CN116828731A - Through hole reflow soldering process for sub-mother board - Google Patents
Through hole reflow soldering process for sub-mother board Download PDFInfo
- Publication number
- CN116828731A CN116828731A CN202310710532.3A CN202310710532A CN116828731A CN 116828731 A CN116828731 A CN 116828731A CN 202310710532 A CN202310710532 A CN 202310710532A CN 116828731 A CN116828731 A CN 116828731A
- Authority
- CN
- China
- Prior art keywords
- soldering
- welding
- hole reflow
- daughter board
- designing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000008569 process Effects 0.000 title claims abstract description 27
- 238000003466 welding Methods 0.000 claims abstract description 36
- 238000005516 engineering process Methods 0.000 claims abstract description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 8
- 230000009194 climbing Effects 0.000 claims abstract description 8
- 239000010959 steel Substances 0.000 claims abstract description 8
- 239000006227 byproduct Substances 0.000 claims abstract description 6
- 238000002474 experimental method Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a through hole reflow soldering process for a sub-mother board, which comprises the following steps: step 1: designing a daughter board bonding pad: designing a bonding pad on the daughter board, and ensuring the tin climbing height and the assembly welding strength on the bonding pad of the daughter board; step 2: designing a ladder template: designing the shape of the steel mesh to meet the soldering tin amount required by product welding; step 3: and (3) sticking: mounting the daughter board to the motherboard by adopting a surface mount technology; step 4: welding through hole reflow process: and searching proper welding parameters through DOE experiments, and then performing a through hole reflow process to perform welding. According to the invention, a through hole reflow soldering technology is adopted, and the mode of soldering the sub-mother boards one by one from a single point is improved to be through hole reflow soldering once integral soldering, so that the assembly soldering efficiency and quality of the sub-mother boards are improved, and the index of high reliability of the assembly soldering of the mother boards is achieved.
Description
Technical Field
The invention relates to the technical field of sub-mother board welding, in particular to a through hole reflow welding process for a sub-mother board.
Background
The reflow soldering technology is not unfamiliar in the field of electronic manufacturing, and components on various control boards used in various devices/electric appliances are soldered to a circuit board by the process, and a heating circuit is arranged in the device, so that air or nitrogen is heated to a high enough temperature and then blown to the circuit board on which the components are already stuck, and solder on two sides of the components is melted and then bonded to a main board. The process has the advantages that the temperature is easy to control, oxidation can be avoided in the welding process, and the manufacturing cost is easy to control.
The reflow soldering technique is in fact a fine process soldering technique. The technology has the greatest advantage that electronic components can be welded on the circuit board on some small circuit boards, so that the requirements of enterprises on the circuit board are met. In terms of production technology, reflow soldering is a soldering technique and a smt technique in an application. It can be said that the tools requiring electricity are produced by reflow soldering. In the aspect of practical application, the reflow soldering is said to be applied to aspects of production and life of people. The reflow soldering is mainly used for soldering circuit boards of mounted components.
The traditional SMT reflow soldering is to realize the soldering of the mechanical and electrical connection between the soldering terminal or pin of the surface-assembled component and the bonding pad of the printed board by remelting the paste solder pre-distributed on the bonding pad of the printed board. Namely, reflow soldering is to solder components onto a PCB, and aims at surface mounting devices, and in order to adapt to the development of surface mounting technology, the measure for solving the soldering difficulty is to adopt a through hole reflow soldering technology; to this end, we propose a through-hole reflow soldering process for a sub-motherboard.
Disclosure of Invention
The invention aims to provide a through hole reflow soldering process for a sub-mother board, which aims to solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: a through hole reflow soldering process for a mother board comprises the following steps:
step 1: designing a daughter board bonding pad: designing a bonding pad on the daughter board, and ensuring the tin climbing height and the assembly welding strength on the bonding pad of the daughter board;
step 2: designing a ladder template: designing the shape of the steel mesh to meet the soldering tin amount required by product welding;
step 3: and (3) sticking: mounting the daughter board to the motherboard by adopting a surface mount technology;
step 4: welding through hole reflow process: and searching proper welding parameters through DOE experiments, and then performing a through hole reflow process to perform welding.
Preferably, before the step S3 of mounting, solder paste needs to be printed on the motherboard.
Preferably, the method further comprises step S5: and detecting after welding, and adopting X-ray detection.
Compared with the prior art, the invention has the beneficial effects that:
1. the through hole reflow soldering technology is adopted, and the mode of soldering the sub-mother boards one by one from a single point is improved to be through hole reflow soldering once integral soldering, so that the assembly soldering efficiency and quality of the sub-mother boards are improved, and the index of high reliability of the assembly soldering of the mother boards is achieved;
2. the daughter board bonding pad design technology: the special design is carried out on the bonding pad on the daughter board, so that the tin climbing height and the assembling and welding strength on the bonding pad of the daughter board are ensured; surface mounting technology: the daughter board is accurately mounted on the mother board by adopting a surface mounting technology; step steptail technology (Step template design): the special steel mesh design accords with the soldering tin amount required by product welding; through hole reflow technique: by applying DOE experiments, the optimal parameters are searched, and the welding target with high reliability of the through hole reflow soldering process is achieved;
3. assembling and welding the sub-mother board is finished through a through hole reflow soldering process for the first time, and high-reliability connection of the sub-mother board is achieved; the special design of the daughter board bonding pad ensures the tin climbing height and the assembly welding strength on the daughter board bonding pad; through the special design of the steel mesh, the printing quantity of the solder paste is controlled, the residue of rosin soldering flux is reduced, and the cleanliness of the product is maintained.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
Referring to fig. 1, in an embodiment of the present invention, a through hole reflow soldering process for a sub-motherboard includes the following steps:
step 1: designing a daughter board bonding pad: designing a bonding pad on the daughter board, and ensuring the tin climbing height and the assembly welding strength on the bonding pad of the daughter board;
step 2: designing a ladder template: designing the shape of the steel mesh to meet the soldering tin amount required by product welding;
step 3: and (3) sticking: mounting the daughter board to the motherboard by adopting a surface mount technology;
step 4: welding through hole reflow process: and searching proper welding parameters through DOE experiments, and then performing a through hole reflow process to perform welding.
Preferably, before the step S3 of mounting, solder paste needs to be printed on the motherboard.
Preferably, the method further comprises step S5: and detecting after welding, and adopting X-ray detection.
The through hole reflow soldering technology is adopted, and the mode of soldering the sub-mother boards one by one from a single point is improved to be through hole reflow soldering once integral soldering, so that the assembly soldering efficiency and quality of the sub-mother boards are improved, and the index of high reliability of the assembly soldering of the mother boards is achieved;
the daughter board bonding pad design technology: the special design is carried out on the bonding pad on the daughter board, so that the tin climbing height and the assembling and welding strength on the bonding pad of the daughter board are ensured; surface mounting technology: the daughter board is accurately mounted on the mother board by adopting a surface mounting technology; step steptail technology (Step template design): the special steel mesh design accords with the soldering tin amount required by product welding; through hole reflow technique: by applying DOE experiments, the optimal parameters are searched, and the welding target with high reliability of the through hole reflow soldering process is achieved;
assembling and welding the sub-mother board is finished through a through hole reflow soldering process for the first time, and high-reliability connection of the sub-mother board is achieved; the special design of the daughter board bonding pad ensures the tin climbing height and the assembly welding strength on the daughter board bonding pad; through the special design of the steel mesh, the printing quantity of the solder paste is controlled, the residue of rosin soldering flux is reduced, and the cleanliness of the product is maintained.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A through hole reflow soldering process for a mother board is characterized in that: the method comprises the following steps:
step 1: designing a daughter board bonding pad: designing a bonding pad on the daughter board, and ensuring the tin climbing height and the assembly welding strength on the bonding pad of the daughter board;
step 2: designing a ladder template: designing the shape of the steel mesh to meet the soldering tin amount required by product welding;
step 3: and (3) sticking: mounting the daughter board to the motherboard by adopting a surface mount technology;
step 4: welding through hole reflow process: and searching proper welding parameters through DOE experiments, and then performing a through hole reflow process to perform welding.
2. A through-hole reflow soldering process for sub-motherboards in accordance with claim 1, wherein: before the step S3 of mounting, solder paste needs to be printed on the motherboard.
3. A through-hole reflow soldering process for sub-motherboards in accordance with claim 1, wherein: further comprising step S5: and detecting after welding, and adopting X-ray detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310710532.3A CN116828731A (en) | 2023-06-15 | 2023-06-15 | Through hole reflow soldering process for sub-mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310710532.3A CN116828731A (en) | 2023-06-15 | 2023-06-15 | Through hole reflow soldering process for sub-mother board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116828731A true CN116828731A (en) | 2023-09-29 |
Family
ID=88112081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310710532.3A Pending CN116828731A (en) | 2023-06-15 | 2023-06-15 | Through hole reflow soldering process for sub-mother board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116828731A (en) |
-
2023
- 2023-06-15 CN CN202310710532.3A patent/CN116828731A/en active Pending
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |