CN112040669A - SMT (surface mount technology) welding process for PCB (printed circuit board) in shell - Google Patents
SMT (surface mount technology) welding process for PCB (printed circuit board) in shell Download PDFInfo
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- CN112040669A CN112040669A CN202010969967.6A CN202010969967A CN112040669A CN 112040669 A CN112040669 A CN 112040669A CN 202010969967 A CN202010969967 A CN 202010969967A CN 112040669 A CN112040669 A CN 112040669A
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- pcb
- steel mesh
- shell
- frameless
- welding
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
The invention discloses an SMT (surface mount technology) welding process for a PCB (printed circuit board) in a shell. The process comprises the following steps: selecting materials of a shell cover plate and a shell cavity, and respectively carrying out surface treatment on the shell cover plate and the shell cavity; welding the PCB board in the cavity of the shell; covering and fixing the frameless steel mesh on the PCB, wherein the windows on the frameless steel mesh correspond to the bonding pads on the PCB one by one; printing solder paste on a bonding pad on the PCB through the frameless steel mesh, and taking out the frameless steel mesh after printing is finished; using an automatic chip mounter to mount surface-mounted devices on the PCB; and soldering the surface-mounted device to the corresponding position of the PCB through reflow soldering. The invention adopts the processes of manual printing and automatic surface mounting, has simple process, strong operability and high assembly efficiency, and can meet the SMT welding of large-batch and high-integration substrates.
Description
Technical Field
The invention relates to the technical field of electronic industry welding, in particular to an SMT (surface mount technology) welding process for a PCB (printed circuit board) in a shell.
Background
Smt (surface Mount technology), also known as surface Mount technology, is a board-level assembly technique for mounting Surface Mount Devices (SMDs) onto Printed Circuit Boards (PCBs), is one of the most common techniques and processes in the electronic assembly industry today, and is also the core of modern electronic assembly technology.
The SMT soldering process generally includes reflow soldering and wave soldering, wherein the reflow soldering process is a soldering process for achieving surface mount device terminals or introducing mechanical and electrical connections to PCB pads by melting solder paste pre-printed on the PCB pads. It comprises the following steps: (1) manufacturing a steel mesh, namely manufacturing the steel mesh with proper thickness and a windowing mode according to the size of a bonding pad and a device on the PCB; (2) printing solder paste, covering a steel mesh on the PCB, and using equipment such as a printer and the like to leak the solder paste onto the bonding pad through the windowed hole of the steel mesh by using a scraper; (3) mounting the device, namely mounting the device on a corresponding position on a PCB (printed Circuit Board) by using equipment such as a chip mounter and the like, and contacting the printed solder paste with the device; (4) and reflow soldering, after the device is mounted, putting the PCB with the device mounted in a reflow oven and other welding equipment, heating the PCB through a set welding curve, and performing fusion soldering on the solder paste on the device after four stages of temperature rise, heat preservation, reflow soldering, cooling and the like to connect the device with a bonding pad on the printed board.
At present, an SMT process generally performs reflow soldering on a single board, however, in a microwave assembly, the requirement for the grounding performance of a PCB is high, the whole board needs to be grounded in a large area, and the void ratio is strictly limited, so in the microwave assembly, a PCB is generally assembled by soldering the PCB to a housing first and then soldering a surface-mounted device to the PCB. Because the PCB is already mounted in the housing, the conventional SMT process is no longer suitable, and the related equipment, such as a full-automatic printer, cannot be used at this time, and therefore, the process can be generally completed only by manual soldering or the like. However, for mass products, the efficiency is very low, the defects such as insufficient solder and bridge are easy to occur, the yield is not high, the problem is particularly prominent for microwave component high-frequency boards with high assembly density, and the bad phenomena such as the solder of the grounding pad cannot be wetted are also caused.
Disclosure of Invention
The invention aims to provide the SMT welding process for the PCB in the shell, which is simple in process, strong in operability and high in assembly efficiency, and meets the assembly requirements of large-batch and high-reliability products.
The technical solution for realizing the purpose of the invention is as follows: an SMT welding process for a PCB in a shell comprises the following steps:
and 6, welding the surface-mounted device to the corresponding position of the PCB through reflow soldering.
Further, in the step 1, the materials of the shell cover plate and the shell cavity are selected, and the surface treatment is respectively performed on the shell cover plate and the shell cavity, specifically as follows:
the shell cover plate is made of 4A11 aluminum alloy, and the surface treatment mode is natural color conductive oxidation;
the housing cavity adopts 6061 aluminum alloy, and the surface treatment mode is as follows: the PCB welding position is primed by nickel plating, the thickness is 5 mu m, then gold plating is carried out on the surface of the PCB, the thickness is 0.5 mu m, and the rest non-welding positions are oxidized by natural color conduction;
the shell cover plate is welded to the shell cavity in a laser seal welding mode.
Further, the PCB board in the step 2 is a multilayer mixed-compression composite board which is made of FR4+ CLTE-XT and has a total thickness of 1.4 mm;
the surface treatment process of the PCB comprises the following steps: plating nickel, palladium and gold on the front surface, wherein the thickness is 3 mu m; back surface chemical deposition of gold, 0.3 μm thick.
Further, step 3 the no frame steel mesh passes through laser beam machining shaping, and steel mesh thickness 0.06 ~ 0.13mm, the mode of windowing is: 0603 packaging and opening a hole according to the ratio of 1:1 below, and performing tin bead prevention treatment.
Further, step 4, solder paste is printed on the bonding pad on the PCB through the borderless steel mesh, and the borderless steel mesh is taken out after the printing is completed, which is specifically as follows:
placing solder paste on the frameless steel mesh, and then printing the solder paste on a bonding pad of the PCB through a window on the frameless steel mesh by using a scraper; during operation, one hand presses the frameless steel mesh, and the other hand uses the scraper to print the solder paste, so that no gap is formed between the frameless steel mesh and the PCB;
after the printing is completed, the frameless steel mesh is taken out by using tweezers and cleaned by using ultrasonic.
Further, in step 5, a surface mount device is mounted on the PCB by using an automatic surface mount machine, which includes:
mounting the shell cavity on a supporting plate, and mounting a surface-mounted device by using an automatic chip mounter;
and adjusting the Z-axis parameter of the automatic chip mounter according to the thickness of the cavity of the shell, so that the suction nozzle does not collide with the cavity of the shell during automatic chip mounting.
Further, in step 6, the surface mount device is soldered to a corresponding position of the PCB by reflow soldering, which is as follows:
setting a backflow curve according to the size and the structure of the shell cavity;
after the surface-mounted device is mounted, the shell cavity is placed in a reflow furnace, the shell cavity enters a track according to a set reflow curve, solder paste on the surface-mounted device is melted and welded through four stages of temperature rise, heat preservation, reflow welding and cooling, and finally the surface-mounted device is welded to the corresponding position of the PCB.
Compared with the prior art, the invention has the following remarkable advantages: (1) the process is simple, the operability is strong, and the SMT welding of surface-mounted devices is completed without using complex tools and equipment; (2) the process has strong universality, can meet the SMT welding of most similar products, has high assembly efficiency, and can meet the SMT welding of large-batch and high-integration substrates.
Drawings
FIG. 1 is a flow chart of the SMT welding process of the PCB inside the housing of the invention.
Fig. 2 is a schematic view of the housing of the present invention.
Fig. 3 is a schematic diagram of a PCB according to the present invention.
FIG. 4 is a schematic view of a frameless steel mesh according to the present invention.
FIG. 5 is a diagram illustrating the welding effect of the welding process according to the present invention in the examples.
Reference numerals:
1-shell cover plate, 2-shell cavity, 3-PCB, 4-frameless steel mesh and 5-surface-mounted device.
Detailed Description
With reference to fig. 1, the SMT soldering process of the PCB board in the housing of the present invention includes the following steps:
and 6, soldering the surface-mounted device 5 to the corresponding position of the PCB 3 through reflow soldering.
Further, in the step 1, the materials of the housing cover plate 1 and the housing cavity 2 are selected, and the two are respectively subjected to surface treatment, specifically as follows:
the shell cover plate 1 is made of 4A11 aluminum alloy, and the surface treatment mode is natural color conductive oxidation;
the housing cavity 2 adopts 6061 aluminum alloy, and the surface treatment mode is as follows: the welding position of the PCB 3 is primed by nickel plating, the thickness is 5 mu m, then gold is plated on the surface of the PCB, the thickness is 0.5 mu m, and the rest non-welding positions are oxidized by natural color conduction;
the shell cover plate 1 is welded to the shell cavity 2 in a laser seal welding mode.
Further, the PCB 3 in the step 2 is a multilayer mixed-compression composite board which is made of FR4+ CLTE-XT and has a total thickness of 1.4 mm;
the surface treatment process of the PCB 3 comprises the following steps: plating nickel, palladium and gold on the front surface, wherein the thickness is 3 mu m; back surface chemical deposition of gold, 0.3 μm thick.
Further, step 3 no frame steel mesh 4 is through laser beam machining shaping, and steel mesh thickness 0.06 ~ 0.13mm, the mode of windowing is: 0603 packaging and opening a hole according to the ratio of 1:1 below, and performing tin bead prevention treatment.
Further, step 4, printing solder paste on the bonding pad of the PCB board 3 through the borderless steel mesh 4, and taking out the borderless steel mesh 4 after printing is completed, specifically as follows:
placing solder paste on the frameless steel mesh 4, and then printing the solder paste on a bonding pad of the PCB 3 through a window on the frameless steel mesh 4 by using a scraper; during operation, one hand presses the frameless steel mesh 4, and the other hand uses a scraper to print solder paste, so that no gap is formed between the frameless steel mesh 4 and the PCB 3;
after the printing is completed, the borderless steel mesh 4 is taken out using tweezers and cleaned with ultrasound.
Further, in step 5, the surface mount device 5 is mounted on the PCB 3 by using an automatic surface mount machine, which includes the following specific steps:
mounting the shell cavity 2 on a supporting plate, and mounting a surface-mounted device 5 by using an automatic chip mounter;
and adjusting the Z-axis parameter of the automatic chip mounter according to the thickness of the shell cavity 2, so that the suction nozzle does not collide with the shell cavity 2 during automatic chip mounting.
Further, in step 6, the surface mount device 5 is soldered to the corresponding position of the PCB 3 by reflow soldering, which is as follows:
setting a backflow curve according to the size and the structure of the shell cavity 2;
after the surface-mounted device 5 is mounted, the shell cavity 2 is placed in a reflow furnace, the solder paste enters a track according to a set reflow curve, the solder paste on the surface-mounted device 5 is melted and welded in four stages of heating, heat preservation, reflow welding and cooling, and finally the surface-mounted device 5 is welded to the corresponding position of the PCB 3.
The invention will be further described with reference to the following drawings and specific embodiments.
Examples
As shown in fig. 2, in the case used in this embodiment, the material of the case cover plate 1 is 4a11 aluminum alloy, and the surface treatment is natural color conductive oxidation. The 2 materials of casing cavity are 6061 aluminum alloy, and 2 surface treatment modes of casing cavity are: the PCB is primed by nickel plating with a thickness of 5 μm at the welding position, and then gold plating with a thickness of 0.5 μm is carried out on the surface, and the rest non-welding positions are oxidized by natural color conduction. In order to ensure the sealing performance of the shell, the shell cover plate 1 is welded on the shell cavity 2 in a laser seal welding mode.
As shown in FIG. 3, the PCB 3 used in the present invention is made of FR4+ CLTE-XT, and has a total thickness of 1.4 mm. Because the shell needs to be sealed, the thickness of the shell cavity 2 is too small, the PCB 3 cannot be installed in the shell cavity 2 in a screw fastening mode, and the PCB 3 used in the invention requires high grounding performance, therefore, the PCB 3 is used for large-area grounding welding in the shell cavity 2. The surface treatment process of the PCB 3 comprises the following steps: plating nickel, palladium and gold on the front surface, wherein the thickness is 3 mu m; back surface chemical deposition of gold, 0.3 μm thick.
As shown in fig. 4, the frameless steel net 4 used in the present invention is formed by laser processing. The steel mesh windowing mode is as follows: 0603 and 1:1 below, the holes need to be treated for tin bead prevention. 0603 or more, the package is processed according to a general windowing mode. The thickness of the frameless steel mesh 4 used in the invention has higher processing requirements, the thickness is 0.06-0.13 mm, and the excessive thickness of the steel mesh can cause excessive soldering tin amount, so that the phenomenon of bridging short circuit of a surface-mounted device occurs; the undersize of the thickness can cause the solder quantity to be too little, and the situations of false soldering, non-overlapping of a soldering terminal and a soldering pad and the like can occur.
As shown in fig. 5, in the welding effect diagram after the welding process is adopted in this embodiment, it can be seen that, by using the welding process in the present invention, the surface-mounted device has a good welding effect, and defects such as short circuit and insufficient solder joint do not occur.
The SMT welding process for the PCB in the shell comprises the following implementation steps:
(1) the PCB 3 is welded on the shell cavity 2 by using materials such as solder paste or soldering lugs, and the step belongs to a general welding process, and the welding mode is more, such as a vacuum furnace, a reflow furnace, a heating table and the like;
(2) the frameless steel mesh 4 is covered on the PCB 3, and at the moment, it needs to be noticed that the windowing on the frameless steel mesh 4 is required to be in one-to-one correspondence with the welding pads on the PCB 3, and any dislocation cannot occur. In order to ensure the corresponding position, a positioning hole is processed in the local area of the shell cavity 2, so that the PCB 3 and the frameless steel mesh 4 are ensured not to deviate after being put in;
(3) and placing part of solder paste on the steel mesh, then printing the solder paste on the bonding pads on the PCB 3 by using a small scraper, and leaking the solder paste onto the bonding pads of the PCB 3 through the opening holes on the frameless steel mesh 4. During operation, the frameless steel mesh 4 is pressed by one hand, and solder paste is printed by the scraper by the other hand, so that no obvious gap is formed between the frameless steel mesh 4 and the PCB 3. After printing is finished, gently taking down the frameless steel mesh 4 by using tweezers, and cleaning the frameless steel mesh by using an ultrasonic cleaning machine;
(4) the shell cavity 2 is arranged on a supporting plate, and an automatic chip mounter is used for mounting the surface-mounted device 5. It should be noted that: the traditional automatic chip mounter process parameters are not used under the condition, and the Z-axis parameters of the automatic chip mounter are adjusted according to the thickness of the shell cavity 2, in the invention, the Z-axis parameters are raised by 2-4 mm according to the thickness of the shell cavity 2, so that the phenomenon that a surface mounted device 5 falls off due to collision between a suction nozzle and the shell cavity 2 during automatic chip mounting is avoided.
(5) After the surface-mounted device 5 is mounted, the shell cavity 2 is placed in a reflow furnace, the shell cavity enters a track according to a set curve, solder paste on the surface-mounted device 5 is melted and welded after four stages of temperature rise, heat preservation, reflow welding, cooling and the like, and finally the surface-mounted device 5 on the PCB 3 is welded to a corresponding position.
The SMT welding of the PCB in the shell can be completed through the 5 steps, the innovative processes of manual printing and automatic surface mounting are adopted, the assembly efficiency is very high, and the method has a great guiding effect on similar product processes.
Claims (7)
1. An SMT welding process for a PCB in a shell is characterized by comprising the following steps:
step 1, selecting materials of a shell cover plate (1) and a shell cavity (2), and respectively carrying out surface treatment on the materials;
step 2, welding the PCB (3) into the shell cavity (2);
step 3, covering and fixing the frameless steel mesh (4) on the PCB (3), wherein the windows on the frameless steel mesh (4) correspond to the bonding pads on the PCB (3) one by one;
step 4, printing solder paste on the bonding pad on the PCB (3) through the frameless steel mesh (4), and taking out the frameless steel mesh (4) after printing is finished;
step 5, using an automatic chip mounter to mount a surface-mounted device (5) on the PCB (3);
and 6, soldering the surface-mounted device (5) to the corresponding position of the PCB (3) through reflow soldering.
2. An SMT (surface mount technology) welding process for PCBs (printed circuit boards) in a shell according to claim 1, wherein materials of a shell cover plate (1) and a shell cavity (2) are selected in step 1, and surface treatment is performed on the two materials respectively, specifically as follows:
the shell cover plate (1) is made of 4A11 aluminum alloy, and the surface treatment mode is natural color conductive oxidation;
the housing cavity (2) adopts 6061 aluminum alloy, and the surface treatment mode is as follows: the welding position of the PCB (3) is primed by nickel plating with the thickness of 5 mu m, then gold is plated on the surface with the thickness of 0.5 mu m, and the rest non-welding positions are oxidized by natural color conduction;
the shell cover plate (1) is welded to the shell cavity (2) in a laser seal welding mode.
3. An SMT welding process for PCBs inside a housing according to claim 1, wherein in step 2, the PCB (3) is a multi-layer hybrid composite board made of FR4+ CLTE-XT and having a total thickness of 1.4 mm;
the surface treatment process of the PCB (3) comprises the following steps: plating nickel, palladium and gold on the front surface, wherein the thickness is 3 mu m; back surface chemical deposition of gold, 0.3 μm thick.
4. An SMT (surface mount technology) welding process for PCBs (printed circuit boards) in a housing according to claim 1, wherein the frameless steel mesh (4) in the step 3 is formed through laser processing, the thickness of the steel mesh is 0.06-0.13 mm, and the windowing mode is as follows: 0603 packaging and opening a hole according to the ratio of 1:1 below, and performing tin bead prevention treatment.
5. An SMT (surface mount technology) welding process for PCBs (printed circuit boards) in a housing according to claim 1, wherein step 4 is to print solder paste on the pads of the PCB (3) through the borderless steel mesh (4), and the borderless steel mesh (4) is taken out after printing is completed, specifically as follows:
solder paste is placed on the frameless steel mesh (4), and then the solder paste is printed on a bonding pad of the PCB (3) through a window on the frameless steel mesh (4) by using a scraper; during operation, one hand presses the frameless steel mesh (4), and the other hand uses a scraper to print solder paste, so that no gap is formed between the frameless steel mesh (4) and the PCB (3);
after printing is finished, the frameless steel mesh (4) is taken out by using tweezers and cleaned by using ultrasonic.
6. An SMT solder process for PCB boards inside a housing according to claim 1, wherein step 5 said surface mount device (5) is mounted on the PCB board (3) using an automatic surface mount machine, specifically as follows:
mounting the shell cavity (2) on a supporting plate, and mounting a surface-mounted device (5) by using an automatic chip mounter;
and adjusting the Z-axis parameter of the automatic chip mounter according to the thickness of the shell cavity (2), so that the suction nozzle does not collide with the shell cavity (2) during automatic chip mounting.
7. An SMT process for soldering a PCB board inside a housing according to claim 1, wherein step 6 is performed by reflow soldering to solder the surface mounted device (5) to a corresponding location of the PCB board (3), as follows:
setting a backflow curve according to the size and the structure of the shell cavity (2);
after the surface-mounted device (5) is mounted, the shell cavity (2) is placed in a reflow furnace, the shell cavity enters a track according to a set reflow curve, solder paste on the surface-mounted device (5) is melted and welded through four stages of temperature rise, heat preservation, reflow welding and cooling, and finally the surface-mounted device (5) is welded to the corresponding position of the PCB (3).
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| CN113146151A (en) * | 2021-04-02 | 2021-07-23 | 扬州海科电子科技有限公司 | T/R assembly substrate assembly process |
| CN113395840A (en) * | 2021-06-03 | 2021-09-14 | 上海丸旭电子科技有限公司 | Method for improving welding reliability of surface mount type shunt |
| CN113556885A (en) * | 2021-06-29 | 2021-10-26 | 联宝(合肥)电子科技有限公司 | Welding process based on anti-oxidation protection |
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| CN112040669B (en) | 2022-03-15 |
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