CN213150486U

CN213150486U - Paster alloy resistor with enhanced heat dissipation capability

Info

Publication number: CN213150486U
Application number: CN202022428187.9U
Authority: CN
Inventors: 任寓琦
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-05-07
Anticipated expiration: 2030-10-28

Abstract

The utility model discloses a patch alloy resistor for enhancing heat dissipation capacity, which comprises a resistor body and an insulating heat-conducting layer; a heat conducting electrode is arranged below the resistor body; the insulating heat conduction layer is filled between the resistor body and the heat conduction electrode. The utility model discloses compare with current paster alloy resistance and had more the one deck and be used for radiating heat conduction electrode, can effectively promote the heat-sinking capability of alloy resistance, the temperature of alloy resistance is more stable to the reduction makes the resistance of resistance more stable because the resistance value that the temperature risees and leads to changes.

Description

Paster alloy resistor with enhanced heat dissipation capability

Technical Field

The utility model relates to a strengthen heat-sinking capability's paster alloy resistance.

Background

In 1887, the chemist Edward Weston (Edward Weston) invented a constantan alloy. In 1889, the manganese-nickel-copper alloy was first developed globally by Isabellenhutte, Germany, and the first surface-mount milliohm current sensing resistor in the world was produced in 1987. Kokomata and manganese nickel copper alloys are widely used in the field of resistors, particularly precision resistors and measuring and sampling resistors, because of their excellent temperature resistance characteristics.

The existing chip alloy resistors are roughly divided into three types, the cross sections of the chip alloy resistors are respectively in a shape like a Chinese character 'yi', a shape like a Chinese character 'ji' and a shape like a Chinese character 'Jiong', the latter two types are also respectively called as an outward folding type and an inward folding type, and the chip alloy resistors are often used in occasions with larger power. Issato Germany also produces an in-line alloy resistor similar TO the TO-247 package, which can be conveniently bolted TO a heat sink and has a high heat dissipation capability. However, these several chip alloy resistors have different disadvantages:

the other parts of the I-shaped alloy resistor except the two end electrodes are covered by the packaging layer. When the heat dissipation alloy core is welded on a circuit board, although the package can be in contact with the circuit board except for electrodes at two ends, two layers of materials with poor heat conduction are arranged between the alloy core needing heat dissipation and the circuit board: the solder resist on the package layer and the circuit board may even have one more layer of air in some cases, which results in good heat dissipation in the only two-terminal electrodes.

The outer-folding type and inner-folding type alloy resistors are usually not insulated on the whole, but only the non-electrode part is bent, so that only the electrode is contacted with the circuit board when the outer-folding type and inner-folding type alloy resistors are welded on the circuit board, and the rest part has a certain distance from the circuit board. Thus, air can be circulated, but the heat dissipation efficiency is not higher than that of the direct contact heat dissipation with metal.

The in-line alloy resistor of the TO-247-like package has high heat dissipation capacity, but is too large in volume and is in an in-line structure, so that the volume of the whole circuit cannot be reduced by a method of mounting the in-line alloy resistor on a circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model discloses to the problem that above-mentioned prior art exists, provide a strengthen heat-sinking capability's paster alloy resistance, make the resistance of alloy resistance more stable.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:

a patch alloy resistor for enhancing heat dissipation capacity comprises a resistor body, an insulating heat conduction layer and a heat conduction electrode; a heat conducting electrode is arranged below the resistor body; the insulating heat conduction layer is filled between the resistor body and the heat conduction electrode.

Preferably, an encapsulation layer is also included; the insulating heat conduction layer is sealed by the packaging layer.

Further preferably, the middle part of the resistor body is arched upwards to form an inner cavity, and the heat conducting electrode is positioned in the inner cavity; a portion of the upper surface of the resistor body and the lower surface of the thermally conductive electrode are exposed outside the encapsulation layer.

Further preferably, a part of the surface of the resistor body is wrapped by an encapsulation layer; the upper surface of the resistor body is at the same height with the packaging layer above.

Further preferably, the upper surface of the resistor body is a plane; an inner cavity is formed in the middle of the lower side of the resistor body, and the heat conduction electrode is located in the inner cavity; the lower surface of the resistor body, the lower surface of the heat conducting electrode and the packaging layer are at the same horizontal height.

Further preferably, one side surface of the resistor body is provided with a pin extending downwards, and the resistor body is filled with an insulating heat conduction layer in the area of the projection surface of the heat conduction electrode; the packaging layer wraps partial areas of the insulating heat conduction layer and the heat conduction electrode; the packaging layer wraps the resistor body except the pins.

Further preferably, the two side surfaces of the resistor body extend outwards and are bent downwards, so that the middle part of the resistor body forms a sealed inner cavity, and the heat conducting electrode is positioned in the inner cavity.

Preferably, the insulating and heat conducting layer is a die bond adhesive, a bonding adhesive, a heat conducting adhesive, a ceramic coating or a non-metal film.

Preferably, the heat conducting electrode is gold, silver, copper or aluminum and alloys thereof.

Preferably, the surface of the pin exposed out of the encapsulation layer of the resistor body is provided with a plating layer.

The utility model discloses compare with current paster alloy resistance and had more the one deck and be used for radiating heat conduction electrode, can effectively promote the heat-sinking capability of alloy resistance, the temperature of alloy resistance is more stable to the reduction makes the resistance of resistance more stable because the resistance value that the temperature risees and leads to changes.

Drawings

Fig. 1 is a cross-sectional view of a first embodiment of the present invention;

fig. 2 is a cross-sectional view of a second embodiment of the present invention;

fig. 3 is a cross-sectional view of a third embodiment of the present invention;

fig. 4 is a perspective view of a third embodiment of the present invention;

fig. 5 is a perspective view of another perspective view according to the embodiment of the present invention;

fig. 6 is a cross-sectional view of a fourth embodiment of the present invention;

fig. 7 is a perspective view of a fourth embodiment of the present invention;

fig. 8 is a cross-sectional view of a fifth embodiment of the present invention;

fig. 9 is a perspective view of a fifth embodiment of the present invention.

In the figure: a resistor body 1; an insulating heat conduction layer 2; a heat conductive electrode 3; and an encapsulation layer 4.

Detailed Description

The present invention will be further described with reference to the following embodiments. Wherein the showings are for the purpose of illustrating the invention only and not for the purpose of limiting the same, and in which there is shown by way of illustration only and not in any way limiting the scope of the invention; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings, this is for convenience of description and simplicity of description, and does not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the terms describing positional relationships in the drawings are for illustrative purposes only and should not be construed as limiting the present invention.

In the present invention, unless otherwise specified or limited, it should be noted that terms such as "mounted," "connected," and the like are used in a broad sense, and for example, the terms may be mechanically connected, electrically connected, or pneumatically connected, or may be connected inside two elements, directly connected, or indirectly connected through an intermediate medium, and those skilled in the art can understand the specific meanings of the terms according to specific situations.

The utility model discloses used insulating heat-conducting layer 2 chooses for use solid crystal glue, bonding glue, heat-conducting glue, ceramic coating or non-metallic film etc. to have certain insulating ability and have the material of good heat-conducting ability usually. The heat conducting electrode 3 is usually made of high heat conductivity material such as gold, silver, copper or aluminum and its alloy; the surface may have one or more coatings that meet the requirements of the application, such as enhanced solderability or oxidation resistance.

Example one

As shown in fig. 1, the alloy resistance of this embodiment is similar to the outward-folded alloy resistance. The resistor body 1 is shaped like a Chinese character 'ji'; the middle part of the resistor body 1 is arched upwards to form an inner cavity, and a heat conducting electrode 3 is arranged in the inner cavity. An insulating heat conduction layer 2 is coated between the heat conduction electrode 3 and the resistor body 1 to fill the gap. The packaging layer 4 is coated on the periphery below the heat conducting electrode 3, so that the insulating heat conducting layer 2 is sealed and is not contacted with air; the heat conducting electrode 3 and the packaging layer 4 together form a flat lower surface.

In the first embodiment, when the resistor is correctly attached to a circuit board in actual use, the lower surface of the resistor body 1 is welded with soldering tin, and the soldering tin is welded on copper-clad parts of a circuit board substrate; the heat conducting electrode 3 is correspondingly welded on the copper cladding of the circuit board substrate through soldering tin. In normal operation, current will flow through the resistor body 1 and some heat will be generated. Part of heat is conducted to the heat conducting electrode 3 through the insulating heat conducting layer 2 and then conducted to the copper-clad layer in the middle part below for further dissipation; the other part of heat is directly conducted to the copper-clad parts at two ends along the resistor body 1 to be further dissipated; the remaining heat is then dissipated directly to the outside by the resistor body 1. Because the thermal conductivity of air is low, the majority of the generated heat can be dissipated through copper cladding, so the embodiment can effectively enhance heat dissipation.

Example two

As shown in fig. 2, the resistor body 1 of the present embodiment is substantially in the shape of an inverted "concave", the middle portion of the resistor body 1 is arched upward to form an inner cavity, and the heat conducting electrode 3 is disposed in the inner cavity. An insulating heat conduction layer 2 is coated between the heat conduction electrode 3 and the resistor body 1 to fill the gap. The packaging layer 4 is coated on the periphery below the heat conducting electrode 3, so that the insulating heat conducting layer 2 is sealed and is not contacted with air; the lower surface of the resistor body 1 and the lower surface packaging layer 4 of the heat conducting electrode 3 jointly form a flat lower surface.

The welding and heat dissipation method of the present embodiment is similar to that of the first embodiment; the difference is that the appearance of the resistor body 1 is more regular, and the heat exchange area with air is larger; and the contact area of the heat conduction electrode 3 and the copper coating is larger, and the heat dissipation efficiency is higher.

EXAMPLE III

As shown in fig. 3, 4 and 5, the upper surface of the resistor body 1 is also wrapped with a layer of encapsulation layer 4 based on embodiment 1; so that only the pins and the upper surface of the resistor body 1 and the lower surface of the heat conducting electrode 3 are exposed outside and are wrapped by the packaging layer 4.

The alloy resistor of the third embodiment is integrally in an international standard package (DFN-8) and adopts a double-sided cooling design, so that the overall structure is compact and regular.

Example four

As shown in fig. 6 and 7, the resistor body 1 is divided into two parts, i.e., a lead pin and a flat plate, and the heat conductive electrode 3 is flat. From the top view, the flat plate part of the resistor body 1 is partially overlapped with the heat conducting electrode 3; and the overlapped part of the two is filled by the insulating heat conduction layer 2. The encapsulation layer 4 encapsulates the resistor body 1 except for the lead portions and a portion of the thermally conductive electrode 4.

The fourth embodiment is an international standard package (TO-263-7), which is suitable for high-power application occasions.

EXAMPLE five

As shown in fig. 8 and fig. 9, the middle of the resistor body 1 of this embodiment is a plane, and two side surfaces of the resistor body extend outward and bend in the same direction to form an inner cavity, a heat conducting electrode 3 is disposed in the inner cavity, and an insulating and heat conducting layer is coated between the heat conducting electrode 3 and the resistor body 1. And the heat conducting electrode 3 and the lower surface of the resistor body 1 are at the same level.

The resistor body 1 is a standard package, and the two parts extending outwards along the two circumferential directions can ensure that no short circuit occurs during mounting, so the encapsulation layer 4 can be omitted in the embodiment.

Claims

1. The utility model provides a strengthen heat-sinking capability's paster alloy resistance which characterized in that: the resistor comprises a resistor body (1), an insulating heat conduction layer (2) and a heat conduction electrode (3); a heat conducting electrode (3) is arranged below the resistor body (1); the insulating heat conduction layer (2) is filled between the resistor body (1) and the heat conduction electrode (3).

2. A chip alloy resistor for enhancing heat dissipation as recited in claim 1, wherein: further comprising an encapsulation layer (4); the insulating heat conduction layer (2) is sealed by a packaging layer (4).

3. A chip alloy resistor for enhancing heat dissipation as recited in claim 2, wherein: the middle part of the resistor body (1) is arched upwards to form an inner cavity, and the heat-conducting electrode (3) is positioned in the inner cavity; part of the upper surface of the resistor body (1) and the lower surface of the heat conducting electrode (3) are exposed outside the packaging layer (4).

4. A chip alloy resistor for enhancing heat dissipation as recited in claim 3, wherein: part of the surface of the resistor body (1) is wrapped by an encapsulation layer (4); the upper surface of the resistor body (1) and the packaging layer (4) above the resistor body are at the same height.

5. A chip alloy resistor for enhancing heat dissipation as recited in claim 2, wherein: the upper surface of the resistor body (1) is a plane; an inner cavity is formed in the middle of the lower side of the resistor body (1), and the heat-conducting electrode (3) is located in the inner cavity; the lower surface of the resistor body (1), the lower surface of the heat conducting electrode (3) and the packaging layer (4) are at the same horizontal height.

6. A chip alloy resistor for enhancing heat dissipation as recited in claim 2, wherein: one side surface of the resistor body (1) is provided with a pin extending downwards, and the resistor body (1) is filled with an insulating heat conduction layer (2) in the area of the projection surface of the heat conduction electrode (3); the packaging layer (4) wraps partial areas of the insulating heat conduction layer (2) and the heat conduction electrode (3); the packaging layer (4) wraps the resistor body (1) except for the pins.

7. A chip alloy resistor for enhancing heat dissipation as recited in claim 1, wherein: two side surfaces of the resistor body (1) extend outwards and are bent downwards, so that a sealed inner cavity is formed in the middle of the resistor body (1), and the heat-conducting electrode (3) is positioned in the inner cavity.

8. A chip alloy resistor with enhanced heat dissipation capability according to any one of claims 1 to 7, wherein: the insulating heat conduction layer (2) is made of solid crystal glue, bonding glue, heat conduction glue, ceramic paint or a non-metal film.

9. A chip alloy resistor with enhanced heat dissipation capability according to any one of claims 1 to 7, wherein: the heat conducting electrode (3) is gold, silver, copper or aluminum and alloy thereof.

10. A chip alloy resistor with enhanced heat dissipation capability according to any one of claims 2-6, wherein: the surface of the pin exposed outside the packaging layer (4) of the resistor body (1) is provided with a plating layer.