CN107889374A - A kind of compensation reflow soldering method of the solder of via devices - Google Patents

A kind of compensation reflow soldering method of the solder of via devices Download PDF

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Publication number
CN107889374A
CN107889374A CN201711124617.4A CN201711124617A CN107889374A CN 107889374 A CN107889374 A CN 107889374A CN 201711124617 A CN201711124617 A CN 201711124617A CN 107889374 A CN107889374 A CN 107889374A
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CN
China
Prior art keywords
solder
hole
amount
printed circuit
circuit board
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711124617.4A
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Chinese (zh)
Inventor
杨小健
张琪
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Beijing Institute of Computer Technology and Applications
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Beijing Institute of Computer Technology and Applications
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Application filed by Beijing Institute of Computer Technology and Applications filed Critical Beijing Institute of Computer Technology and Applications
Priority to CN201711124617.4A priority Critical patent/CN107889374A/en
Publication of CN107889374A publication Critical patent/CN107889374A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Abstract

The invention discloses a kind of compensation reflow soldering method of solder of through hole class device, wherein, including：Calculate amount of solder needed for weld pads；Calculation template printing solder amount；Compensation amount of solder needed for calculating；The surface that printed circuit board base board is used to insert to via devices is placed upward, and the template for offering window is placed on into surface of the printed circuit board base board for inserting via devices；The jack that solder is entered in the printed circuit board base board by the window；The weld tabs provided with through hole is being mounted corresponding to the window on solder, and is being used for the jack for inserting via devices in the through hole alignment printed circuit board base board；The pin of through hole class device is plugged in the jack of the printed circuit board base board；The printed circuit board base board for being fitted with via devices is sent into solder reflow device, reflow soldering is carried out to the base pin place of via devices.The compensation reflow soldering method of solder of the through hole class device of the present invention, simple to operate, welding efficiency is high, is adapted to typical products in mass production production, and ensure that welding quality.

Description

A kind of compensation reflow soldering method of the solder of via devices
Technical field
The present invention relates to a kind of Through-hole reflow to connect method, particularly a kind of compensation reflow soldering of the solder of via devices Method.
Background technology
With electronic product to miniaturization, multi-functional and high-performance direction development, printed circuit board (PCB) assembling form development For the assembly method based on surface mount (SMT).But due to factors such as product inherent strength, reliability and applicabilities Restrict, a number of through hole class inserting device still can be used in product, its assembling technique used is typically at present Manual welding or wave soldering.
Using manual welding, i.e., via devices are inserted into the hole of printed circuit board (PCB), reverse circuit plate, will with electric iron Its pin welds on circuit boards, there is that production link is more, production cycle length and the problems such as welding quality unstable.
Using wave soldering, the general crest mounted welder for wanting design specialized, printed circuit board (PCB) is fixed in the frock, so After through hole class device is inserted into circuit board apertures afterwards, with frock fixed via class device and circuit board, the circuit board that will be installed It is sent into wave-soldering furnace and is welded with frock, the welding method welding efficiency is low, and welding tooling cost is high, bridging easily occurs The defects of.
The measure for solving process above difficult point is to use Through-hole reflow connection technology：Carrying out the welding of through hole class device When, solder wire is imprinted in via pad in advance, existed after then through hole class device is inserted by reflow soldering, the solder of fusing Lead, the circuit board metallization through hole of the good pad of wellability and through hole class device, and shape are flowed in the presence of surface tension Into the solder joint similar with manual welding, wave soldering, the interconnection for contact of completing to be electrically connected.But the pad of through hole class device, except Having outside the upper and lower pad of circuit board, the through hole in also printed board thickness direction needs to fill up solder, and in component pin and printing The junction of plate two sides pad will also form semi-moon shaped solder joint, it is therefore desirable to amount of solder it is about more than the amount of solder of surface mounting component 3~4 times, the preferable solder joint of through hole class device can not be only formed by the amount of solder that traditional template window is bitten.
The content of the invention
It is an object of the invention to provide a kind of compensation reflow soldering method of solder of through hole class device, it is intended in solution State in the prior art, the problem of through hole class device manual welding is of poor quality, efficiency is low, and further invention through hole class device backflow Solder compensation way, solves the problems, such as through hole class device reflow soldering insufficient solder connection.
A kind of compensation reflow soldering method of solder of through hole class device of the present invention, wherein, including：
Step 1：According to solder needed for printed circuit board (PCB) jack size and through hole class device pin Size calculation weld pads Amount；
Step 2：According to through hole class device pin size design template opening size, corresponding via devices receptacle area Thickness window is of uniform thickness with other regions, calculation template printing solder amount；
Step 3：Amount of solder is compensated according to needed for calculating amount of solder needed for mould printing amount of solder and solder joint, designs weld tabs Size, weld tabs is ring-type, provided with through hole；
Step 4：The surface that printed circuit board base board is used to insert to via devices is placed upward, will offer window Template is placed on the surface that the printed circuit board base board is used to insert via devices, and the window aligns and connected described It is used for the jack for inserting via devices in printed circuit board base board.
Step 5：Using printing equipment, printing solder, solder enter the printing by the window in the template Jack in circuit board substrate；
Step 6：The template is unloaded from the printed circuit board base board, and by the printed circuit board (PCB) with solder Substrate is sent into patch device, is mounting the weld tabs provided with through hole corresponding to the window on solder, and described in through hole alignment It is used for the jack for inserting via devices in printed circuit board base board；
Step 7：Utilize the jack for inserting equipment by the pin of through hole class device and being plugged in the printed circuit board base board It is interior, and the pin of via devices passes through the through hole of the weld tabs；
Step 8：The printed circuit board base board for being fitted with via devices is sent into solder reflow device, to via devices Base pin place carries out reflow soldering.
According to a kind of compensation reflow soldering method embodiment of solder of through hole class device of the present invention, wherein, it is described logical Amount of solder needed for the class device reflow soldering of hole is calculated by below equation and obtained：
Vsp=VTHT+2×V1-V2
Wherein：VspAmount of solder needed for=each pin；
VTHTFilling amount of solder in=through hole；
V1=device side leg amount of solder and bottom surface leg amount of solder；
V2=pin volume.
According to an embodiment of the compensation reflow soldering method of solder of through hole class device of the present invention, wherein, step 1 mould The window size of plate is limited by the through hole class device pin spacing, and mould printing amount of solder is calculated by below equation and obtained：
Vtp=κ (V3+V4)
Wherein：VtpThe amount of solder that=pad hole is always bitten；
V3=bond pad surface bites amount of solder；
V4Amount of solder is bitten in=pad hole；
The volume fraction of metallic particles in κ=solder.
According to a kind of compensation reflow soldering method embodiment of solder of through hole class device of the present invention, wherein, step 3 Amount of solder needed for the through hole class device reflow soldering is more than the amount of solder that the template is bitten, and the amount of solder that need to be compensated is by following Formula is calculated and obtained：
Vlp=Vsp-Vtp
Wherein：Vlp-=amount of solder that need to be compensated；
VspAmount of solder needed for=each pin；
VtpThe amount of solder that=pad hole is always bitten.
According to the present invention a kind of through hole class device the compensation reflow soldering method embodiment of solder, wherein, step 2 and Step 3, using printing equipment in the template printing solder；Mounted using patch device corresponding to the window on solder Weld tabs provided with through hole.
According to a kind of compensation reflow soldering method embodiment of solder of through hole class device of the present invention, wherein, step 4 profit The pin of through hole class device is plugged in the jack of the printed circuit board base board with inserting equipment, and the pin of via devices Through the through hole of the weld tabs.
According to a kind of compensation reflow soldering method embodiment of solder of through hole class device of the present invention, wherein, step 5 profit Reflow soldering is carried out to the base pin place of via devices with solder reflow device.
The present invention also provides a kind of weld tabs, and it is placed on the solder surface of printed circuit board (PCB) printing, the printed circuit The jack of inserting via devices is provided with plate substrate, is provided with through hole in the weld tabs, the through hole aligns and connects the jack,
Further, the weld tabs is ring-type, provided with through hole；
Further, the amount of solder deficiency that the weld tabs can be described in flexible compensation during the device reflow soldering of through hole class, weldering The size of piece is calculated by below equation and obtained：
Wherein：The thickness of H=weld tabs；
Vlp=the amount of solder that need to be compensated；
The external diameter of D=weld tabs；
The internal diameter of d=weld tabs.
The compensation reflow soldering method of solder of the through hole class device of the present invention, solder compensation is carried out using weld tabs, is solved The problem of only biting situation lower through-hole class device reflow soldering soldering tin amount deficiency by conventional template window, and using full automatic Equipment, the reflow soldering of through hole class device is completed, instead of manual welding, simple to operate, efficiency high, be adapted to typical products in mass production life Production, and ensure that welding quality.
Brief description of the drawings
The cut-away illustration that Fig. 1 is printed circuit board base board provided in an embodiment of the present invention and template coordinates；
Fig. 2 is the cut-away illustration of the printed circuit board base board after solder in printing provided in an embodiment of the present invention；
Fig. 3 is the cut-away illustration of the printed circuit board base board after weld tabs provided in an embodiment of the present invention attachment；
Fig. 4 is the cut-away illustration of the printed circuit board base board provided in an embodiment of the present invention for being fitted with through-hole component；
Fig. 5 is the cut-away illustration that solder provided in an embodiment of the present invention compensates weld tabs.
Embodiment
To make the purpose of the present invention, content and advantage clearer, with reference to the accompanying drawings and examples, to the present invention's Embodiment is described in further detail.
The cut-away illustration that Fig. 1 is printed circuit board base board provided in an embodiment of the present invention and template coordinates；Fig. 2 is this hair The cut-away illustration of printed circuit board base board in the printing that bright embodiment provides after solder；Fig. 3 provides for the embodiment of the present invention Weld tabs attachment after printed circuit board base board cut-away illustration；Fig. 4 is fitted with through hole member to be provided in an embodiment of the present invention The cut-away illustration of the printed circuit board base board of device；Fig. 5 is that the cutting of solder provided in an embodiment of the present invention compensation weld tabs is shown It is intended to, as Figure 1-5, one embodiment of the compensation reflow soldering method of solder of via devices of the present invention, for military products All there is the jack 2 for ceramic base through-hole component, for the ease of in such printing electricity on the printed circuit board base board 1 of industry Ceramic base through-hole component is inserted on road plate substrate 1, ceramic base through-hole component is welded on printed circuit board (PCB) base so as to realize On plate 1, connect in the present embodiment using the compensation Through-hole reflow of solder, its specific operating procedure is as follows：
Step 1：The surface that printed circuit board base board 1 is used to insert to through-hole component is face-up placed, and will be offered The template 3 of window 4 be placed on printed circuit board (PCB) to applied to inserting through-hole component surface on, and the window 4 align and even Jack 2 on logical printed circuit board base board 1, aliging and connecting for window 4 and jack 2 is kept, is had on printed circuit board base board 1 more The few jack 2 for needing to insert through-hole component, it is just corresponding in template 3 to open up how many corresponding windows 4.
Step 2：Using printing equipment, printing solder 5, solder 5 will be flowed into jack 2 by window 4 in template 3, So that in jack 2 and upper surface is filled with solder 5.
Step 3：Template 3 on printed circuit board base board 1 is unloaded, the printed circuit board base board 1 with solder 5 is sent Enter patch device, the weld tabs of through hole 7 is offered using the surface mount of solder 5 of the patch device on printed circuit board base board 1 6, and the jack 2 on the printed aligned circuit board substrate 1 of through hole 7, how many needs to insert through hole on printed circuit board base board 1 The jack 2 of component, it is just corresponding to mount the how many weld tabs 6 for offering through hole 7.
Step 4：The surface that printed circuit board base board 1 is used to insert to through-hole component is face-up placed, and utilizes inserting Equipment inserts the pin 9 of through-hole component 8 in the jack 2 of printed circuit board base board 1, and the pin 9 sequentially passes through weld tabs 6 The jack 2 of through hole 7 and printed circuit board base board 1, and wrapped up by solder 5.
Step 5：The printed circuit board base board 1 for having inserted through-hole component 8 is sent into solder reflow device, to logical Reflow soldering is carried out at the pin 9 of hole component 8.
Above-mentioned Through-hole reflow connects method by the weld tabs 6 provided with through hole 7, easily solves and only leans on conventional template window The problem of biting situation lower through-hole class device reflow soldering soldering tin amount deficiency, and weld tabs 6 can be automated using patch device Attachment, simple to operate, efficiency high, it is adapted to typical products in mass production production.
As shown in Figures 1 to 5, for an embodiment, the relation between above-mentioned each part and each part is defined below：
The diameter a of pin 9 of through-hole component 8；
The outer diameter D of weld tabs 6, the internal diameter d of weld tabs 6；
Porose disc external diameter on printed circuit board base board 1 is D1；
Jack external diameter on printed circuit board base board 1 is D2；
The thickness of printed circuit board base board 1 is h；
The thickness of template 3 is N；The length L of window 4 in template 3；The width L of window 4 in template 3；
After welding, the solder 5 in jack 2 carries weight 100%, and porose disc welding is in good wet state, the climbing ladder of solder 5 Approximate degree is in 45 °.
Solder 5 forms solid from crystallization is melted to, its Volume Changes approximation 80%.
In the present embodiment, above-mentioned known conditions is integrated, can obtain calculating the Reflow Soldering of pin 9 of through-hole component 8 The formula of amount of solder, specific as follows needed for connecing：
Vsp=VTHT+2×V1-V2
Wherein：VspAmount of solder needed for=each pin；
VTHTFilling amount of solder in=through hole；
V1=device side leg amount of solder and bottom surface leg amount of solder；
V2=pin volume；
The formula of the printing solder amount of window 4 in template 3 can be obtained, it is specific as follows：
Vtp=κ (V3+V4)
Wherein：VtpThe amount of solder that=pad hole is always bitten；
V3=bond pad surface bites amount of solder；
V4Amount of solder is bitten in=pad hole；
The volume fraction of metallic particles in κ=solder.
To sum up formula, the thickness formula of ring-type compensation weld tabs 6 can be obtained, it is specific as follows：
Wherein：H is the thickness of weld tabs；
VlpFor the amount of solder that need to be compensated；
D is the external diameter of weld tabs；
D is the internal diameter of weld tabs；
The size of the weld tabs 6 is calculated according to associated more item datas, and it causes the pin 9 of through-hole component 8 The form of solder joint accurately controls, and the quality of welding is good.
As shown in Figures 1 to 5, for an embodiment,
Welding pin spacing 2.54mm through-hole component is required on a certain printed circuit board base board, for other compatible tables Component is pasted, using template thickness 1.5mm, method is connect using the compensation Through-hole reflow of solder.Specific implementation process is：
Via devices pin spacing 2.54mm, pin diameter 0.4mm；Porose disc external diameter 1.6mm on printed circuit board base board, insert Hole external diameter 0.9mm；In order to prevent mould printing solder bridging, template window design maximum size long 2.3mm, wide 1.9mm；Ring-type Weld tabs largest outside diameter 2.2mm, internal diameter 0.6mm.
Calculate scolding tin volume V needed for each pin solder joint of through-hole componentsp：
Vsp=VTHT+2×V1-V2
Vsp=2.5277mm3
Calculate the amount of solder V using template window printingtp：
Vtp=κ (V3+V4)
V3=2.3 × 1.9 × 0.15=0.6555mm3
Vtp=0.8 × (0.6555+1.2717)=1.54176mm3
Calculate ring-type weld tabs thickness H：
Calculate to obtain weld tabs thickness 0.28mm, and by weld tabs tape package, meet that patch device attachment requires.
Start automatic welding, the surface that printed circuit board base board first is used to insert to through-hole component is face-up put Put, the template for offering window is placed on printed circuit board (PCB) on the surface applied to inserting through-hole component, and the window Jack in alignment and connection printed circuit board base board, keep aliging and connecting for window and jack.
Using printing equipment, printing solder, solder will be flowed into jack by window in template so that jack neutralizes Upper surface is filled with solder.
Template on printed circuit board base board is unloaded, the printed circuit board base board with solder is sent into patch device, The weld tabs of through hole, and through hole alignment print are offered using the surface mount of solder of the patch device on printed circuit board base board Jack on printed circuit board substrate, in order to ensure the placement accuracy of weld tabs, select accuracy 0.05mm patch device.
The surface that printed circuit board base board is used to insert to through-hole component is face-up placed, will be logical using equipment is inserted The pin of hole component is inserted into the jack of printed circuit board base board, and the pin sequentially passes through the through hole and printed circuit of weld tabs The jack of plate substrate, stretches out the jack 1.0-1.5mm of the printed circuit board base board, and is wrapped up by solder.
The printed circuit board base board for having inserted through-hole component is sent into solder reflow device, to through-hole component Base pin place carries out reflow soldering.
The compensation reflow soldering method of solder of the through hole class device of the present invention, solder compensation is carried out using weld tabs, is solved The problem of only biting situation lower through-hole class device reflow soldering soldering tin amount deficiency by existing template window, and using full-automatic Equipment, complete through hole class device reflow soldering, instead of manual welding, simple to operate, efficiency high, be adapted to typical products in mass production Production, and ensure that welding quality.
Described above is to combine the detailed description that preferred embodiment is carried out to the present invention, is not intended to limit the invention, Any amendment made within the spirit and principles of the invention etc., they both fall within the protection model of the claim of the present invention Among enclosing.

Claims (10)

  1. A kind of 1. compensation reflow soldering method of the solder of via devices, it is characterised in that including：
    Step 1：According to amount of solder needed for printed circuit board (PCB) jack size and through hole class device pin Size calculation weld pads；
    Step 2：According to through hole class device pin size design template opening size, the window of corresponding via devices receptacle area Thickness is of uniform thickness with other regions, calculation template printing solder amount；
    Step 3：Amount of solder is compensated according to needed for calculating amount of solder needed for mould printing amount of solder and solder joint, designs weld tabs size, Weld tabs center is provided with through hole；
    Step 4：The surface that printed circuit board base board is used to insert to via devices is placed upward, will offer the template of window It is placed on the printed circuit board base board and is used to inserting the surfaces of via devices, and the window aligns and connects the printing It is used for the jack for inserting via devices in circuit board substrate；
    Step 5：Using printing equipment, printing solder, solder enter the printed circuit by the window in the template Jack in plate substrate；
    Step 6：The template is unloaded from the printed circuit board base board, and by the printed circuit board base board with solder Patch device is sent into, is mounting the weld tabs provided with through hole, and the through hole alignment printing corresponding to the window on solder It is used for the jack for inserting via devices in circuit board substrate；
    Step 7：The pin of through hole class device is plugged in the jack of the printed circuit board base board using equipment is inserted, and The pin of via devices passes through the through hole of the weld tabs；
    Step 8：The printed circuit board base board for being fitted with via devices is sent into solder reflow device, to the pin of via devices Place carries out reflow soldering.
  2. A kind of 2. compensation reflow soldering method of solder of through hole class device as claimed in claim 1, it is characterised in that step Amount of solder needed for the one through hole class device reflow soldering is calculated by below equation and obtained：
    Vsp=VTHT+2×V1-V2；
    Wherein：VspAmount of solder needed for=each pin；
    VTHTFilling amount of solder in=through hole；
    V1=device side leg amount of solder and bottom surface leg amount of solder；
    V2=pin volume.
  3. A kind of 3. compensation reflow soldering method of solder of through hole class device as claimed in claim 1, it is characterised in that step The window of two templates, the thickness window of corresponding via devices receptacle area and being of uniform thickness for other regions, are bitten Amount of solder is calculated by below equation and obtained：
    Vtp=κ (V3+V4)；
    Wherein：VtpThe amount of solder that=pad hole is always bitten；
    V3=bond pad surface bites amount of solder；
    V4Amount of solder is bitten in=pad hole；
    The volume fraction of metallic particles in κ=solder.
  4. A kind of 4. compensation reflow soldering method of solder of through hole class device as described in right 2 or 3, it is characterised in that step Amount of solder needed for the three through hole class device reflow solderings is more than the amount of solder bitten of the template, the amount of solder that need to be compensated by with Lower formula is calculated and obtained：
    Vlp=Vsp-Vtp
    Wherein：Vlp-=amount of solder that need to be compensated；
    VspAmount of solder needed for=each pin；
    VtpThe amount of solder that=pad hole is always bitten.
  5. A kind of 5. compensation reflow soldering method of solder of through hole class device as described in right 1,2 or 3, it is characterised in that step Rapid three weld tabs can described in flexible compensation during the device reflow soldering of through hole class amount of solder deficiency, the size of weld tabs is by following Formula is calculated and obtained：
    <mrow> <mi>H</mi> <mo>=</mo> <msub> <mi>V</mi> <mrow> <mi>l</mi> <mi>p</mi> </mrow> </msub> <mo>/</mo> <mi>&amp;pi;</mi> <mrow> <mo>(</mo> <msup> <mrow> <mo>(</mo> <mfrac> <mi>D</mi> <mn>2</mn> </mfrac> <mo>)</mo> </mrow> <mn>2</mn> </msup> <mo>-</mo> <msup> <mrow> <mo>(</mo> <mfrac> <mi>d</mi> <mn>2</mn> </mfrac> <mo>)</mo> </mrow> <mn>2</mn> </msup> <mo>)</mo> </mrow> </mrow>
    Wherein：The thickness of H=weld tabs；
    Vlp=the amount of solder that need to be compensated；
    The external diameter of D=weld tabs；
    The internal diameter of d=weld tabs.
  6. A kind of 6. compensation reflow soldering method of solder of through hole class device as described in right 1, it is characterised in that step 3 institute It is ring-type to state weld tabs, and is provided with through hole.
  7. A kind of 7. compensation reflow soldering method of solder of through hole class device as described in right 1, it is characterised in that step 6 institute State weld tabs and be automatically positioned by chip mounter and is mounted on corresponding to the template window on solder；And the through hole alignment institute of weld tabs State and be used for the jack for inserting via devices in printed circuit board base board.
  8. A kind of 8. compensation reflow soldering method of solder of through hole class device as described in right 1, it is characterised in that the printing Equipment is solder printing machine, and the solder reflow device is reflow ovens, and the patch device is high-speed component chip mounter, and inserting is set Standby is via devices placement device.
  9. 9. the compensation reflow soldering method of solder of a kind of through hole class device as described in right 1,5,6, it is characterised in that in institute Step 5 is stated to further comprise：The pin of through hole class device inserts the through hole and the printed circuit through the weld tabs successively The jack of plate substrate, stretch out the jack of the printed circuit board base board.
  10. 10. the compensation reflow soldering method of solder of a kind of through hole class device as described in right 9, it is characterised in that stretch out institute State the jack 1.0-1.5mm of printed circuit board base board.
CN201711124617.4A 2017-11-14 2017-11-14 A kind of compensation reflow soldering method of the solder of via devices Pending CN107889374A (en)

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CN109451663A (en) * 2018-10-16 2019-03-08 上海望友信息科技有限公司 The parameters analysis method and analysis system connect applied to Through-hole reflow
CN111975151A (en) * 2020-07-29 2020-11-24 苏州浪潮智能科技有限公司 Backboard through hole welding method based on gold needle
CN113038735A (en) * 2021-03-12 2021-06-25 深圳市森瑞达贴装技术有限公司 Method for producing SMT patch
CN113579554A (en) * 2021-08-13 2021-11-02 深圳市福摩索金属制品有限公司 High-performance preformed soldering lug and welding method thereof
CN115229375A (en) * 2022-07-01 2022-10-25 北京遥测技术研究所 Solder ring design method for welding coaxial electric connector

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Application publication date: 20180406