CN215499759U

CN215499759U - Circuit board structure convenient for welding chip

Info

Publication number: CN215499759U
Application number: CN202121843712.1U
Authority: CN
Inventors: 吴春梅; 吕正山
Original assignee: Tianchang Lv Hang Electronic Technology Co ltd
Current assignee: Tianchang Lv Hang Electronic Technology Co ltd
Priority date: 2021-08-09
Filing date: 2021-08-09
Publication date: 2022-01-11
Anticipated expiration: 2031-08-09

Abstract

The utility model discloses a circuit board structure convenient for welding a chip, which comprises a chip, wherein the chip comprises a core plate and a plurality of pins uniformly arranged on two sides of the core plate; a circuit board which can be fixedly inserted with the pins is arranged on the chip close to the lower end; the upper surface of the circuit board is provided with a plurality of slots which are matched and spliced with the pins, and the slots are of a single-side opening structure; the pins are inserted into the corresponding slots one by one, the core board is pressed downwards, the pins are completely inserted into the slots, in the pressing process, the pins and the circuit board are fixedly installed through the matching of the convex blocks and the clamping grooves, then the connection positions of the upper surface of the metal plate and the pins are welded through a welding device, meanwhile, the chip is embedded into the circuit board through the single-side opening structure of the slots and the mechanical close-fit embedding method between the pins and the slots, wave soldering is directly carried out on the device, and the reflow soldering or red glue process is omitted.

Description

Circuit board structure convenient for welding chip

Technical Field

The utility model relates to the field of welding of chips and circuit boards, in particular to a circuit board structure convenient for welding chips.

Background

Reflow soldering is that firstly, a circuit board is brushed with solder paste, then a Surface Mounted Device (SMD) is sucked and placed at a corresponding position by a Surface Mounted Device (SMD), and then the SMD and the circuit board are soldered together by melting the solder paste through hot air of a reflow soldering machine. For a full surface mount circuit board, soldering can be done in one go. However, for the mixed-insertion circuit board, a jig needs to be manufactured for machine insertion or manual insertion and then wave soldering is performed, and the circuit board needs to be soldered twice. Wave soldering is suitable for one-time soldering with a THT device circuit board, and for a mixed insertion circuit board, an SMD (surface mounted device) is firstly glued by red glue, then the red glue is solidified by hot air of a reflow soldering machine, and then the wave soldering is carried out together with a through hole device to complete the soldering process.

The all-THT technology is adopted for the circuit board, and the circuit board of the SOP chip is required to be used for welding. As some integrated circuit company products do not provide DIP packages. Only SOP packages. This patent adopts the method that single face circuit board evolution hole machinery tight fit was inlayed, with the SOP chip from the direct wave-soldering of crossing of copper foil face embedding and through-hole device on the circuit board, save reflow soldering or red gluey technology.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a circuit board structure convenient for welding a chip, wherein a square hole of a single-sided circuit board is embedded in a mechanical tight fit manner, and a reflow soldering or red glue process is omitted.

In order to solve the technical problems, the utility model provides the following technical scheme: a circuit board structure convenient for welding a chip comprises a chip, wherein the chip comprises a core plate and a plurality of pins which are uniformly arranged on two sides of the core plate;

a circuit board which can be fixedly inserted with the pins is arranged on the chip close to the lower end;

the upper surface of the circuit board is provided with a plurality of slots which are matched and spliced with pins, and the slots are of single-side opening structures; the upper surface of the circuit board is embedded with a metal plate connected with the pins above the slots, and through holes corresponding to the slots are formed in the surface of the metal plate.

As a preferred technical scheme of the utility model, the two sides of the lower end of each pin are symmetrically provided with a lug which is set in a right-angled triangle structure, and one side far away from the pins is a slope structure with a high height and a low height.

As a preferred technical scheme of the utility model, the two sides of the inside of each slot are respectively provided with a clamping groove which is matched and buckled with the convex block.

As a preferred technical scheme of the utility model, the bottom of each slot is of a slope surface structure inclining downwards.

As a preferred technical scheme of the utility model, the pins are set in an S-shaped structure.

Compared with the prior art, the utility model can achieve the following beneficial effects:

1. the pins are inserted into the corresponding slots one by one, the core board is pressed downwards, the pins are completely inserted into the slots, in the pressing process, the pins and the circuit board are fixedly installed through the matching of the convex blocks and the clamping grooves, then the connection positions of the upper surface of the metal plate and the pins are welded through a welding device, meanwhile, the chip is embedded into the circuit board through the single-side opening structure of the slots and the mechanical close-fit embedding method between the pins and the slots, wave soldering is directly carried out on the device, and the reflow soldering or red glue process is omitted.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic illustration of an explosive structure according to the present invention;

FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2 according to the present invention;

FIG. 4 is a schematic cross-sectional view of a circuit board according to the present invention;

fig. 5 is an enlarged schematic view of the structure at B in fig. 4 according to the present invention.

Wherein: 1. a chip; 11. a core board; 12. a pin; 121. a bump;

2. a circuit board; 21. a metal plate; 22. a slot; 221. a clamping groove.

Detailed Description

The present invention will be further described with reference to specific embodiments for the purpose of facilitating an understanding of technical means, characteristics of creation, objectives and functions realized by the present invention, but the following embodiments are only preferred embodiments of the present invention, and are not intended to be exhaustive. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in fig. 1-5, the present invention provides a circuit board structure for conveniently soldering a chip, which includes a chip 1, wherein the chip 1 includes a core board 11 and a plurality of pins 12 uniformly arranged on two sides of the core board 11; a circuit board 2 which can be fixedly inserted with the pins 12 is arranged on the chip 1 close to the lower end; the upper surface of the circuit board 2 is provided with a plurality of slots 22 which are matched and spliced with the pins 12, and the slots 22 are of a single-side opening structure; the upper surface of the circuit board 2 is arranged above the slot 22 and embedded with a metal plate 21 connected with the pin 12, and the surface of the metal plate 21 is provided with a through hole corresponding to the slot 22.

When the chip is used, the pins 12 are inserted into the corresponding slots 22 one by one, the core plate 11 is pressed downwards, the pins 12 are completely inserted into the slots 22, in the pressing process, the pins 12 and the circuit board 2 are fixedly mounted through the matching of the bumps 121 and the slots 221, then the joints of the upper surface of the metal plate 21 and the pins 12 are welded through a welding device, meanwhile, the chip 1 is embedded into the circuit board 2 through the single-side opening structure of the slots 22 and the mechanical close-fit embedding method between the pins 12 and the slots 22, wave soldering is directly carried out on the device, and the reflow soldering or red glue process is omitted.

In other embodiments, the two sides of the lower end of each pin 12 are symmetrically provided with the protrusions 121, the protrusions 121 are configured in a right triangle structure, and one side away from the pin 12 is a slope structure with a high height and a low height, so that the protrusion 121 improves the extrusion force between the pin 12 and the slot 22 in the downward movement process, and improves the fixing effect.

In other embodiments, the inner two sides of each slot 22 are respectively provided with a slot 221 for engaging with the bump 121, and the fixing effect between the chip 1 and the circuit board 2 is improved by the engagement of the bump 121 and the slot 221.

In other embodiments, the bottom of each slot 22 has a slope structure with a downward slope, so as to facilitate the downward insertion of the pins 12.

In other embodiments, the pins 12 are configured in an "S" configuration, which would facilitate insertion into the interior of the socket 22 if the pins 12 were inserted therein.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a circuit board structure convenient to welding chip, including chip (1), its characterized in that: the chip (1) comprises a core plate (11) and a plurality of pins (12) which are uniformly arranged on two sides of the core plate (11);

a circuit board (2) which can be fixedly inserted with the pins (12) is arranged on the chip (1) close to the lower end;

the upper surface of the circuit board (2) is provided with a plurality of slots (22) which are matched and spliced with the pins (12), and the slots (22) are of a single-side opening structure; the upper surface of the circuit board (2) is embedded with a metal plate (21) connected with the pins (12) above the slots (22), and through holes corresponding to the slots (22) are formed in the surface of the metal plate (21).

2. The circuit board structure for facilitating chip bonding according to claim 1, wherein: each lug (121) is symmetrically arranged on two sides of the lower end of each pin (12), each lug (121) is set in a right-angled triangle structure, and one side, far away from each pin (12), of each lug is of a slope structure with a high height and a low height.

3. The circuit board structure for facilitating chip bonding according to claim 1, wherein: and clamping grooves (221) matched and buckled with the convex blocks (121) are formed in two sides of the inner part of each slot (22).

4. The circuit board structure for facilitating chip bonding according to claim 1, wherein: the bottom of each slot (22) is of a slope surface structure which inclines downwards.

5. The circuit board structure for facilitating chip bonding according to claim 1, wherein: the pins (12) are set in an S-shaped structure.