CN113579554A - High-performance preformed soldering lug and welding method thereof - Google Patents
High-performance preformed soldering lug and welding method thereof Download PDFInfo
- Publication number
- CN113579554A CN113579554A CN202110929589.3A CN202110929589A CN113579554A CN 113579554 A CN113579554 A CN 113579554A CN 202110929589 A CN202110929589 A CN 202110929589A CN 113579554 A CN113579554 A CN 113579554A
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- China
- Prior art keywords
- lug
- soldering
- preformed
- workpiece
- solder
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of soldering lug welding, and discloses a high-performance preformed soldering lug and a welding method thereof, wherein the method comprises the following steps: selecting a corresponding preformed soldering lug according to a workpiece to be soldered; assembling and installing the preformed soldering lug and the workpiece to be soldered, and selecting a corresponding soldering mode; and welding the preformed soldering lug and the workpiece to be welded according to the corresponding welding mode. The invention can improve the cavity in the soldering process of the soldering lug.
Description
Technical Field
The invention relates to the technical field of soldering lug welding, in particular to a high-performance preformed soldering lug and a welding method thereof.
Background
With the development of microelectronic technology, the higher the power transistor device density is, the more stringent the heat dissipation requirements for assembly soldering are. The reduction of welding holes is a core problem of the assembly of high-power devices. Although the vacuum welding can effectively reduce or even eliminate the cavities, the production efficiency is low and the process is complex. The reflow soldering efficiency is high, but the welding voidage of the used solder paste reaches more than 40 percent, and the heat dissipation performance is seriously influenced.
In the prior art, when a large bonding pad is welded by using solder paste, the generation of the cavity is mainly caused by the fact that a large amount of organic solvents account for 40% -50% of the total volume of the solder paste, the solvents are gradually volatilized in the brazing heating process, and a large amount of generated gas is sealed in the bonding pad to finally form the cavity.
Therefore, how to provide a high-performance preformed solder lug and a soldering method thereof to improve the void in the soldering process of the solder lug is an urgent technical problem to be solved.
Disclosure of Invention
The invention aims to provide a high-performance preformed soldering lug and a soldering method thereof, so as to improve a cavity in the soldering process of the soldering lug.
To this end, according to a first aspect, an embodiment of the present invention discloses a high performance solder pre-forming sheet, including: the soldering lug comprises a soldering lug base body and a soldering flux layer, wherein the soldering flux layer is arranged on the surface of the soldering lug base body.
The invention is further provided that the soldering lug base body is made of at least one of tin base, lead base, indium base and bismuth base.
The invention is further arranged in that a thermochromic indicator is arranged in the soldering flux layer.
The invention is further arranged that the content of the soldering flux in the soldering flux layer is less than 0.05%.
The invention is further configured such that the tab substrate is a solder strip, a square tab, a round tab, or a solder ring.
The invention is further provided that the thickness of the soldering lug substrate is 0.025-4 mm.
According to a second aspect, an embodiment of the present invention discloses a welding method for a high performance preformed soldering lug, including: selecting a corresponding preformed soldering lug according to a workpiece to be soldered;
assembling and installing the preformed soldering lug and the workpiece to be soldered, and selecting a corresponding soldering mode;
and welding the preformed soldering lug and the workpiece to be welded according to the corresponding welding mode.
The invention is further provided that the preformed soldering lug is a welding ring, the workpiece to be welded is a thermosensitive element, and the preformed soldering lug and the workpiece to be welded are welded in a local welding mode.
The invention is further provided that the preformed soldering lug is a soldering ring, the workpiece to be soldered is an insertion element, and the preformed soldering lug and the workpiece to be soldered are soldered in a through hole reflow mode.
The invention is further provided that the preformed soldering lug is a welding ring, the workpiece to be welded is a metal group, and the preformed soldering lug and the workpiece to be welded are welded in a direct welding mode.
The invention has the following beneficial effects: the invention discloses a welding method of a high-performance preformed soldering lug, which selects a corresponding preformed soldering lug according to a workpiece to be welded; assembling and installing the preformed soldering lug and the workpiece to be soldered, and selecting a corresponding soldering mode; and welding the preformed soldering lug and the workpiece to be welded according to the corresponding welding mode. Compared with the prior art, the invention can improve the cavity in the soldering lug welding process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flowchart of a welding method for a high-performance preformed solder lug disclosed in this embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The embodiment of the invention discloses a high-performance preformed soldering lug, which comprises: the soldering lug comprises a soldering lug base body and a soldering flux layer, wherein the soldering flux layer is arranged on the surface of the soldering lug base body.
In an alternative embodiment, the bonding pad base is made of at least one of tin base, lead base, indium base and bismuth base.
In an alternative embodiment, a thermochromic indicator is disposed within the flux layer.
In an alternative embodiment, the flux layer has a flux content of less than 0.05%.
In alternative embodiments, the tab substrate is a solder strip, a square tab, a round tab, or a solder ring. In the specific implementation process, the soldering lug substrate can also be an SMT tin lug, a soldering ring or a soldering ring.
In an alternative embodiment, the thickness of the soldering lug base body is 0.025-4 mm.
According to a second aspect, an embodiment of the present invention discloses a welding method for a high performance preformed solder lug, as shown in fig. 1, including:
s101, selecting a corresponding preformed soldering lug according to a workpiece to be soldered;
step S102, assembling and installing the preformed soldering lug and the workpiece to be welded, and selecting a corresponding welding mode;
and step S103, welding the preformed soldering lug and the workpiece to be welded according to the corresponding welding mode.
The invention discloses a welding method of a high-performance preformed soldering lug, which selects a corresponding preformed soldering lug according to a workpiece to be welded; assembling and installing the preformed soldering lug and the workpiece to be soldered, and selecting a corresponding soldering mode; and welding the preformed soldering lug and the workpiece to be welded according to the corresponding welding mode. Compared with the prior art, the invention can improve the cavity in the soldering lug welding process.
It should also be noted that the pre-formed solder pads of the present invention can be precisely mounted using SMT (surface mount) die attach equipment at the fastest speed allowed by the equipment. The solder paste is matched with solder paste for use, so that the metal content can be improved, the effect of strengthening a welding spot is achieved, the splashing and the residue of soldering flux are reduced, and the surface-mounted preformed soldering lug can provide accurate solder consumption, so that higher processing efficiency is realized.
In the specific implementation process, the packaging mode of the preformed soldering lug disclosed by the invention is as follows: and plastic box packaging, tray packaging or customized carrier tape packaging is adopted.
In an alternative embodiment, the preformed welding sheet is a welding ring, the workpiece to be welded is a heat-sensitive element, and the preformed welding sheet and the workpiece to be welded are welded in a local welding mode.
In an alternative embodiment, the preformed soldering lug is a soldering ring, the workpiece to be soldered is an insertion element, and the preformed soldering lug and the workpiece to be soldered are soldered by a through hole reflow method.
In an alternative embodiment, the preformed welding sheet is a welding ring, the workpiece to be welded is a metal group, and the preformed welding sheet and the workpiece to be welded are welded in a direct welding mode.
The working principle is as follows: the invention discloses a welding method of a high-performance preformed soldering lug, which selects a corresponding preformed soldering lug according to a workpiece to be welded; assembling and installing the preformed soldering lug and the workpiece to be soldered, and selecting a corresponding soldering mode; and welding the preformed soldering lug and the workpiece to be welded according to the corresponding welding mode. Compared with the prior art, the invention can improve the cavity in the soldering lug welding process.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. A high performance preformed solder lug, comprising: the soldering lug comprises a soldering lug base body and a soldering flux layer, wherein the soldering flux layer is arranged on the surface of the soldering lug base body.
2. The preformed solder lug of claim 1, wherein the solder lug substrate is made of at least one of tin-based, lead-based, indium-based and bismuth-based materials.
3. The preformed solder lug of claim 1, wherein a thermochromic indicator is disposed within the flux layer.
4. The high performance pre-formed solder lug of claim 1, wherein the flux content in the flux layer is less than 0.05%.
5. The high performance preformed solder lug of claim 1, wherein the solder lug substrate is a solder strip, a square solder lug, a round solder lug, or a solder ring.
6. The high performance preformed solder lug of claim 1, wherein the solder lug substrate has a thickness of 0.025-4 mm.
7. A welding method of a high-performance preformed soldering lug is characterized in that,
selecting a corresponding preformed soldering lug according to a workpiece to be soldered;
assembling and installing the preformed soldering lug and the workpiece to be soldered, and selecting a corresponding soldering mode;
and welding the preformed soldering lug and the workpiece to be welded according to the corresponding welding mode.
8. The method of claim 7, wherein the preformed soldering lug is a soldering ring, the workpiece to be soldered is a heat sensitive element, and the preformed soldering lug and the workpiece to be soldered are welded by local soldering.
9. The method of claim 7, wherein the pre-formed bonding pad is a bonding ring, the workpiece is an interposer, and the pre-formed bonding pad and the workpiece are bonded by through-hole reflow.
10. The method for welding a high performance pre-formed soldering lug according to claim 7, wherein the pre-formed soldering lug is a soldering ring, the workpiece to be soldered is a metal group, and the pre-formed soldering lug and the workpiece to be soldered are directly soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110929589.3A CN113579554A (en) | 2021-08-13 | 2021-08-13 | High-performance preformed soldering lug and welding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110929589.3A CN113579554A (en) | 2021-08-13 | 2021-08-13 | High-performance preformed soldering lug and welding method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113579554A true CN113579554A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110929589.3A Pending CN113579554A (en) | 2021-08-13 | 2021-08-13 | High-performance preformed soldering lug and welding method thereof |
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| CN (1) | CN113579554A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5789068A (en) * | 1995-06-29 | 1998-08-04 | Fry's Metals, Inc. | Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors |
| CN201711675U (en) * | 2010-08-20 | 2011-01-19 | 芯通科技（成都）有限公司 | Preformed soldering tin plate with soldering flux coating |
| CN202169445U (en) * | 2011-07-15 | 2012-03-21 | 广州先艺电子科技有限公司 | Preformed soldering lug pre-coated with soldering flux coating |
| CN103152996A (en) * | 2013-02-06 | 2013-06-12 | 南京同创电子信息设备制造有限公司 | Through hole reflowing process used for dense-spacing long gold-plated pins |
| CN105252173A (en) * | 2015-11-13 | 2016-01-20 | 广东中实金属有限公司 | Preparation method of pre-molding soldering flake with uniform coatings |
| CN107889374A (en) * | 2017-11-14 | 2018-04-06 | 北京计算机技术及应用研究所 | A kind of compensation reflow soldering method of the solder of via devices |
| CN207589305U (en) * | 2017-12-19 | 2018-07-06 | 成都芯通软件有限公司 | A kind of HFC machineries attenuation inserted sheet welding structure and welding pedestal |
| CN110116247A (en) * | 2019-05-15 | 2019-08-13 | 中国电子科技集团公司第三十八研究所 | A kind of method for welding of radar electric product connector |
| CN111014863A (en) * | 2019-11-29 | 2020-04-17 | 中国电子科技集团公司第十三研究所 | Multi-connector welding method and tool for radio frequency packaging shell and preformed solder ring |
| US20200346307A1 (en) * | 2019-04-30 | 2020-11-05 | Indium Corporation | Solder preform with internal flux core including thermochromic indicator |
-
2021
- 2021-08-13 CN CN202110929589.3A patent/CN113579554A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5789068A (en) * | 1995-06-29 | 1998-08-04 | Fry's Metals, Inc. | Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors |
| CN201711675U (en) * | 2010-08-20 | 2011-01-19 | 芯通科技（成都）有限公司 | Preformed soldering tin plate with soldering flux coating |
| CN202169445U (en) * | 2011-07-15 | 2012-03-21 | 广州先艺电子科技有限公司 | Preformed soldering lug pre-coated with soldering flux coating |
| CN103152996A (en) * | 2013-02-06 | 2013-06-12 | 南京同创电子信息设备制造有限公司 | Through hole reflowing process used for dense-spacing long gold-plated pins |
| CN105252173A (en) * | 2015-11-13 | 2016-01-20 | 广东中实金属有限公司 | Preparation method of pre-molding soldering flake with uniform coatings |
| CN107889374A (en) * | 2017-11-14 | 2018-04-06 | 北京计算机技术及应用研究所 | A kind of compensation reflow soldering method of the solder of via devices |
| CN207589305U (en) * | 2017-12-19 | 2018-07-06 | 成都芯通软件有限公司 | A kind of HFC machineries attenuation inserted sheet welding structure and welding pedestal |
| US20200346307A1 (en) * | 2019-04-30 | 2020-11-05 | Indium Corporation | Solder preform with internal flux core including thermochromic indicator |
| CN110116247A (en) * | 2019-05-15 | 2019-08-13 | 中国电子科技集团公司第三十八研究所 | A kind of method for welding of radar electric product connector |
| CN111014863A (en) * | 2019-11-29 | 2020-04-17 | 中国电子科技集团公司第十三研究所 | Multi-connector welding method and tool for radio frequency packaging shell and preformed solder ring |
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