CN217307875U

CN217307875U - Ready-package sound cavity structure

Info

Publication number: CN217307875U
Application number: CN202221176350.XU
Authority: CN
Inventors: 顾泰军; 郑来荫; 邱金华; 毕超仁
Original assignee: Xiamen Kingrise Electronic Co ltd
Current assignee: Xiamen Kingrise Electronic Co ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-08-26
Anticipated expiration: 2032-05-09

Abstract

The utility model relates to an electricity field provides a ready-package sound cavity structure, including mainboard, support and pad contact, the mainboard can be understood as the circuit board. The support is provided with a placing cavity for containing the mainboard, one side of the support is provided with a connecting block, the end surface of the connecting block is provided with a circuit hole penetrating through the placing cavity, and the end surface of the connecting block is also provided with a convex welding block; the pad contact is disposed on the solder bump, and a power line of the main board is electrically connected to the pad contact along the circuit hole. When the fast-assembly sound cavity structure is electrically connected with other components, the fast connection can be carried out by utilizing the pad contact, for example, the direct plug-in type pad contact or the cladding type pad contact and the like, the fast assembly effect on the sound cavity structure is realized, the process of welding a circuit is cancelled by utilizing the assembly of the structure, the difficulty of the production process of the sound cavity is reduced, the problem of welding in a small range during the assembly is avoided, and the production efficiency is improved.

Description

Ready-package sound cavity structure

Technical Field

The utility model relates to an electricity field, specificly relate to a ready-package sound cavity structure.

Background

Nowadays, the development of electronic parts is more and more miniaturized, and therefore, the process difficulty in production and processing is increased by geometric times. For example, when soldering is performed in a mobile phone, a high technical process is required. When welding the sound cavity, the problem of damaging the sound cavity structure easily occurs, and the small sound cavity structure is not beneficial to the welding operation of the circuit because of the narrow assembling space when assembling. Therefore, the difficulty of the welding process is high, the production efficiency is low, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

The utility model provides a ready-package sound cavity structure aims at improving the big and high problem of manufacturing cost of the technology degree of difficulty when current production sound cavity structure.

The utility model discloses a realize like this: a ready-to-mount sound cavity structure comprising:

a main board;

the support is provided with a placing cavity for accommodating the mainboard, one side of the support is provided with a connecting block, the end face of the connecting block is provided with a circuit hole penetrating to the placing cavity, and the end face of the connecting block is also provided with a convex welding block; and

and the pad contact is arranged on the welding block, and a power line of the mainboard is electrically connected with the pad contact along the circuit hole.

Preferably, the semiconductor device further comprises a metal probe disposed on the pad contact and electrically connected to the pad contact.

Preferably, the support comprises an upper frame and a bottom frame which are axially split in half along the circuit hole, and the main board is clamped and fixed in a placing cavity between the upper frame and the bottom frame.

Preferably, the pad contacts are flared pad contacts.

Preferably, the pad contact is a bent wing pad contact, and the bent wing pad contact is used for bending, cladding and fixing.

Preferably, a gold-plated soldering lug is arranged on the soldering block and used for soldering the soldering pad contact.

The utility model has the advantages that:

1. and installing the mainboard in the placing cavity of the bracket, hiding the power line of the mainboard in the circuit hole of the connecting block, and electrically connecting the power line to the pad contact to form an electrical connection point on the bracket. Therefore, when the fast-assembly sound cavity structure is electrically connected with other components, the fast connection can be carried out by utilizing the pad contact, such as a direct plug-in type pad contact or a cladding type pad contact, so that the fast assembly effect on the sound cavity structure is realized, the process of welding a circuit is cancelled by utilizing the assembly of the structure, the difficulty of the production process of the sound cavity is reduced, the problem of welding in a small range during the assembly is avoided, and the production efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic view of a ready-package sound cavity structure according to an embodiment of the present invention;

fig. 2 is an exploded view of a ready-package sound cavity structure according to an embodiment of the present invention.

Reference numerals:

10. a main board;

20. a support; 201. a placement chamber; 202. connecting blocks; 203. a circuit hole; 204. welding the blocks;

205. a top frame; 206. a chassis;

2041. a gold plated tab;

30. a pad contact;

40. a metal probe.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

Examples

Referring to fig. 1 and fig. 2, the present embodiment provides a ready-package sound cavity structure, which includes a main board 10, a bracket 20, and pad contacts 30, where the main board 10 can be understood as a circuit board, and the main board 10 is used to regulate and control components such as a speaker in a sound cavity. The support 20 is provided with a placing cavity 201 for accommodating the mainboard 10, one side of the support 20 is provided with a connecting block 202, the end face of the connecting block 202 is provided with a circuit hole 203 penetrating through the placing cavity 201, and the end face of the connecting block 202 is also provided with a raised welding block 204; the pad contact 30 is disposed on the solder bump 204, and the power supply line of the main board 10 is electrically connected to the pad contact 30 along the circuit hole 203.

The fast-assembly sound cavity structure in the embodiment can be applied to electronic equipment such as a mobile phone and a computer, and the mobile phone is taken as an example. The fast-assembly sound cavity structure needs to be installed in the mobile phone, and is plugged with a circuit inside the mobile phone through the pad contact 30, and then the whole support 20 is installed in the mobile phone.

During production, the main board 10 is first installed in the cavity 201, and the circuit on the main board 10 is installed in the circuit hole 203, and the power line is partially hidden by the designed connection block 202. In order to facilitate rapidness, the power connection end of the power line can be connected with a pad contact 30, the pad contact 30 can be welded on the welding block 204 (the process is in the process of independently assembling the fast-assembly sound cavity structure, so that the problem of welding due to the fact that the space is narrow does not exist), and the fast-assembly sound cavity structure is produced. Furthermore, the fast-assembly sound cavity structure needs to be installed in the mobile phone, and the input end and the output end of the main board 10 can be electrically connected through the plurality of pad contacts 30, so that the effect of communicating with the internal circuit of the mobile phone is achieved, and a circuit line does not need to be connected in a welding manner, so that the process difficulty is reduced, the production efficiency is improved, and the production cost is reduced.

As shown in fig. 1 and 2, the present embodiment further includes a metal probe 40, the metal probe 40 is disposed on the pad contact 30, and the metal probe 40 is electrically connected to the pad contact 30. The metal probe 40 can be understood as a cylindrical metal sheet electrically connected and coated on the end of the power line, and then is inserted into the pad contact 30 to achieve the electrical connection effect. Therefore, two circuits can be electrically connected through the metal probe 40, and the purpose of quickly plugging other circuits is achieved.

As shown in fig. 2, the bracket 20 in this embodiment includes a top frame 205 and a bottom frame 206 that are axially split into halves along the circuit hole 203, and the main board 10 is clamped and fixed in the placing cavity 201 between the top frame 205 and the bottom frame 206. Support 20 adopts the mode design of assembling, is convenient for set up and places chamber 201 and circuit hole 203, and mainboard 10 and power cord of placing that can be better, through the amalgamation of roof-rack 205 and chassis 206, can reach the effect of fixed mainboard 10 and power cord, improves the practicality.

Pad contact 30 is provided with horn mouth formula pad contact 30 in this embodiment, and horn mouth formula pad contact 30 can carry out direct plug-in connection through metal probe 40, is favorable to the installation to be used, improves the practicality.

In this embodiment, the pad contact 30 is provided with a bent wing pad contact 30, and the bent wing pad contact 30 is used for bending, cladding and fixing. For example, after the metal probe 40 is mounted on the bent fixing wing, both wings of the bent fixing wing are bent to fix the metal probe 40 on the pad contact 30, thereby realizing a simple mounting operation and improving practicality.

In this embodiment, the welding block 204 is provided with the gold-plated soldering lug 2041, and the gold-plated soldering lug 2041 is a gold-plated metal piece, so that the welding operation can be performed, and therefore, the gold-plated soldering lug 2041 can weld the pad contact 30, so as to achieve the mounting and fixing of the pad contact 30.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A ready-package sound cavity structure, comprising:

a main board;

2. The ready-package sound cavity structure according to claim 1, wherein: the metal probe is arranged on the pad contact and is electrically connected with the pad contact.

3. The ready-package sound cavity structure according to claim 1, wherein: the support includes along the roof-rack and the chassis of circuit hole axial half-and-half amalgamation, the mainboard centre gripping is fixed in the intracavity of placing between roof-rack and the chassis.

4. The ready-package sound cavity structure according to claim 1, wherein: the pad contact is a horn mouth pad contact.

5. The ready-package sound cavity structure according to claim 1, wherein: the pad contact is a bent wing pad contact, and the bent wing pad contact is used for bending, coating and fixing.

6. The ready-package sound cavity structure according to claim 1, wherein: and a gold-plated soldering lug is arranged on the welding block and used for welding the pad contact.