JP2000079675A - Printing method and device, and printing evaluating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printing method, by which favorable electrodes can be printed, its device and a printing evaluating device by a method wherein the improvement of the slipping-out properties of an electrically conductive paste is contrived by a stage, on which a board is installed, is reciprocated under predetermined conditions during the period of a plate separation. SOLUTION: This printing device prints electrodes made of a creamy solder 3 on the electrode forming surface of a board 1. In order to reciprocate a stencil mask 2 along the separating direction of the board 1 when the stencil mask 2, in through holes of which the creamy solder 3 are filled, and the board 1 are separated from each other, a main controlling part 100 for controlling the reciprocating mechanism 9 of a stage 5 through a reciprocating waveform producing part 101 is provided. At the same time, the reciprocating mechanism 9, the reciprocating waveform producing part 101 and the main controlling part 100 are so constituted as to allow to change at least one of plate separating conditions such as a reciprocating waveform, amplitude and period during the period of a plate separation accompanied by a reciprocation and a separating speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped component such as a capacitor chip and a resistor chip, a chip-shaped semiconductor element such as an IC and an LSI, and a B-shaped semiconductor element.
SMD for packages such as GA and CSP, connectors
The present invention relates to a printing method and an apparatus for printing an electrode made of a conductive paste on an electrode forming surface of an electronic component such as a (Surface Mount device) or a substrate. More specifically, the present invention relates to a stencil mask having a through hole formed therein. After contacting the electrode forming surface and filling the through-holes of the stencil mask with a conductive paste, at least one of the stencil mask and the electronic component is separated while being reciprocated in a separating direction, so that the electrode forming surface is separated. The present invention relates to a printing method and an apparatus for printing an electrode made of the conductive paste.

[0002]

2. Description of the Related Art With the recent downsizing and cost reduction of electronic equipment, chip-like components such as capacitor chips and resistance chips, chip-like semiconductor elements such as ICs and LSIs, and BGAs on which semiconductor elements are molded. , CSP and the like, and electronic components (SMD) such as connectors have been surface-mounted on substrates. In particular, I
Semiconductor elements such as C and LSI have been tending to be surface-mounted as flip-chips on substrates via bump electrodes without packaging. In order to perform surface mounting of such an electronic component on a substrate, it is conceivable to form an electrode (for example, a bump electrode) made of a conductive paste on the electrode forming surface of the electronic component.

As a method of printing electrodes on the SMD or the substrate itself, which is surface-mounted on the substrate, a through-hole of a stencil mask (print mask) mounted on an electrode forming surface of an electronic component is provided with a conductive paste filling member. There has been proposed a method of forming an electrode by filling a conductive paste with a squeegee and then separating the electronic component from the stencil mask.

[0004]

However, in the printing method using the above-mentioned conventional stencil mask, after filling the through-hole with the conductive paste, when the stencil mask is separated from the electronic component, the conductive material in the through-hole is removed. In some cases, a portion of the paste was dragged in close contact with the stencil mask, and a good electrode could not be formed.

Therefore, the present inventor has examined in detail the releasability of the conductive paste when separating the electronic component and the stencil mask. From the time when the electronic component was started to be separated from the stencil mask until the two were completely separated. It has been found that good removability of the conductive paste can be obtained by reciprocating at least one of the electronic component and the stencil mask under predetermined conditions during the plate separation time. It has also been found that it is preferable to change the reciprocating condition in each time zone (for example, the first half and the second half) obtained by dividing the plate separation time into a plurality of times and set the optimum conditions. In addition, the optimum values of these plate separation conditions tend to change depending on the type, viscosity, and thixotropy of the conductive paste, the type of the stencil mask, the surface condition of the electrode forming surface of the electronic component, and the like.

Japanese Unexamined Patent Publication No. HEI 8-112283 describes the lowering speed of a printed circuit board (electronic component) until the printed circuit board (electronic component) separates from a screen plate (stencil mask) at the end of printing. There is disclosed a screen printing apparatus that controls the speed to be slower than the speed at which the printed circuit board rises to just below the screen plate and to increase the speed at which the printed board is lowered after the printed board is separated from the screen plate.
JP-A-8-336946 discloses a cream solder for switching the moving speed of a screen plate or a printed circuit board from a low speed to a high speed when the screen plate or the printed circuit board reaches a plate separation position immediately before separation of the screen plate and the printed circuit board. A printing method and apparatus are disclosed. However, the drive control of the screen plate in these methods and apparatuses is intended to shorten the plate separation time, and merely moves the screen plate or the printed board in one direction. Further, there is no description in these publications suggesting that the screen plate or the printed board is reciprocated and that the reciprocation is related to the releasability of the printing paste (conductive paste).

The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component and a stencil mask within a plate separation time from when the electronic component starts to be separated from the stencil mask until the two are completely separated. A reciprocating motion of at least one of them under a predetermined condition to improve the removability of the conductive paste and to provide a printing method and apparatus capable of printing a good electrode, and a printing evaluation apparatus. That is.

[0008]

In order to achieve the above object, according to the first aspect of the present invention, a stencil mask having a through hole is brought into contact with an electrode forming surface of an electronic component, and the stencil mask is formed in the through hole of the stencil mask. A printing method for printing an electrode made of the conductive paste on the electrode forming surface by filling the conductive paste and then separating at least one of the stencil mask and the electronic component while reciprocating in a separating direction. Then, at least one of the stencil mask and the electronic component is reciprocated along the separation direction without increasing the average separation distance between the stencil mask filled with the conductive paste in the through hole and the electronic component. Then, the stencil mask and the electronic component are gradually separated from each other while the reciprocating motion is continued.

According to the printing method of the first aspect, when the stencil mask in which the through-hole is filled with the conductive paste is separated from the electronic component, the average separation distance between the stencil mask and the electronic component is not increased. By reciprocating at least one of the stencil mask and the electronic component along the separation direction,
The slip resistance (shear stress) between the inner wall of the through-hole of the stencil mask and the conductive paste is reduced without dividing the conductive paste into the electronic component side and the stencil mask side. afterwards,
By gradually separating the electronic component and the stencil mask while continuing the reciprocating motion, a portion of the conductive paste in the through-hole is not closely dragged by the stencil mask,
The electronic component and the stencil mask are completely separated while the conductive paste is in close contact with the electrode forming surface of the electronic component.

According to a second aspect of the present invention, a stencil mask having a through-hole formed therein is brought into contact with an electrode forming surface of an electronic component, and the through-hole of the stencil mask is filled with a conductive paste. A printing method for printing an electrode made of the conductive paste on the electrode forming surface by separating at least one of the components while reciprocating the component in a reciprocating direction. The amplitude and cycle of the reciprocation are set to such an extent that the conductive paste is not separated, and as the electronic component and the stencil mask approach the end of the separating operation, the amplitude of the reciprocating movement gradually increases and It is characterized in that the period is gradually shortened.

In the printing method according to the second aspect, the electronic component and the stencil mask are gradually moved while reciprocating at least one of the stencil mask and the electronic component in which the through-hole is filled with the conductive paste along the separating direction. Separated. By setting the amplitude and cycle of the reciprocating motion immediately after the start of the separating operation involving the reciprocating motion to such an extent that the conductive paste is not divided, the conductive paste is not divided into the electronic component side and the stencil mask side. In addition, the slip resistance (shear stress) between the inner wall of the through hole of the stencil mask and the conductive paste is reduced. Thereafter, as the electronic component and the stencil mask approach each other at the end of the separating operation, the amplitude of the reciprocating motion is gradually increased and the cycle thereof is gradually shortened, and the slip resistance (shear stress) is further reduced. By gradually separating the component and the stencil mask, a part of the conductive paste in the through-hole is not closely dragged by the stencil mask. The electronic component and the stencil mask are completely separated.

According to a third aspect of the present invention, there is provided a filling means for filling a conductive paste into a through-hole of a stencil mask in a state where the stencil mask having a through-hole formed therein is in contact with an electrode forming surface of an electronic component; Driving means for driving at least one of the stencil mask and the electronic component so as to separate the stencil mask filled with the conductive paste and the electronic component, and comprising an electrode made of the conductive paste on the electrode forming surface. A printing apparatus for printing, wherein when the stencil mask filled with the conductive paste in the through hole and the electronic component are separated from each other, at least one of the stencil mask and the electronic component is reciprocated along the separation direction. As described above, while providing control means for controlling the driving means, the driving means and the control means, the waveform, amplitude and period of the reciprocating motion in the plate separation time with the reciprocating motion, and It is characterized in that it has changeable configured at least one plate release conditions spaced velocity.

[0013] In the printing apparatus according to the third aspect, the driving means for driving at least one of the stencil mask and the electronic component in which the through-hole is filled with the conductive paste by the filling means is controlled by the control means. When separating the electronic component from the electronic component, at least one of the electronic component and the stencil mask is reciprocated along the separation direction. The electronic component and the stencil mask are separated from each other in a state where the slip resistance (shear stress) between the inner wall of the through-hole of the stencil mask and the conductive paste is weakened by this reciprocating motion, so that the conductive paste in the through-hole is removed. The electronic component and the stencil mask are completely separated in a state where the conductive paste is in close contact with the electrode forming surface of the electronic component without the part being closely attached to the stencil mask and being dragged.
Here, at least one condition of the waveform, amplitude and cycle of the reciprocating motion and the speed of the reciprocating motion within the revolving motion accompanied by the reciprocating motion is changed, and the imprint releasing time is changed according to the type of the conductive paste. Separation conditions suitable for each of the divided time zones are set.

According to a fourth aspect of the present invention, in the printing apparatus of the third aspect, a display means for displaying a waveform indicating a separating operation involving reciprocation of the stencil mask and the electronic component, and inputting the plate separating condition. And input means.

In the printing apparatus according to the fourth aspect, the plate separation condition is input by the input unit while watching the waveform indicating the separation operation involving the reciprocation of the stencil mask and the electronic component displayed on the display unit.

According to a fifth aspect of the present invention, in the printing apparatus of the third aspect, storage means for storing the plate separation condition is provided.

In the printing apparatus according to the fifth aspect, the optimum value of the plate separation condition is stored in the storage means. Then, the separation operation involving the reciprocating movement of the stencil mask and the electronic component is controlled using the optimum value of the plate separation condition stored in the storage means.

According to a sixth aspect of the present invention, there is provided a stencil mask in which a conductive paste is filled in a through hole and an electronic component on which a printed pattern made of the conductive paste is formed, and then the stencil mask and the electronic component are contacted. A printing evaluation device for evaluating the plate separation condition when separating the stencil mask and the electronic component so as to separate the stencil mask filled with the conductive paste in the through hole and the electronic component. A driving unit for driving one of the stencil masks, and a control unit for controlling the driving unit so as to reciprocate at least one of the stencil mask and the electronic component in a separating direction when separating the stencil mask from the electronic component. Means, and the driving means and the control means are provided with at least one of a waveform, an amplitude and a period of the reciprocating motion and a speed of the reciprocating motion within a plate separating time accompanied by the reciprocating motion. It is characterized in that it has changeable configure One condition.

In the printing evaluation apparatus according to the present invention, the driving means for driving at least one of the stencil mask and the electronic component in which the through holes are filled with the conductive paste is controlled by the control means, so that the stencil mask and the electronic component can be controlled. When the electronic components are separated, at least one of the electronic component and the stencil mask is reciprocated along the separation direction. The electronic component and the stencil mask are separated from each other in a state where the slip resistance (shear stress) between the inner wall of the through-hole of the stencil mask and the conductive paste is weakened by this reciprocating motion, so that the conductive paste in the through-hole is removed. Part is closely attached to the stencil mask without being dragged,
The electronic component and the stencil mask are completely separated while the conductive paste is in close contact with the electrode forming surface of the electronic component. Here, by changing at least one condition of the waveform, amplitude, and period of the reciprocating motion and the speed of the reciprocating motion within the revolving motion with the reciprocating motion, the imprint releasing is performed according to the type of the conductive paste. It is possible to find a release condition suitable for each time zone obtained by dividing the time into a plurality of times.

According to a seventh aspect of the present invention, in the printing evaluation apparatus of the sixth aspect, display means for displaying a waveform indicating a separating operation involving reciprocation of the stencil mask and the electronic component, and inputting the plate separating condition. And input means for inputting the information.

In the printing evaluation apparatus of the present invention, the plate separation condition is inputted by the input unit while watching the waveform indicating the separation operation involving the reciprocation of the stencil mask and the electronic component displayed on the display unit.

According to an eighth aspect of the present invention, in the printing evaluation apparatus of the sixth aspect, storage means for storing the plate separation condition is provided.

In the printing evaluation apparatus of the present invention, the optimum value of the plate separation condition is stored in the storage means. Then, the optimum value of the plate separation condition stored in the storage unit is transferred to the printing apparatus, so that the separation operation involving the reciprocating movement of the stencil mask and the electronic component can be controlled.

The slip resistance (shear stress) between the inner wall of the through hole of the stencil mask and the conductive paste is reduced by the reciprocating movement of at least one of the electronic component and the stencil mask. It is considered that the conductive paste existing near the inner wall of the through hole becomes liquefied.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention is applied to a printing method and an apparatus for printing an electrode made of a conductive paste on an electrode forming surface of a printed circuit board (hereinafter, referred to as a "substrate") as an electronic component. An embodiment will be described. FIG.
(A) and (b) are illustrations of a separating operation for separating the substrate 1 and the stencil mask 2 in the printing method according to the first embodiment of the present invention, and FIG. Substrate 1
6 is a graph showing a time change of a distance D between an upper surface of the stencil mask and a lower surface of the stencil mask 2. First, the stencil mask 2 is positioned so that the through-hole 2a of the stencil mask 2 is positioned on the electrode pad 1a formed on the electrode forming surface of the substrate 1, and is brought into contact with the substrate 1. A through hole 2a of the stencil mask 2 in contact with the substrate is filled with a cream solder 3 as a conductive paste using a squeegee (not shown). Then, the separation between the substrate 1 and the stencil mask 2 is started. Until a predetermined time elapses from the start of the separating operation, the substrate 1 is reciprocated along the separating direction as indicated by an arrow A in FIG. 1A (t in FIG. 1C).
Time to 1). By this reciprocating motion, the slip resistance (shear stress) between the cream solder 3 and the inner wall of the through hole 2a of the stencil mask 2 can be reduced without dividing the cream solder 3 into the substrate 1 side and the stencil mask 2 side. it can.

Next, as shown by an arrow B in FIG.
The substrate 1 is gradually separated from the stencil mask 2 while the reciprocating motion is continued (time from t1 to t2 in FIG. 1C). By separating the substrate 1 in this manner, the cream solder 3 in the through-hole 2a is in close contact with the stencil mask 2 and is not dragged, so that the cream solder 3 is in close contact with the electrode forming surface of the substrate 1. Thus, the substrate 1 and the stencil mask 2 can be completely separated.

As described above, according to the present embodiment, the cream solder 3 is removed by reciprocating the substrate 1 within the plate separation time from when the substrate 1 starts to be separated from the stencil mask 2 until the substrate 1 is completely separated. Thus, good bump electrodes can be formed on the electrode pads 1 a of the substrate 1. (Hereinafter, margin)

Further, according to the present embodiment, the cream solder 3 is used in the initial stage of the separating operation to start separating the substrate 1.
Can reduce the slip resistance (shear stress) between the inner wall of the through hole 2a of the stencil mask 2 and the cream solder 3 without separating the stencil mask 2 into the stencil mask 2 side.

Next, a printing method according to a second embodiment of the present invention will be described. 2A and 2B are explanatory views of a separating operation for separating the substrate 1 and the stencil mask 2 in the printing method according to the present embodiment, and FIG. 2C is a diagram illustrating the substrate 1 during the separating operation. D between the upper surface of the mask and the lower surface of the stencil mask 2
5 is a graph showing a time change of the graph. In this method, first,
As shown by an arrow A1 in FIG. 2A, the substrate 1 starts to be separated from the stencil mask 2 while reciprocating the substrate 1 in the direction of separation. The amplitude and cycle of the reciprocating motion immediately after the start of the separating operation involving the reciprocating motion is set to such an extent that the cream solder 3 is not divided. As a result, the cream solder 3 is
The slip resistance (shear stress) between the cream solder 3 and the inner wall of the through-hole 2a of the stencil mask 2 is reduced without being divided into the stencil mask 2 and the stencil mask 2 side.

Thereafter, as indicated by an arrow A2 in FIG. 2B, as the substrate 1 approaches the end of the separating operation in which the substrate 1 is completely separated from the stencil mask 2 (t3 in FIG. 2C),
The amplitude of the reciprocating motion is gradually increased and its cycle is gradually shortened, and the slip resistance (shear stress) of the cream solder 3 is increased.
Is further weakened, and the substrate 1 is gradually separated from the stencil mask 2. As a result, a portion of the cream solder 3 in the through-hole 2a is not dragged in close contact with the stencil mask 2, and the substrate 1 and the stencil mask 2 are connected with the cream solder 3 in close contact with the pad electrode 1a of the substrate 1. Can be completely separated.

As described above, according to the present embodiment, the substrate 1 is reciprocated within the plate separation time to improve the removability of the cream solder 3 and to provide a good bump electrode on the electrode pad 1a of the substrate 1. Can be formed.

According to the present embodiment, the cream solder 3 is not divided into the substrate 1 and the stencil mask 2 at the initial stage of the separating operation at which the substrate 1 is separated from the stencil mask 2. The slip resistance (shear stress) between the inner wall of the second through hole 2a and the cream solder 3 can be reduced.

In the printing method according to each of the above embodiments, the reciprocating component of the substrate 1, that is, the waveform of the vibration component ΔD of the distance D between the substrate 1 and the stencil mask 2 has a waveform as shown in FIG. Although it is a sine wave, the present invention can be applied to a case where the waveform of the vibration component ΔD is another type of waveform such as a rectangular wave shown in FIG. 3B or a triangular wave shown in FIG. It is.

In the first embodiment, the substrate 1 which is one of the separation condition parameters within the plate separation time is used.
In the second embodiment, the amplitude and cycle of the reciprocating motion of the substrate 1 are changed within the plate separation time. However, according to the type of the cream solder 3,
The waveform of the vibration component ΔD of the distance D between the substrate 1 and the stencil mask 2 may be changed. Further, these separation condition parameters may be changed by appropriately combining them.

Next, a printing apparatus according to a third embodiment of the present invention, which can realize the above-described printing method, will be described. FIG. 4 is a schematic configuration diagram of the printing apparatus.
In this apparatus, a stencil mask 2 made of a plastic material mounted on a frame member 2b is fixed by a fixing member 4. The substrate 1 on which the electrodes are to be printed is held on the stage 5 such that the electrode forming surface faces upward. Driving means is provided on the lower surface of the stage 5. The driving means includes a reciprocating mechanism 9 for reciprocating the stage 5, a stepping motor 6 capable of rotating forward and reverse, a ball screw 6 rotatably connected to the lower surface of the reciprocating mechanism 9, and the motor 6. It is configured using a vertically moving mechanism 7 including a nut (not shown) that is driven to rotate.

The rotation of the stepping motor 6 is controlled by a main control unit 100 comprising a CPU or the like as control means. By this rotation control, the stage 5 can be continuously driven in a fixed direction, and the substrate 1 can be separated from the stencil mask 2.

The reciprocating mechanism 9 can be constituted by using a movable coil or a movable magnet utilizing the same principle as that of a speaker, a servomotor, a piezoelectric element, a mechanism utilizing variation in air pressure or oil pressure, or the like. The reciprocating mechanism 9 includes a reciprocating waveform generator 10 controlled by the main controller 100.
1, a drive control signal is sent. The reciprocating waveform generator 101 is connected to a display device 102 such as a liquid crystal panel or a CRT as a display means, so that the reciprocating waveform of the stage 5 on which the substrate 1 is mounted over the entire separation operation can be confirmed. I have.

The main control unit 100 includes a ten-key pad, a fine adjustment dial, and the like as input means for inputting at least one plate separation condition of the reciprocating waveform, amplitude and cycle, and the separation speed. The input device 103 is connected. Further, the main control unit 100 has a storage device 10 as a storage unit for storing an optimum value of the plate separation condition.
4 are connected. As this storage device 104, F
It can be composed of a D device, an HD device, a semiconductor memory, and the like.

In the printing apparatus having the above-described configuration, first, the stencil mask 2 is fixed by the fixing member 4, and then the motor 6 is driven to rotate so that the stage 5 holding the substrate 1 is raised and brought into contact with the stencil mask 2. Then, the cream solder 3 is set on the upper surface of the stencil mask 2, and the squeegee 8 as a filling means is moved in the direction of arrow C by a driving device (not shown) to fill the through-hole of the stencil mask 2 with the cream solder 3. Imprint.

Next, while the stencil mask 2 filled with the cream solder 3 is fixed, the motor 6 is driven to rotate to separate the substrate 1. In this separating operation, the reciprocating mechanism 9 is controlled by the main control unit 1 via the reciprocating waveform generator 101.
00, the substrate 1 is moved in the direction along the separation direction (vertical direction in the figure) as illustrated in the above-described printing method.
And the substrate 1 can be separated from the stencil mask 2.

As described above, according to the present embodiment, when the substrate 1 is separated from the stencil mask 2 filled with the cream solder 3, the substrate 1 is reciprocated so that the inner wall of the through-hole of the stencil mask 2 and the cream solder 3 And the slip resistance (shear stress) can be reduced. By separating the substrate 1 and the stencil mask 2 in a state where the slip resistance (shear stress) is weakened, a part of the cream solder 3 in the through-hole does not come into close contact with the stencil mask 2 and is dragged. The substrate 1 and the stencil mask 2 can be completely separated while the cream solder 3 is in close contact with the pad electrode of the substrate 1.

Further, by changing the drive waveform input to the reciprocating mechanism 9 during the plate separation time accompanied by the reciprocating motion, the waveform, amplitude and period of the reciprocating motion, and the speed at which the substrate 1 is separated are changed. At least one of the conditions can be set as a separation condition suitable for each of the time zones obtained by dividing the separation time into a plurality.

In each of the above embodiments, the substrate 1
Has been described, the present invention can be applied to a case where the substrate 1 is fixed and the stencil mask 2 is moved, or a case where both are moved.

In each of the above embodiments, the case where cream solder is filled as the conductive paste has been described. However, the present invention can be applied to the case where other conductive pastes other than the cream solder are filled. Things.

In each of the above embodiments, the substrate 1
Although the case of printing the electrodes has been described, the present invention,
When bump electrodes are collectively formed on a wafer on which a plurality of semiconductor elements are mounted on a substrate, electrodes are mounted on a BGA or CSP type package in which a semiconductor chip is molded, or on connectors or the like mounted on the substrate. Can be applied to the case of forming the same, and a similar effect can be obtained.

In the above embodiment, the case of an actual printing apparatus has been described with reference to FIG. 4. However, the configuration of FIG. 4 is based on the plate separation condition when separating the stencil mask from the electronic component. The present invention can be similarly applied to a print evaluation device to be evaluated. In this case, by changing at least one condition of the waveform, amplitude and period of the reciprocating motion and the speed of the reciprocating motion in the revolving motion with the reciprocating motion, each time of dividing the imprinting time into a plurality of times. It is possible to find a suitable release condition for each of the belts. The optimum value of the plate separation condition found by the printing evaluation device can be input from the input device 103 of the printing device and used, or transferred to the printing device via a storage device and used.

[0047]

According to the first to fifth aspects of the present invention, at least one of the electronic component and the stencil mask is reciprocated within a plate separation time from the time when the electronic component and the stencil mask are started to be separated until the two are completely separated. By doing so, there is an effect that the removability of the conductive paste is improved and a good electrode can be printed.

In particular, according to the first and second aspects of the present invention, the conductive paste is not divided into the electronic component side and the stencil mask side at the initial stage of the separating operation at which the electronic component and the stencil mask start to be separated. In addition, there is an effect that the slip resistance (shear stress) between the inner wall of the through hole of the stencil mask and the conductive paste can be reduced.

According to the third aspect of the present invention, the waveform of the reciprocating motion during the plate separation time accompanied by the reciprocating motion is
At least one condition of the amplitude, the period, and the separation speed can be set to a separation condition suitable for each of the time zones obtained by dividing the separation time into a plurality according to the type of the conductive paste. This has the effect.

According to the fourth aspect of the present invention, the plate separation condition is input by the input unit while watching the waveform indicating the separation operation involving reciprocation of the stencil mask and the electronic component displayed on the display unit. Therefore, there is an effect that the setting of the plate separation condition becomes easy.

According to the fifth aspect of the present invention, the separating operation involving the reciprocating movement of the stencil mask and the electronic component is controlled with good reproducibility by using the optimum value of the separating condition stored in the storage means. be able to. Moreover, there is an effect that the optimum value of the plate separation condition found by another device can be stored in the storage means and used.

According to the present invention, the electronic component and the stencil mask are separated according to the type of the conductive paste and the like during the plate separation time from when the separation of the electronic component to the stencil mask is started until the two are completely separated. Since it is possible to find the optimal condition for separating the plate when reciprocating at least one of the stencil masks, it is possible to improve the removability of the conductive paste and to print a good electrode. .

In particular, according to the seventh aspect of the present invention, inputting the plate separation condition by the input unit while watching the waveform indicating the separation operation involving reciprocation of the stencil mask and the electronic component displayed on the display unit. Therefore, there is an effect that setting of the separation condition becomes easy.

In particular, according to the invention of claim 8, the optimum value of the plate separation condition stored in the storage means is transferred to the printing apparatus, and the separation operation involving reciprocating movement of the stencil mask and the electronic component is controlled. There is an effect that can be.

[Brief description of the drawings]

FIGS. 1A and 1B are explanatory diagrams of a printing method according to a first embodiment of the present invention. (C) is a graph showing a time change of a distance D between the upper surface of the substrate and the lower surface of the stencil mask during the separating operation in the printing method.

FIGS. 2A and 2B are explanatory diagrams of a printing method according to a second embodiment of the present invention. (C) is a graph showing a time change of a distance D between the upper surface of the substrate and the lower surface of the stencil mask during the separating operation in the printing method.

FIG. 3A is an explanatory diagram of a waveform of a vibration component ΔD of a distance D between a substrate and a stencil mask in the first and second embodiments. (B) and (c) are explanatory views of a waveform of a vibration component ΔD of a distance D between a substrate and a stencil mask according to a modification.

FIG. 4 is a schematic configuration diagram of a printing apparatus according to a third embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 substrate 1a electrode pad 2 stencil mask 2a through hole 3 cream solder 4 fixing member 5 stage 6 stepping motor 7 ball screw 8 squeegee 9 reciprocating mechanism 100 main control unit 101 reciprocating waveform generating unit 102 display device 103 input device 104 storage device

Claims (8)

[Claims] 1. A stencil mask having a through-hole formed therein is brought into contact with an electrode forming surface of an electronic component. After filling a conductive paste into the through-hole of the stencil mask, at least one of the stencil mask and the electronic component is removed. A printing method for printing an electrode made of the conductive paste on the electrode forming surface by reciprocating while reciprocating in a separating direction, the stencil mask having the through-hole filled with the conductive paste, and the electronic component. After reciprocating at least one of the stencil mask and the electronic component along the direction of separation without increasing the average separation distance between the stencil mask and the electronic component while continuing the reciprocation. A printing method characterized in that the printing papers are gradually separated from each other. 2. A stencil mask in which a through-hole is formed is brought into contact with an electrode forming surface of an electronic component, and after filling a conductive paste in the through-hole of the stencil mask, at least one of the stencil mask and the electronic component is removed. A printing method for printing an electrode made of the conductive paste on the electrode forming surface by separating while reciprocating in a separating direction, comprising: an amplitude of the reciprocating motion immediately after the start of the separating operation involving the reciprocating motion; The period is set to such an extent that the conductive paste is not divided, and as the electronic component and the stencil mask approach the end of the separating operation, the amplitude of the reciprocating motion gradually increases and the period gradually decreases. Printing method characterized by performing. 3. A filling means for filling a conductive paste into a through-hole of the stencil mask while the stencil mask having the through-hole formed therein is in contact with an electrode forming surface of the electronic component, and the conductive paste is filled. A printing device that includes a driving unit that drives at least one of the stencil mask and the electronic component so as to separate the stencil mask and the electronic component, and prints an electrode made of the conductive paste on the electrode forming surface. When the stencil mask filled with the conductive paste in the through hole and the electronic component are separated from each other, the driving is performed such that at least one of the stencil mask and the electronic component is reciprocated along the separation direction. Control means for controlling the means; and controlling the driving means and the control means to reduce the waveform, amplitude and period of the reciprocating movement and the speed of the separation during the separation time of the plate accompanying the reciprocating movement. Printing apparatus characterized by the changeable configure Kutomo one plate release conditions. 4. The printing apparatus according to claim 3, further comprising: display means for displaying a waveform indicating a separation operation involving reciprocation of the stencil mask and the electronic component; and input means for inputting the plate separation condition. A printing device, comprising: 5. The printing apparatus according to claim 3, further comprising storage means for storing the plate separation condition. 6. When a stencil mask in which a conductive paste is filled in a through hole is brought into contact with an electronic component on which a printed pattern made of the conductive paste is formed, and then the stencil mask is separated from the electronic component. A drive for driving at least one of the stencil mask and the electronic component so that the stencil mask and the electronic component are separated from each other by filling the conductive paste into the through holes. Means, and control means for controlling the driving means, so as to reciprocate at least one of the stencil mask and the electronic component along the separation direction when separating the stencil mask and the electronic component. Changing at least one condition of a waveform, an amplitude and a period of the reciprocating motion and a speed of the reciprocating motion during a separation time of the plate accompanied by the reciprocating motion. Printing evaluation apparatus characterized by being configured to capacity. 7. A printing evaluation apparatus according to claim 6, wherein display means for displaying a waveform indicating a separation operation involving reciprocation of said stencil mask and said electronic component; and input means for inputting said plate separation condition. A printing evaluation device comprising: 8. The print evaluation apparatus according to claim 6, further comprising storage means for storing the plate separation condition.