CN101179034A - Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component - Google Patents
Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component Download PDFInfo
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- CN101179034A CN101179034A CNA2007100780183A CN200710078018A CN101179034A CN 101179034 A CN101179034 A CN 101179034A CN A2007100780183 A CNA2007100780183 A CN A2007100780183A CN 200710078018 A CN200710078018 A CN 200710078018A CN 101179034 A CN101179034 A CN 101179034A
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- pin
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Abstract
The invention discloses a method for opening a solder paste printing steel mesh of a no-pin flat package fine pitch device The invention relates to a surface mount technology for a circuit substrate, with the purpose of changing the shape of a steel mesh and increasing the side length of solder paste geometry at the grounding pad, and thus the tension generated by fusing is distributed more evenly in such a manner that the deficiency of prior art is overcome and the quality of QFN package device is increased. The opening in the method is carried out by the ratio of 1: 1 at the pin pad site, and the matrix distribution using the rectangle which area is the same with the pin, is carried out by 50 per cent of the grounding pad. By innovating the opening of the solder paste printing steel mesh, the invention ensures the laser cutting precision in the steel plate opening process, guarantees the symmetry of the opening, and effectively prevents solder balls when in assembling a QFN chip, thus increasing the grounding heat dispersion of the QFN chip.
Description
Technical field
The present invention relates to single procedure technology method that electronic device is produced, furthermore, relate to the surface installation technique of circuit substrate, in particular to the tin paste printed steel mesh opening method of the close pin type of no pin flat packaging (QFN) class device.
Technical background
QFN encapsulation has advantages such as good electricity and hot property, volume are little, in light weight, and the ideal that has become many new application is selected.In printed board, the large tracts of land exposed pads of encapsulation hot weld dish corresponding with it is measure-alike; Conductive welding disk to its corresponding around pad size similar, only extroversion is long slightly.Mounting in the process of QFN packaging, because having, the QFN element is used for improving heat radiation and electric property, the middle large bonding pad that exposes, be covered with uniform pin around it simultaneously, so need the work of strict process process optimization to guarantee packaging qualification rate.
QFN uses the bottom solder terminal, but rather than the solder ball of slump connect, this terminal influence is moistening, solder joint slump, self-centering, and the welding contact-making surface is subjected to outside contamination easily, thereby has dwindled the process window of stencilization and component mounter widely.For close spacing QFN element, wire mark bridge lotus also may appear, pick up and place produce the collimation error, the moistening problem such as bad of reflux drift, solder joint cavity, Xi Qiao and scolding tin.
By retrieval, the patented technology that relates to no pin flat packaging at present only has " a kind of repair method that does not have pin package class device " No. 200410044395.1, does not still have the application part of the tin paste printed steel mesh opening method of QFN device.
Summary of the invention
The object of the present invention is to provide a kind of tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component, to change the steel mesh shape, increase the length of side of ground pad place tin cream geometry, make the tension distribution that produces when melting more even, thereby overcome the defective of prior art, improve the quality of QFN packaging.
The inventor is in long-term practice and test, found that perforated area accounts for that 70%～90% and opening mode of pad is the influence of sphere of movements for the elephants to product quality on the printed circuit board, through research repeatedly, summing up in ground pad perforated area, to account for bonding pad area 50%～70% comparatively suitable.
Based on above-mentioned cognition, the tin paste printed steel mesh opening method of the pin-free flat pack type dense feet type component that the inventor provided is the ratio opening of sentencing at the pin pad 1: 1, sentence 50% of ground connection place pad at ground pad, make matrix distribution with the rectangle that area is identical with pin.
The inventor points out: ground pad adopts the rectangle identical with the pin bonding pad area to make matrix distribution at interval, can increase the length of side of ground pad place tin cream geometry, extended capability after helping the thawing of tin cream and improving thawing, make the tension distribution that produces when melting get more even, avoid the QFN chip when tin cream melts, to produce drift phenomenon, thereby improve the ground connection thermal diffusivity of QFN chip.
The inventive method is guaranteed the laser cutting precision in the steel plate opening process by the innovation of tin paste printed steel mesh opening, guarantees the symmetry of opening, and the QFN chip plays the phenomenon of tin sweat(ing) when reducing assembling effectively simultaneously, improves the ground connection thermal diffusivity of QFN chip.
Description of drawings
Further specify the present invention by the following drawings:
Fig. 1 is close pin QFN device printed circuit board bond pad shapes schematic diagram, and Fig. 2 is traditional steel mesh opening schematic diagram, and Fig. 3 is a steel mesh opening schematic diagram provided by the invention.Among the figure, 1 is ground pad, and 2 is the pad at pin place.
Can find out that from the comparison of Fig. 3 and Fig. 2 the present invention sentences 1: 1 ratio opening at the pin pad, ground pad 1 is made matrix distribution by the rectangle identical with pin pad 2 areas.
Embodiment
For the tin paste printed steel mesh of pin-free flat pack type dense feet type component, adopt hatch method as accompanying drawing 3, promptly sentence 1: 1 ratio opening at the pin pad; Ground pad 1 is made matrix distribution by the rectangle identical with pin pad 2 areas.
Adopt steel mesh opening method of the present invention,, reduce to 0.46% from original 2.1%, improved product quality effectively because the defective that causes of QFN device accounts for the ratio of whole processing procedure overall defect.
Claims (1)
1. the tin paste printed steel mesh opening method of a pin-free flat pack type dense feet type component, it is characterized in that this method is the ratio opening of sentencing at the pin pad 1: 1, sentence 50% of ground connection place pad at ground pad, make matrix distribution with the rectangle that area is identical with pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100780183A CN101179034A (en) | 2007-11-23 | 2007-11-23 | Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100780183A CN101179034A (en) | 2007-11-23 | 2007-11-23 | Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101179034A true CN101179034A (en) | 2008-05-14 |
Family
ID=39405217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100780183A Pending CN101179034A (en) | 2007-11-23 | 2007-11-23 | Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101179034A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140055A (en) * | 2011-11-28 | 2013-06-05 | 联发科技（新加坡）私人有限公司 | Surface mount technology process for advanced quad flat no-lead package process and stencil used therewith |
| CN103170693A (en) * | 2013-03-27 | 2013-06-26 | 张家港市东大工业技术研究院 | Technology method of void-free butt welding of large-area flat plate |
| CN103568500A (en) * | 2012-07-25 | 2014-02-12 | 上海斐讯数据通信技术有限公司 | Ball grid array chip printing fixture |
| CN104582307A (en) * | 2015-01-09 | 2015-04-29 | 浪潮(北京)电子信息产业有限公司 | Device packaging method and system |
| CN104934383A (en) * | 2015-07-13 | 2015-09-23 | 上海斐讯数据通信技术有限公司 | PCB packaging design method of QFN chip and the QFN chip |
| CN110049634A (en) * | 2019-05-08 | 2019-07-23 | 中国电子科技集团公司第二十九研究所 | A kind of assembly technique based on thin space QFN device and pottery envelope QFP device |
| CN112216616A (en) * | 2020-09-23 | 2021-01-12 | 深圳市金百泽电子科技股份有限公司 | Design method of QFN chip heat dissipation bonding pad steel mesh |
| CN115352200A (en) * | 2022-08-16 | 2022-11-18 | 广东风华高新科技股份有限公司 | Laminated inductor and printing process of silver bumps of laminated inductor |
-
2007
- 2007-11-23 CN CNA2007100780183A patent/CN101179034A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140055A (en) * | 2011-11-28 | 2013-06-05 | 联发科技（新加坡）私人有限公司 | Surface mount technology process for advanced quad flat no-lead package process and stencil used therewith |
| TWI497666B (en) * | 2011-11-28 | 2015-08-21 | Mediatek Singapore Pte Ltd | Surface mount technology for advanced quad flat no-lead package and stencil used therewith |
| CN103568500A (en) * | 2012-07-25 | 2014-02-12 | 上海斐讯数据通信技术有限公司 | Ball grid array chip printing fixture |
| CN103170693A (en) * | 2013-03-27 | 2013-06-26 | 张家港市东大工业技术研究院 | Technology method of void-free butt welding of large-area flat plate |
| CN104582307A (en) * | 2015-01-09 | 2015-04-29 | 浪潮(北京)电子信息产业有限公司 | Device packaging method and system |
| CN104934383A (en) * | 2015-07-13 | 2015-09-23 | 上海斐讯数据通信技术有限公司 | PCB packaging design method of QFN chip and the QFN chip |
| CN110049634A (en) * | 2019-05-08 | 2019-07-23 | 中国电子科技集团公司第二十九研究所 | A kind of assembly technique based on thin space QFN device and pottery envelope QFP device |
| CN112216616A (en) * | 2020-09-23 | 2021-01-12 | 深圳市金百泽电子科技股份有限公司 | Design method of QFN chip heat dissipation bonding pad steel mesh |
| CN115352200A (en) * | 2022-08-16 | 2022-11-18 | 广东风华高新科技股份有限公司 | Laminated inductor and printing process of silver bumps of laminated inductor |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |