CN2838958Y - Tin paste printer - Google Patents
Tin paste printer Download PDFInfo
- Publication number
- CN2838958Y CN2838958Y CN 200520046028 CN200520046028U CN2838958Y CN 2838958 Y CN2838958 Y CN 2838958Y CN 200520046028 CN200520046028 CN 200520046028 CN 200520046028 U CN200520046028 U CN 200520046028U CN 2838958 Y CN2838958 Y CN 2838958Y
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- CN
- China
- Prior art keywords
- base
- paste
- circuit board
- net sheet
- loam cake
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- Expired - Fee Related
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Abstract
The utility model relates to a tin paste printer, particularly a tin paste printer for printing tin paste to the surface of a circuit board, which is applied to surface adhesion technology; the tin paste printer comprises a base arranged on the surface of the circuit board; an opening is arranged at the middle of the base; a net sheet arranged in the opening is butted against the side wall of the opening and then is assembled in the opening; the net sheet is provided with a plurality of meshes which correspond to the position of the circuit board which needs to be printed. In addition, an upper cover is arranged at the upper part of the base, and the upper cover is assembled on the base; the upper cover corresponding to the opening of the base is provided with a through hole so as to the meshes of the net sheet expose; thus, the tin paste can be arranged on the net sheet; then, the tin paste is extruded by an extruding device so that the pin paste penetrating through the meshes is printed on the surface of the circuit board.
Description
[technical field]
The relevant a kind of paste-tin printing apparatus of the utility model, be meant especially and be applied in the surperficial adhesion technology, in order to paste solder printing on the welded gasket of circuit board surface in order to soldering of electronic components, and can be, and be beneficial to the cleaning tin cream and guarantee the paste-tin printing apparatus of printing quality according to the size of the size adjusting net sheet of electronic component.
[background technology]
Along with development of electronic technology, the number of electronic components of assembling on the circuit board increases day by day, for the ease of assembling and manufacturing circuit board, industry adopts surperficial adhesion technology (SMT) that electronic component (as IC chip) etc. is welded on the circuit board mostly, this general operation is: at first utilize the position of printing machine with paste solder printing electronic component pre-welding to the circuit board, then electronic component is sticked to above-mentioned position, to together deliver in the brazier heating with the circuit board of electronic component afterwards makes the tin cream fusing and electronic component is welded on the circuit board, and described printing machine comprises a load bearing seat mostly, one web plate and tin cream scraping device, in manufacture process, earlier circuit board is placed on the load bearing seat, the tin cream scraping device is from web plate one side direction opposite side motion, and extruding tin cream and see through web plate coated one deck tin cream on the welding position of electronic component correspondence on the circuit board.This kind method is highly suitable in smooth circuit board surface print solder paste, and for the circuit board of need maintenances, because of circuit board surface has been welded with some electronic components, this circuit board surface is uneven, as use said method then need change many structures, very inconvenience, particularly to some BGA of pin (Ball Grid Array) electronic component, it need lay quite intensive pad on area very little on the circuit board, as using said method, except that need are changed many structures, also because above-mentioned web plate area is bigger, and not quick detachable, therefore unnecessary tin cream is difficult to do Net to remove, and the quality of the tin cream of printing after can influencing.In addition, as utilize said method, as the number of connections of BGA electronic component not simultaneously, need to change web plate, because of its fixed structure quite complicated, so remove very inconvenient.
In view of this, in fact be necessary to develop a kind of with paste solder printing on the welded gasket of circuit board surface in order to soldering of electronic components, and can be, and be beneficial to the cleaning tin cream and guarantee the paste-tin printing apparatus of printing quality according to the size of the size adjusting net sheet of electronic component.
[summary of the invention]
The utility model purpose be to provide a kind of with paste solder printing on the welded gasket of circuit board surface in order to soldering of electronic components, and can be, and be beneficial to the cleaning tin cream and guarantee the paste-tin printing apparatus of printing quality according to the size of the size adjusting net sheet of electronic component.
For achieving the above object, the utility model paste-tin printing apparatus comprises a base, this base is positioned over circuit board surface, and a perforate is offered at this base middle part, and be provided with a net sheet in this perforate, the sidewall interference engagement of this net sheet and this perforate, and be mounted in this perforate, and this net sheet has several mesh, to need the position of print solder paste corresponding with circuit board, in addition, this base top is provided with a loam cake, this loam cake is combined on the base with removably, and this loam cake is provided with a through hole to perforate that should base, exposes with the mesh with the net sheet, so tin cream can be positioned on the net sheet, then by pressurizing unit extruding tin cream, make tin cream see through mesh and be printed in circuit board surface.
According to the utility model preferred embodiment, corresponding first screw that is provided with in edge of this loam cake and base, this loam cake and base pass this first screw and are combined into one by a screw.
According to the utility model preferred embodiment, this paste-tin printing apparatus also is provided with the leader, after on paste solder printing and circuit board, this paste-tin printing apparatus is got from circuit board.
According to the utility model preferred embodiment, wherein this handle one end periphery is provided with screw thread, and this loam cake correspondence is provided with second screw, this handle by the screw thread of one end sealed with second screw in, cover and be mounted on.
Compared to prior art, the utility model is by an independent paste-tin printing apparatus being set with the surface with paste solder printing and circuit board, therefore do not need labyrinth used in the prior art, this paste-tin printing apparatus adopts base and the separable structure of loam cake simultaneously, can be beneficial on the one hand and remove unnecessary tin cream, also can be beneficial to more draping sheet on the other hand, with corresponding with the size of electronic component.
[description of drawings]
The schematic diagram that Fig. 1 uses for the utility model paste-tin printing apparatus.
Fig. 2 is the three-dimensional exploded view of the utility model paste-tin printing apparatus and circuit board.
[specific embodiment]
See also shown in Figure 1, be the application schematic diagram of the utility model paste-tin printing apparatus 1, in use, this paste-tin printing apparatus 1 be positioned on the circuit board 2, corresponding with the position that welded gasket 20 is set on the circuit board 2, thus with paste solder printing in these welded gasket 20 surfaces.This paste-tin printing apparatus 1 is provided with a base 10, this base 10 is positioned over circuit board 2 surfaces, and a perforate 100 (being detailed later) is offered at these base 10 middle parts, and be provided with a net sheet 12 in this perforate 100, the sidewall of this net sheet 12 and this perforate 100 against, and be mounted in this perforate 100, and the bottom surface copline of the bottom surface of this net sheet 12 and base 10, and recline with the surface of circuit board 2.In addition, this net sheet 12 has several mesh 120, with corresponding with welded gasket 20 positions of circuit board 2, so that tin cream sees through this mesh 120 and is printed in welded gasket 20 surfaces.In addition, these base 10 tops are provided with a loam cake 11, this loam cake 11 is combined on the base 10 removably, and 11 pairs of this loam cakes should base 10 perforate 100 be provided with a through hole 110, expose with mesh 120 net sheet 12, so tin cream can be positioned on the net sheet 12,, make tin cream see through mesh 120 and be printed on the welded gasket 20 on circuit board 2 surfaces then by pressurizing unit (not shown) extruding tin cream.
See also shown in Figure 2ly, be the three-dimensional exploded view of the utility model paste-tin printing apparatus and circuit board, wherein the base 10 of this paste-tin printing apparatus 1 all is square with loam cake 11, and these base 10 middle parts offer perforate 100 and also are square, and with net sheet 12 to open shape corresponding.In addition, four jiaos of this base 10 are equipped with first screw 101, with corresponding with first screw 111 of loam cake 11, and by first screw 14 loam cake 11 are combined on the base 10.
This net sheet 12 is a rectangular flat board, in the perforate 100 that is mounted on base 10, and the thickness of net sheet 12 is identical with the degree of depth (being the thickness of base 10) of base 10 perforates 100, after so can making this net sheet 12 be placed in the perforate 100, the bottom surface copline of the bottom surface of this net sheet 12 and this base 10 is provided with, thereby reclines with the surface of circuit board 2.In addition, the middle part of this net sheet 12 is provided with several regularly arranged mesh 120, so that tin cream sees through this mesh 120 and is printed on the welded gasket 20 on circuit board 2 surfaces.
This loam cake 11 is square, corresponding with base 10, wherein also be provided with through hole 110, corresponding with the perforate 100 of base 10, but area is littler than perforate 100, and promptly the area than net sheet 12 is little, so that when being combined in this loam cake 11 on the base 10, the part of these loam cake 11 adjacent through-holes 110 just in time is pressed on the edge of net sheet 12, locatees thereby make net sheet 12 have on the vertical direction.In addition, this loam cake 11 is equipped with first screw 111 at four jiaos, with corresponding with first screw 101 of base 10, and by first screw 14 loam cake 11 is combined on the base 10.Again, this loam cake 11 respectively offers one second screw 112 at the middle part of through hole 110 two side portions, so as with the screw thread of handle 15 ends sealed (being detailed later).
In addition, this paste-tin printing apparatus 1 also is provided with leader 15, so that with paste solder printing after on the welded gasket 20 on circuit board 2 surfaces, by this handle 15 this paste-tin printing apparatus 1 is taken off from circuit board 2 surfaces, in the present embodiment, this handle 15 is cylindricality, and the one end is provided with screw thread, to cooperate, so that handle 15 is locked on this loam cake 11 with second screw 112 of this loam cake 11.
See also Fig. 1 again, during assembling, earlier net sheet 12 is mounted in the perforate 100 at these base 10 middle parts, the sidewall interference engagement of the ora terminalis of this net sheet 12 and this perforate 100 and being mounted on the base 10 wherein, and the bottom surface copline of the bottom surface of this net sheet 12 and this base 10 is provided with, and then loam cake 11 is positioned on this base 10, pass this loam cake 11 and base 10 corresponding first screws 101 by first screw 14,111, and this loam cake 11 is combined with base 10, compress the lateral margin of net sheet 12 with the part of this loam cake 11 in season in through hole 110 peripheries, and this net sheet 12 is located on circuit board 2 vertical direction, last again that handle 15 is sealed by second screw 112 of the screw thread of one end and loam cake 11, and this handle 15 is mounted on this loam cake 11.
During use, this paste-tin printing apparatus 1 is positioned over circuit board 2 surfaces, and it is corresponding with the welded gasket 20 on circuit board 2 surfaces, then tin cream is positioned in the through hole 110 of loam cake 11, and above net sheet 12,, make tin cream see through mesh 120 and be printed on the welded gasket 20 on circuit board 2 surfaces afterwards by a pressurizing unit (not shown) extruding tin cream, and after printing tin cream, by handle 15 this paste-tin printing apparatus 1 is taken off from the surface of circuit board 2.
Compared to prior art, the utility model is by an independent paste-tin printing apparatus 1 being set with the surface with paste solder printing and circuit board 2, therefore do not need labyrinth used in the prior art, therefore be highly suitable for changing behind the BGA electronic component in order to print solder paste on circuit board, to weld the BGA electronic component again.And this paste-tin printing apparatus 2 adopts base 10 and loam cake 11 separable structures, can be beneficial on the one hand and remove unnecessary tin cream, also can be beneficial to more draping sheet 12 on the other hand, with corresponding with the size of electronic component.
Claims (5)
1, a kind of paste-tin printing apparatus, be applied in the surperficial adhesion technology, in order to paste solder printing on the welded gasket of circuit board surface, it is characterized in that this paste-tin printing apparatus comprises: a base, this base is positioned over circuit board surface, and a perforate is offered at this base middle part; One net sheet is arranged in the perforate of base, and the sidewall interference engagement of this net sheet and this perforate, and the bottom surface copline of the bottom surface of this net sheet and base, and again, this net sheet has several mesh, with corresponding with the welded gasket of circuit board; One loam cake, this loam cake is combined on the base with removably, and this loam cake is provided with a through hole to perforate that should base, exposes with the mesh with the net sheet.
2, paste-tin printing apparatus as claimed in claim 1 is characterized in that: corresponding first screw that is provided with in edge of this loam cake and base, this loam cake and base pass this first screw and are combined into one by a screw.
3, paste-tin printing apparatus as claimed in claim 1 is characterized in that: this paste-tin printing apparatus also is provided with the leader, after on paste solder printing and circuit board, this paste-tin printing apparatus is taken off from circuit board.
4, paste-tin printing apparatus as claimed in claim 3 is characterized in that: this handle one end periphery is provided with screw thread, and this loam cake correspondence is provided with second screw, this handle by the screw thread of one end sealed with second screw in, cover and be mounted on.
5, as claim 1,2,3 or 4 described paste-tin printing apparatus, it is characterized in that: the via area of this loam cake is littler than the area of net sheet, so that when being combined in this loam cake on the base, the part of this loam cake adjacent through-holes just in time is pressed on the edge of net sheet, locatees thereby make the net sheet have on the vertical direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520046028 CN2838958Y (en) | 2005-10-28 | 2005-10-28 | Tin paste printer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520046028 CN2838958Y (en) | 2005-10-28 | 2005-10-28 | Tin paste printer |
Publications (1)
Publication Number | Publication Date |
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CN2838958Y true CN2838958Y (en) | 2006-11-22 |
Family
ID=37426944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200520046028 Expired - Fee Related CN2838958Y (en) | 2005-10-28 | 2005-10-28 | Tin paste printer |
Country Status (1)
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CN (1) | CN2838958Y (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101252815B (en) * | 2008-03-31 | 2010-06-09 | 广州金升阳科技有限公司 | Solder tray local tin plating method on circuit board |
CN103568500A (en) * | 2012-07-25 | 2014-02-12 | 上海斐讯数据通信技术有限公司 | Ball grid array chip printing fixture |
CN108012457A (en) * | 2018-01-19 | 2018-05-08 | 南京利景盛电子有限公司 | A kind of soft or hard compoboard double-sided bottom welds a reflux technique method |
CN111761151A (en) * | 2020-07-09 | 2020-10-13 | 陈星� | Solder paste printing device for chip processing |
CN113942293A (en) * | 2021-10-14 | 2022-01-18 | 浪潮商用机器有限公司 | Through-hole solder paste printing device |
CN115229295A (en) * | 2022-06-09 | 2022-10-25 | 上海移远通信技术股份有限公司 | Positioner and manual brush tin subassembly |
-
2005
- 2005-10-28 CN CN 200520046028 patent/CN2838958Y/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101252815B (en) * | 2008-03-31 | 2010-06-09 | 广州金升阳科技有限公司 | Solder tray local tin plating method on circuit board |
CN103568500A (en) * | 2012-07-25 | 2014-02-12 | 上海斐讯数据通信技术有限公司 | Ball grid array chip printing fixture |
CN108012457A (en) * | 2018-01-19 | 2018-05-08 | 南京利景盛电子有限公司 | A kind of soft or hard compoboard double-sided bottom welds a reflux technique method |
CN111761151A (en) * | 2020-07-09 | 2020-10-13 | 陈星� | Solder paste printing device for chip processing |
CN113942293A (en) * | 2021-10-14 | 2022-01-18 | 浪潮商用机器有限公司 | Through-hole solder paste printing device |
CN113942293B (en) * | 2021-10-14 | 2023-08-08 | 浪潮商用机器有限公司 | Through-hole solder paste printing device |
CN115229295A (en) * | 2022-06-09 | 2022-10-25 | 上海移远通信技术股份有限公司 | Positioner and manual brush tin subassembly |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061122 Termination date: 20091130 |