CN218039190U - Double-sided packaging product - Google Patents

Abstract

The utility model discloses a two-sided encapsulation product, include: the base plate is provided with a first mounting surface and a second mounting surface which are opposite, and the base plate is internally provided with a plurality of layers of copper-clad plates and via holes for conducting the copper-clad plates of all layers; the electronic elements (including chips and discrete devices) are provided with a plurality of first mounting surfaces and second mounting surfaces which are respectively mounted with the electronic elements, and the electronic elements are electrically connected with the copper-clad plate; the pin is arranged on one side of the substrate and comprises an inner pin and a pin terminal which are integrally connected, the inner pin is welded with the via hole, and a certain distance is kept between the pin terminal and the substrate; and the plastic package body is packaged on the first mounting surface and the second mounting surface so as to cover the electronic element and the pins, and the distance from the end surface of the pin terminal to the substrate is not less than the thickness of the plastic package body on the side where the pin terminal is located, so that the pin terminal is exposed outside the plastic package body. The pins of the scheme can be installed on the substrate before packaging, so that the pins do not need to be installed after packaging, and the production process is simplified.

Description

Double-sided packaged product

Technical Field

The application relates to the technical field of electronic device packaging, in particular to a double-sided packaging product.

Background

With the rapid development of the semiconductor industry, electronic products are miniaturized with higher density, more functions and smaller product size. Most of the packages of the current substrate package products can only be packaged on a single side, so that the defect of large occupied area of the products exists; although the double-sided packaging of some products is realized, the assembly of the pins needs to be carried out again after the single product is packaged, the process is complex, and the process difficulty is high.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides an aim at: there is provided a double-sided packaged product which can solve the above-mentioned problems existing in the prior art.

In order to achieve the purpose, the following technical scheme is adopted in the application:

a two-sided packaged product comprising:

the base plate is provided with a first mounting surface and a second mounting surface which are opposite, and the base plate is internally provided with a plurality of layers of copper-clad plates and via holes for conducting the copper-clad plates of all layers;

a plurality of electronic elements (including chips and discrete devices), wherein the electronic elements are respectively mounted on the first mounting surface and the second mounting surface and are connected with the copper-clad plate in a welding manner;

the pins are arranged on one side of the substrate and comprise inner pins and pin terminals which are integrally connected, the inner pins are welded with the via holes, and a certain distance is kept between the pin terminals and the substrate;

and the plastic package body is packaged on the first mounting surface and the second mounting surface to cover the electronic element and the pins, and the distance between the end surface of the pin terminal and the substrate is not less than the thickness of the plastic package body on the side where the pin terminal is located, so that the pin terminal is exposed outside the plastic package body.

Optionally, the inner pin includes a first connecting portion and a second connecting portion, two ends of the second connecting portion are respectively connected to the first connecting portion and the pin terminal, the first connecting portion extends into the via hole and is welded to the via hole, and the second connecting portion protrudes out of the first attaching surface or the second attaching surface, so that a certain distance is maintained between the pin terminal and the substrate.

Optionally, the diameter of the first connecting portion is matched with the diameter of the via hole, and the diameter of the second connecting portion is larger than the diameter of the via hole.

Optionally, the first connecting portion is welded to the inner wall of the via hole to electrically connect the first connecting portion to each layer of the copper-clad plate.

Optionally, the inner pins are mounted on the first mounting surface or the second mounting surface at positions corresponding to the via holes.

Optionally, a device mounting area for mounting the electronic component and a pin mounting area for mounting the pin are formed in the middle of the substrate, and the pin mounting area is located on the periphery of the device mounting area.

Optionally, two opposite sides of the device mounting area are respectively provided with one row of pins, and the two rows of pins are symmetrically arranged.

Optionally, the pins are uniformly distributed around the device mounting area.

Optionally, the electronic component includes a chip and a discrete device.

Optionally, the chip is mounted on the first mounting surface, and the discrete device and the pins are mounted on the second mounting surface.

The beneficial effect of this application does:

(1) According to the scheme, the electronic elements are respectively arranged on the first surface mounting surface and the second surface mounting surface to realize double-sided packaging, so that the surface area of the substrate is fully utilized, and the miniaturization design of the size of the product is facilitated;

(2) The pins are arranged and connected with the through holes in the plastic package in a welding manner, and the end faces of the pins are exposed out of the plastic package, so that the external circuit can be electrically connected with the electronic elements in the plastic package through the pins; the pins can be arranged on the substrate before packaging, so that the pins do not need to be arranged after packaging, and the production process is simplified;

(3) The pin of this scheme is located one side of base plate, and the pin terminal emerges outside the plastic envelope body, when installing the product of this scheme to the terminal PCB board, can directly aim at the pad on the terminal PCB board with the pin terminal and accomplish the dress, so the product of this scheme need not to plant the tin ball again and be used for with the welding of terminal PCB board at the pin terminal surface after accomplishing the encapsulation to production technology has further been simplified.

Drawings

The present application will be described in further detail below with reference to the accompanying drawings and examples.

Fig. 1 is a schematic perspective view of a double-sided packaged product according to an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of a double-sided packaged product according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a pin according to an embodiment of the present application.

In the figure:

1. a substrate; 11. a first mounting surface; 12. a second mounting surface; 13. a via hole; 2. an electronic component; 21. A chip; 22. a discrete device; 3. a pin; 31. an inner pin; 311. a first connection portion; 312. a second connecting portion; 32. a pin terminal; 4. and (6) molding the body.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the embodiments of the present application clearer, the following detailed description of the technical solutions of the embodiments of the present application makes clear that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1 to 3, the present embodiment provides a double-sided packaged product, including:

the base plate 1 is provided with a first mounting surface 11 and a second mounting surface 12 which are opposite, and the base plate 1 is internally provided with a plurality of layers of copper-clad plates and through holes 13 for conducting the copper-clad plates of all layers;

a plurality of electronic elements 2, wherein the electronic elements 2 are respectively mounted on the first mounting surface 11 and the second mounting surface 12, and the electronic elements 2 are connected with the copper-clad plate in a welding manner;

the pin 3 is installed on one side of the substrate 1, the pin 3 comprises an inner pin 31 and a pin terminal 32 which are integrally connected, the inner pin 31 is welded with the via hole 13, and a certain distance is kept between the pin terminal 32 and the substrate 1;

and the plastic package body 4 is packaged on the first mounting surface 11 and the second mounting surface 12 to cover the electronic element 2 and the pins 3, and the distance from the end surface of the pin terminal 32 to the substrate 1 is not less than the thickness of the plastic package body 4 on the side where the pin terminal 32 is located, so that the pin terminal 32 is exposed outside the plastic package body 4.

Specifically, in the substrate 1, the inner wall of the via hole 13 is provided with a metal coating for connecting with any one or more layers of copper-clad plates, so as to realize the connection between different electronic elements 2 and different copper-clad plates; for the via hole 13 which needs to be connected with the external circuit, the pin 3 can be arranged at the via hole 13 to be connected with the via hole, so that the connection between the internal circuit and the external circuit is realized, and for the via hole 13 which does not need to be connected with the external circuit, the pin 3 is not required to be arranged.

For the specific functions to be realized by the product, the electronic component 2 may be selected according to actual needs, and generally includes a chip 21 and a discrete device 22, and the mounting manner of different electronic components 2 on the substrate 1 may be different, for example, the chip 21 is generally adhered to the substrate 1 by an adhesive material, and is bonded to a pad on the substrate 1 by a bonding wire (such as a gold wire, a copper wire, etc.), and the discrete device 22 with exposed leads 3 and a smaller volume may directly solder and fix the exposed leads 3 to the pad on the substrate 1.

In order to ensure that the pin terminals 32 are exposed outside the plastic package body 4 after packaging, the distance from the end surfaces of the pin terminals 32 to the mounting surface on which the pins 3 are mounted needs to be ensured to be greater than the height of any electronic element 2 on the mounting surface, the packaging height of the plastic package body 4 on the mounting surface is not greater than the distance from the end surfaces of the pin terminals 32 to the mounting surface on which the pins 3 are mounted, and the plastic package body 4 needs to cover all the electronic elements 2 after packaging.

For the installation of this embodiment when product uses of making things convenient for, all pins 3 of this product only set up in one side of base plate 1 (can be first subsides dress face 11 or second subsides dress face 12), so when assembling this embodiment product to the terminal PCB board, can directly be with the one side that has pin 3 towards the pad on the terminal PCB board, with this embodiment product welding just can realize the electric connection with terminal PCB on the pad. Therefore, after the product of the embodiment is packaged, the solder balls for connecting with the external bonding pads do not need to be deposited on the end surfaces of the pin terminals 32, so that the production process is simplified.

In the structure of the pin 3 connected to the substrate 1, as one implementation manner of this embodiment, the inner pin 31 includes a first connection portion 311 and a second connection portion 312, two ends of the second connection portion 312 are respectively connected to the first connection portion 311 and the pin terminal 32, the first connection portion 311 extends into the via hole 13 and is welded to the via hole 13, and the second connection portion 312 protrudes from the first mounting surface 11 or the second mounting surface 12, so that a certain distance is maintained between the pin terminal 32 and the substrate 1.

Specifically, in the structure, the first connecting portion 311 is inserted into the via hole 13, and the reliability of the connection between the pin 3 and the substrate 1 can be effectively improved by using the limiting functions of the first connecting portion 311 and the via hole 13, and meanwhile, the connection area between the pin 3 and the via hole 13 is increased, so that the pin 3 and the via hole 13 can be conveniently connected and fixed.

Further, the diameter of the first connection portion 311 matches the diameter of the via hole 13, and the diameter of the second connection portion 312 is larger than the diameter of the via hole 13.

The first connection portion 311 and the via hole 13 are preferably in clearance fit, the first connection portion 311 is inserted into the via hole 13 during installation, and the solder material fills a gap between the first connection portion 311 and the via hole 13, so that the pin 3 is combined with the substrate 1, and the pin 3 is electrically connected with the via hole 13. The diameter of the second connection part 312 is larger than that of the via hole 13, so that the second connection part 312 can be used for realizing the installation and positioning of the pin 3, specifically, when the first connection part 311 is inserted into the via hole 13, the second connection part 312 cannot be inserted continuously after abutting against the surface of the substrate 1, at the moment, the first connection part 311 is inserted in place, and the distance from the end surface of the pin terminal 32 to the substrate 1 is just the sum of the heights of the second connection part 312 and the pin terminal 32, so that the stable control of the height of the pin terminal 32 is realized; during packaging, the end face of the pin terminal 32 is just abutted against the surface of the mold, the plastic package material cannot cover the end face of the pin terminal 32, and the pin terminal 32 is exposed after plastic package forming, so that other procedures such as glue removal, surfacing and the like are not needed.

Preferably, the first connecting portion 311 is welded to the inner wall of the via hole 13, so as to weld the first connecting portion 311 to each layer of the copper-clad plate.

Specifically, after the first connection portion 311 is inserted into the via hole 13, solder is deposited in the gap between the via hole 13 and the first connection portion 311, and the first connection portion 311 and the via hole 13 are firmly bonded by the solder and electrically connected to each other.

In the structure in which the lead 3 is connected to the substrate 1, as another embodiment of this embodiment, the inner lead 31 is attached to the first attaching surface 11 or the second attaching surface 12 at a position corresponding to the via hole 13.

Specifically, compared to the previous embodiment, in this embodiment, no structure extends into the via hole 13, the inner lead 31 is directly attached and fixed to the end of the via hole 13, and the inner lead 31 and the substrate 1 are also connected and fixed by using a solder material.

Regarding the layout of the product of this embodiment, a device mounting area for mounting the electronic component 2 and a pin 3 mounting area for mounting the pin 3 are formed in the middle of the substrate 1, and the pin 3 mounting area is located at the periphery of the device mounting area.

Arranging the pins 3 on the periphery of the electronic component 2 on the substrate 1, the mounting of the pins 3 does not interfere with the mounting of other electronic components 2, and thus, the pins 3 and the electronic components 2 are conveniently and orderly mounted on the substrate 1. Meanwhile, the pins 3 are arranged on the periphery of the substrate 1, which is helpful for conveniently welding the product of the embodiment to the bonding pads of the terminal PCB.

As one implementation manner of this embodiment, two opposite sides of the device mounting area are respectively provided with one row of the pins 3, and the two rows of the pins 3 are symmetrically arranged.

As another implementation manner of this embodiment, the pins 3 are uniformly distributed around the device mounting area.

With regard to the electronic component 2 of the present embodiment, it is preferable that the electronic component 2 includes a chip 21 and a discrete device 22.

Further, the chip 21 is mounted on the first mounting surface 11, and the discrete device 22 and the leads 3 are mounted on the second mounting surface 12.

During the specific application, first subsides dress face 11 is for being located product front one side, and second subsides dress face 12 is for being located product back one side (towards terminal PCB pad one side promptly), and chip 21 calorific capacity is great in the course of the work, installs chip 21 on first dress face 11 and is favorable to its heat dissipation.

On the other hand, the embodiment further provides a method for processing a double-sided packaging product, which includes the steps of:

s1, mounting each electronic element 2 on a first mounting surface 11 and a second mounting surface 12 of a substrate 1 respectively, and mounting pins 3 on the first mounting surface 11 or the second mounting surface 12 at positions corresponding to through holes 13;

specifically, in mounting, the discrete devices 22 and the leads 3 may be mounted on the second mounting surface 12 before the chip 21 is mounted on the first mounting surface 11.

And S2, respectively packaging the first mounting surface 11 and the second mounting surface 12 of the substrate 1 by packaging materials to form a plastic package body 4, wherein the plastic package body 4 covers all the electronic elements 2 and the pins 3, and the pin terminals 32 are exposed out of the plastic package body 4.

As a preferred embodiment of this embodiment, in the processing process, the substrate 1 is a unit of a sliced carrier, that is, the carrier includes a plurality of substrates 1; after the encapsulation of all the substrates 1 on the carrier board is completed, the sliced semi-finished product is cut and separated into the single double-sided encapsulated product.

Therefore, in the processing method of the embodiment, the mass production of the double-sided packaged product is realized, the assembly of the electronic components 2 and the pins 3 on the multiple substrates 1 can be completed simultaneously in a single processing process, the packaging of all the substrates 1 on the carrier plate is completed once after the assembly is completed, and the substrates are cut and separated into multiple single products through a cutting process after the packaging is cured. Therefore, the production efficiency can be greatly improved through a mass production mode.

Further, when the pins 3 are mounted, auxiliary connecting ribs are connected between the pins 3 on the adjacent sides of the two connected substrates 1, and the auxiliary connecting ribs are cut off during cutting separation.

Specifically, the pins 3 of the present embodiment are mounted on the substrate 1 and located at the periphery of the electronic component 2, so that in the two connected substrates 1, there is no interference obstacle of the electronic component 2 between the pins 3 on the adjacent sides, and therefore, the pins 3 used in the present embodiment can be connected into one piece by two rows of pins 3 through the auxiliary connecting rib during molding, and the whole pins 3 are mounted on the two connected substrates 1 during mounting, so that the mounting efficiency of the pins 3 can be effectively increased. Meanwhile, when cutting and separating, the auxiliary connecting ribs are cut off, and the independence of the pins 3 can be realized.

In summary, the double-sided package product and the processing method thereof disclosed in the embodiment have the following beneficial effects:

(1) According to the scheme, the electronic elements 2 are respectively arranged on the first mounting surface and the second mounting surface to realize double-sided packaging, the surface area of the substrate 1 is fully utilized, and the miniaturization design of the size of the product is facilitated;

(2) The pins 3 are arranged to be in tin soldering connection with the through holes 13 in the plastic package body 4, and the pin terminals 32 are exposed out of the plastic package body 4, so that the pins 3 can be used for realizing the electrical connection between an external circuit and the electronic elements 2 in the plastic package body 4; the pins 3 can be arranged on the substrate 1 before packaging, so that the pins 3 do not need to be arranged after packaging, and the production process is simplified;

(3) The pin 3 of this scheme is located one side of base plate 1, and the terminal surface of pin terminal 32 shows outside plastic-sealed body 4, when installing the product of this scheme to the terminal PCB board, can directly aim at the pad on the terminal PCB board with pin terminal 32 and accomplish and paste dress, so the product of this scheme need not to plant the tin ball again in pin terminal 32 terminal surface after accomplishing the encapsulation and be used for the welding with the terminal PCB board to production technology has further been simplified.

In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used in an orientation or positional relationship merely for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present application. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The technical principles of the present application have been described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the present application and is not to be construed in any way as limiting the scope of the application. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present application without inventive effort, which shall fall within the scope of the present application.

Claims (10)

1. A two-sided packaged product, comprising:

the circuit board comprises a substrate (1) and a circuit board, wherein the substrate (1) is provided with a first mounting surface (11) and a second mounting surface (12) which are opposite to each other, and the substrate (1) is internally provided with a plurality of layers of copper-clad plates and through holes (13) for conducting the copper-clad plates of all layers;

the electronic components (2) are respectively attached to the first attaching surface (11) and the second attaching surface (12), and the electronic components (2) are connected with the copper-clad plate in a welding mode;

the pin (3) is arranged on one side of the substrate (1), the pin (3) comprises an inner pin (31) and a pin terminal (32) which are integrally connected, the inner pin (31) is welded with the via hole (13), and a certain distance is kept between the pin terminal (32) and the substrate (1);

the plastic package body (4) is packaged on the first mounting surface (11) and the second mounting surface (12) to cover the electronic element (2) and the pins (3), and the end face distance of the pin terminals (32) is not smaller than the distance of the substrate (1) and the thickness of the plastic package body (4) on the side where the pin terminals (32) are located, so that the pin terminals (32) are exposed outside the plastic package body (4).

2. The double-sided package product of claim 1, wherein the inner lead (31) comprises a first connecting portion (311) and a second connecting portion (312), two ends of the second connecting portion (312) are respectively connected with the first connecting portion (311) and the lead terminal (32), the first connecting portion (311) extends into the via hole (13) and is welded with the via hole (13), and the second connecting portion (312) protrudes from the first mounting surface (11) or the second mounting surface (12) so as to keep a certain distance between the lead terminal (32) and the substrate (1).

3. A two-sided packaged product according to claim 2, wherein the diameter of the first connection portion (311) matches the diameter of the via (13), and the diameter of the second connection portion (312) is larger than the diameter of the via (13).

4. The double-sided packaging product of claim 3, wherein the first connecting portion (311) is welded to the inner wall of the via hole (13) to electrically connect the first connecting portion (311) to each copper-clad plate.

5. A two-sided packaged product according to claim 1, wherein the inner leads (31) are attached to the first attachment surface (11) or the second attachment surface (12) at positions corresponding to the vias (13).

6. The two-sided package product according to claim 4 or 5, wherein the substrate (1) has a central portion forming a device mounting area for mounting the electronic component (2) and a lead (3) mounting area for mounting the lead (3), the lead (3) mounting area being located at an outer periphery of the device mounting area.

7. The double-sided packaged product according to claim 6, wherein two opposite sides of the device mounting region are respectively provided with a row of the pins (3), and the two rows of the pins (3) are symmetrically arranged.

8. The double-sided packaged product according to claim 6, wherein the pins (3) are uniformly arranged around the device mounting area.

9. A double-sided packaged product according to claim 1, wherein the electronic component (2) comprises a chip (21) and a discrete device (22).

10. A two-sided packaged product according to claim 9, wherein the chip (21) is mounted to the first mounting face (11) and the discrete device (22) and the leads (3) are mounted to the second mounting face (12).

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