CN113690677A - Hybrid integrated power module capable of being plugged and unplugged quickly - Google Patents
Hybrid integrated power module capable of being plugged and unplugged quickly Download PDFInfo
- Publication number
- CN113690677A CN113690677A CN202110999999.5A CN202110999999A CN113690677A CN 113690677 A CN113690677 A CN 113690677A CN 202110999999 A CN202110999999 A CN 202110999999A CN 113690677 A CN113690677 A CN 113690677A
- Authority
- CN
- China
- Prior art keywords
- power module
- circuit
- ceramic plate
- metal shell
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a hybrid integrated power module capable of being quickly plugged and unplugged, wherein a socket is welded by using a circuit, the power module comprises a ceramic plate and contact pins, the contact pins are meshed with the socket, the quick plugging and the disconnection are realized, the contact pins are welded on the outer surface of the ceramic plate, the ceramic plate is provided with through holes, circuit patterns are printed on the through holes and the inner surface, the inner surface of the ceramic plate bears surface-mounted components to form a power circuit, the integrity is realized, the contact pins are connected with the surface-mounted components through the circuit patterns, a metal shell is grooved, the ceramic plate is arranged on the inner surface of the metal shell, the contact pins penetrate through the grooves, a cover plate and the side surface of the metal shell are welded to form an integrated portable power module, the connection is more reliable, the metal shell is provided with mounting holes, fastening screws penetrate through the mounting holes to fix the power module on the power circuit, the looseness is not easy to occur, and the number and the arrangement of the contact pins are designed according to the power circuit, the module can be expanded and adjusted to meet the requirements of different power utilization circuits, has diversification and compatibility, and has multiple functions.
Description
Technical Field
The invention belongs to the technical field of electrical structures, and particularly relates to an electrical interface structure technology.
Background
Along with the development of electronic systems towards miniaturization and integration, hybrid integrated circuits have more and more demands and applications for power modules.
The circuit board of the hybrid integrated power module is mostly manufactured by using low-temperature co-fired ceramic, high-temperature co-fired ceramic or alumina ceramic plate and the like, and is sealed by adopting an all-metal shell. The input pin and the output pin of the hybrid integrated power supply modules are metal columns, and glass insulators are adopted to be fixed on a metal shell. And wires need to be welded on the metal posts, or the metal posts are welded on a printed circuit board, so that signals of the hybrid integrated power module are led out. If the hybrid integrated power module is to be taken down after welding, the metal column needs to be desoldered first.
For electronic systems with small size and high integration density, the desoldering operation is limited by space, difficult to implement, and inconvenient for maintenance, repair, and replacement of the hybrid integrated power module.
In the patent of the hybrid integrated circuit module based on the low-temperature co-fired ceramic technology and the manufacturing method thereof, the output pins are sintered on the metal posts on the shell, and the metal posts are also in a welding mode when in use, so that the module is inconvenient to rapidly assemble and replace.
The patent hybrid integrated circuit device internally improves the space utilization rate of the module through layering, and the output pins are also metal columns sintered on the shell and also need to be welded in application.
Along with the application requirements of miniaturization and integration, the hybrid integrated power module needs to be improved in design so as to realize quick and convenient plugging of the hybrid integrated power module.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a hybrid integrated power module capable of being plugged and unplugged quickly, pins are welded on a ceramic plate of a hybrid integrated circuit to serve as pins and are connected with a matched socket in a plugging and unplugging manner, and in order to achieve the purpose, the invention adopts the following technical scheme.
The power module comprises a ceramic plate and a contact pin, the contact pin is meshed with the socket, the contact pin is welded on the outer surface of the ceramic plate and serves as an input pin and an output pin, a via hole is formed in the ceramic plate, circuit patterns are printed on the via hole and the inner surface, the contact pin circuit patterns are connected with a power circuit, and the power circuit supplies power to a power circuit through the contact pin and the socket.
Furthermore, the power circuit is formed by surface-mounted components, the surface-mounted components are borne on the inner surface of the ceramic plate and have integrity, and the contact pins are connected with the surface-mounted components through circuit patterns.
The power module further comprises a metal shell and a cover plate, the metal shell is grooved, the size of the groove opening is slightly smaller than that of the ceramic plate, the ceramic plate is installed on the inner surface of the metal shell, the contact pin penetrates out of the groove opening, and the cover plate is welded with the side face of the metal shell and packaged into an integrated portable power module.
Furthermore, the number and arrangement of the contact pins can be expanded and adjusted according to the design of the power circuit so as to meet the requirements of different power circuits, and the multifunctional power circuit has diversification and compatibility and one module has multiple functions.
The metal shell is provided with a mounting hole, and a fastening screw penetrates through the mounting hole to fix the power supply module on the power supply circuit, so that the power supply module is not easy to loosen.
The invention has the beneficial effects that: the power supply is realized by the mode of the contact pins and the socket, the quick plugging and unplugging are realized together with the disconnection, the replacement is directly disassembled in the process of maintenance and detection, the power circuit is moved to the ceramic plate, the integrity is good, the number and the arrangement of the contact pins are adjustable, different input and output signal combinations are connected, the diversity and the compatibility are realized, the metal shell is packaged and fixed, and the connection is more reliable.
Drawings
Fig. 1 is a module package diagram, and fig. 2 is a structural layout diagram.
Reference numerals: the circuit board comprises a ceramic plate 1, a pin 2, a metal shell 3-1, a metal shell 3-2, a mounting hole 4, a cover plate 5, a surface-mounted component 6, a circuit pattern 7 and a via hole 8.
Detailed Description
The technical scheme of the invention is specifically explained in the following by combining the attached drawings.
The module is packaged as shown in figure 1, a metal shell is grooved, the size of a groove opening is slightly smaller than that of a ceramic plate 1, the ceramic plate 1 is installed inside the surface 3-1 of the metal shell, a pin 2 penetrates out of the groove opening, a cover plate 5 is welded with the side surface 3-2 of the metal shell, a power circuit is packaged inside the metal shell, the metal shell is provided with a mounting hole 4, a power supply module is connected with a power circuit through the pin and a socket, and then penetrates through the mounting hole 4 through a fastening screw to fix the power supply module on the power circuit.
The structure of the module is as shown in fig. 2, the pin 2 is welded on the outer surface of the ceramic plate 1, the power circuit is designed by adopting a surface-mounted component 6, the inner surface of the ceramic plate 1 bears the surface-mounted component 6, the ceramic plate 1 is designed with a via hole 8, the via hole 8 and the inner surface of the ceramic plate 1 are printed with a circuit pattern 7, and the pin 2 is used as an input/output pin and is connected with the surface-mounted component 6 through the circuit pattern 7.
The socket is welded on the electric circuit, the pin 2 is engaged with the socket, and the power circuit supplies power to the electric circuit through the pin and the socket.
The above-described embodiments are not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention are included in the scope of the present invention.
Claims (5)
1. The utility model provides a hybrid integrated power module of quick plug, with circuit welding socket which characterized in that includes: the ceramic plate is provided with through holes, circuit patterns are printed on the inner surfaces of the through holes and the ceramic plate, the contact pins are connected with a power circuit, and the power circuit supplies power to a power circuit through the contact pins and the socket.
2. The fast pluggable hybrid integrated power module of claim 1, wherein the power circuit is formed by surface mount components, the surface of the ceramic board carries the surface mount components, and the pins are connected to the surface mount components through the circuit pattern.
3. The fast-pluggable hybrid integrated power module according to claim 1 or 2, further comprising: the metal shell is grooved, the size of the groove opening is slightly smaller than that of the ceramic plate, the ceramic plate is installed on the inner surface of the metal shell, the contact pin penetrates out of the groove opening, and the cover plate is welded with the side face of the metal shell and packaged into the power module.
4. The fast-pluggable hybrid integrated power module of claim 3, wherein the number and arrangement of the pins are scalable and adjustable according to the design of the power circuit.
5. The fast-pluggable hybrid integrated power module of claim 4, wherein the metal housing is provided with mounting holes, and fastening screws are inserted through the mounting holes to fix the power module to the power circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110999999.5A CN113690677A (en) | 2021-08-27 | 2021-08-27 | Hybrid integrated power module capable of being plugged and unplugged quickly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110999999.5A CN113690677A (en) | 2021-08-27 | 2021-08-27 | Hybrid integrated power module capable of being plugged and unplugged quickly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113690677A true CN113690677A (en) | 2021-11-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110999999.5A Pending CN113690677A (en) | 2021-08-27 | 2021-08-27 | Hybrid integrated power module capable of being plugged and unplugged quickly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113690677A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364125A (en) * | 2021-12-31 | 2022-04-15 | 中国电子科技集团公司第十四研究所 | Thick film hybrid integrated circuit with devices arranged on two sides and production method thereof |
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| CN204010980U (en) * | 2014-06-24 | 2014-12-10 | 乐清市浙南机电有限公司 | Transformer |
| CN105172400A (en) * | 2015-10-27 | 2015-12-23 | 华东光电集成器件研究所 | Method for silk-screen printing of different film thicknesses |
| CN105428460A (en) * | 2015-12-17 | 2016-03-23 | 湖北捷讯光电有限公司 | Electric packaging method for photoelectric device |
| US20160139439A1 (en) * | 2014-11-17 | 2016-05-19 | Boe Technology Group Co., Ltd. | Lighting-on apparatus |
| CN105845814A (en) * | 2016-05-04 | 2016-08-10 | 华中科技大学 | Ultraviolet LED packaging structure and manufacturing method thereof |
| CN109244045A (en) * | 2018-09-29 | 2019-01-18 | 北方电子研究院安徽有限公司 | A kind of thick film substrate miniaturization Can encapsulating structure |
| CN111669888A (en) * | 2019-03-06 | 2020-09-15 | 立诚光电股份有限公司 | Three-dimensional circuit structure and process for optical device |
| CN211531415U (en) * | 2019-12-18 | 2020-09-18 | 西安博航电子有限公司 | High-reliability miniaturized thick film circuit module |
-
2021
- 2021-08-27 CN CN202110999999.5A patent/CN113690677A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204010980U (en) * | 2014-06-24 | 2014-12-10 | 乐清市浙南机电有限公司 | Transformer |
| US20160139439A1 (en) * | 2014-11-17 | 2016-05-19 | Boe Technology Group Co., Ltd. | Lighting-on apparatus |
| CN105172400A (en) * | 2015-10-27 | 2015-12-23 | 华东光电集成器件研究所 | Method for silk-screen printing of different film thicknesses |
| CN105428460A (en) * | 2015-12-17 | 2016-03-23 | 湖北捷讯光电有限公司 | Electric packaging method for photoelectric device |
| CN105845814A (en) * | 2016-05-04 | 2016-08-10 | 华中科技大学 | Ultraviolet LED packaging structure and manufacturing method thereof |
| CN109244045A (en) * | 2018-09-29 | 2019-01-18 | 北方电子研究院安徽有限公司 | A kind of thick film substrate miniaturization Can encapsulating structure |
| CN111669888A (en) * | 2019-03-06 | 2020-09-15 | 立诚光电股份有限公司 | Three-dimensional circuit structure and process for optical device |
| CN211531415U (en) * | 2019-12-18 | 2020-09-18 | 西安博航电子有限公司 | High-reliability miniaturized thick film circuit module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364125A (en) * | 2021-12-31 | 2022-04-15 | 中国电子科技集团公司第十四研究所 | Thick film hybrid integrated circuit with devices arranged on two sides and production method thereof |
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