CN103568500A - Ball grid array chip printing fixture - Google Patents

Ball grid array chip printing fixture Download PDF

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Publication number
CN103568500A
CN103568500A CN201210260918.0A CN201210260918A CN103568500A CN 103568500 A CN103568500 A CN 103568500A CN 201210260918 A CN201210260918 A CN 201210260918A CN 103568500 A CN103568500 A CN 103568500A
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CN
China
Prior art keywords
grid array
tin
ball grid
array chip
printing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210260918.0A
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Chinese (zh)
Inventor
朱继承
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Feixun Data Communication Technology Co Ltd
Original Assignee
Shanghai Feixun Data Communication Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Feixun Data Communication Technology Co Ltd filed Critical Shanghai Feixun Data Communication Technology Co Ltd
Priority to CN201210260918.0A priority Critical patent/CN103568500A/en
Publication of CN103568500A publication Critical patent/CN103568500A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a ball grid array chip printing fixture. The ball grid array chip printing fixture is of a steel mesh structure and comprises a mesh frame, a rubber region and a mesh sheet, wherein the mesh sheet is arranged in the center, the rubber region connects the mesh sheet and the mesh frame arranged on the periphery, the mesh sheet is provided with a plurality of tin through holes, and the cross section of the tin through holes is rectangular. The ball grid array chip printing fixture is simple in structure; compared with a traditional chip pressing fixture, can achieve larger tin feeding quantity and more stable printing quality and greatly avoid bridging, missing printing and tin insufficiency.

Description

Ball grid array chip printing apparatus
Technical field
The present invention relates to a kind of manufacturing equipment of surface mounting technology industry, particularly a kind of printing apparatus that is applied to ball grid array chip manufacture.
Background technology
Along with the development of IC industry, surface mounting technology (Surface Mounted Technology " SMT "), as most popular a kind of technology and technique in current Electronic Assemblies industry, is more and more applied.
The phenomenons such as the printing quality of 0.4mm live width thin space ball grid array structure (Ball Grid Array " BGA ") is the manufacturing difficult problem of SMT always, and in printing process is controlled, printing draws point, bite are perplexing technical staff always.In prior art, as shown in Figure 1, steel mesh sheet 10 arranges a plurality of tin holes 20 of crossing above, and these cross sections of crossing tin hole are rounded.In practical operation, if steel mesh tool is crossed tin hole, opening is excessive, easily causes crossover phenomenon, if steel mesh tool is crossed tin hole too small openings, easily produces and bites and lack the problems such as tin.Technical staff changes merely steel mesh tool net sheet thickness sometimes, but so still easily other element is produced the harmful effects such as rosin joint or crossover.
Those skilled in the art is devoted to develop a kind of ball grid array chip printing apparatus, to improve the Related Technical Issues in printing process control.
Summary of the invention
The technical problem to be solved in the present invention is in order to overcome in prior art, and printing process easily causes crossover in controlling, bites and lack the deficiency of tin phenomenon, and a kind of ball grid array chip printing apparatus is provided.
The present invention solves above-mentioned technical problem by following technical proposals:
A kind of ball grid array chip printing apparatus, its feature is, described printing apparatus is steel net structure, comprise screen frame, adhesive tape and net sheet three parts, described net sheet is positioned at centre position, described adhesive tape connection network sheet and be arranged on peripheral screen frame, described net sheet comprises a plurality of tin holes of crossing, the described cross section of crossing tin hole is rectangle.
Preferably, described tin hole excessively comprises outside tin hole, Guo Xi hole, Guo Xikonghe center, inner side excessively;
It is X=0.21 ~ 0.27mm that tin hole rectangular cross-section dimensions is crossed in described outside, Y=0.24~0.33mm;
It is X=0.21 ~ 0.27mm that tin hole rectangular cross-section dimensions is crossed in described inner side, Y=0.24~0.33mm;
Guo Xi hole, described center rectangular cross-section dimensions is X=0.21 ~ 0.27mm, Y=0.21~0.27mm.
Preferably, described net sheet thickness is 0.1mm.
Preferably, described screen frame thickness is 40mm.
Preferably, described live width corresponding to tin hole is excessively 0.4mm.
In the present invention, above-mentioned optimum condition can be combined on the basis that meets this area general knowledge, obtains each preferred embodiment of the present invention.
Positive progressive effect of the present invention is: this ball grid array chip printing apparatus is simple in structure, and with respect to traditional chip printing apparatus, the lower tin amount of this tool is fuller, and printing quality is more stable, greatly reduces crossover, bites and the appearance of tin phenomenon less.
Accompanying drawing explanation
Fig. 1 is the structural representation of ball grid array chip printing apparatus in prior art.
Fig. 2 is according to the structural representation of the ball grid array chip printing apparatus under a specific embodiment of the present invention.
Fig. 3 is according to the net chip architecture schematic diagram of the printing apparatus under a specific embodiment of the present invention.
The specific embodiment
Embodiments of the invention describe with reference to the accompanying drawings.In Figure of description, the element with similar structures or function will represent with identical component symbol.Accompanying drawing is each embodiment of the present invention for convenience of explanation just, is not to carry out to the present invention the explanation of exhaustive, neither limit scope of the present invention.
Fig. 2 shows the schematic structure of a ball grid array chip printing apparatus under specific embodiment.In this embodiment, printing apparatus comprises screen frame 14, adhesive tape 12 and net sheet 10, and net sheet 10 is positioned at the mid portion of tool.Net sheet 10 by adhesive tape 12 be arranged on peripheral screen frame 14 and be connected.In a preferred embodiment, screen frame 14 thickness are 40mm, and net sheet 10 thickness are 0.1mm,
Fig. 3 shows the net sheet schematic construction of a printing apparatus under specific embodiment.In this embodiment, net sheet 10 comprises a plurality of tin holes of crossing, and these cross tin hole according to the difference of position, can be divided into outside and cross tin hole 32, and 36 3, Guo Xi hole, tin Kong34He center part is crossed in inner side.The cross section of crossing tin hole is rectangle, and crossing live width corresponding to tin hole is 0.4mm.In a preferred embodiment, it is X=0.21 ~ 0.27mm that tin hole 32 rectangular cross-section dimensions are crossed in outside, Y=0.24~0.33mm; It is X=0.21 ~ 0.27mm that tin hole 34 rectangular cross-section dimensions are crossed in inner side, Y=0.24~0.33mm; Guo Xi hole, center 36 rectangular cross-section dimensions are X=0.21 ~ 0.27mm, Y=0.21~0.27mm.
This tin hole dimension of crossing, adds upper net plate thickness and is adjusted into 0.1mm, makes this printing apparatus obtain in use better printing effect.Because lower tin amount is owing to adopting rectangular opening special shape, with respect to traditional design of tin hole excessively, the lower tin amount while using tool of the present invention is very full, and printing quality is more stable, needn't worry very full other the bad problem causing of lower tin amount.
Those skilled in the art will appreciate that disclosed technical scheme not only can be used in ball grid array chip printing apparatus, can be useful in equally other need to be by the intensive printing manufacturing industry of crossing tin of tool.
Although more than described the specific embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is limited by appended claims.Those skilled in the art is not deviating under the prerequisite of principle of the present invention and essence, can make various changes or modifications to these embodiments, but these changes and modification all fall into protection scope of the present invention.

Claims (5)

1. a ball grid array chip printing apparatus, it is characterized in that, described printing apparatus is steel net structure, comprise screen frame, adhesive tape and net sheet three parts, described net sheet is positioned at centre position, described adhesive tape connection network sheet and be arranged on peripheral screen frame, described net sheet comprises a plurality of tin holes of crossing, the described cross section of crossing tin hole is rectangle.
2. ball grid array chip printing apparatus as claimed in claim 1, is characterized in that, described tin hole excessively comprises outside tin hole, Guo Xi hole, Guo Xikonghe center, inner side excessively;
It is X=0.21 ~ 0.27mm that tin hole rectangular cross-section dimensions is crossed in described outside, Y=0.24~0.33mm;
It is X=0.21 ~ 0.27mm that tin hole rectangular cross-section dimensions is crossed in described inner side, Y=0.24~0.33mm;
Guo Xi hole, described center rectangular cross-section dimensions is X=0.21 ~ 0.27mm, Y=0.21~0.27mm.
3. ball grid array chip printing apparatus as claimed in claim 1 or 2, is characterized in that, described net sheet thickness is 0.1mm.
4. ball grid array chip printing apparatus as claimed in claim 1 or 2, is characterized in that, described screen frame thickness is 40mm.
5. ball grid array chip printing apparatus as claimed in claim 1 or 2, is characterized in that, described live width corresponding to tin hole is excessively 0.4mm.
CN201210260918.0A 2012-07-25 2012-07-25 Ball grid array chip printing fixture Pending CN103568500A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210260918.0A CN103568500A (en) 2012-07-25 2012-07-25 Ball grid array chip printing fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210260918.0A CN103568500A (en) 2012-07-25 2012-07-25 Ball grid array chip printing fixture

Publications (1)

Publication Number Publication Date
CN103568500A true CN103568500A (en) 2014-02-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210260918.0A Pending CN103568500A (en) 2012-07-25 2012-07-25 Ball grid array chip printing fixture

Country Status (1)

Country Link
CN (1) CN103568500A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
JP2000079675A (en) * 1998-09-03 2000-03-21 Ricoh Microelectronics Co Ltd Printing method and device, and printing evaluating device
CN2838958Y (en) * 2005-10-28 2006-11-22 上海环达计算机科技有限公司 Tin paste printer
CN101179034A (en) * 2007-11-23 2008-05-14 中国振华(集团)科技股份有限公司 Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component
CN102107552A (en) * 2010-12-30 2011-06-29 昶虹电子(苏州)有限公司 Surface mount technology (SMT) printing steel mesh
CN202225541U (en) * 2011-10-11 2012-05-23 杭州光韵达光电科技有限公司 Steel mesh fixing tool
CN202753571U (en) * 2012-07-25 2013-02-27 上海斐讯数据通信技术有限公司 Printing jig for chips in ball grid array

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
JP2000079675A (en) * 1998-09-03 2000-03-21 Ricoh Microelectronics Co Ltd Printing method and device, and printing evaluating device
CN2838958Y (en) * 2005-10-28 2006-11-22 上海环达计算机科技有限公司 Tin paste printer
CN101179034A (en) * 2007-11-23 2008-05-14 中国振华(集团)科技股份有限公司 Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component
CN102107552A (en) * 2010-12-30 2011-06-29 昶虹电子(苏州)有限公司 Surface mount technology (SMT) printing steel mesh
CN202225541U (en) * 2011-10-11 2012-05-23 杭州光韵达光电科技有限公司 Steel mesh fixing tool
CN202753571U (en) * 2012-07-25 2013-02-27 上海斐讯数据通信技术有限公司 Printing jig for chips in ball grid array

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