CN109310012A - A kind of steel mesh and the manual reflow soldering method using the steel mesh - Google Patents
A kind of steel mesh and the manual reflow soldering method using the steel mesh Download PDFInfo
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- CN109310012A CN109310012A CN201810797582.9A CN201810797582A CN109310012A CN 109310012 A CN109310012 A CN 109310012A CN 201810797582 A CN201810797582 A CN 201810797582A CN 109310012 A CN109310012 A CN 109310012A
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- Prior art keywords
- steel mesh
- aperture
- pad
- intensive
- reflow soldering
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 101
- 239000010959 steel Substances 0.000 title claims abstract description 101
- 238000005476 soldering Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000006071 cream Substances 0.000 claims abstract description 44
- 229910000679 solder Inorganic materials 0.000 claims abstract description 44
- 239000004615 ingredient Substances 0.000 claims description 8
- 230000005499 meniscus Effects 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- 238000005323 electroforming Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000010079 rubber tapping Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 41
- 238000004519 manufacturing process Methods 0.000 description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Abstract
The invention discloses a kind of steel meshes, it is provided with several for carrying out the aperture of paste solder printing, aperture includes the first aperture for intensive pad paste solder printing, intensive pad is made of the corresponding multiple intensive pads of son of the multiple pins in more pin components the same side, and single intensive pad is directly crossed in single first aperture.The invention also discloses the manual reflow soldering methods for using the steel mesh, include the following steps: paste solder printing: steel mesh is fixed on circuit boards, then tin cream is bitten on the pad of circuit board using scraper, and tin cream extra on steel mesh is brushed and is moved back except steel mesh；Dispensing attachment: Heraeus is melted by curing oven, after the Heraeus of fusing is then dripped to the corresponding position of circuit board element, and component is placed at dripped Heraeus and is fixed；Reflow soldering.Steel mesh and manual reflow soldering method of the invention, can be effectively reduced small lot component welding cost, improve welding efficiency and yield rate.
Description
Technical field
Electronics industry welding technology field of the present invention, and in particular to a kind of steel mesh and the manual reflow soldering using the steel mesh
Method.
Background technique
Surface installation technique (SMT) is a kind of will to pacify without pin or short leg surface-assembled component (abbreviation SMC/SMD)
On the surface of printed circuit board (Printed Circuit Board, abbreviation PCB) or the surface of other substrates, by returning
The methods of fluid welding or immersed solder are subject to the circuit load technology of welding assembly, are most common a kind of skills in current electronic assembly industry
Art and technique.
Surface installation technique (SMT) generally includes following steps:
1) steel mesh is made, which is reserved with aperture identical with pad size in the corresponding position of board pads；
2) paste solder printing covers steel mesh on circuit boards, and tin cream is passed through opening on steel mesh using the scraper of printing machine
It bites on pad in hole；
3) part mounts, and component is accurately placed at circuit board corresponding position, makes component's feet and pad by chip mounter
On tin cream be in contact；
4) circuit board after attachment is put into reflow soldering, and is heated according to specific temperature curve by reflow soldering, is melted
Change tin cream, then liquid solder can be adsorbed on pin (referred to as " phenomenon of solder rising ") under the action of electro-wetting principle, first after cooling
Device pin is securely welded on pad.
When in above-mentioned paste solder printing step, in order to guarantee welding effect, strict control paste solder printing amount, therefore steel are needed
Net can be made very thin, generally less than 0.15mm, so that the cost of manufacture of steel mesh is higher；Meanwhile steel mesh when paste solder printing
It generally requires and tensioning is carried out by the mechanical arm of printing machine, to fix steel mesh and guarantee that steel mesh is smooth.Therefore, surface installation technique
(SMT) it is chiefly used in industrial mass production, and the component of small lot is welded, electric iron is mainly still utilized by manpower at present
It is welded.Since the pin spacing of component is smaller (0.1~0.5mm), the problems such as being easy to appear rosin joint, desoldering, burn-through, lead
Cause welding efficiency, yield rate lower, especially for the welding of intensive device, this problem is more prominent.
It can be seen that a kind of welding method of surface-assembled suitable for small lot component is needed, to reduce small lot
Component welding cost improves welding efficiency and yield rate.
Summary of the invention
The present invention provides a kind of steel meshes, can be applied in the manual reflow soldering of small lot component, can be effective
Ground reduces small lot component welding cost, improves welding efficiency and yield rate.
In order to solve the above technical problems, the invention adopts the following technical scheme:
A kind of steel mesh, is provided with several apertures for being used to carry out paste solder printing, and the aperture includes for intensively welding
First aperture of disk paste solder printing, the intensive pad is by the corresponding multiple sons of the multiple pins in more pin components the same side
The single intensive pad is directly crossed in intensive pad composition, single first aperture.
Further, the steel mesh is planar sheet, and first aperture is rectangle, and size meets:
L=(D+d) n-d,
W<l
Wherein, the L: the first aperture length, D: the width of the intensive pad of son, d: the spacing of the adjacent intensive pad of son, n: son is close
Collect the quantity of pad；W: the first aperture widths, l: the length of the intensive pad of son.
Further, the width W of single first aperture are as follows:
0.5c≤H≤c
Wherein, the W: the first aperture widths, k: the angle of pin and the intensive pad of son, p1: solder institute accounting in tin cream ingredient
Example, p2: scaling powder proportion in tin cream ingredient, H ': the thickness of steel mesh, H: the height of tin cream meniscus, c: pin thickness.
Further: the thickness d of steel mesh meets: 0.20mm≤d≤0.3mm.
Further, the aperture further includes that the second aperture of paste solder printing is carried out for non-dense set pad, and described second
Size scaled down of the size of aperture relative to non-dense set pad.
Further, the making material of steel mesh is metal or plastics.
Further, the aperture is made in the way of laser, electroforming, etching etc..
The present invention also provides the manual reflow soldering methods of above-mentioned steel mesh, include the following steps:
Make above-mentioned steel mesh；
Paste solder printing: the steel mesh is fixed on printed circuit board (abbreviation circuit board), then utilizes scraper by tin cream
It bites on the pad of circuit board, and tin cream extra on steel mesh is brushed and is moved back except steel mesh；
Dispensing attachment: Heraeus is melted by curing oven, the Heraeus of fusing is then dripped into circuit board element phase
Behind the position answered, and component is placed at dripped Heraeus and is fixed；
Reflow soldering: the circuit board that will be fixed with patch, while being printed with tin cream, which is placed in reflow soldering, carries out Reflow Soldering.
Further, in paste solder printing step, the scraper bites tin cream into Tapping procedures and the steel mesh
Angle is 45 °.
Further, using clip that steel mesh is fixed on circuit boards in paste solder printing step.
Compared with prior art, the invention has the benefit that
Steel mesh of the invention overcomes for pad intensive on circuit board, and steel mesh aperture is inconvenient, aperture difficulty is big
Problem effectively improves the producing efficiency of steel mesh, reduces the welding cost of small lot component, meanwhile, improve craft
Reflow soldering efficiency.When carrying out reflow soldering, due to phenomenon of solder rising, as long as the control of paste solder printing amount is rationally, the intensive weldering
It can be all attached on neighbouring pin after tin cream fusing between disk, without will cause the adhesion between pin；
In the present embodiment, the thickness of steel mesh facilitates production for tin cream in 0.2mm or more by using thicker steel mesh
The aperture of printing, and in paste solder printing, convenient for steel mesh is fixed on circuit boards.It is particularly suitable for the hand of small lot component
Work reflow soldering can efficiently solve rosin joint during manual welding, de- in conjunction with manual welding and the respective advantage of Reflow Soldering
The problems such as weldering, burn-through, low yield rate, improves the welding efficiency of small lot component；At the same time it can also be effectively reduced Reflow Soldering
Steel mesh cost of manufacture, thereby reduces welding cost.
Manual reflow soldering method of the invention can be saved effectively and be welded by using the steel mesh of special drilling
This, improves welding efficiency；And its steel mesh thickness used is not less than 0.2mm, steel mesh used in more general reflow soldering is thick,
Convenient for fixing steel mesh in solder reflow process, be conducive to by manual welding in conjunction with Reflow Soldering, design and a kind of facilitate small lot first
The manual reflow soldering method of device welding.It is low to efficiently solve rosin joint during manual welding, desoldering, burn-through, yield rate
The problems such as, improve the welding efficiency of small lot component；At the same time it can also be effectively reduced Reflow Soldering steel mesh cost of manufacture,
Thereby reduce welding cost.
Detailed description of the invention
Technology of the invention is described in further detail with reference to the accompanying drawings and detailed description:
Fig. 1 is the intensive pad schematic diagram of circuit board of the present invention；
Fig. 2 is the first aperture schematic diagram of steel mesh of the present invention；
Fig. 3 is the schematic diagram of steel mesh of the present invention in one embodiment；
Fig. 4 is the corresponding circuit board schematic diagram of steel mesh described in Fig. 3；
Fig. 5 is component of the present invention and pad reflow soldering schematic diagram；
Fig. 6 is that intensive pad of the present invention is using steel mesh of the present invention and returning by hand in one embodiment
Effect picture after flowing welding method welding.
Wherein:
1, circuit board；11, intensive pad；111, the intensive pad of son；12, non-dense set pad；2, steel mesh；21, the first aperture；
22, the second aperture；3, component；31, pin；32, more pin components；4, tin cream；41, tin cream meniscus；
Specific embodiment
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, it should be understood that preferred reality described herein
Apply example only for the purpose of illustrating and explaining the present invention and is not intended to limit the present invention.
The invention discloses a kind of steel meshes, are provided with several for carrying out opening for paste solder printing when manual reflow soldering
Hole, aperture include the first aperture 21 for intensive 11 paste solder printing of pad, wherein intensive pad 11 is by more pin components 32
The corresponding multiple intensive pads 111 of son of the multiple pins in the same side form, and single first aperture 21 is directly across single described
Intensive pad 11.
For intensive pad 11, very close, the adjacent intensive pad 111 of son is arranged between the intensive pad 111 of son
Between spacing very little, and the width of the intensive pad 111 of son is also smaller, it has not been convenient to open respectively for the intensive pad 111 of every height
If the aperture of paste solder printing, therefore open up the first aperture 21 across single intensive pad 11.It effectively overcomes for circuit
On plate 1 for intensive pad 11, the problem that steel mesh aperture is inconvenient, aperture difficulty is big effectively improves the producing efficiency of steel mesh,
The welding cost of small lot component 3 is reduced, meanwhile, improve manual reflow soldering efficiency.
When carrying out reflow soldering, due to phenomenon of solder rising, as long as the control of paste solder printing amount is rationally, between intensive pad 111
It can be all attached to after tin cream fusing on neighbouring pin 31, without will cause the adhesion between pin 31.And the number to be printed master of tin cream
To depend on the thickness d of steel mesh and the size of aperture (including the first aperture 21 and the second aperture).
In the above-described embodiments, as shown in Fig. 1~Fig. 6, steel mesh is planar sheet, and the first aperture 21 is rectangle, ruler
Very little satisfaction:
L=(D+d) n-d,
W<l
Wherein, 21 length of the L: the first aperture, D: the width of the intensive pad 111 of son, d: the spacing of adjacent intensive pad, n: son
The quantity of intensive pad 111；The width of W: the first aperture 21, l: the length of the intensive pad 111 of son.
Preferably, the width W of single first aperture 21 are as follows:
0.5c≤H≤c
Wherein, 21 width of the W: the first aperture, D: the width of the intensive pad 111 of son, k: the folder of pin 31 and intensive pad 111
Angle, p1: solder proportion, p in tin cream ingredient2: scaling powder proportion in tin cream ingredient, H ': manual reflow soldering steel mesh
Thickness, H: the height of tin cream meniscus 41, c: 31 thickness of pin.
Specifically, the width W calculation method of the first aperture 21 is as follows:
As shown in figure 4, the welding to component 3, the wedge shape space below the heel of pin 31 is all filled by tin cream 4,
Height H at its tin cream meniscus 41 should at least be equal to the half of 31 thickness of pin, and preferably equal to 31 thickness of pin, therefore every
Scolding tin volume V needed for a pin 312For
In formula, w: the width of the intensive pad 11 of son, k: the angle of pin and the intensive pad 111 of son.
Due in tin cream 4 solder and scaling powder can be evaporated in solder reflow process, lead to the reduction of 4 volume of tin cream,
Therefore
(1-p1-p2)·V1=V2
In formula, p1: solder proportion, p in tin cream ingredient2: scaling powder proportion, V in tin cream ingredient1: paste solder printing
When each pad on tin cream volume.
Since the shape that tin cream meniscus 41 and pin 31 are formed can be obtained similar to triangle:
In formula, n is 31 numbers of pin, and the L: the first aperture 21 is long, and the W: the first aperture 21 is wide, H ': the steel of manual reflow soldering
Thickness of net.
Joint type (1)-(3):
In the above-described embodiments, the thickness d of steel mesh meets: 0.20mm≤d≤0.3mm.It is used in general reflow soldering
Steel mesh thickness is usually no more than 0.2mm, usually in 0.15mm.
In the present embodiment, the thickness of steel mesh is less than 0.2mm, by using thicker steel mesh, facilitates production for tin cream
The aperture of printing, and in paste solder printing, convenient for steel mesh is fixed on the circuit card 1.It is particularly suitable for small lot component 3
Manual reflow soldering can efficiently solve rosin joint during manual welding, de- in conjunction with manual welding and the respective advantage of Reflow Soldering
The problems such as weldering, burn-through, low yield rate, improves the welding efficiency of small lot component 3；At the same time it can also be effectively reduced reflux
Welding steel net cost of manufacture, thereby reduces welding cost.
In the present embodiment, aperture further includes that the second aperture of paste solder printing is carried out for non-dense set pad 12, for non-close
For foot type device, identical as dosage when machine Reflow Soldering in order to control tin cream dosage, the size of the second aperture is relative to non-
The corresponding pad size scaled down of intensive pad 12.Specifically, the size calculating of the second aperture is as follows on the steel mesh:
VTin=l1w1h1=l2w2h2
In formula, l1: the length of pad, w1: the width of pad；l2: the length of the second aperture, w2: the width of the second aperture；h1: machine SMT
Weld steel mesh thickness, h2: steel mesh thickness.
It can thus be concluded that
In the above-described embodiments, the making material of steel mesh is metal or plastics.
Aperture is made in the way of laser, electroforming, etching etc..
In one embodiment, circuit board 1 as shown in Figure 4, using steel mesh to circuit board 1 carry out component 3 (including
More pin components 32 and common component) welding, wherein more pin components 32 share the intensive pin of 4 rows, every row's packet
Include 12 pins 31；Wherein, the 0.2mm of 31 thickness of single pin, about 15 ° of angle of single pin 31 and the intensive pad 111 of son,
Length 1.8mm, the width 0.3mm of the intensive pad 111 of the corresponding son of single pin 31, between son 111 pad of intensive pad between
Away from 0.3mm.For the circuit board 1, steel mesh 2 is made using the aluminium flake of 0.2mm thickness, is computed, intensive pad 11 on circuit board 1
Locating corresponding first aperture Design of length is 6.6mm, wide to be designed as 0.63mm.Then carved according to the bore size of design using laser
Quarter, machine carried out aperture on aluminium flake, obtained steel mesh 2 as shown in Figure 3.It is welded after carrying out paste solder printing using above-mentioned steel mesh 2, it can
Obtain the welding effect of more pin components 32 as shown in FIG. 6.
The invention also discloses a kind of manual reflow soldering methods using above-mentioned steel mesh, it is characterised in that: including following
Step:
Paste solder printing: steel mesh being fixed on circuit boards, is then bitten tin cream on the pad of circuit board using scraper,
And tin cream extra on steel mesh is brushed and is moved back except steel mesh；
Dispensing attachment: Heraeus is melted by curing oven, the Heraeus of fusing is then dripped into 3 phase of circuit board element
Behind the position answered, and component is placed at dripped Heraeus and is fixed；
Reflow soldering: the circuit board that will be fixed with patch, while being printed with tin cream, which is placed in reflow soldering, carries out Reflow Soldering.
Manual reflow soldering method of the invention can be saved effectively and be welded by using the steel mesh of special drilling
This, improves welding efficiency；And steel mesh used in its more general reflow soldering of steel mesh thickness for using is thick, takes over convenient for Reflow Soldering
Steel mesh is fixed in journey, is conducive to by manual welding in conjunction with Reflow Soldering, and a kind of craft for facilitating small lot component 3 to weld is designed
Reflow soldering method.The problems such as efficiently solving rosin joint, desoldering, burn-through, low yield rate during manual welding, improves small
The welding efficiency of batch component；At the same time it can also be effectively reduced Reflow Soldering steel mesh cost of manufacture, thereby reduces and be welded into
This.
In the above-described embodiments, in paste solder printing step, tin cream is bitten into Tapping procedures the folder with steel mesh by scraper
Angle is 45 °.Facilitate and scrapes tin cream to aperture.
It is using clip that steel mesh is fixed on circuit boards in paste solder printing step.Without by printing machine mechanical arm
Tensioning, leveling, fixation are carried out, simplifies paste solder printing step, while can be realized using simple tool, reduces and returns by hand
Flow welding cost.
Steel mesh of the present invention and using the steel mesh manual reflow soldering method other contents referring to the prior art,
Details are not described herein.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, therefore
Without departing from the technical solutions of the present invention, according to the technical essence of the invention it is to the above embodiments it is any modification,
Equivalent variations and modification, all of which are still within the scope of the technical scheme of the invention.
Claims (10)
1. a kind of steel mesh is provided with several for carrying out the aperture of paste solder printing, it is characterised in that: the aperture includes using
In the first aperture of intensive pad paste solder printing, the intensive pad is respectively corresponded by the multiple pins in more pin components the same side
The intensive pads composition of multiple sons, single first aperture directly crosses over the single intensive pad.
2. steel mesh according to claim 1, it is characterised in that: the steel mesh is planar sheet, and first aperture is in length
Rectangular, size meets:
L=(D+d) n-d,
W<l
Wherein, the L: the first aperture length, D: the width of the intensive pad of son, d: the spacing of the adjacent intensive pad of son, n: the intensive weldering of son
The quantity of disk；W: the first aperture widths, l: the length of the intensive pad of son.
3. steel mesh according to claim 2, it is characterised in that: the width W of single first aperture are as follows:
0.5c≤H≤c
Wherein, the W: the first aperture widths, k: the angle of pin and the intensive pad of son, p1: solder proportion, p in tin cream ingredient2:
Scaling powder proportion in tin cream ingredient, H ': the thickness of steel mesh, H: the height of tin cream meniscus, c: pin thickness.
4. steel mesh according to claim 1, it is characterised in that: the thickness d of steel mesh meets: 0.20mm≤d≤0.3mm.
5. steel mesh according to claim 4, it is characterised in that: the aperture further includes carrying out tin cream for non-dense set pad
Second aperture of printing, size scaled down of the size of second aperture relative to non-dense set pad.
6. steel mesh according to claim 1, it is characterised in that: the making material of steel mesh is metal or plastics.
7. steel mesh according to claim 1, it is characterised in that: aperture system in the way of laser, electroforming, etching etc.
?.
8. a kind of manual reflow soldering method using steel mesh described in any one of claim 1-7, it is characterised in that: including under
State step:
Paste solder printing: the steel mesh being fixed on circuit boards, is then bitten tin cream on the pad of circuit board using scraper,
And tin cream extra on steel mesh is brushed and is moved back except steel mesh；
Dispensing attachment: Heraeus is melted by curing oven, it is corresponding that the Heraeus of fusing is then dripped into circuit board element
Behind position, and component is placed at dripped Heraeus and is fixed；
Reflow soldering: the circuit board that will be fixed with patch, while being printed with tin cream, which is placed in reflow soldering, carries out Reflow Soldering.
9. craft reflow soldering method according to claim 8, it is characterised in that: described to scrape in paste solder printing step
It is 45 ° that knife, which bites tin cream into Tapping procedures with the angle of the steel mesh,.
10. craft reflow soldering method according to claim 8, it is characterised in that: in paste solder printing step, utilize folder
Son is fixed on circuit boards by steel mesh.
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| CN201810797582.9A CN109310012A (en) | 2018-07-19 | 2018-07-19 | A kind of steel mesh and the manual reflow soldering method using the steel mesh |
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| CN201810797582.9A CN109310012A (en) | 2018-07-19 | 2018-07-19 | A kind of steel mesh and the manual reflow soldering method using the steel mesh |
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| CN109874237A (en) * | 2019-03-11 | 2019-06-11 | 深圳市海能达通信有限公司 | SMT welding procedure and steel mesh for SMT welding procedure |
| CN111010861A (en) * | 2019-12-31 | 2020-04-14 | 广州金升阳科技有限公司 | Six-side shielding device, electronic module applying six-side shielding device and manufacturing method of electronic module |
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| CN114845479A (en) * | 2022-05-20 | 2022-08-02 | 深圳市兆驰数码科技股份有限公司 | Through hole reflow soldering infrared head implementation method |
| WO2022166936A1 (en) * | 2021-02-03 | 2022-08-11 | 华为技术有限公司 | Interface board interconnection device |
| CN115458420A (en) * | 2022-09-16 | 2022-12-09 | 惠州市则成技术有限公司 | Ball mounting process for IC carrier plate |
| CN115709349A (en) * | 2021-08-20 | 2023-02-24 | 北京小米移动软件有限公司 | Tin powder, preparation method of tin powder, tin paste, welding method of circuit board and circuit board |
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| CN115458420A (en) * | 2022-09-16 | 2022-12-09 | 惠州市则成技术有限公司 | Ball mounting process for IC carrier plate |
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