CN109202200A - A kind of microwave components integration welding method - Google Patents
A kind of microwave components integration welding method Download PDFInfo
- Publication number
- CN109202200A CN109202200A CN201811352175.3A CN201811352175A CN109202200A CN 109202200 A CN109202200 A CN 109202200A CN 201811352175 A CN201811352175 A CN 201811352175A CN 109202200 A CN109202200 A CN 109202200A
- Authority
- CN
- China
- Prior art keywords
- substrate
- components
- welding method
- electronic component
- cavity components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Abstract
The present invention discloses a kind of microwave components integration welding method, includes the following steps: that substrate is arranged on the cavity components for being equipped with welding alloy layer, and the welding alloy layer is terne metal material, and wherein the content of lead is 10wt%-50wt%；Electronic component is set on substrate；Cavity components and substrate are welded.By using special welding alloy, frock clamp is designed, the Integral synchronous for realizing electronic component welding sequence and substrate welds process carries out, so that microwave components need to be only sintered in process once can be completed assembling, it greatly increases the production efficiency, has saved human resources.
Description
Technical field
The present invention relates to electronic manufacturing fields, and in particular to a kind of microwave components integration welding method.
Background technique
Due to the needs that electronic product pcb board is increasingly miniaturized, there is chip component, traditional welding method cannot
It meets the needs of.As surface mounting technology (SMT) development is gradually improved, a variety of surface mount elements (SMC) and Mount Device (SMD)
Occurring, reflow soldering process technology and equipment as mounting technology a part are also developed accordingly, and application is increasingly extensive,
Almost all it has been applied in all electronics fields.
When attachment, circuit board is generally located on dedicated substrate, the coated with solder on substrate, then electronic component is set
It sets on substrate, substrate, which is then placed into heating in heating furnace, makes solder fusing to which electronic component is soldered to circuit board
On.
Existing microwave components are due to being related to cavity effect, other than electronic component welding sequence above-mentioned, it is also necessary to
By substrate welds in the cavity components of adaptation.It is repeatedly welded in assembling production process, it is cumbersome, limit production
Efficiency occupies a large amount of human resources from raising.
Summary of the invention
In view of this, the application provides a kind of microwave components integration welding method.By using special welding alloy,
Frock clamp is designed, the Integral synchronous for realizing electronic component welding sequence and substrate welds process carries out, so that microwave
Component need to be only sintered in process once can be completed assembling, greatly increases the production efficiency, has saved human resources.
In order to solve the above technical problems, technical solution provided by the invention is a kind of microwave components integration welding method,
Include the following steps:
Substrate is set on the cavity components for being equipped with welding alloy layer, the welding alloy layer is terne metal material,
The content of middle lead is 10wt%-50wt%；
Electronic component is set on substrate；
Cavity components and substrate are welded.
Preferably, the electronic component step that is arranged on substrate includes the following steps:
Make substrate that the predeterminated position on cavity components is set；
Installation positioning tool is fitted tightly over substrate on the welding alloy layer of cavity components；
Coated with solder and mount electronic component on substrate；
Remove positioning tool.
Preferably, the positioning tool includes magnet and iron plate, and the magnet is arranged in cavity components bottom, the iron plate
Gap between electronic component is set on substrate.
Preferably, described that cavity components progress welding step is included the following steps:
Briquetting is set on substrate；
Briquetting and cavity components are gripped；
Cavity components carry out Reflow Soldering.
Preferably, the briquetting is equipped with first through hole, the patch of electronic component in the first through hole and the substrate
Holding position is correspondingly arranged, and the extending direction of the first through hole is vertical with the substrate.
It is preferably, described that briquetting and cavity components are gripped into step specifically:
Upper fixture is set above briquetting, and fixture under being arranged below cavity components, upper fixture and lower fixture are drawn close to pressure
Block and cavity components are clamped.
Preferably, the upper fixture is equipped with the second through-hole, and second through-hole is set in upper fixture in cellular arrangement
It sets, the extending direction of adjacent second through-hole is parallel to each other.
Preferably, the lower fixture is equipped with supporting lug.
Preferably, the peak temperature of the Reflow Soldering is 210 DEG C -215 DEG C.
The application compared with prior art, it has the advantage that:
Using lead content is the terne metal of 10wt%-50wt% as welding alloy layer, makes Reflow Soldering peak when welding
It is worth temperature control in 210 DEG C of -220 DEG C of sections, 205 DEG C -215 DEG C of sintering temperature area when being welded on mainboard with electronic component
Between be overlapped so that electronic component welding sequence it is synchronous with substrate welds process carry out so that microwave components are in process
In only need to be sintered assembling once can be completed, greatly increase the production efficiency, saved human resources.
Since the substrate thickness of microwave components is very thin, after making circuit on substrate, due to Mass Distribution and internal stress
Relationship, a degree of warpage often occurs for circuit substrate, can not be accurate right when leading to silk-screen printing and automatic chip mounting
Position.Under the action of magnet, iron plate can provide substrate the active force more than iron plate self gravity, so that the substrate quilt of warpage
It is compacted the accurate positionin on cavity components, when convenient for following process.
The welding of electronic component and the welding of substrate carry out simultaneously, and electronic component is in the centre bit of fixture package
It sets.Since the thermal conductivity of substrate itself is too low, thermal resistance when electronic component Reflow Soldering in heat transfer to component solder joint compared with
Greatly.Through-hole is set on briquetting and fixture, electronic component is enable to be exposed in thermal current when heating in solder reflow device, is protected
The effect of Reflow Soldering is demonstrate,proved.
Detailed description of the invention
Fig. 1 is that positioning tool is mounted on the structural representation axis surveys view on cavity components in the present invention；
Fig. 2 is that positioning tool is mounted on the structural representation side view on cavity components in the present invention；
Fig. 3 is the structural representation side view that briquetting and upper fixture, lower fixture clamp cavity components in the present invention；
Fig. 4 is the structural representation top view of briquetting in the present invention；
Fig. 5 is the structural representation top view of upper fixture in the present invention；
Fig. 6 is the binary phase diagraml of leypewter.
Appended drawing reference: cavity components 1, soldering alloy layer 11, substrate 2, electronic component 21, conducting wire 22, magnet 31, iron plate
32, briquetting 4, first through hole 41, upper fixture 51, the second through-hole 511, lower fixture 52, supporting lug 521.
Specific embodiment
It is with reference to the accompanying drawing and specific real in order to make those skilled in the art more fully understand technical solution of the present invention
Applying example, the present invention is described in further detail.
Embodiment 1
Fig. 1 and Fig. 2 are please referred to, the embodiment of the present invention provides a kind of microwave components integration welding method, including walks as follows
It is rapid:
Substrate 2 is set on the cavity components 1 for being equipped with welding alloy layer 11, and wherein welding alloy layer 11 is terne metal material
Matter, wherein the content of lead is 10wt%；
Make substrate 2 that the predeterminated position on cavity components 1 is set；
Magnet 31 is set in 1 bottom of cavity components, iron 32 is arranged in the gap on substrate 2 between electronic component 21
Piece is fitted tightly over substrate 2 on the welding alloy layer 11 of cavity components 1；
Coated with solder and mount electronic component 21 on substrate 2；
Remove magnet 31 and iron plate 32；
Please refer to Fig. 3 and Fig. 4, on substrate 2 be arranged briquetting 4, briquetting 4 be equipped with first through hole 41, first through hole 41 with
The mounting position of electronic component 21 is correspondingly arranged on substrate 2, and the extending direction of first through hole 41 is vertical with substrate 2；
Fig. 3 and Fig. 5 are please referred to, upper fixture 51 is set above briquetting 4, fixture 52 under being arranged below cavity components 1, on
Fixture 51 and lower fixture 52 are drawn close and are clamped to briquetting 4 and cavity components 1；Upper fixture 51 be equipped with the second through-hole 511, second
In cellular arrangement setting in upper fixture 51, the extending direction of adjacent second through-hole 511 is parallel to each other through-hole 511；Lower fixture
52 are equipped with supporting lug 521.
Cavity components 1 and substrate 2 carry out Reflow Soldering simultaneously under 210 DEG C -215 DEG C of peak temperature.
Referring to FIG. 6, i.e. Sn content is in 50wt%- when lead content is in the section 10wt%-50wt% in terne metal
When 90wt%, the fusing point of terne metal is at 220 DEG C or less.Usually in reflow soldering process, the temperature of circuit substrate sintering is 205
Between DEG C -215 DEG C.Using the terne metal of the composition proportion as welding alloy layer, it is welded on substrate 2 on cavity components 1
Welding temperature section and electronic component 21 be welded on the welding temperature section on substrate 2 coincidence, so as to realize microwave
The integration welding of component.
The solder coated when mount electronic component 21 is tin cream common in Reflow Soldering, due to going back other than tin in tin cream
Comprising scaling powder and surfactant, it is arranged between cavity components and substrate when being sintered and is difficult to volatilize away, cause to weld
There are a large amount of cavities.Therefore the welding alloy that welding temperature is overlapped with Reflow Soldering temperature range need in addition be prepared.The change of lead and lead
It closes object and has certain toxicity, in order to reduce the usage amount of lead, the terne metal of 10wt% lead content is used in the present embodiment.This
Field technical staff, can also be using close other alloying components of fusing point on the basis of understanding the technical program.
The iron plate 32 being arranged on substrate 2 has under the sucking action of magnet 31 to 1 direction of cavity components is mobile
Gesture is fitted on cavity components 1 so that substrate 2 steadily be pressed, and is avoided because 2 warpage of substrate makes mount electronic component
Error is generated when 21.Iron plate compact, setting flexibly, can effectively avoid the setting position of electronic component 21, not influence
The coating of solder and the attachment of electronic component 21.Magnet 31 uses permanent magnet in the present embodiment, completes electronic component 21
Attachment after magnet 31 far from iron plate 32 after 1 certain distance of cavity components lose magnetic force attract, can be easily popped out.At other
In embodiment, magnet 31 can also use electromagnet, the presence or absence of magnetism be controlled by power on/off, convenient for the taking-up of iron plate 32.
After the attachment for completing electronic component 21, by cavity components 1, the substrate being arranged in cavity components 12 and substrate 2
On electronic component 21 be put into solder reflow device be sintered together.In order to guarantee sintering quality, briquetting 4, upper folder are set
Tool 51 and lower fixture 52 grip cavity components 1 and substrate 2.
Welding and substrate 2 and the welding of cavity components 1 due to electronic component 21 with substrate 2 carry out simultaneously, electronics member
Device 21 is in the center of fixture package.In order to avoid the heated deficiency of electronic component 21, on briquetting 4 and upper fixture 51
Offer through-hole.The setting position of first through hole 41 and electronic component 21 on briquetting 4 corresponds, and makes each electronics member device
Part 21 can be sufficiently exposed in thermal current.The second through-hole 511 on fixture 51 can equably be heated simultaneously in cellular arrangement
Briquetting 4 is transferred heat to, avoids influencing temperature when sintering since low-temperature space occurs in heated deficiency between upper fixture 51 and briquetting 4
Degree is uniformly distributed.
Sometimes also supporting lug 521 can be arranged, when conducting wire is placed in edge welding lead in substrate 2 on lower fixture 52
When on cavity components 1, supporting lug 521 supports conducting wire and substrate 2 is located at sustained height, so that conducting wire is stablized and is placed on substrate
It is welded together on 2.
Embodiment 2
The present embodiment and the distinctive points of embodiment 1 are: the welding alloy layer 11 is the terne metal of the lead containing 40wt%
Material.
Embodiment 3
The present embodiment and the distinctive points of embodiment 1 are: the welding alloy layer 11 is the terne metal of the lead containing 50wt%
Material.
The above is only the preferred embodiment of the present invention, it is noted that above-mentioned preferred embodiment is not construed as pair
Limitation of the invention, protection scope of the present invention should be defined by the scope defined by the claims..For the art
For those of ordinary skill, without departing from the spirit and scope of the present invention, several improvements and modifications can also be made, these change
It also should be regarded as protection scope of the present invention into retouching.
Claims (9)
1. a kind of microwave components integration welding method, which comprises the steps of:
Substrate is set on the cavity components for being equipped with welding alloy layer, and the welding alloy layer is terne metal material, wherein lead
Content be 10wt%-50wt%；
Electronic component is set on substrate；
Cavity components and substrate are welded.
2. microwave components integration welding method as described in claim 1, which is characterized in that described that electronics is arranged on substrate
Component step includes the following steps:
Make substrate that the predeterminated position on cavity components is set；
Installation positioning tool is fitted tightly over substrate on the welding alloy layer of cavity components；
Coated with solder and mount electronic component on substrate；
Remove positioning tool.
3. microwave components integration welding method as claimed in claim 2, which is characterized in that the positioning tool includes magnet
And iron plate, the magnet are arranged in cavity components bottom, the gap between electronic component is arranged on substrate in the iron plate.
4. microwave components integration welding method as described in claim 1, which is characterized in that described to be welded to cavity components
Step is connect to include the following steps:
Briquetting is set on substrate；
Briquetting and cavity components are gripped；
Cavity components carry out Reflow Soldering.
5. microwave components integration welding method as claimed in claim 4, which is characterized in that it is logical that the briquetting is equipped with first
Hole, the first through hole and the mounting position of electronic component on the substrate are correspondingly arranged, the extension side of the first through hole
To vertical with the substrate.
6. microwave components integration welding method as claimed in claim 5, which is characterized in that described by briquetting and cavity components
Grip step specifically:
Upper fixture is set above briquetting, fixture under being arranged below the cavity components, upper fixture and lower fixture draw close to briquetting and
Cavity components are clamped.
7. microwave components integration welding method as claimed in claim 6, which is characterized in that the upper fixture is equipped with second
Through-hole, for second through-hole in cellular arrangement setting in upper fixture, the extending direction of adjacent second through-hole is mutually flat
Row.
8. microwave components integration welding method as claimed in claim 6, which is characterized in that the lower fixture is equipped with support
Convex block.
9. microwave components integration welding method as claimed in claim 4, which is characterized in that the peak temperature of the Reflow Soldering
It is 210 DEG C -215 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811352175.3A CN109202200A (en) | 2018-11-14 | 2018-11-14 | A kind of microwave components integration welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811352175.3A CN109202200A (en) | 2018-11-14 | 2018-11-14 | A kind of microwave components integration welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109202200A true CN109202200A (en) | 2019-01-15 |
Family
ID=64996451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811352175.3A Pending CN109202200A (en) | 2018-11-14 | 2018-11-14 | A kind of microwave components integration welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109202200A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112828414A (en) * | 2020-12-30 | 2021-05-25 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
| CN113146151A (en) * | 2021-04-02 | 2021-07-23 | 扬州海科电子科技有限公司 | T/R assembly substrate assembly process |
| CN117564388A (en) * | 2024-01-15 | 2024-02-20 | 成都世源频控技术股份有限公司 | Automatic sintering method and sintering device for microwave module substrate and cavity |
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| CN207723759U (en) * | 2017-12-14 | 2018-08-14 | 晶科能源有限公司 | A kind of welding photovoltaic component tooling |
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| JP2013120869A (en) * | 2011-12-08 | 2013-06-17 | Parat Co Ltd | Soldering device |
| CN102785039A (en) * | 2012-07-30 | 2012-11-21 | 东莞永安科技有限公司 | Solder paste and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112828414A (en) * | 2020-12-30 | 2021-05-25 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
| CN112828414B (en) * | 2020-12-30 | 2022-09-13 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
| CN113146151A (en) * | 2021-04-02 | 2021-07-23 | 扬州海科电子科技有限公司 | T/R assembly substrate assembly process |
| CN117564388A (en) * | 2024-01-15 | 2024-02-20 | 成都世源频控技术股份有限公司 | Automatic sintering method and sintering device for microwave module substrate and cavity |
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Application publication date: 20190115 |