CN112968587A - Power supply structure - Google Patents
Power supply structure Download PDFInfo
- Publication number
- CN112968587A CN112968587A CN202110144142.5A CN202110144142A CN112968587A CN 112968587 A CN112968587 A CN 112968587A CN 202110144142 A CN202110144142 A CN 202110144142A CN 112968587 A CN112968587 A CN 112968587A
- Authority
- CN
- China
- Prior art keywords
- transformer
- patch
- power supply
- pcba
- supply structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Abstract
The invention discloses a power supply structure, comprising: the electronic component assembly comprises a shell and a PCBA assembly, wherein the PCBA assembly comprises an electronic component, a patch transformer and a power module pin extending out of the shell; the electronic component and the surface mounted transformer are respectively arranged on a PCB to form the PCBA assembly; one end of the power module pin is connected with the circuit of the PCBA component, and the other end of the power module pin is used as a free end and extends out of the shell; and the patch pin of the patch transformer is connected with a corresponding circuit in the PCBA component. This application changes traditional magnetic ring transformer into paster transformer, has overcome the magnetic ring transformer and need pass through the shortcoming of flatiron manual welding magnetic ring transformer's lead wire, through setting up paster transformer, can realize paster transformer's subsides through automatic paster technique to improve degree of automation, save the cost of labor.
Description
Technical Field
The invention relates to the technical field of power modules, in particular to a power structure.
Background
In a traditional micropower power supply structure, a transformer on a PCBA assembly is a magnetic ring transformer, the transformer is generally provided with 6 or 9 lead ends, in order to realize an electrical function, leads of the magnetic ring transformer need to be welded with a bonding pad on the PCBA, and the traditional procedure is that an operator uses a soldering iron to weld. The thin wires are manually soldered by a soldering iron due to the thin wires, and the soldering time is long.
There is a need for a power supply architecture that overcomes the above-mentioned problems.
Disclosure of Invention
The invention provides a power supply structure which is used for solving the problems that in the prior art, a lead of a magnetic ring transformer is thin, the lead of the magnetic ring transformer needs to be welded manually by a soldering iron, and the welding working hour is long.
The present invention provides a power supply structure, comprising: the electronic component assembly comprises a shell and a PCBA assembly, wherein the PCBA assembly comprises an electronic component, a patch transformer and a power module pin extending out of the shell;
the electronic component and the surface mounted transformer are respectively arranged on a PCB to form the PCBA assembly;
one end of the power module pin is connected with the circuit of the PCBA component, and the other end of the power module pin is used as a free end and extends out of the shell;
and the patch pin of the patch transformer is connected with a corresponding circuit in the PCBA component.
Optionally, the patch transformer includes a transformer housing and a magnetic ring transformer disposed in the transformer housing, and pins of the magnetic ring transformer are connected to patch pins of the patch transformer.
Optionally, the patch transformer is disposed on the PCBA assembly on a side opposite the electronic component.
Optionally, the number of the patch pins is 4 or more than 4.
Optionally, the shape of the patch transformer includes one or a combination of the following shapes: cube, cuboid, cylinder.
Optionally, when the patch transformer is in the shape of a cylinder, patch pins are arranged on the bottom surface of the cylinder.
Optionally, the chip transformer is attached to the PCBA assembly in an automatic chip attachment manner;
specifically, the patch pins of the patch transformer are attached to the PCBA assembly.
Optionally, the patch transformer is disposed on a PCBA assembly on the same side as the electronic component.
Optionally, the power supply structure is suitable for a micro-power supply device.
Optionally, after the power module in the power structure is started, the power module is in a working state;
calculating an average value of the power conversion efficiency of the power module by the following formula:
α(j)＝A*T1(j)+B*H1(j)
β(j)＝A*T2(j)+B*H2(j)
γ(j)＝A*Tn(j)+B*Hn(j)
wherein the content of the first and second substances,
the average value of the electric energy conversion efficiency is obtained; t is t0、t1、t2、tn-1、tnRespectively representing the working time of the power supply module; p1(i) Is t0To t1Output power of time period, P2(i) Is t1To t2Output power of time period, Pn(i) Is tn-1To tnThe output power of the time period, P is the rated power; α (j) is t0To t1Environmental parameter of time period, beta (j) being t1To t2Environmental parameter of time period, gamma (j) being tn-1To tnAn environmental parameter of a time period; a and B respectively represent empirical coefficients, wherein the value of A is 0.2-0.5, and the value of B is 0.1-0.4; t is1(j) Is t0To t1Average temperature of time period, T2(j) Is t1To t2Average temperature of time period, Tn(j) Is tn-1To tnAverage temperature over a period of time; h1(j) Is t0To t1Average humidity of the time period H2(j) Is t1To t2Average humidity of the time period Hn(j) Is tn-1To tnAverage humidity over a period of time; n is the total number of divided time periods;
determining a loss value delta according to the average value of the electric energy conversion efficiency:
and when the loss value is less than or equal to a preset threshold value, replacing the patch transformer.
The invention provides a power supply structure, which changes the traditional magnetic ring transformer into a patch transformer, overcomes the defect that the magnetic ring transformer needs to manually weld the lead of the magnetic ring transformer by a soldering iron, and can realize the surface mounting of the patch transformer by an automatic surface mounting technology by arranging the patch transformer, thereby improving the automation degree and saving the labor cost. Meanwhile, all devices in the PCBA assembly can be changed into surface mount devices, and a surface mount machine (SMT) can be used for completely assembling the devices in the product assembling process, so that the automation degree is improved, and the labor cost is saved; on the other hand, the transformer lead wire of the traditional mode is thin, mechanical external force which is pulled can be generated in the manual assembly process, the thin transformer winding pin is easily pulled and torn off, and the quality hidden danger in the production process is increased. The scheme of the embodiment fundamentally avoids the problems.
In addition, the PCBA component is integrated through the surface mount technology, and the PCBA component has the characteristics of high density, high reliability, designability, producibility, testability, assemblability, maintainability and the like. In large-scale and ultra-large-scale electronic packaging components, an effective chip carrier is provided for the chip packaging of the miniaturization of the electronic components.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of a split structure of a power supply structure according to an embodiment of the invention;
fig. 2 is a schematic diagram of a combined structure of a power supply structure in an embodiment of the invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example 1:
an embodiment of the present invention provides a power supply structure, and fig. 1 is a schematic diagram of a split structure of a power supply structure in an embodiment of the present invention; fig. 2 is a schematic diagram of a combined structure of a power supply structure in an embodiment of the invention. With reference to fig. 1 and 2, the power supply structure includes: a housing 101 and a PCBA assembly 102, the PCBA assembly 102 including electronics 102-1, a patch transformer 102-2, and a power module pin 102-3 extending from the housing;
the electronic component 102-1 and the patch transformer 102-2 are respectively arranged on a PCB to form the PCBA assembly 102;
the power module pin 102-3 has one end connected to the circuitry of the PCBA assembly 102 and another end extending from the housing 101 as a free end;
the patch pin 102-2-1 of the patch transformer 102-2 is connected to corresponding circuitry in the PCBA assembly 102.
The working principle of the technical scheme is as follows: in the embodiment, the traditional magnetic ring transformer is changed into the patch transformer 102-2, the defect that the magnetic ring transformer needs to be manually welded with a lead wire through a soldering iron is overcome, and the patch transformer 102-2 can be mounted through an automatic patch technology by arranging the patch transformer 102-2, so that the automation degree is improved, and the labor cost is saved.
The various components of the power supply arrangement are described and illustrated separately below.
PCBA is short for English Printed Circuit Board Assembly, that is, the PCB is formed by mounting electronic components on the PCB by SMT technology or by the whole process of DIP plug-in, which belongs to a writing method commonly used in China.
SMT is a Surface mount Technology (abbreviated as Surface Mounted Technology) which is the most popular Technology and process in the electronic assembly industry.
The PCB is a printed circuit board (also called PCB) or Printed Circuit Board (PCB), often abbreviated as PCB (printed circuit board), and may be called an important electronic component, and is also a support for electronic components and a provider for connecting lines of the electronic component 102-1.
The housing is used for packaging the PCBA component 102, and through packaging, damage of the external environment to the PCBA component 102 is reduced, the service life of the PCBA component 102 is prolonged, and meanwhile, the safety of a power supply structure is also improved.
The PCBA assembly 102 includes electronics 102-1, a patch transformer 102-2, and power module pins 102-3 extending from the housing.
The electronic component 102-1, in combination with printed circuitry in the PCBA assembly 102, performs the corresponding functions of the power supply structure.
The power module pin 102-3 extends from the housing, with one end of the power module pin 102-3 being connected to the circuitry of the PCBA assembly 102 and the other end extending as a free end from the housing for connection to an external device.
The electronic component 102-1 and the patch transformer 102-2 are respectively disposed on a PCB to form the PCBA assembly 102, and are disposed on the PCB to form the PCBA assembly 102 by a general patch technology.
To be noted, the patch pin 102-2-1 of the patch transformer 102-2 is connected to a corresponding circuit in the PCBA assembly 102, and the voltage transformation function of the power supply structure is realized through the corresponding circuit connection in the PCBA assembly 102.
The beneficial effects of the above technical scheme are: in the embodiment, the traditional magnetic ring transformer is changed into the patch transformer 102-2, the defect that the magnetic ring transformer needs to be manually welded with a lead wire through a soldering iron is overcome, and the patch transformer 102-2 can be mounted through an automatic patch technology by arranging the patch transformer 102-2, so that the automation degree is improved, and the labor cost is saved. Meanwhile, all the devices in the PCBA assembly 102 can be changed into chip mounted devices, and the devices can be assembled completely by using a chip mounter (SMT) in the product assembling process, so that the automation degree is improved, and the labor cost is saved; on the other hand, the transformer lead wire of the traditional mode is thin, mechanical external force which is pulled can be generated in the manual assembly process, the thin transformer winding pin is easily pulled and torn off, and the quality hidden danger in the production process is increased. The scheme of the embodiment fundamentally avoids the problems.
In addition, the PCBA component 102 is integrated by the chip mounting technology, and has the characteristics of high density, high reliability, designability, producibility, testability, assemblability, maintainability and the like. In large-scale and ultra-large-scale electronic package components, an effective chip carrier is provided for the miniaturized chip package of the electronic component 102-1.
Example 2:
on the basis of embodiment 1, the patch transformer 102-2 includes a transformer housing and a magnetic loop transformer disposed in the transformer housing, and a pin of the magnetic loop transformer is connected to a patch pin 102-2-1 of the patch transformer 102-2.
The beneficial effects of the above technical scheme are: the patch transformer 102-2 is arranged in a mode of a shell and a magnetic ring transformer, and pins of the magnetic ring transformer are connected with patch pins 102-2-1 of the patch transformer 102-2. Because the magnetic ring transformer lead wire of traditional mode is very thin, can produce the mechanical external force that drags in manual assembly process, thin transformer wire winding pin is pulled easily and is torn off, has increased the quality hidden danger of production process. The PCBA component 102 is attached to the PCBA component 102 in a patch pin 102-2-1 mode by adopting the scheme of the embodiment, so that the problems are fundamentally avoided.
Example 3:
on the basis of embodiment 1, the patch transformer 102-2 is disposed on the PCBA assembly 102 on the side opposite to the electronic component 102-1.
The beneficial effects of the above technical scheme are: the PCB board may be a single panel, a double panel, or a multi-layer board, regardless of the type of panel, and the patch transformer 102-2 is disposed on the PCBA assembly 102 on the side opposite the electronic component 102-1.
Namely, the electronic component 102-1 and the patch transformer 102-2 are respectively mounted on two sides of the PCB, so that the occupied space of the PCBA assembly 102 can be saved, and an effective chip carrier is provided for the miniaturized chip packaging of the electronic component 102-1 in large-scale and ultra-large-scale electronic packaging components.
Example 4:
on the basis of the embodiment 1, the number of the patch pins 102-2-1 is 4 or more than 4.
The beneficial effects of the above technical scheme are: the number of the patch pins 102-2-1 can be 4, 6 or more as required. The number of the patch pins 102-2-1 is not limited, and the patch pins can be correspondingly customized according to the actual requirements of users, so that the patch pins are suitable for the requirements of the users in different occasions.
Example 5:
on the basis of embodiment 1, the shape of the patch transformer 102-2 includes one or more of the following shapes in combination: cube, cuboid, cylinder.
The beneficial effects of the above technical scheme are: the shape of the patch transformer 102-2 is not limited and can be any shape so long as its face in contact with the face plate of the PCBA component 102 is sufficient to ensure that the patch pins 102-2-1 can be attached to the face plate of the PCBA component 102.
The shape of the device can be single, such as a cube, a cuboid or a cylinder, or a combination of the cube and the cylinder, and the shape can be set arbitrarily according to actual requirements.
Example 6:
on the basis of embodiment 5, when the patch transformer 102-2 is in the shape of a cylinder, the patch pins 102-2-1 are arranged on the bottom surface of the cylinder.
The beneficial effects of the above technical scheme are: in order to ensure that the face of the pad transformer 102-2 in contact with the face of the PCBA assembly 102 is sufficient to mount the pad pins 102-2-1 to the face of the PCBA assembly 102, sufficient area is provided therebetween to ensure secure mounting of the pad pins 102-2-1.
The diversity of shapes of the patch transformer 102-2 is also applicable to various needs of various situations.
Example 7:
on the basis of the embodiment 1, the patch transformer 102-2 is attached to the PCBA component 102 in an automatic patch manner;
specifically, the patch pin 102-2-1 of the patch transformer 102-2 is attached to the PCBA assembly 102.
The beneficial effects of the above technical scheme are: the chip mounting transformer 102-2 is automatically mounted by adopting a chip mounting machine technology, so that the mounting firmness of the chip mounting transformer 102-2 and the PCBA component 102 is ensured, and the safety and the service life of the power supply structure are prolonged.
In addition, the PCBA component 102 is integrated by the chip mounting technology, and has the characteristics of high density, high reliability, designability, producibility, testability, assemblability, maintainability and the like. In large-scale and ultra-large-scale electronic package components, an effective chip carrier is provided for the miniaturized chip package of the electronic component 102-1.
Example 8:
on the basis of embodiment 1, the patch transformer 102-2 is arranged on the PCBA assembly 102 on the same side as the electronic component 102-1.
The beneficial effects of the above technical scheme are: the patch transformer 102-2 is disposed on the PCBA assembly 102 on the same side as the electronic component 102-1, depending on various requirements. When the user has the above requirements, the patch transformer 102-2 can be arranged on the same side as the electronic component 102-1 by arranging the circuit on the PCB, so as to meet different requirements of different users.
Example 9:
on the basis of embodiment 1, the power supply structure is suitable for micro-power supply devices.
The beneficial effects of the above technical scheme are: the power supply structure provided by the embodiment is applied to a micro-power supply device, and the micro-power supply is mainly applied to the aspects of industrial instruments, medical instruments, communication systems, industrial automation and data communication interfaces.
Example 10:
on the basis of embodiment 1, after a power module in the power structure is started, the power module is in a working state;
calculating an average value of the power conversion efficiency of the power module by the following formula:
α(j)＝A*T1(j)+B*H1(j)
β(j)＝A*T2(j)+B*H2(j)
γ(j)＝A*Tn(j)+B*Hn(j)
wherein the content of the first and second substances,
the average value of the electric energy conversion efficiency is obtained; t is t0、t1、t2、tn-1、tnRespectively representing the working time of the power supply module; p1(f) Is t0To t1Output power of time period, P2(i) Is t1To t2Output power of time period, Pn(i) Is tn-1To tnThe output power of the time period, P is the rated power; α (j) is t0To t1Environmental parameter of time period, beta (j) being t1To t2Environmental parameter of time period, gamma (j) being tn-1To tnAn environmental parameter of a time period; a and B respectively represent empirical coefficients, A takes the value of 0.2-0.5,the value of B is 0.1-0.4; t is1(j) Is t0To t1Average temperature of time period, T2(j) Is t1To t2Average temperature of time period, Tn(j) Is tn-1To tnAverage temperature over a period of time; h1(j) Is t0To t1Average humidity of the time period H2(j) Is t1To t2Average humidity of the time period Hn(j) Is tn-1To tnAverage humidity over a period of time; n is the total number of divided time periods;
determining a loss value delta according to the average value of the electric energy conversion efficiency:
and when the loss value is less than or equal to a preset threshold value, replacing the patch transformer.
The beneficial effects of the above technical scheme are: the embodiment changes the traditional magnetic ring transformer into the patch transformer, overcomes the defect that the magnetic ring transformer needs to be manually welded with a lead wire of the magnetic ring transformer by a soldering iron, and can realize the patch mounting of the patch transformer by an automatic patch mounting technology by arranging the patch transformer, thereby improving the automation degree and saving the labor cost.
In addition, all devices in the PCBA assembly can be changed into chip mounting devices, and a chip mounting machine (SMT) can be used for completely assembling the devices in the product assembling process, so that the automation degree is improved, and the labor cost is saved.
On the other hand, the transformer lead wire of the traditional mode is thin, mechanical external force which is pulled can be generated in the manual assembly process, the thin transformer winding pin is easily pulled and torn off, and the quality hidden danger in the production process is increased. The scheme of the embodiment fundamentally avoids the problems.
Therefore, the mean value and the loss value of the electric energy conversion efficiency are determined through calculation, whether a power module in the power structure is in a state to be replaced or not is judged, when the loss value obtained through calculation is lower than a preset threshold value, the electric energy conversion efficiency of the patch transformer is seriously unbalanced, and a new patch transformer needs to be replaced to restore the functionality of the power structure.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A power supply structure, comprising: the electronic component assembly comprises a shell and a PCBA assembly, wherein the PCBA assembly comprises an electronic component, a patch transformer and a power module pin extending out of the shell;
the electronic component and the surface mounted transformer are respectively arranged on a PCB to form the PCBA assembly;
one end of the power module pin is connected with the circuit of the PCBA component, and the other end of the power module pin is used as a free end and extends out of the shell;
and the patch pin of the patch transformer is connected with a corresponding circuit in the PCBA component.
2. The power supply structure as claimed in claim 1, wherein the patch transformer comprises a transformer housing and a magnetic loop transformer disposed in the transformer housing, and a pin of the magnetic loop transformer is connected to a patch pin of the patch transformer.
3. The power supply structure of claim 1, wherein the patch transformer is disposed on the PCBA assembly on a side opposite the electronic component.
4. The power supply structure according to claim 1, wherein the number of the patch pins is 4 or more than 4.
5. The power supply structure of claim 1, wherein the shape of the patch transformer comprises a combination of one or more of the following shapes: cube, cuboid, cylinder.
6. The power supply structure according to claim 5, wherein when the patch transformer is shaped as a cylinder, patch pins are provided on the bottom surface of the cylinder.
7. The power supply structure of claim 1, wherein the chip transformer is mounted on the PCBA assembly in an automatic chip mounting manner;
specifically, the patch pins of the patch transformer are attached to the PCBA assembly.
8. The power supply structure of claim 1, wherein the patch transformer is disposed on a PCBA assembly on the same side as the electronic component.
9. The power supply structure according to claim 1, wherein the power supply structure is adapted for a micro-power supply device.
10. The power supply structure according to claim 1, wherein the power supply module is in an operating state after the power supply module in the power supply structure is started;
calculating an average value of the power conversion efficiency of the power module by the following formula:
α(j)＝A*T1(j)+B*H1(j)
β(j)＝A*T2(j)+B*H2(j)
γ(j)＝A*Tn(j)+B*Hn(j)
wherein the content of the first and second substances,
the average value of the electric energy conversion efficiency is obtained; t is t0、t1、t2、tn-1、tnRespectively representing the working time of the power supply module; p1(f) Is t0To t1Output power of time period, P2(i) Is t1To t2Output power of time period, Pn(i) Is tn-1To tnThe output power of the time period, P is the rated power; α (j) is t0To t1Environmental parameter of time period, beta (j) being t1To t2Environmental parameter of time period, gamma (j) being tn-1To tnAn environmental parameter of a time period; a and B respectively represent empirical coefficients, wherein the value of A is 0.2-0.5, and the value of B is 0.1-0.4; t is1(j) Is t0To t1Average temperature of time period, T2(j) Is t1To t2Average temperature of time period, Tn(j) Is tn-1To tnAverage temperature over a period of time; h1(j) Is t0To t1Average humidity of the time period H2(j) Is t1To t2Average humidity of the time period Hn(j) Is tn-1To tnAverage humidity over a period of time; n is the total number of divided time periods;
determining a loss value delta according to the average value of the electric energy conversion efficiency:
and when the loss value is less than or equal to a preset threshold value, replacing the patch transformer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110144142.5A CN112968587A (en) | 2021-02-02 | 2021-02-02 | Power supply structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110144142.5A CN112968587A (en) | 2021-02-02 | 2021-02-02 | Power supply structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112968587A true CN112968587A (en) | 2021-06-15 |
Family
ID=76273383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110144142.5A Pending CN112968587A (en) | 2021-02-02 | 2021-02-02 | Power supply structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112968587A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113507778A (en) * | 2021-07-07 | 2021-10-15 | 广州市爱浦电子科技有限公司 | Paster micropower power module suitable for chip mounter automated production |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060032043A1 (en) * | 2004-08-11 | 2006-02-16 | Lin Chih H | Method for packing transformer |
| CN101599698A (en) * | 2009-05-19 | 2009-12-09 | 广州金升阳科技有限公司 | A kind of micro-power DC-DC power supply and manufacture method thereof |
| CN205140720U (en) * | 2015-11-09 | 2016-04-06 | 广州金升阳科技有限公司 | Transformer and have power circuit board of this transformer |
| CN205901589U (en) * | 2016-03-18 | 2017-01-18 | 李文雄 | Integration DC -DC conversion equipment |
| CN106384652A (en) * | 2016-10-26 | 2017-02-08 | 广州致远电子股份有限公司 | Micro-power power module skeleton |
| CN107481837A (en) * | 2017-08-17 | 2017-12-15 | 广州金升阳科技有限公司 | A kind of switch power module structure |
| CN208754595U (en) * | 2018-04-28 | 2019-04-16 | 广州致远电子有限公司 | A kind of surface mount isolation module |
| CN211181909U (en) * | 2019-12-02 | 2020-08-04 | 珠海市海威尔电器有限公司 | Power supply module |
-
2021
- 2021-02-02 CN CN202110144142.5A patent/CN112968587A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060032043A1 (en) * | 2004-08-11 | 2006-02-16 | Lin Chih H | Method for packing transformer |
| CN101599698A (en) * | 2009-05-19 | 2009-12-09 | 广州金升阳科技有限公司 | A kind of micro-power DC-DC power supply and manufacture method thereof |
| CN205140720U (en) * | 2015-11-09 | 2016-04-06 | 广州金升阳科技有限公司 | Transformer and have power circuit board of this transformer |
| CN205901589U (en) * | 2016-03-18 | 2017-01-18 | 李文雄 | Integration DC -DC conversion equipment |
| CN106384652A (en) * | 2016-10-26 | 2017-02-08 | 广州致远电子股份有限公司 | Micro-power power module skeleton |
| CN107481837A (en) * | 2017-08-17 | 2017-12-15 | 广州金升阳科技有限公司 | A kind of switch power module structure |
| CN208754595U (en) * | 2018-04-28 | 2019-04-16 | 广州致远电子有限公司 | A kind of surface mount isolation module |
| CN211181909U (en) * | 2019-12-02 | 2020-08-04 | 珠海市海威尔电器有限公司 | Power supply module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113507778A (en) * | 2021-07-07 | 2021-10-15 | 广州市爱浦电子科技有限公司 | Paster micropower power module suitable for chip mounter automated production |
| CN113507778B (en) * | 2021-07-07 | 2022-08-16 | 广州市爱浦电子科技有限公司 | Paster micropower power module suitable for chip mounter automated production |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7002808B2 (en) | Assembling structure of electronic apparatus and assembling method thereof | |
| EP1646271A3 (en) | Control device and method of manufacturing thereof | |
| CN112968587A (en) | Power supply structure | |
| CN201985382U (en) | Connector with shielding function | |
| CN112996272B (en) | Manufacturing method of power supply structure | |
| CN201252676Y (en) | Flexible circuit board for flat mini-size motor | |
| CN201267057Y (en) | Surface patch type circulator | |
| CN207427562U (en) | A kind of USB circuit plate device | |
| CN113690677A (en) | Hybrid integrated power module capable of being plugged and unplugged quickly | |
| CN202841712U (en) | PCB provided with connector | |
| CN210182374U (en) | Integrated chip for packaging various wire diameters, mainboard and electronic equipment | |
| CN201112665Y (en) | Electric connector component | |
| CN208754595U (en) | A kind of surface mount isolation module | |
| CN217307875U (en) | Ready-package sound cavity structure | |
| CN201213181Y (en) | Electric power connector | |
| CN211455432U (en) | Novel automatic installation SMD magnetic ring structure | |
| CN102969292B (en) | Integrated power supply module | |
| CN107166207B (en) | Direct type backlight lamp bar module | |
| CN109587947A (en) | A kind of circuit board | |
| CN218939422U (en) | Integrated 1394B transformer aviation plug | |
| CN209824249U (en) | Small wireless communication module supporting multiple welding and power supply modes | |
| CN202310293U (en) | Lead of camera module circuit | |
| CN208227424U (en) | A kind of temperature control and circuit board that can be dust-proof | |
| CN209766822U (en) | Connection structure of integrated circuit board and integrated circuit board | |
| CN215345233U (en) | PCB pad packaging for plug-in optical fiber material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210615 |