CN218274581U - Aluminum foil band structure for welding power device - Google Patents
Aluminum foil band structure for welding power device Download PDFInfo
- Publication number
- CN218274581U CN218274581U CN202222074306.4U CN202222074306U CN218274581U CN 218274581 U CN218274581 U CN 218274581U CN 202222074306 U CN202222074306 U CN 202222074306U CN 218274581 U CN218274581 U CN 218274581U
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- CN
- China
- Prior art keywords
- aluminum foil
- metal base
- base island
- power
- power device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73221—Strap and wire connectors
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses technical scheme discloses a power device welding aluminium foil strip structure, including setting up in the metal base island of plastic envelope surface one side, it has power chip to weld through the solder on the metal base island, and metal base island one side is equipped with outer base pin, and power chip's source electrode and drain electrode are connected with outer base pin through an aluminium foil strip, and the width of aluminium foil strip is 60 mils at least, and the thickness of aluminium foil strip is 6 mils at least. The utility model discloses technical scheme has been solved and has been used for carrying on the conventional copper line of chip package or the welding of aluminium wire can't satisfy high-power, heavy current, the problem of high heat dissipation and low internal resistance demand among the prior art.
Description
Technical Field
The utility model discloses technical scheme relates to integrated circuit encapsulation field, in particular to power device welding aluminium foil tape structure.
Background
The integrated circuit is packaged in the form of a housing for mounting a semiconductor integrated circuit chip. The chip packaging structure has the functions of mounting, fixing, sealing, protecting the chip, enhancing the electric heating performance and the like, and is connected to pins of the packaging shell through the connecting points on the chip by using the leads, and the pins are connected with other devices through the leads on the printed circuit board, so that the connection of the internal chip and an external circuit is realized. The quality of the packaging technology directly influences the performance of the chip and the design and manufacture of the Printed Circuit Board (PCB) connected with the chip. The form of the package is therefore crucial. With the technical development of 3 rd generation semiconductor technology GaN and SiC high-power chips, the requirements for packaging heat dissipation, packaging impedance and the like are higher and higher, and the requirements for high power, large current, high heat dissipation and low internal resistance cannot be met by conventional copper wire or aluminum wire welding.
SUMMERY OF THE UTILITY MODEL
The technical scheme of the utility model aims at solving one of the technical problem in the correlation technique to a certain extent at least. Therefore, the utility model discloses technical scheme's main aim at provides a power device welding aluminium foil strip structure, aims at solving the problem that conventional copper line or the welding of aluminium line that are used for carrying out chip package among the prior art can't satisfy high-power, heavy current, high heat dissipation and low internal resistance demand.
In order to achieve the above object, the utility model provides a power device welding aluminum foil strip structure, which comprises a metal base island arranged on one side of the surface of a plastic package, a power chip is welded on the metal base island through a welding material, an outer pin is arranged on one side of the metal base island, a source electrode and a drain electrode of the power chip are connected with the outer pin through an aluminum foil strip,
the aluminum foil strip has a width of at least 60 mils and a thickness of at least 6 mils.
In one embodiment, at least 1 welding point is arranged between the aluminum foil strip and the source electrode and the drain electrode.
In one embodiment, the solder comprises soft solder and solder paste.
In one embodiment, the metal base island and the outer pin are both of a metal copper layer structure and have a thickness of at least 0.2mm.
In one embodiment, the metal base island, the outer pins, the solder, the power chip and the aluminum foil strip are all coated on the plastic package body through epoxy resin.
The utility model discloses technical scheme's beneficial effect as follows:
the utility model discloses power device welding aluminium foil tape structure that technical scheme provided has abandoned in the past and has adopted copper line, aluminium wire welded structure, can realize high-power, the heavy current, the demand of high heat dissipation and low internal resistance, and job stabilization is stabilized more than the operating current stabilizes 100A, and heat energy derives fast and makes the encapsulation device temperature low.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the technical solutions of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic view of a cross-sectional structure of each component disposed on a metal base island in the technical solution of the present invention.
[ list of reference numerals for main parts/components ]
| Reference numerals | Name (R) | Reference numerals | Name(s) |
| 1 | |
41 | |
| 2 | |
5 | |
| 3 | |
6 | Solder joint |
| 4 | |
7 | |
| 40 | Source electrode |
Detailed Description
In order to make the utility model discloses technical scheme's purpose, utility model technical scheme's advantage are more clearly understood, will combine below the utility model discloses the attached drawing in the technical scheme embodiment is right utility model technical scheme in the technical scheme embodiment clearly, describe completely. It is obvious that the described embodiments are only some embodiments of the technical solution of the present invention, not all embodiments.
Based on the embodiment in the technical scheme of the utility model, all other embodiments that ordinary skilled person in the art obtained under the prerequisite of not making creative work all belong to the scope of the utility model technical scheme protection.
It should be noted that all the directional indicators (for example, upper, lower, left, right, front, rear, 8230) \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components in a specific state (as shown in the attached drawings), the motion situation, etc., and if the specific posture is changed, the directional indicator is also changed accordingly.
Descriptions in the technical solutions of the present invention as related to "first", "second", etc. are used for descriptive purposes only and are not to be interpreted as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the technical solution of the present invention, unless explicitly stated or limited otherwise, the terms "connected" and "fixed" should be understood in a broad sense, for example, "fixed" may be a fixed connection, or may be a detachable connection, or may be integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the technical solution of the present invention can be understood by those of ordinary skill in the art according to specific situations.
In addition, the utility model discloses utility model technical scheme between each embodiment can combine each other among the technical scheme, but must be based on the ordinary technical personnel in this field can realize, should consider this kind of utility model technical scheme's combination not exist when utility model technical scheme's combination appears contradicting each other or can't realize, also is not in the protection scope that technical scheme required of the utility model.
The utility model discloses technical scheme's concrete embodiment as follows:
with reference to figure 1 of the drawings,
the wide area of the aluminum foil strip 5 is welded with the power chip 4, and the welding area point beating design is adopted, so that the conduction internal resistance is minimum; a larger operating current can be carried. The heat generated by the work of the power chip 4 can be quickly conducted to the outside of the packaging body through the aluminum foil strip 5, the stable work of the working current above 100A is realized, the temperature of the packaging device is low due to the quick conduction of the heat energy, and the high-efficiency and low-loss technology of the high-power packaging device is realized.
The structure includes metal base island 1, places power chip 4 on the metal base island 1 layer, and metal base island 1 and power chip 4 pass through solder 3 and bond, and power chip 4's source 40 and drain 41 are connected with outer pin 2 through aluminium foil strip 5, and metal base island 1 layer, outer pin 2, solder 3, power chip 4 and aluminium foil strip 5 are inside plastic-sealed body 7 through using the epoxy protection. The metal base island 1 and the outer pins 2 are made of metal copper materials, and the thickness of the metal base island and the thickness of the outer pins are not less than 0.2mm. The solder 3 is soft solder 3 or a solder paste material. The aluminum foil strip 5 gauge is 60 mils wide by 6 mils thick, but is not limited to the other dimensional specifications listed. The aluminum foil strip 5, the power chip 4 and the pins form welding points through a wedge-shaped tool ultrasonic cold welding process. Two welding points 6 are formed on the power chip 4 through jumping, and the contact area of the aluminum foil strip 5 and the chip is increased.
The process comprises the following steps:
the power chip 4 is bonded on the metal base island 1 through soft solder 3 or solder paste-the chip source electrode 40/drain electrode 41 is connected with the outer pin 2 through a copper base band and an ultrasonic cold welding technology, and finally the metal base island 1, the outer pin 2, the solder 3, the power chip 4 and the aluminum foil band 5 are wrapped in the plastic package body 7 through epoxy resin for protection.
The utility model discloses technical scheme's theory of operation as follows:
the power device is welded with the aluminum foil strip 5 structure, the former copper wire and aluminum wire welding structure is abandoned, the requirements of high power, large current, high heat dissipation and low internal resistance can be met, the working current is stable and works more than 100A, and the temperature of the packaging device is low due to the rapid conduction of heat energy.
It only does to go up the utility model discloses technical scheme's preferred embodiment, not consequently restriction the utility model discloses technical scheme's patent scope all is in the utility model discloses technical scheme's utility model technical scheme designs under, utilizes the utility model discloses the equivalent structure transform that technical scheme description and attached content did, or direct/indirect application all includes in other relevant technical field the utility model discloses technical scheme's patent protection within range.
Claims (5)
1. A power device welding aluminum foil belt structure is characterized by comprising
A metal base island arranged on one side of the surface of the plastic package, a power chip welded on the metal base island through solder, an outer pin arranged on one side of the metal base island, a source electrode and a drain electrode of the power chip connected with the outer pin through an aluminum foil strip,
the width of aluminium foil area is 60 mils at least, the thickness of aluminium foil area is 6 mils at least.
2. The power device welding aluminum foil tape structure as claimed in claim 1, wherein at least 1 welding point is provided between the aluminum foil tape and the source electrode and the drain electrode.
3. The power device soldering aluminum foil tape structure of claim 1, wherein the solder comprises soft solder and solder paste.
4. The power device soldering aluminum foil tape structure of claim 1, wherein the metal base island and the outer pin are both of a metallic copper layer structure and have a thickness of at least 0.2mm.
5. The structure of the power device soldering aluminum foil tape as claimed in claim 1, wherein the metal base island, the outer pins, the solder, the power chip and the aluminum foil tape are coated on the plastic package body by epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222074306.4U CN218274581U (en) | 2022-08-08 | 2022-08-08 | Aluminum foil band structure for welding power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222074306.4U CN218274581U (en) | 2022-08-08 | 2022-08-08 | Aluminum foil band structure for welding power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218274581U true CN218274581U (en) | 2023-01-10 |
Family
ID=84766189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222074306.4U Active CN218274581U (en) | 2022-08-08 | 2022-08-08 | Aluminum foil band structure for welding power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218274581U (en) |
-
2022
- 2022-08-08 CN CN202222074306.4U patent/CN218274581U/en active Active
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