CN210956654U - Anti-corrosion heat dissipation type patch diode - Google Patents
Anti-corrosion heat dissipation type patch diode Download PDFInfo
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- CN210956654U CN210956654U CN201922421156.8U CN201922421156U CN210956654U CN 210956654 U CN210956654 U CN 210956654U CN 201922421156 U CN201922421156 U CN 201922421156U CN 210956654 U CN210956654 U CN 210956654U
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Abstract
The utility model provides an anti-corrosion heat dissipation type surface mount diode, which comprises an insulating packaging body, wherein the bottom and two side surfaces of an insulating heat dissipation seat protrude out of the insulating packaging body, and the bottoms of anti-corrosion conductive pins all protrude out of the insulating packaging body; the insulating heat dissipation seat is provided with a chip positioning groove, the diode chip is positioned in the chip positioning groove, one side of the anti-corrosion conductive pin, which is close to the insulating heat dissipation seat, is integrally formed with an anti-folding lug, one side of the anti-folding lug is provided with a wiring limiting groove, two electrodes of the diode chip are respectively connected in the two wiring limiting grooves through two wires, and the center of the wiring limiting groove is coplanar with the upper surface of the electrode of the diode chip. The utility model discloses can effectively avoid the heat to gather between diode chip and the applied PCB, conductive pin's corrosion resisting property is good, conductive pin not with diode chip direct weld contact, the inside stress that forms of insulating packaging body when can effectively reduce the encapsulation.
Description
Technical Field
The utility model relates to a diode specifically discloses a SMD diode of anticorrosive heat dissipation type.
Background
The diode is a common electronic element in electronic equipment, and is an electronic device made of semiconductor material, and it has unidirectional conductivity, i.e. when a forward voltage is applied to the anode and cathode of the diode, the diode is on, and when a reverse voltage is applied, the diode is off.
The patch type diode is obtained by connecting two ends of a diode chip to two conductive pins and then packaging the two conductive pins outside through insulating resin. In addition, in the prior art, the exposed part of the conductive pin of the surface mount diode is easily corroded by corrosive substances, and the service life is short.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide an anti-corrosion heat dissipation type surface mount diode, which has good heat dissipation performance, good anti-corrosion performance of the conductive pins, small internal stress of the insulating package, and stable structure.
In order to solve the prior art problem, the utility model discloses an anticorrosive heat dissipation type surface-mounted diode, which comprises an insulating packaging body, wherein an insulating heat dissipation seat, a diode chip and two anticorrosive conductive pins are arranged in the insulating packaging body, the bottom and two side surfaces of the insulating heat dissipation seat protrude out of the insulating packaging body, the two anticorrosive conductive pins are positioned at the other two sides of the insulating heat dissipation seat, and the bottoms of the anticorrosive conductive pins all protrude out of the insulating packaging body;
the insulating heat dissipation seat is provided with a chip positioning groove, the diode chip is positioned in the chip positioning groove, one side of the anti-corrosion conductive pin, which is close to the insulating heat dissipation seat, is integrally formed with an anti-folding lug, one side of the anti-folding lug, which is close to the diode chip, is provided with a wiring limiting groove, two electrodes of the diode chip are respectively connected in the two wiring limiting grooves through two wires, the centers of the wiring limiting grooves are coplanar with the upper surfaces of the electrodes of the diode chip, and the wiring limiting grooves are connected with the wires through conductive bonding blocks.
Furthermore, the insulating heat dissipation seat is a ceramic seat.
Furthermore, the two side faces of the insulating heat dissipation seat, which are opposite to the two anticorrosion conductive pins, are provided with reinforcing grooves.
Furthermore, heat dissipation grooves are formed in the two side faces, protruding out of the insulating packaging body, of the insulating heat dissipation seat.
Further, the anti-corrosion conductive pins are graphite pins.
Furthermore, the bottom surface of anticorrosive electrically conductive pin is equipped with the welding recess.
Further, the conductive bonding block is a conductive silver glue block.
The utility model has the advantages that: the utility model discloses an anticorrosive SMD diode of heat dissipation type, bottom at diode chip is provided with the insulating radiating seat, can effectively avoid the heat to gather between diode chip and applied PCB, thereby effectively avoid the heat to gather and influence the working property, the corrosion resisting property of electrically conductive pin is good, long service life, furthermore, electrically conductive pin not with diode chip direct welding contact, the inside stress that forms of insulating packaging body when can effectively reduce the encapsulation, and be used for the wire of electrically conductive connection need not to bend, can effectively ensure the stable in structure of SMD diode firm.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic cross-sectional view along a-a' in fig. 1.
Fig. 3 is a schematic view of a three-dimensional structure of the middle insulating heat sink of the present invention.
The reference signs are: the chip package comprises an insulating package body 10, an insulating heat sink 20, a chip positioning groove 21, a reinforcing groove 22, a heat dissipation groove 23, a diode chip 30, a wire 31, an anti-corrosion conductive pin 40, an anti-folding bump 41, a wiring limiting groove 42, a conductive bonding block 43 and a welding groove 44.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 to 3.
The embodiment of the utility model discloses a SMD diode of anticorrosive heat dissipation type, including insulating packaging body 10, be equipped with insulating radiating seat 20, diode chip 30 and two anticorrosive electrically conductive pins 40 in insulating packaging body 10, the bottom and the both sides face of insulating radiating seat 20 are protruding outside insulating packaging body 10, two anticorrosive electrically conductive pins 40 are located the other both sides of insulating radiating seat 20, the bottom of two anticorrosive electrically conductive pins 40 all protrudes outside insulating packaging body 10;
the insulating heat dissipation seat 20 is provided with a chip positioning groove 21, the diode chip 30 is located in the chip positioning groove 21, the upper surface of one side of each anti-corrosion conductive pin 40 close to the insulating heat dissipation seat 20 is integrally formed with an anti-folding bump 41, one side of each anti-folding bump 41 close to the diode chip 30 is provided with a wiring limiting groove 42, two electrodes of the diode chip 30 are respectively connected in the two wiring limiting grooves 42 through two wires 31, namely, one end of each wire 31 is connected with one electrode of the diode chip 30 through a conductive structure, the other end of each wire 31 is located in the wiring limiting groove 42, the center of the wiring limiting groove 42 is coplanar with the upper surface of the electrode of the diode chip 30, the wiring limiting groove 42 is connected with one end of each wire 31 far away from the diode chip 30 through a conductive bonding block 43, the conductive bonding block 43 is located in the wiring limiting groove 42, and an enough height position can be provided, the lead 31 can directly extend into the wiring limiting groove 42 after being connected with the diode chip 30 without bending, so that the lead 31 is prevented from forming elasticity due to bending, internal stress generated when the insulating packaging body 10 is formed by injection molding packaging is avoided, and the reliability of the connection relation between the lead 31 and the wiring limiting groove 42 is improved.
The diode chip 30 is arranged on the insulating heat sink 20, and the insulating heat sink 20 protrudes out of the two side faces and the bottom face of the insulating packaging body 10, so that the heat exchange efficiency between the insulating heat sink 20 and the external environment is high, heat generated when the diode chip 30 works can be efficiently released to the external environment through the insulating heat sink 20, and the insulating heat sink 20 does not influence the work of an internal conductive circuit of the chip diode; the two anticorrosion conductive pins are communicated with the diode chip 30 through the conducting wire 31, the connecting structure between the conducting wire 31 and the anticorrosion conductive pin 40 is firm and reliable, the anticorrosion conductive pins have good conducting performance and anticorrosion performance, the corrosion damage caused by exposure in air can be avoided, and the service life is long; this SMD diode can further satisfy the design demand of slimming.
In this embodiment, the insulating heat dissipation seat 20 is a ceramic seat, and the ceramic has good insulating property and heat dissipation performance, so that the heat dissipation performance of the surface mount diode can be effectively ensured, and meanwhile, a short circuit caused to an internal circuit of the surface mount diode can be avoided.
In this embodiment, the insulating heat sink 20 is just opposite to the two side surfaces of the two corrosion-resistant conductive pins 40, and the reinforcing grooves 22 are arranged, so that the contact area between the insulating heat sink 20 and the insulating package 10 is increased through the reinforcing grooves 22, the firmness of the connection structure is improved, and the stability of the overall structure of the patch diode can be improved finally.
Based on the above embodiment, the two side surfaces of the insulating heat sink 20 protruding from the insulating package 10 are respectively provided with the heat dissipation groove 23, the heat dissipation groove 23 and the reinforcement groove 22 are located on different side surfaces of the insulating heat sink 20, and the contact area between the insulating heat sink 20 and the external environment can be effectively increased through the heat dissipation groove 23, so that the heat dissipation efficiency of the insulating heat sink 20 is improved.
In this embodiment, anticorrosive conductive pin 40 is the graphite pin, and graphite has good corrosion protection and electric conductive property, and anticorrosive conductive pin 40 also can not receive the influence of corrosive substance basically in exposing in the external environment, can ensure SMD diode's electrically conductive intercommunication effect simultaneously.
Based on the above embodiment, the bottom surface of the anti-corrosion conductive pin 40 is provided with the welding groove 44, the firmness of the patch type diode welded on the PCB pad can be improved through the welding groove 44, and preferably, the welding groove 44 may be a groove.
In this embodiment, the conductive adhesive block 43 is a conductive silver paste block, which has good conductive performance and adhesive property, and can effectively improve the stability and conductive reliability of the connection structure between the wire 31 and the soldering groove 44, and the wire 31 is connected to the electrode of the diode chip 30 through solder or conductive silver paste.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. The anti-corrosion heat dissipation type patch diode is characterized by comprising an insulating packaging body (10), wherein an insulating heat dissipation seat (20), a diode chip (30) and two anti-corrosion conductive pins (40) are arranged in the insulating packaging body (10), the bottom and two side faces of the insulating heat dissipation seat (20) protrude out of the insulating packaging body (10), the two anti-corrosion conductive pins (40) are positioned on the other two sides of the insulating heat dissipation seat (20), and the bottoms of the anti-corrosion conductive pins (40) protrude out of the insulating packaging body (10);
the chip heat dissipation structure is characterized in that a chip positioning groove (21) is formed in the insulating heat dissipation seat (20), the diode chip (30) is located in the chip positioning groove (21), an anti-folding lug (41) is integrally formed on one side, close to the insulating heat dissipation seat (20), of the anti-corrosion conductive pin (40), a wiring limiting groove (42) is formed on one side, close to the diode chip (30), of the anti-folding lug (41), two electrodes of the diode chip (30) are connected to the two wiring limiting grooves (42) through two wires (31), the centers of the wiring limiting grooves (42) are coplanar with the upper surfaces of the electrodes of the diode chip (30), and the wiring limiting grooves (42) are connected with the wires (31) through conductive bonding blocks (43).
2. The chip diode of claim 1, wherein the insulating heat sink (20) is a ceramic base.
3. The chip diode of claim 1, wherein the insulating heat sink (20) has a reinforcing groove (22) on both sides facing the two anti-corrosion conductive pins (40).
4. The anti-corrosion heat dissipation patch diode according to claim 3, wherein heat dissipation grooves (23) are formed on both sides of the insulating heat sink (20) protruding from the insulating package (10).
5. The chip diode of claim 1, wherein the anti-corrosion and heat-dissipation type pins (40) are graphite pins.
6. The chip diode of claim 5, wherein the bottom surface of the lead pin (40) is provided with a soldering groove (44).
7. The chip diode of claim 1, wherein the conductive adhesive block (43) is a conductive silver paste block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922421156.8U CN210956654U (en) | 2019-12-26 | 2019-12-26 | Anti-corrosion heat dissipation type patch diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922421156.8U CN210956654U (en) | 2019-12-26 | 2019-12-26 | Anti-corrosion heat dissipation type patch diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210956654U true CN210956654U (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922421156.8U Active CN210956654U (en) | 2019-12-26 | 2019-12-26 | Anti-corrosion heat dissipation type patch diode |
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| CN (1) | CN210956654U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116887A (en) * | 2023-09-14 | 2023-11-24 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
-
2019
- 2019-12-26 CN CN201922421156.8U patent/CN210956654U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117116887A (en) * | 2023-09-14 | 2023-11-24 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
| CN117116887B (en) * | 2023-09-14 | 2024-04-30 | 先之科半导体科技(东莞)有限公司 | High-electrical-contact-performance patch-type triode |
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Address after: Room 103, building 1, No.76, Baiye Road, Liaobu Town, Dongguan City, Guangdong Province 523430 Patentee after: Xianzhike semiconductor technology (Dongguan) Co.,Ltd. Address before: Room 103, building 1, No.76, Baiye Road, Liaobu Town, Dongguan City, Guangdong Province 523430 Patentee before: Zhongzhi Semiconductor Technology (Dongguan) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |