characterized in that: the thickness of described tin cream transmission plate is 0.15mm.
5. Metal Substrate scrubbing brush tin device according to claim 2 is characterized in that: in the mounting groove of described pallet grippers alignment pin is set, and corresponding mating holes is offered in the bottom of described metal substrate.
6. Metal Substrate scrubbing brush tin device according to claim 1 is characterized in that: offer the power amplifier avoiding hollow groove on the described tin cream transmission plate, and offer the power amplifier holddown groove corresponding with described power amplifier avoiding hollow groove on the described metal substrate.
7. Metal Substrate scrubbing brush tin device according to claim 6 is characterized in that: the fineness of described power amplifier holddown groove is for less than 0.8 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220690565 CN203057706U (en) | 2012-12-13 | 2012-12-13 | Solder paste coating device for metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220690565 CN203057706U (en) | 2012-12-13 | 2012-12-13 | Solder paste coating device for metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203057706U true CN203057706U (en) | 2013-07-10 |
Family
ID=48740616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220690565 Expired - Lifetime CN203057706U (en) | 2012-12-13 | 2012-12-13 | Solder paste coating device for metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203057706U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620852A (en) * | 2020-12-28 | 2021-04-09 | 瓷金科技(河南)有限公司 | Base framing device and base framing method |
-
2012
- 2012-12-13 CN CN 201220690565 patent/CN203057706U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620852A (en) * | 2020-12-28 | 2021-04-09 | 瓷金科技(河南)有限公司 | Base framing device and base framing method |
| CN112620852B (en) * | 2020-12-28 | 2022-06-10 | 瓷金科技(河南)有限公司 | Base framing device and base framing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 510663 Shenzhou Road 10, Science City, Guangdong, Guangzhou Patentee after: Jingxin Network System Co.,Ltd. Address before: 510663 Shenzhou Road 10, Science City, Guangzhou, Guangdong, Guangzhou Patentee before: COMBA TELECOM SYSTEMS (CHINA) Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130710 |
|
| CX01 | Expiry of patent term |