CN219917171U - Power device and power module - Google Patents

Abstract

The utility model provides a power device and a power module, wherein the power device comprises a device body and at least one group of pin parts, each group of pin parts comprises at least two pin structures, the pin structures are electrically connected with the device body, each pin structure comprises at least one pair of pins, and each pair of pins comprises a pin type pin and a mounting type pin which are connected with each other. The technical scheme of the utility model can improve the flexibility of power device installation and the packaging efficiency.

Description

Power device and power module

Technical Field

The utility model relates to the technical field of power devices, in particular to a power device and a power module.

Background

In the prior art, a power semiconductor device is generally packaged by adopting all direct-insert pins and through a direct-insert packaging mode, the pins of the power device are firstly inserted into element holes, and then the pins are welded in the element holes of a circuit board. After the soldering is completed, if the length of the pins in the direction perpendicular to the board surface of the circuit board is too long, the extra length of the pins should be cut off. If all the surface-mounted pins are adopted, a certain electrical distance is needed between two adjacent pins, otherwise, the problem of electrical connection exists, and the comprehensive cost is high.

Therefore, the packaging mode of the power semiconductor device in the prior art cannot efficiently realize the electrical connection with the circuit board, is not suitable for automatic production, and has higher cost.

Disclosure of Invention

The utility model mainly aims to provide a power device and a power module, and aims to improve the flexibility of power device installation and packaging efficiency.

In order to achieve the above object, the present utility model provides a power device, including:

a device body; and

at least one group of pin parts, each group of pin parts comprises at least two pin structures, the pin structures are electrically connected with the device body, each pin structure comprises at least one pair of pins, and each pair of pins comprises a pin type pin and a mounting type pin which are connected with each other.

In an embodiment of the present utility model, the pin structure further includes a connection portion, where the connection portion is electrically connected to the first metal layer or the chip of the device body, and one end of the connection portion, which is far away from the device body, extends to form the pin type pin and the mounting type pin.

In an embodiment of the present utility model, the power device further includes a connection member, one end of the connection member is connected to the connection portion, and the other end of the connection member is connected to the first metal layer or the chip of the device body, so that the connection portion is electrically connected to the first metal layer or the chip;

and/or the connecting part is welded to the device body.

In an embodiment of the present utility model, the pin-type pins and the mounted pins are electrically connected to the first metal layer or the chip of the device body, respectively.

In an embodiment of the utility model, the device body includes a first metal layer, a chip and a plastic package, and the chip is disposed on a surface of the first metal layer;

the plastic package piece is covered and sealed on the chip, and at least part of each pin is exposed out of the plastic package piece;

and in the same group of pin parts, two pin structures are electrically connected with the first metal layer, and the other pin structure is electrically connected with the chip.

In an embodiment of the utility model, the device body further includes a heat-conducting insulating substrate, the first metal layer is disposed on a side surface of the heat-conducting insulating substrate, a carrier region is formed on a side surface of the first metal layer away from the heat-conducting insulating substrate, and the chip is disposed in the carrier region;

the plastic package piece is covered on the heat-conducting insulating substrate and the first metal layer, and the surface of the heat-conducting insulating substrate, which is away from the first metal layer, is exposed outside the plastic package piece.

In an embodiment of the utility model, the device body further includes a second metal layer, the second metal layer is disposed on a side of the heat-conducting and insulating substrate facing away from the first metal layer, and a surface of the second metal layer facing away from the heat-conducting and insulating substrate is exposed outside the plastic package;

and/or the thermally conductive and insulating substrate comprises an alumina ceramic substrate.

In an embodiment of the utility model, the chip comprises at least one of an IGBT, an anti-parallel diode, a fast recovery diode, a P-type diode, an N-type diode, such that the power device may be used to form an IGBT series topology, a power brake pipe series topology, an IGBT parallel topology, a power rectifier bridge topology, or a power brake pipe topology.

In an embodiment of the utility model, the device body is further provided with a connection hole for penetrating a locking member to fix the power device.

The utility model also proposes a power module comprising at least one power device as described in any of the preceding claims;

the power module comprises a rectifier bridge topology power module, a rectifier half-bridge topology power module, a rectifier single-tube topology power module, a power IGBT single-tube topology power module or a power IGBT half-bridge topology power module.

According to the technical scheme, at least one pin type pin and at least one mounting type pin with the same electric connection relationship are used as a pin structure on the power device, so that when the power device is packaged, the mounting type pin or the pin type pin on the pin structure can be used for connection, so that the power device can be packaged by adopting an automatic surface mounting mode through the mounting type pin to be connected with devices such as a circuit board, for example, a reflow soldering process is adopted, overlong pins are not required to be cut at the moment, the assembly steps between the power device and the circuit board are simplified, the power device can be suitable for an automatic surface mounting technology, and the packaging efficiency is improved; the pin type pins can be selected for packaging according to actual demands, or the pin type pins and the mounting type pins are respectively selected for packaging for different pin structures, so that the problem of electrical connection existing when the mounting type pins are singly used is avoided, the manufacturability, the flexibility and the high efficiency of the power device packaging are improved, the packaging efficiency is improved, and the cost is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of an embodiment of a power device of the present utility model;

FIG. 2 is a cross-sectional view of an embodiment of a power device of the present utility model;

FIG. 3 is a schematic diagram of an internal connection of an embodiment of the power device of the present utility model in a power IGBT series topology application;

fig. 4 is an internal connection diagram of another embodiment of the power device of the present utility model applied to a power IGBT series topology;

FIG. 5 is a circuit topology for a power IGBT series topology application;

FIG. 6 is a schematic diagram of the internal connections of an embodiment of the power device of the present utility model in a power brake pipe serial topology application;

FIG. 7 is a schematic diagram illustrating the internal connections of another embodiment of the power device of the present utility model in a power brake pipe serial topology application;

FIG. 8 is a circuit topology for a power brake pipe series topology application;

fig. 9 is an internal connection diagram of an embodiment of the power device of the present utility model applied to a parallel topology of power IGBTs;

FIG. 10 is a diagram illustrating internal connections of another embodiment of the power device of the present utility model in a power IGBT parallel topology application;

FIG. 11 is a circuit topology for a power IGBT parallel topology application;

FIG. 12 is a schematic diagram illustrating an internal connection of a power device according to an embodiment of the present utility model in a topology application of a power rectifier bridge;

FIG. 13 is a schematic diagram illustrating an internal connection of another embodiment of a power device according to the present utility model in a power rectifier bridge topology application;

FIG. 14 is a parallel circuit topology for a power rectifier bridge topology application;

FIG. 15 is a series circuit topology for a power rectifier bridge topology application;

FIG. 16 is a diagram illustrating internal connections of an embodiment of a power device of the present utility model in a power brake pipe topology application;

FIG. 17 is a diagram illustrating internal connections of another embodiment of a power device of the present utility model in a power brake pipe topology application;

fig. 18 is a circuit topology for a power brake pipe topology application.

Reference numerals illustrate:

the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The present utility model proposes a power device 100.

Referring to fig. 1 and 2, in some embodiments of the power device 100 of the present utility model, the power device 100 includes:

a device body 10; and

at least one set of lead parts, each set of lead parts comprises at least two lead structures 30, at least two lead structures 30 are electrically connected with the device body 10, each lead structure 30 comprises at least one pair of leads, and each pair of leads comprises a pin type lead 31 and a mounting type lead 33 which are electrically connected with each other.

Specifically, the power device 100 provided by the utility model is suitable for topologies such as a power IGBT, a rectifier bridge, a brake unit with an energy feedback function and the like, the power device 100 comprises a device body 10 and at least one group of pin parts, each group of pin parts comprises at least two pin structures 30, one end of each pin structure 30 is electrically connected with the device body 10, and the other end extends to a direction far away from the device body 10 to form pins for connecting a circuit board.

In this embodiment, when the integrated circuit topology in one power device 100 includes a plurality of sub-topologies (as shown in fig. 3, the integrated circuit topology includes two sub-topologies), the pins corresponding to each sub-topology may be a group of pin portions. In some embodiments, the circuit topology integrated in one power device 100 may be regarded as a whole, and the pins in the power device 100 may be regarded as a group of pins as a whole, which may be specifically determined according to practical situations, and the embodiments of the present disclosure are not limited to this.

In this embodiment, since the power device 100 may be a double-sided pin or a multi-sided pin, and the plurality of pins led out from one side may be structurally independent from each other, each set of pins may include at least two pin structures 30, so that at least two pin structures 30 having no interconnection relationship may be disposed on the same side, or only one pin structure 30 may be disposed on one side, which is not limited herein.

In this embodiment, some of the lead structures 30 in a set of leads may include at least two leads, for example: 2, 3, 4, 8, etc. Wherein one pin type pin 31 and one mounting type pin 33 in one pin structure 30 may be a pair. It should be understood that, of course, one pin structure 30 may include one pin type pin 31 and two mounting type pins 33, or two pin type pins 31 and one mounting type pin 33, and the pin type pin 31 and the mounting type pin 33 connected in the same pin structure 30 only refer to the pin type pin 31 and the mounting type pin 33 of the same pin structure 30 having the same electrical connection relationship, for example, the pin type pin 31 and the mounting type pin 33 of the same pin structure 30 are connected as a unitary structure to be commonly connected to the same device, or may be connected to the same device as shown in fig. 16 and 17, respectively. Specifically, the method can be determined according to actual conditions, and is not limited in the embodiment of the present specification.

Referring to fig. 3, taking the group of pins placed on the left side of the connection hole 17 as an example, the pins are composed of three pin structures 30 located on the upper and lower sides of the device body 10, so that two of the pin structures 30 can respectively form a positive electrode and a negative electrode or respectively form an emitter and a control electrode of the power device, when the power device 100 can be connected to a circuit board through the group of pins, the pin structures 30 of each group of pins can be conducted through copper foil of the circuit board, thereby forming a complete circuit between the power device 10 and the circuit board to be combined into different application topologies, including but not limited to a rectifier bridge, a rectifier half bridge, a rectifier single tube, a power IGBT half bridge, a rectifier half bridge and a rectifier half bridge+a brake tube. It will be understood that other possible circuit topologies may be combined, and specifically may be determined according to the actual situation, which is not limited by the embodiments of the present disclosure.

The pin structure 30 of the power device 100 includes the mounting pins 33 suitable for SMT surface mounting technology and the pin pins 331 suitable for whole machine spot welding, laser welding or wave soldering, so as to solve the problem of electrical connection between the power module and the power connector of the driver, and the pin pins 31 or the mounting pins 33 can be selected for packaging according to actual requirements, so that the manufacturability and flexibility of packaging the power device 100 and the circuit board are improved. When the mounting pins 33 are selected for packaging, the power device 100 can be packaged in an automated surface mount manner, thereby improving packaging efficiency.

It will be appreciated, therefore, that in the technical solution of the present utility model, each pin structure 30 on the power device 100 may be configured as a combined structure including the pin-type pins 31 and the mounted pins 33 that are connected. It will be understood, of course, that in some embodiments, as shown in fig. 16 and 17, only the pin 31 may be disposed on a portion of the pin structure 30 in the set of pins, or only the mounting pin 33 may be disposed on the pin structure 30, which may be specifically determined according to the actual situation, and the embodiment of the present disclosure is not limited thereto.

When the power device 100 is packaged, for the same pin structure 30, the mounting type pin 33 or the pin type pin 31 on the same pin structure can be alternatively used for being connected with a circuit board, so that the power device 100 can be packaged by adopting an automatic surface mounting mode through the mounting type pin 33 and connected with devices such as the circuit board, for example, a reflow soldering process is adopted, overlong pins are not required to be cut at the moment, the assembly step between the power device 100 and the circuit board is simplified, the packaging method is applicable to an automatic surface mounting technology, and the packaging efficiency is improved; the pin type pins 31 can be selected for packaging according to actual requirements, or the pin type pins 31 and the mounting type pins 33 are respectively selected for packaging for different pin structures 30, so that the electrical connection problem existing when the mounting type pins 33 are singly used is avoided, the manufacturability, flexibility and high efficiency of the power device 100 packaging are improved, the packaging efficiency is improved, and the cost is reduced.

Referring to fig. 3 and 4, in some embodiments of the power device 100 of the present utility model, the pin structure 30 may further include a connection portion 35, where the connection portion 35 is electrically connected to the first metal layer 11 or the chip 13 of the device body 10, and an end of the connection portion 35 away from the device body 10 may extend away from the device body 10 to form the pin-type pins 31 and/or the mounting pins 33.

According to the technical scheme of the utility model, each pin structure 30 on the power device 100 is provided as a combined structure comprising the pin type pins 31 and the mounting type pins 33 which are connected, so that different pins are selected to be connected with a circuit board according to actual requirements.

The surface of the power device 100 opposite to the circuit board when the power device 100 is fixed to the circuit board is defined as a bottom surface of the power device 100, in some embodiments, the bottom surface may be a surface of the plastic package 15 away from the chip 13, it is of course understood that a manner of bending pins may also be changed, and the bottom surface may be the heat conductive insulating substrate 12 or the second metal layer, which may be specifically determined according to practical situations, and this embodiment is not limited to this embodiment. In one embodiment, the device body 10 may include a first metal layer 11 and a chip 13, the chip 13 is disposed on the first metal layer 11, the lead structure 30 includes a connection portion 35, the connection portion 35 extends outwards from the device body 10, the pin-type lead 31 and the mounting-type lead 33 are both formed at one end of the connection portion 35 away from the device body 10, the pin-type lead 31 extends from one end of the connection portion 35 away from the device body 10 to the bottom surface of the power device 100 and protrudes out of the bottom surface of the power device 100, the mounting-type lead 33 includes an extension portion 331 and a mounting portion 333 connected, wherein the extension portion 331 extends from one end of the connection portion 35 away from the device body 10 to the bottom surface of the power device 100, and the mounting portion 333 is bent from one end of the extension portion 331 away from the connection portion 35 to extend away from the bottom surface of the power device 100. By this arrangement, only the connection portion 35 is electrically connected to the device body 10, so that the pin type pins 31 and the mounting type pins 33 can be kept electrically connected, and a user can select one of the pin type pins 31 and the mounting type pins 33 to be connected to the circuit board according to actual requirements.

In addition, in this embodiment, the connection portion 35 may be in a split structure with the first metal layer 11, and the connection portion 35 may be directly welded on the first metal layer 11 of the device body 10 to be electrically connected with the device body 10, or connected with the first metal layer 11 or the chip 13 by a metal copper sheet or a binding wire, so as to be electrically connected with the device body 10; the connection portion 35 may be formed integrally with the first metal layer 11, or may be formed as a split structure between a part of the connection portion 35 and the first metal layer 11, and another part of the connection portion 35 may be formed integrally with the first metal layer 11, which may be specifically determined according to practical situations, and the embodiment of the present disclosure is not limited thereto.

In some embodiments of the power device 100 of the present utility model, the connection 35 may be soldered to the device body 10.

In this embodiment, the connection portion 35 is connected with the device body 10 by welding, so that the connection strength between the pin structure 30 and the device body 10 can be improved, the structural strength of the power device 100 is improved, the pin structure 30 and the device body 10 can maintain good connection stability, and the risk of internal circuit breaking of the power device 100 is reduced, at this time, the connection portion 35 can be electrically connected with the device body 10 by welding, for example, the connection portion 35 can be welded on the first metal layer 11 of the device body 10, or the connection portion 35 can be electrically connected with the device body 10 by the connection piece 50 such as a metal copper sheet and a binding wire, and compared with the connection manner in which the connection piece 50 such as a metal copper sheet and a binding wire is adopted for connection, the material usage in the power device 100 is reduced, and the volume of the power device 100 is reduced.

Referring to fig. 4, in some embodiments of the power device 100 of the present utility model, the power device 100 further includes a connection member 50, one end of the connection member 50 is connected to the connection portion 35, and one end of the connection member 50 is connected to the first metal layer 11 or the chip 13 of the device body 10, so that the connection portion 35 is electrically connected to the first metal layer 11 or the chip 13.

In this embodiment, the connection part 35 may be connected with the first metal layer 11 or the chip 13 of the device body 10 through the connection piece 50, the connection piece 50 may be a metal copper sheet, an aluminum wire, a binding wire, or the like, which is not limited herein, and the connection is performed through the connection piece 50, only by ensuring that two ends of the connection wire are respectively connected with the connection part 35 and a to-be-connected position on the device body 10, the connection structure is more flexible, and the influence on the structural arrangement and the wiring structure in the device body 10 is reduced.

In some embodiments, the device body 10 may include the first metal layer 11, the chip 13 and the plastic package 15, at this time, the pin structure 30 is electrically connected with the carrier region 111 or the chip 13 on the first metal layer 11, and part of the pin structure 30 and the carrier region 111 are entirely covered in the plastic package 15 with the chip 13, so as to improve the overall structural strength and structural stability of the power device 100, protect the internal devices, and also avoid the direct exposure of the connecting wires to reduce the fracture risk.

Referring to fig. 16 and 17, in some embodiments of the power device 100, the pin-type pins 31 and the mounting pins 33 may be electrically connected to the first metal layer 11 or the chip 13 of the device body 10, respectively.

In this embodiment, a pin structure 30 on the power device 100 may include a combination of pin type pins 31 and mounting type pins 33 that are disposed independently, so as to select different pins to connect with the circuit board according to actual requirements. In this embodiment, the pin pins 31 and the mounting pins 33 are respectively and independently arranged to be electrically connected with the device body 10, and may be respectively welded to the first metal layer 11, or respectively connected with the first metal layer 11 or the chip 13 of the device body 10 through the connecting piece 50, which is not limited herein, so that the pin pins 31 and the mounting pins 33 can be prevented from interfering with each other during packaging, the connection structure is more flexible, and the influence on the structural arrangement and the wiring structure in the device body 10 is reduced.

Referring to fig. 1 to 4, in some embodiments of the power device 100 of the present utility model, the device body 10 includes a first metal layer 11, a chip 13, and a plastic package 15, and the chip 13 is disposed on the first metal layer 11;

the plastic package 15 is covered on the chip 13, and at least part of each pin is exposed out of the plastic package 15;

in two lead structures 30 of the same group of lead parts, one lead structure 30 is electrically connected with the first metal layer 11, and the other lead structure 30 is electrically connected with the chip 13.

In this embodiment, the device body 10 may include a first metal layer 11, a chip 13 and a plastic package 15, where the first metal layer 11 may be substantially plate-shaped, and one side surface of the first metal layer is a conductive area, the plastic package 15 may be a shell structure, and one side of the plastic package is open, and the opening covers the surface of the first metal layer 11, where the surface of the first metal layer 11 is provided with the carrier region 111, so as to enclose the first metal layer 11 to form a package cavity, and at this time, the chip 13 is disposed on the first metal layer 11 and electrically connected to the first metal layer 11, and is located in the package cavity. In this embodiment, the first metal layer 11 is a top surface of the power device 100.

In this embodiment, the pin structure 30 is disposed through the plastic package 15, one end of the pin structure is electrically connected to the first metal layer 11 or the chip 13, the other end extends from the side of the device body 10 to the outside of the plastic package 15, and the pin 31 and the mounting pin 33 are both located at one end of the pin structure 30 far from the device body 10 to be exposed outside the plastic package 15. When the power device 100 is packaged on the circuit board, the first metal layer 11 is located at one side far away from the circuit board, so that the heat dissipation efficiency of the power device 100 can be improved, and the heat dissipation of the power device 100 can be accelerated.

In addition, two or more pin structures 30 may be provided, each pin structure 30 may be provided with one or more pairs of pin pins 31 and mounting pins 33, and are electrically connected with the carrier section 111 and the chip 13 according to actual requirements, so that when the pin structure is welded on a PCB board, the pin structure may be combined into different application topologies through PCB copper foil, and the topologies include, but are not limited to, a rectifier bridge, a rectifier half bridge, a rectifier single tube, a power IGBT half bridge, a rectifier half bridge+a brake tube, and the like.

Referring to fig. 3, in some embodiments of the power device 100 of the present utility model, the device body 10 further includes a thermally conductive and insulating substrate 12, the first metal layer 113 is disposed on a side surface of the thermally conductive and insulating substrate 12, a carrier region 111 is formed on a side surface of the first metal layer 113 away from the thermally conductive and insulating substrate 12, and the chip 13 is disposed on the carrier region 111.

It will be appreciated that packages such as TO-247 and TO-220 are not suitable for reflow soldering for some power devices 100. At this time, a combined structure of the heat conductive insulating substrate 12 and the conductive metal layer may be adopted, so as to improve the heat dissipation efficiency in the welding process, avoid overheating in the welding process of the power device 100, and also improve the heat dissipation efficiency in the use process of the power device 100. In this embodiment, at this time, heat generated during the operation of the power device 100 and the power module may be transferred from the first metal layer 113 inside the power device 100 to the outside through the heat conducting insulating substrate 12 for heat dissipation, or may be connected to a radiator through the heat conducting insulating substrate 12 for heat dissipation, thereby improving the heat dissipation efficiency of the power device 100 and the power module. At this time, the area of the first metal layer 113 may be smaller than the area of the heat conducting and insulating substrate 12, so that the plastic package 15 covers the heat conducting and insulating substrate 12 and completely covers the first metal layer 113 and the chip 13, thereby avoiding the risk of short circuit and the like caused by the exposure of the first metal layer 113.

In addition, compared with the three-layer structure formed by a similar structure such as DBC (copper clad ceramic substrate) in the following embodiment, the carrier formed by the first metal layer 113 and the thermally conductive and insulating substrate 12 in this embodiment has only a two-layer structure, and one-side binding electrical connection is omitted, so that the structure is simple, and the volume of the power device 100 can be reduced.

In some embodiments of the power device 100 of the present utility model, the device body 10 further includes a second metal layer, where the second metal layer is disposed on a side of the thermally conductive and insulating substrate 12 facing away from the first metal layer 113, and a surface of the second metal layer facing away from the thermally conductive and insulating substrate 12 is exposed outside the plastic package 15.

It can be appreciated that for some power devices 100, such as TO-247 and TO-220, the package is not suitable for reflow soldering, and at this time, a combined structure of the thermally conductive first metal layer 11 and the conductive carrier region 111 may be adopted, so as TO improve the heat dissipation efficiency of the soldering process, avoid overheating during the soldering process of the power device 100, and also improve the heat dissipation efficiency during the use process of the power device 100.

In this embodiment, the device body 10 is provided with a heat conducting insulating substrate 12 and two metal layers, the two metal layers are respectively disposed on opposite sides of the heat conducting insulating substrate 12, so that the two metal layers are mutually insulated and isolated by the insulating layer, the two metal layers are respectively defined as a first metal layer 113 and a second metal layer, so that a carrier region 111 is disposed on a surface of the first metal layer 113 facing away from the heat conducting insulating substrate 12, and the chip 13 is disposed on the carrier region 111.

In some embodiments, the area of the first metal layer 113 may be smaller than that of the insulating layer, so that the plastic package 15 covers the insulating layer and completely covers the first metal layer 113 and the chip 13, thereby avoiding the risk of short circuit and the like caused by exposure of the first metal layer 113. The metal layer may be made of copper or copper alloy with better heat conduction and heat dissipation properties, or nickel, silver, gold, palladium, or other materials, for example, the heat conduction and insulation substrate 12 and the two metal layers may be combined to form a DBC copper-clad ceramic plate as a carrier, which is not limited herein.

In some embodiments of the power device 100 of the present utility model, the thermally conductive and insulating substrate 12 may be an alumina ceramic substrate.

It will be appreciated that packages such as TO-247 and TO-220 are not suitable for reflow soldering for some power devices 100. At this time, a combined structure of the heat conductive and insulating substrate 12 structure and the conductive metal layer may be adopted, so as to improve the heat dissipation efficiency in the welding process, avoid overheating in the welding process of the power device 100, and also improve the heat dissipation efficiency in the use process of the power device 100. In the embodiment, the heat conducting and insulating substrate 12 is an alumina ceramic substrate, and the alumina ceramic has better heat conductivity and heat dissipation property; and the heat conduction and heat dissipation efficiency of the power device 100 can be ensured, the structural strength is improved, the damage risk of the power device 100 is reduced, and the service life is prolonged.

Referring to fig. 1, in some embodiments of the power device 100 of the present utility model, the device body 10 is further provided with a connection hole 17 for inserting a locking member to fix the power device 100.

It can be appreciated that the power device 100 according to the present utility model may be mounted on a circuit board by mounting or directly inserting. In this embodiment, the device body 10 of the power device 100 is provided with the connection hole 17, the connection hole 17 penetrates through the top surface and the bottom surface of the device body 10 in the power device 100, and at this time, a locking member such as a bolt may be inserted through the connection hole 17 and connected with the circuit board, so as to improve the connection strength between the power device 100 and the circuit board.

In some embodiments of the power device 100 of the present utility model, the chip 13 includes at least one of an IGBT, an anti-parallel diode, a fast recovery diode, a P-type diode, an N-type diode, such that the power device may be used to form an IGBT series topology, a power brake pipe series topology, an IGBT parallel topology, a power rectifier bridge topology, or a power brake pipe topology. It can be appreciated that the power device 100 of the present utility model can select at least one chip 13 to form different topologies according to different use requirements, so as to improve the use flexibility.

Referring to fig. 3 to 18, the present utility model further provides a power module including the power device 100 as described in any one of the foregoing description;

the power module comprises a rectifier bridge topology power module, a rectifier half-bridge topology power module, a rectifier single-tube topology power module, a power IGBT single-tube topology power module or a power IGBT half-bridge topology power module. It should be noted that, the types of the power modules may be the above-mentioned rectifier bridge topology power module, rectifier half-bridge topology power module, rectifier single-tube topology power module, power IGBT half-bridge topology power module or a combination of at least two circuit topology power modules, and may also be other possible circuit topology power modules, which may be specifically determined according to actual situations, and this is not limited in the embodiments of the present disclosure.

The power module provided by the utility model adopts all the technical schemes of all the embodiments, so that the power module at least has all the beneficial effects brought by all the technical schemes and is not described in detail herein.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. A power device, comprising:

a device body; and

at least one group of pin parts, each group of pin parts comprises at least two pin structures, the pin structures are electrically connected with the device body, each pin structure comprises at least one pair of pins, and each pair of pins comprises a pin type pin and a mounting type pin which are connected with each other.

2. The power device of claim 1, wherein the pin structure further comprises a connection portion electrically connected to a first metal layer or chip of the device body, the connection portion extending away from an end of the device body to form the pin-in-pin and the die-attach pin.

3. The power device of claim 2, further comprising a connection member having one end connected to the connection portion and the other end connected to a first metal layer or chip of the device body so that the connection portion is electrically connected to the first metal layer or chip;

and/or the connecting part is welded to the device body.

4. The power device of claim 1, wherein the pin and the mount pin are electrically connected to a first metal layer or chip of the device body, respectively.

5. The power device of claim 1, wherein the device body comprises a first metal layer, a chip, and a plastic package, the chip being disposed on a surface of the first metal layer;

the plastic package piece is covered and sealed on the chip, and at least part of each pin is exposed out of the plastic package piece;

and in the same group of pin parts, two pin structures are electrically connected with the first metal layer, and the other pin structure is electrically connected with the chip.

6. The power device of claim 5, wherein the device body further comprises a thermally conductive and insulating substrate, the first metal layer is disposed on a side surface of the thermally conductive and insulating substrate, a carrier region is formed on a side surface of the first metal layer away from the thermally conductive and insulating substrate, and the chip is disposed in the carrier region;

the plastic package piece is covered on the heat-conducting insulating substrate and the first metal layer, and the surface of the heat-conducting insulating substrate, which is away from the first metal layer, is exposed outside the plastic package piece.

7. The power device of claim 6, wherein the device body further comprises a second metal layer disposed on a side of the thermally conductive and insulating substrate facing away from the first metal layer, a surface of the second metal layer facing away from the thermally conductive and insulating substrate being exposed outside the plastic package;

and/or the thermally conductive and insulating substrate comprises an alumina ceramic substrate.

8. The power device of claim 5, wherein the chip comprises at least one of an IGBT, an anti-parallel diode, a fast recovery diode, a P-type diode, an N-type diode, such that the power device is operable to form an IGBT series topology, a power brake pipe series topology, an IGBT parallel topology, a power rectifier bridge topology, or a power brake pipe topology.

9. The power device according to any one of claims 1 to 8, wherein the device body is provided with a connection hole for penetrating a locking member to fix the power device.

10. A power module comprising at least one power device as claimed in any one of claims 1 to 9;

the power module comprises a rectifier bridge topology power module, a rectifier half-bridge topology power module, a rectifier single-tube topology power module, a power IGBT single-tube topology power module or a power IGBT half-bridge topology power module.