CN109244045A - A kind of thick film substrate miniaturization Can encapsulating structure - Google Patents
A kind of thick film substrate miniaturization Can encapsulating structure Download PDFInfo
- Publication number
- CN109244045A CN109244045A CN201811144181.XA CN201811144181A CN109244045A CN 109244045 A CN109244045 A CN 109244045A CN 201811144181 A CN201811144181 A CN 201811144181A CN 109244045 A CN109244045 A CN 109244045A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- thick film
- encapsulating structure
- ceramic substrate
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 79
- 239000000919 ceramic Substances 0.000 claims abstract description 55
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 11
- 238000005516 engineering process Methods 0.000 claims description 9
- 238000009966 trimming Methods 0.000 abstract description 9
- 238000012360 testing method Methods 0.000 abstract description 6
- 230000011218 segmentation Effects 0.000 abstract description 4
- 238000011056 performance test Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
The invention discloses a kind of thick film substrates to minimize Can encapsulating structure, and upper and lower two layers of pcb board of setting spacing is arranged on the pin of shell pedestal, and upper and lower two layers of pcb board is electrically connected by pin or contact pin；The upper or/and lower surface of upper and lower two layers of pcb board is equipped with element pasted on surface；A ceramic substrate is also welded in the upper surface of upper layer pcb board, and metal nut cap covers on shell pedestal, carries out air-tight packaging to two layers of pcb board.The present invention is printed on ceramic substrate the demanding circuit unit of resistance precision and resistance using thick-film technique, is conducive to the active trimming of resistance, easy to operate；The reasonable segmentation of circuit layout is conducive to the circuit performance test of every block of plate, reduces difficulty of test.
Description
Technical field
The present invention relates to a kind of thick film substrates to minimize Can encapsulating structure.
Background technique
Currently known thick film substrate assembles Can construction packages technology, and usually substrate front side carries out surface mounting component
Or the assembling of bare chip；Then substrate back realizes the fixation with shell, last shell and metal cover plate by way of bonding
Parallel seam welding is carried out, realizes the full air-tight packaging structure of Can.
Disadvantage: single substrate bonding Can encapsulation makes substrate back that can not be bonded component, only substrate front side into
The assembling of row surface mounting component or bare chip causes circuit level lower.
Summary of the invention
The purpose of the present invention is to provide a kind of thick film substrates to minimize Can encapsulating structure, can solve requirement electricity
The substrate package problem of the particular/special requirements such as precision height is hindered, while improving the integrated level of substrate package, it is difficult to reduce processing encapsulation
It spends, is easy to operate, reducing the difficulty of test of circuit performance.
Realize the technical solution of the object of the invention:
A kind of thick film substrate miniaturization Can encapsulating structure, characterized in that between being arranged setting on the pin of shell pedestal
Away from upper and lower two layers of pcb board, upper and lower two layers of pcb board be electrically connected by pin or contact pin；
Wherein, the upper or/and lower surface of upper and lower two layers of pcb board is equipped with element pasted on surface；It also welds the upper surface of upper layer pcb board
A ceramic substrate is connect,
Metal nut cap covers on shell pedestal, carries out air-tight packaging to two layers of pcb board.
Circuit on ceramic substrate is formed using thick film print technology or silk-screen printing technique.
Active device on ceramic substrate uses bare chip gold wire bonding.
Ceramic substrate is realized by way of silver-gilt copper wire or the welding of the area PAD and is electrically connected with upper layer pcb board.
Ceramic substrate passes through being electrically connected between conduction band side even realization front and back.
It is more than that the resistance thick film of setting accuracy is printed on the ceramic substrate on the pcb board of upper layer on lower layer's pcb board；Resistance
Both ends be welded on the pcb board of upper layer by silver-gilt copper wire, then be electrically connected by pin or contact pin with lower layer pcb board.
Pass through support ring constant spacing between upper and lower two layers of pcb board.
Support ring is arranged on pin between shell pedestal and lower layer's pcb board.
Upper and lower layer pcb board is set on the pin for being welded on shell pedestal by way of soldering.
In the one side of shell pedestal towards lower layer's pcb board, felt pad is set.
Advantages of the present invention are as follows:
1) the reasonable segmentation of circuit layout is conducive to the circuit performance test of every block of plate, reduces difficulty of test.
2) thick-film technique is all used to the demanding circuit unit of resistance precision and resistance in circuit, is printed on ceramic base
Be conducive to the active trimming of resistance on plate, bare chip gold wire bonding meets common process, easy to operate.
3) 2 layers of PCB printed board are sleeved on the pin of Can by way of soldering, and the assembling of pcb board uses tin
Surface mounting component is welded, common process is met, it is easy to operate.
4) ceramic substrate circuit module is soldered on pcb board as a device, it is simple to make assembling, and be able to achieve
The circuit module of high-precision requirement is realized using thick-film technique.
5) using ceramic substrate and printing plate Hybrid assembling in shell pedestal, shell pedestal passes through with metal nut cap
Laser Welding forms full air-tight packaging.
Detailed description of the invention
Fig. 1 is Can pedestal main view；
Fig. 2 is the side view of Fig. 1；
Fig. 3 is assembly structure figure；
Fig. 4 is the side view of Fig. 3.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.Following embodiment is only used for clearly illustrating the present invention
Technical solution, and not intended to limit the protection scope of the present invention.
In conjunction with Fig. 1-Fig. 4, in the present invention using ceramic substrate and printing plate Hybrid assembling in shell pedestal, pipe
Shell pedestal 1 forms full air-tight packaging by Laser Welding with metal nut cap 2.Thick film is set with printing plate miniaturization Can encapsulation
Meter technology is sleeved on the pin of shell pedestal in such a way that 2 layers of pcb board are by soldering, and the positive back side of lower layer's pcb board 3 is complete
Using Surface Mount part, the positive back side of upper layer pcb board 4 also uses Surface Mount part, and one piece of pottery is welded in the front (upper surface) of pcb board at the middle and upper levels
Porcelain substrate 5.Thick film print technology is used on ceramic substrate 5, using screen printing technique, active device uses bare chip spun gold key
It closes.By 6 constant spacing of support ring between two layers of pcb board, support ring 6 is sleeved on shell pedestal pin 11.Upper and lower layer pcb board
Between inner electrical connection be electrically connected by the pin 11 of soldering contact pin 7 and shell pedestal.Resistance requirement precision is high, needs
The circuit unit of active trimming is processed by the technique of ceramic substrate thick film screen printing, resistance trimming, while using bare chip spun gold
Bonding pattern improves integrated level.Ceramic substrate 5 is soldered on upper layer pcb board 4 as a device cell, passes through plating between the two
Silver-bearing copper silk 9 or the mode of the area PAD welding are realized to be electrically connected with the upper layer pcb board accepted, the electricity of ceramic substrate front and back
It learns connection and positive back wiring is even realized by ceramic substrate side.One piece of felt pad 8(is bonded optionally in the bottom surface of shell pedestal
Depending on), it prevents and surface mounting component short circuit.The full air-tight packaging of Can is realized finally by the mode of laser seam weld.
Invention complete procedure is described more fully below.
1 technical characterstic (the technical issues of solution)
1.1 technical solution features
1) this programme is the technique that Laser Welding is carried out using domestic mature Can pedestal and metal nut cap, its main feature is that: it can
By property height, shock resistance is easy to operate.
2) baseplate material uses Al2O3And the substrate of other materials, there is certain resistance to mechanical impact capacity, feature is
Selection is general.
3) it has selected thick film print technology and printed circuit board technology is all conventional process, processing easy to produce.
4) flexible design is modified, does over again conveniently, and technique difficulty of processing significantly reduces, and yield rate greatly improves.
5) structure for being suitable for the similar all Can pedestals of structure and metal nut cap encapsulation designs.
1.2 technological difficulties
1) circuit level is high, and density is big, and laying out pattern effective area only has the one third of general thick-film technique circuit, because
This is sleeved on shell pin using upper and lower layer pcb board, increases cloth plate suqare, improves integrated level.
2) it is equipped with precision resister in circuit and needs active trimming, therefore has the circuit part and resistance of required precision
Ceramic substrate thick film print technology must be used, while requiring to improve integrated level.In order to solve this problem, using thick film screen printing
Ceramic substrate and pcb board patch two ways carry out Hybrid assembling.
3) ceramic substrate uses thick film screen printing, and positive component uses bare chip gold wire bonding technique, high precision electro
Resistance uses silk-screen printing, is able to satisfy the requirement of resistance high-precision and online active trimming, improves integrated level.
4) ceramic substrate realizes positive back wiring, needs to realize by ceramic substrate side even printing；Ceramic substrate and pcb board
Between electricity interlinkage and fixed assembling, realize electricity interlinkage by way of the adhesion zone soldering of the ceramic substrate back side and be installed on
Pcb board.
5) it is electrically connected, can be realized using the silver-gilt copper wire soldering process of high reliablity between ceramic substrate and upper pcb board
It is electrically connected.
6) interconnect between upper layer PCB and lower layer's pcb board: shell area is small, and it is defeated that the pin on shell pedestal has been used as circuit
Foot out, interconnection between upper and lower two layers of pcb board is interconnected between two layers of pcb board by contact pin there are great difficulty, while utilizing shell
The pin interconnection of pedestal.
7) precision resister on lower layer's pcb board is printed on the ceramic substrate on the pcb board of upper layer.
8) precision resister needs thick film screen printing on ceramic substrate on lower layer's pcb board, and thick film ceramic substrate is tin
It is welded on the pcb board of upper layer, realization is electrically connected that there are difficulty.The precision resister both ends that thick film screen printing can be used pass through silver-plated copper
Silk is welded on the pcb board of upper layer, then is electrically connected by contact pin and lower layer PCB.
9) assembling must use new thinking.Shell submounts are bonded one layer of felt pad, and upper and lower layer PCB prints sleeve-board
On the pin of shell pedestal, the ceramic substrate of thick film screen printing uses the thick-film technique of gold wire bonding, and soldering is mounted on upper layer
On pcb board, interconnected between upper and lower layer pcb board by outer pin and contact pin.
10) design requirement difficulty of processing reduces, is easy to operate, so common technique must be selected to reach requirement.
2 technical solutions
Thick film and printing plate miniaturization Can encapsulation designing technique are the sets in such a way that 2 layers of PCB printed board are by soldering
On the pin 11 of Can, lower layer's pcb board uses Surface Mount part completely, also uses Surface Mount part on the pcb board of upper layer, welds above
Thick film screen printing resistance is used on the ceramic substrate connect, active device uses bare chip gold wire bonding.Pass through between two layers of PCB printed board
Support ring constant spacing, inner electrical connection being attached by soldering contact pin between pcb board.Resistance requirement precision is high, needs
The circuit unit and resistance of active trimming processed by the technique of ceramic substrate thick film screen printing, resistance trimming, while using naked
Chip gold wire bonding mode improves integrated level.Ceramic substrate is soldered on pcb board as a device cell, is passed through between the two
Silver-gilt copper wire and the mode of the area PAD welding realize it is Nian Jie and be electrically connected with the PCB printed board of undertaking, the positive back side of ceramic substrate
It is electrically connected and positive back wiring is even realized by ceramic substrate side.The full gas of Can is realized finally by the mode of laser seam weld
Close property encapsulation.Specifically use following design scheme.
1) segmentation of circuit layout
For the ease of test, the unit of upper and lower two pieces of PCB printed boards is split by respective functional block as far as possible, is conducive to every
The test of block plate.The demanding circuit unit of resistance precision is printed on ceramic substrate, and ceramic substrate can be connected by conduction band side
It is printed onto the ceramic substrate back side, then is electrically connected with the upper layer pcb board welding of undertaking, the upper layer in shell is mounted on.It is right
There is a small amount of resistance with high accuracy to be also printed on ceramic substrate in the circuit unit that lower layer is entirely the pcb board of Surface Mount part, electricity
Resistance both ends are connected to the upper PCB circuit board of undertaking by welding silver-gilt copper wire, are carried out by contact pin together with realization between two circuit boards
The electrical functions of circuit, had both solved the testability of circuit in this way, also can solve the resistance debugging function of high-precision circuit unit
Energy.
2) layout of ceramic substrate
The demanding circuit unit of resistance precision is printed on ceramic substrate, even can be printed onto the ceramic substrate back side by side,
It is attached again with the welding of the upper layer pcb board of undertaking, is mounted on the upper layer of shell.It is entirely the pcb board of Surface Mount part for lower layer
Circuit unit in there is a small amount of resistance with high accuracy to be also printed on ceramic substrate, resistance both ends are connected to by welding silver-gilt copper wire
The upper layer pcb board of undertaking is connected between two pcb boards by contact pin, realizes the electrical functions of circuit.
3) mode of communicating between upper and lower layer pcb board
Upper layer and lower layer pcb board is sleeved on the pin of shell pedestal by through-hole, and pin had both been used as output function foot, is also used as 2
A PCB circuit inner electrical interface channel.Inner electrical connection is also electrically connected by punching, welding contact pin between PCB.
4) encapsulating package
Can includes shell pedestal and metal nut cap.As shown in Figure 1 and Figure 2, shell pedestal is to draw with 2 row's dual-in-lines
The platform of foot, platform edges have a narrow short step along surrounding, for carrying out laser seam weld with metal nut cap.Metal nut cap is
Be open cuboid cavity on one side, is welded together with shell pedestal, forms air-tight packaging.
5) assembling structure
The support ring for being used to support lower layer's pcb board is arranged on shell pedestal pin.Suit, soldering lower layer on the pin of shell pedestal
Pcb board can put one layer of insulation material backing strap or not place insulating materials according to the actual situation between lower layer's pcb board and shell pedestal
Pad；Support ring, the contact pin of welding two layers of pcb board spacing of isolation are covered on pin again；Upper layer pcb board is set with again, is soldered to and draws
On foot and contact pin, upper layer pcb board lower surface is all surface mounting component, upper surface soldering surface mounting component and ceramic substrate, ceramic base
Thick film print technology and gold wire bonding technique are used on plate, are electrically connected between ceramic substrate and upper layer pcb board and are passed through silver-gilt copper wire
Metal nut cap, is finally laser-welded on shell pedestal by soldering or other connection types, forms air-tight packaging.Assembling structure
Figure such as Fig. 2.
3 technological merits (beneficial effect)
1) the reasonable segmentation of circuit layout is conducive to the circuit performance test of every block of plate, reduces difficulty of test.
2) thick-film technique is all used to the demanding circuit unit of resistance precision and resistance in circuit, is printed on ceramic base
Be conducive to the active trimming of resistance on plate, bare chip gold wire bonding meets common process, easy to operate.
3) 2 layers of PCB printed board are sleeved on the pin of Can by way of soldering, and the assembling of pcb board uses tin
Surface mounting component is welded, common process is met, it is easy to operate.
4) ceramic substrate circuit module is soldered on the pcb board of upper layer as a device, keeps assembling simple, and can be real
The circuit module of existing high-precision requirement is realized using thick-film technique.
5) using ceramic substrate and printing plate Hybrid assembling in shell pedestal, shell pedestal passes through with metal nut cap
Laser Welding forms full air-tight packaging.
4 process parameters designs
1) adhesives: the material of conductive epoxy H37MP, H20E or suitable performance；
Solder(ing) paste RHG55-OF-2063 or NC-62-90A
2) connecting material: spun gold, silver-gilt copper wire, contact pin or suitable performance material；
3) shell pedestal: gold-plated or nickel plating the material product for cutting down steel or suitable performance；
4) substrate: ceramic substrate and pcb board.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvement and deformations can also be made, these improvement and deformations
Also it should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of thick film substrate minimizes Can encapsulating structure, characterized in that be arranged setting on the pin of shell pedestal
Upper and lower two layers of pcb board of spacing, upper and lower two layers of pcb board are electrically connected by pin or contact pin；
Wherein, the upper or/and lower surface of upper and lower two layers of pcb board is equipped with element pasted on surface；It also welds the upper surface of upper layer pcb board
A ceramic substrate is connect,
Metal nut cap covers on shell pedestal, carries out air-tight packaging to two layers of pcb board.
2. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that ceramic substrate
On circuit formed using thick film print technology or silk-screen printing technique.
3. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that ceramic substrate
On active device use bare chip gold wire bonding.
4. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that ceramic substrate
It is realized by way of silver-gilt copper wire or the welding of the area PAD and is electrically connected with upper layer pcb board.
5. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that ceramic substrate
Pass through being electrically connected between conduction band side even realization front and back.
6. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that lower layer PCB
It is more than that the resistance thick film of setting accuracy is printed on the ceramic substrate on the pcb board of upper layer on plate；The both ends of resistance pass through silver-plated
Copper wire is welded on the pcb board of upper layer, then is electrically connected by pin or contact pin with lower layer pcb board.
7. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that upper and lower two
Pass through support ring constant spacing between layer pcb board.
8. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that shell pedestal
Support ring is arranged on pin between lower layer's pcb board.
9. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that upper and lower layer
Pcb board is set on the pin for being welded on shell pedestal by way of soldering.
10. a kind of thick film substrate according to claim 1 minimizes Can encapsulating structure, characterized in that in shell
Felt pad is arranged in the one side of pedestal towards lower layer's pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811144181.XA CN109244045B (en) | 2018-09-29 | 2018-09-29 | Miniaturized metal tube shell packaging structure of thick film substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811144181.XA CN109244045B (en) | 2018-09-29 | 2018-09-29 | Miniaturized metal tube shell packaging structure of thick film substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109244045A true CN109244045A (en) | 2019-01-18 |
| CN109244045B CN109244045B (en) | 2024-04-05 |
Family
ID=65054494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811144181.XA Active CN109244045B (en) | 2018-09-29 | 2018-09-29 | Miniaturized metal tube shell packaging structure of thick film substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109244045B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110225656A (en) * | 2019-06-06 | 2019-09-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | A kind of assemble method minimizing printing plate |
| CN110429009A (en) * | 2019-08-30 | 2019-11-08 | 桂林航天电子有限公司 | A kind of 2 class solid-state relays of staggered floor construction |
| CN110544673A (en) * | 2019-09-12 | 2019-12-06 | 西安电子科技大学 | Multilayer fused three-dimensional system integrated structure |
| CN110581124A (en) * | 2019-09-12 | 2019-12-17 | 西安电子科技大学 | preparation method of multi-level fused three-dimensional system integrated structure |
| CN111653526A (en) * | 2020-03-24 | 2020-09-11 | 鑫金微半导体(深圳)有限公司 | SiP 3-dimensional packaging and processing method of high-power hybrid semiconductor integrated circuit |
| CN113690677A (en) * | 2021-08-27 | 2021-11-23 | 中国电子科技集团公司第十四研究所 | Hybrid integrated power module capable of being plugged and unplugged quickly |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05114689A (en) * | 1991-10-23 | 1993-05-07 | Mitsubishi Electric Corp | Integrated circuit device |
| JPH0645516A (en) * | 1992-07-27 | 1994-02-18 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| CN1371238A (en) * | 2001-02-27 | 2002-09-25 | Lg电子株式会社 | Integrated module |
| JP2003309372A (en) * | 2002-04-17 | 2003-10-31 | Hitachi Ltd | Thick-film multilayer wiring board |
| US20040089943A1 (en) * | 2002-11-07 | 2004-05-13 | Masato Kirigaya | Electronic control device and method for manufacturing the same |
| US20050258913A1 (en) * | 2004-05-19 | 2005-11-24 | Manabu Ito | Constant temperature type crystal oscillator |
| JP2007012772A (en) * | 2005-06-29 | 2007-01-18 | Nichicon Corp | Hybrid integrated circuit board |
| JP2007317968A (en) * | 2006-05-26 | 2007-12-06 | Denso Corp | Electronic control device |
| CN101783649A (en) * | 2008-12-25 | 2010-07-21 | 日本电波工业株式会社 | Oven controlled multistage crystal oscillator |
| US20180013386A1 (en) * | 2016-07-07 | 2018-01-11 | Nihon Dempa Kogyo Co., Ltd. | Oven-controlled crystal oscillator |
| CN208848880U (en) * | 2018-09-29 | 2019-05-10 | 北方电子研究院安徽有限公司 | A kind of thick film substrate miniaturization Can encapsulating structure |
-
2018
- 2018-09-29 CN CN201811144181.XA patent/CN109244045B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05114689A (en) * | 1991-10-23 | 1993-05-07 | Mitsubishi Electric Corp | Integrated circuit device |
| JPH0645516A (en) * | 1992-07-27 | 1994-02-18 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| CN1371238A (en) * | 2001-02-27 | 2002-09-25 | Lg电子株式会社 | Integrated module |
| JP2003309372A (en) * | 2002-04-17 | 2003-10-31 | Hitachi Ltd | Thick-film multilayer wiring board |
| US20040089943A1 (en) * | 2002-11-07 | 2004-05-13 | Masato Kirigaya | Electronic control device and method for manufacturing the same |
| US20050258913A1 (en) * | 2004-05-19 | 2005-11-24 | Manabu Ito | Constant temperature type crystal oscillator |
| JP2007012772A (en) * | 2005-06-29 | 2007-01-18 | Nichicon Corp | Hybrid integrated circuit board |
| JP2007317968A (en) * | 2006-05-26 | 2007-12-06 | Denso Corp | Electronic control device |
| CN101783649A (en) * | 2008-12-25 | 2010-07-21 | 日本电波工业株式会社 | Oven controlled multistage crystal oscillator |
| US20180013386A1 (en) * | 2016-07-07 | 2018-01-11 | Nihon Dempa Kogyo Co., Ltd. | Oven-controlled crystal oscillator |
| CN208848880U (en) * | 2018-09-29 | 2019-05-10 | 北方电子研究院安徽有限公司 | A kind of thick film substrate miniaturization Can encapsulating structure |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110225656A (en) * | 2019-06-06 | 2019-09-10 | 中国兵器工业集团第二一四研究所苏州研发中心 | A kind of assemble method minimizing printing plate |
| CN110429009A (en) * | 2019-08-30 | 2019-11-08 | 桂林航天电子有限公司 | A kind of 2 class solid-state relays of staggered floor construction |
| CN110429009B (en) * | 2019-08-30 | 2024-03-29 | 桂林航天电子有限公司 | 2-type solid relay with staggered structure |
| CN110544673A (en) * | 2019-09-12 | 2019-12-06 | 西安电子科技大学 | Multilayer fused three-dimensional system integrated structure |
| CN110581124A (en) * | 2019-09-12 | 2019-12-17 | 西安电子科技大学 | preparation method of multi-level fused three-dimensional system integrated structure |
| CN110581124B (en) * | 2019-09-12 | 2021-03-19 | 西安电子科技大学 | Preparation method of multi-level fused three-dimensional system integrated structure |
| CN110544673B (en) * | 2019-09-12 | 2021-03-19 | 西安电子科技大学 | Multilayer fused three-dimensional system integrated structure |
| CN111653526A (en) * | 2020-03-24 | 2020-09-11 | 鑫金微半导体(深圳)有限公司 | SiP 3-dimensional packaging and processing method of high-power hybrid semiconductor integrated circuit |
| CN113690677A (en) * | 2021-08-27 | 2021-11-23 | 中国电子科技集团公司第十四研究所 | Hybrid integrated power module capable of being plugged and unplugged quickly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109244045B (en) | 2024-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109244045A (en) | A kind of thick film substrate miniaturization Can encapsulating structure | |
| US5438478A (en) | Electronic component carriers and method of producing the same as well as electronic devices | |
| US20040150097A1 (en) | Optimized conductive lid mounting for integrated circuit chip carriers | |
| WO1994005038A1 (en) | Metal electronic package incorporating a multi-chip module | |
| CN100527412C (en) | Electronic circuit module and method for fabrication thereof | |
| CN106463470A (en) | Wiring board, electronic device, and electronic module | |
| US20070126107A1 (en) | Multi-chip semiconductor connector assembly method | |
| CN101179034A (en) | Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component | |
| CN208848880U (en) | A kind of thick film substrate miniaturization Can encapsulating structure | |
| CN102142416A (en) | Device mounting board, semiconductor module and portable apparatus | |
| CN104617910B (en) | Quartz crystal | |
| JPS58128754A (en) | Hybrid integrated circuit | |
| US8253239B2 (en) | Multi-chip semiconductor connector | |
| JP3847839B2 (en) | Semiconductor device | |
| CN101866889A (en) | Substrate-free chip packaging and manufacturing method thereof | |
| CN110225656A (en) | A kind of assemble method minimizing printing plate | |
| CN218039190U (en) | Double-sided packaging product | |
| CN114373740B (en) | Electromagnetic shielding packaging structure, electronic device module and manufacturing method thereof | |
| CN214176018U (en) | Power semiconductor packaging structure | |
| CN218299820U (en) | Packaging structure and semiconductor product using same | |
| CN108447632B (en) | Surface mounting type semiconductor resistor bridge packaging structure | |
| JP2003338579A (en) | Wiring board with radiator plate | |
| JPH08274250A (en) | Semiconductor device | |
| JP2017079258A (en) | Electronic part-mounting board and electronic device | |
| JPH0258257A (en) | Semiconductor package with leads |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 233040 No.10 Caiyuan Road, Bengbu City, Anhui Province Patentee after: Anhui North Microelectronics Research Institute Group Co.,Ltd. Country or region after: China Address before: 233040 No.10 Caiyuan Road, Bengbu City, Anhui Province Patentee before: NORTH ELECTRON RESEARCH INSTITUTE ANHUI Co.,Ltd. Country or region before: China |