CN216817987U - Reinforced high-heat-dissipation high-power alloy resistor - Google Patents
Reinforced high-heat-dissipation high-power alloy resistor Download PDFInfo
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- CN216817987U CN216817987U CN202220226659.9U CN202220226659U CN216817987U CN 216817987 U CN216817987 U CN 216817987U CN 202220226659 U CN202220226659 U CN 202220226659U CN 216817987 U CN216817987 U CN 216817987U
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Abstract
The utility model discloses a reinforced high-heat-dissipation high-power alloy resistor, which is characterized in that a reinforcing sheet is arranged on the lower surface of a resistor chip, and a heat-dissipation colloid is adopted to encapsulate the resistor chip and the reinforcing sheet, so that the structural strength of the reinforcing sheet and the cured heat-dissipation colloid to the reinforcing chip part is utilized, the effective connection between two resistor bonding pads is realized by means of the viscosity of the heat-dissipation colloid, the structural strength of the whole alloy resistor is ensured, the resistor chip can be made thinner and thinner, and the resistance value of the alloy resistor can be more than 100 mR; meanwhile, the lower surface of the heat dissipation colloid is flush with the bottom surface of the resistance pad, the upper surface of the heat dissipation colloid protrudes out of the upper surface of the resistance pad, and the heat dissipation groove is formed in the upper surface of the heat dissipation colloid, so that the alloy resistor can be in good contact with a circuit board when being pasted, the heat dissipation area of the heat dissipation colloid is increased, and the heat dissipation requirement of the large-resistance alloy resistor is met.
Description
Technical Field
The utility model relates to the technical field of alloy resistors, in particular to a reinforced high-heat-dissipation high-power alloy resistor.
Background
The alloy resistor is a resistor which adopts alloy as a current medium, has the characteristics of low resistance, high precision, low temperature coefficient, impact current resistance, high power and the like, and is widely applied to precision instruments, military products, aerospace avionics, new energy photovoltaic products, automobiles and the like.
In general, the resistance value is adjusted by punching for a resistor having a thickness of 0.2mm or more, and by punching, chemical planar view, photo etching, or the like for a resistor having a thickness of 0.2mm or less. The larger the resistance is, the thinner and thinner the resistor body correspondingly, when the thickness of the resistor body is less than 0.1mm, the thickness of the resistor body is equivalent to that of an A4 paper, the strength is low, the resistor body is easy to deform, the requirements on the overcurrent capacity and the heat dissipation of the resistor body are higher, the structural strength and the heat dissipation capacity are limited, the resistance of the traditional alloy resistor can only be 5mR, and the requirement of the market (such as new energy photovoltaic products) on the high-resistance alloy resistor is difficult to meet.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a reinforced high-heat-dissipation high-power alloy resistor, aiming at meeting the market demand on high-resistance alloy resistors.
In order to achieve the purpose, the reinforced high-heat-dissipation high-power alloy resistor provided by the utility model comprises a resistor chip, resistor bonding pads welded on two sides of the resistor chip and a heat-dissipation colloid, wherein a reinforcing sheet is arranged on the lower surface of the resistor chip, an insulating heat-conducting layer is arranged between the reinforcing sheet and the resistor chip, and the heat-dissipation colloid wraps the resistor chip and the reinforcing sheet; the lower surface of the heat dissipation colloid is flush with the lower surface of the resistance pad, the upper surface of the heat dissipation colloid protrudes out of the upper surface of the resistance pad, and the upper surface of the heat dissipation colloid is provided with a heat dissipation groove.
Optionally, a height difference is provided between the bottom surface of the resistor chip and the bottom surface of the resistor pad, and the height difference is greater than or equal to 0.4 mm.
Optionally, the resistor chip is bent to form a cavity with a downward opening, the depth of the cavity is more than 0.4mm, and the reinforcing sheet is located in the cavity.
Optionally, the width of the heat dissipation groove is 1 mm-2 mm.
Optionally, the resistor chip is made of low temperature-drift manganin.
Optionally, the resistor pad is made of copper.
According to the reinforced high-heat-dissipation high-power alloy resistor provided by the utility model, the reinforcing sheet is arranged on the lower surface of the resistor chip, and the resistor chip and the reinforcing sheet are packaged by adopting the heat-dissipation colloid, so that the structural strength of the reinforcing sheet and the solidified heat-dissipation colloid to the reinforcing chip part is utilized, the effective connection between the two resistor bonding pads is realized by means of the viscosity of the heat-dissipation colloid, the structural strength of the whole alloy resistor is ensured, the resistor chip can be made thinner and thinner, and the resistance value of the alloy resistor can be made larger; meanwhile, the lower surface of the heat dissipation colloid is flush with the bottom surface of the resistance pad, the upper surface of the heat dissipation colloid protrudes out of the upper surface of the resistance pad, and the heat dissipation groove is formed in the upper surface of the heat dissipation colloid, so that the alloy resistor can be in good contact with a circuit board when being pasted, the heat dissipation area of the heat dissipation colloid is increased, and the heat dissipation requirement of the large-resistance alloy resistor is met.
By adopting the alloy resistor with the structure, the resistance value of the alloy resistor can reach more than 100mR, and the requirement of the market on the large-resistance alloy resistor is effectively met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a reinforced high-heat-dissipation high-power alloy resistor according to the present invention;
FIG. 2 is a schematic structural diagram of an alloy die in an embodiment of the reinforced high-heat dissipation and high-power alloy resistor of the present invention;
FIG. 3 is a schematic structural diagram of another embodiment of the reinforced high heat dissipation and high power alloy resistor of the present invention;
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should be considered to be absent and not within the protection scope of the present invention.
The utility model provides a reinforced high-heat-dissipation high-power alloy resistor.
Referring to fig. 1-2, fig. 1 is a schematic structural diagram of an embodiment of the reinforced high heat dissipation power alloy resistor of the present invention, and fig. 2 is a schematic structural diagram of an alloy bare chip in an embodiment of the reinforced high heat dissipation power alloy resistor of the present invention.
As shown in fig. 1-2, in the embodiment of the utility model, the reinforced high heat dissipation and high power alloy resistor includes a resistor chip 103, a first resistor pad 101 and a second resistor pad 102 soldered on both sides of the resistor chip 103, and a heat dissipation adhesive 400. The resistance chip 103 is made of low-temperature floating manganese copper, the first resistance pad 101 and the second resistance pad 102 are made of red copper, the resistance chip 103, the first resistance pad 101 and the second resistance pad 102 are welded together through electron beam welding, the resistance chip 103, the first resistance pad 101 and the second resistance pad 102 can be instantly melted by high temperature generated by the electron beam welding, brazing filler metal is not needed during welding, welding waste is not generated, and a formed welding line 104 is straight and attractive.
A reinforcing plate 200 is provided on the lower surface of the resistor chip 103, and the reinforcing plate 200 is made of a high-strength alloy or metal to increase the structural strength of the resistor chip 103. An insulating and heat conducting layer 300 is arranged between the reinforcing sheet 200 and the resistor chip 103, and the insulating and heat conducting layer 300 also wraps the two sides of the reinforcing sheet 200 to prevent the reinforcing sheet 200 from being in electrical contact with the resistor chip 103, the first resistor pad 101 and the second resistor pad 102.
The heat dissipation colloid 400 wraps the resistor chip 103 and the reinforcing sheet 200, and after the heat dissipation colloid 400 is cured, the resistor chip 103 and the reinforcing sheet 200 can be packaged and protected. In addition, the solidified heat dissipation colloid 400 can also be matched with the reinforcing sheet 200 to form double reinforcement, so that the structural strength of the alloy resistor on the resistor chip part is further improved; and the cured heat dissipation colloid 400 can also effectively glue the two resistance pads together, so that the overall structural strength of the alloy resistor is ensured. Therefore, the resistor chip 103 can be made thinner to 0.03mm, so that the resistance of the alloy resistor can be made larger to be more than 100 mR.
In the present embodiment, the heat dissipating adhesive 400 only wraps the resistor chip 103 and the stiffener 200, and therefore, the tin on the first resistor pad 101 and the second resistor pad 102 is not affected.
The requirement of the high-resistance alloy resistor on heat dissipation is higher, and therefore, in this embodiment, the lower surface of the heat dissipation colloid 400 is flush with the lower surfaces of the first resistor pad 101 and the second resistor pad 103, so that the alloy resistor can be completely attached to the circuit board during mounting, and the heat dissipation effect of the alloy resistor is ensured; meanwhile, the upper surface of the heat dissipation colloid 400 protrudes out of the upper surface of the resistor pad, and a heat dissipation groove 400a with a width of 1mm to 2mm is formed in the upper surface of the heat dissipation colloid 400. Therefore, the heat dissipation area of the heat dissipation colloid 400 is increased, the heat dissipation capacity of the alloy resistor is improved, and the heat dissipation requirement of the high-resistance alloy resistor is met. Meanwhile, the heat dissipation groove 400a can prevent the heat from being concentrated too much to affect the heat dissipation efficiency of the resistor chip 103.
In this embodiment, the thickness of the first resistance pad 101 and the second resistance pad 102 is greater than the thickness of the resistance chip 103, so that a height difference of 0.4mm or more is ensured between the bottom surface of the resistance chip 103 and the bottom surface of the resistance pad, and a cavity with a depth of 0.4mm or more is formed, thereby reserving a sufficient space for the reinforcing sheet 200, the heat dissipation resin 400, and the insulating and heat conducting layer 300. Of course, for the large-resistance alloy resistor, the thickness of the resistor pad is usually much larger than that of the resistor chip 103, and the above arrangement is only applied to the case that the thickness of the resistor chip 103 is not much different from that of the resistor pad.
In other embodiments, as shown in fig. 3, the resistor chip 103 may be bent to form a cavity with a depth of 0.4mm or more at the bottom of the resistor chip 103, so as to reserve sufficient space for the stiffener 200, the heat dissipation resin 400, and the insulating and heat conducting layer 300.
Compared with the prior art, the utility model has the beneficial effects that: the resistance value of the alloy resistor can be more than 100mR, and the requirement of the market on the large-resistance alloy resistor is effectively met.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention, which are made by using the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. A reinforced high-heat-dissipation high-power alloy resistor comprises a resistor chip and resistor bonding pads welded on two sides of the resistor chip, and is characterized by further comprising a heat-dissipation colloid, wherein reinforcing plates are arranged on the lower surface of the resistor chip, an insulating heat-conducting layer is arranged between each reinforcing plate and the resistor chip, and the heat-dissipation colloid wraps the resistor chip and the reinforcing plates; the lower surface of the heat dissipation colloid is flush with the lower surface of the resistance pad, the upper surface of the heat dissipation colloid protrudes out of the upper surface of the resistance pad, and a heat dissipation groove is formed in the upper surface of the heat dissipation colloid.
2. The reinforced high heat dissipation and high power alloy resistor of claim 1, wherein a height difference is provided between the bottom surface of the resistor chip and the bottom surface of the resistor pad, and the height difference is greater than 0.4 mm.
3. The reinforced high-heat-dissipation high-power alloy resistor as recited in claim 1, wherein the resistor chip is bent to form a cavity with a downward opening, the depth of the cavity is greater than 0.4mm, and the reinforcing plate is located in the cavity.
4. The reinforced high-heat-dissipation high-power alloy resistor as recited in claim 1, wherein the width of the heat dissipation groove is 1mm to 2 mm.
5. The reinforced high heat dissipation and power alloy resistor as recited in any one of claims 1-4, wherein the resistor chip is made of low temperature-drift manganin.
6. The reinforced high heat dissipation and power alloy resistor as recited in claim 1, wherein the resistor pad is made of red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220226659.9U CN216817987U (en) | 2022-01-27 | 2022-01-27 | Reinforced high-heat-dissipation high-power alloy resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220226659.9U CN216817987U (en) | 2022-01-27 | 2022-01-27 | Reinforced high-heat-dissipation high-power alloy resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216817987U true CN216817987U (en) | 2022-06-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220226659.9U Active CN216817987U (en) | 2022-01-27 | 2022-01-27 | Reinforced high-heat-dissipation high-power alloy resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216817987U (en) |
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2022
- 2022-01-27 CN CN202220226659.9U patent/CN216817987U/en active Active
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