CN105979719A - Welding method for printed circuit board - Google Patents
Welding method for printed circuit board Download PDFInfo
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- CN105979719A CN105979719A CN201610443281.7A CN201610443281A CN105979719A CN 105979719 A CN105979719 A CN 105979719A CN 201610443281 A CN201610443281 A CN 201610443281A CN 105979719 A CN105979719 A CN 105979719A
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- tin cream
- welding
- welded
- disking area
- components
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a welding method for a printed circuit board. The welding method for the printed circuit board comprises the steps of performing primary tin-coating treatment on bonding pad regions corresponding to each to-be-welded component of the printed circuit board by a steel mesh; performing secondary tin-adding treatment on the bonding pad regions corresponding to the components with insufficient tin paste amount; performing chip-mounting treatment on each to-be-welded component of the printed circuit board; and performing reflow soldering treatment on the chip-mounted printed circuit board to finish the welding of each to-be-welded component of the printed circuit board. By adoption of the welding method, the welding reliability of the printed circuit board is improved.
Description
Technical field
The present invention relates to printed-board technology field, particularly relate to the welding method of a kind of printed circuit board (PCB).
Background technology
Along with the development of science and technology, the components and parts being applied on the printed circuit board (PCB) in various electronic product more come
The least, such as 01005 device (a size of 0.4mm*0.2mm) is applied in batches, and less
03015 device (a size of 0.3mm*0.15mm) of size is the most starting to import application.Except these
Undersized precision components, printed circuit board (PCB) also has the components and parts of the large-size such as shielded rack, deck.
Due to various sizes of components and parts when welding different to the requirement of tin cream amount, various sizes of in order to realize
Components and parts disposably synchronize reflow soldering and complete, and (ladder steel mesh different parts has generally to use ladder steel mesh
Have different thickness) carry out upper stannum, it is achieved the corresponding different tin cream of different components and parts on printed circuit board (PCB)
Amount.But due to differing greatly of each component size, and the thickness of ladder steel mesh also has certain limitation,
Ladder steel mesh can not fully meet the welding requirements of the components and parts of various sizes, it may appear that short circuit, rosin joint etc.
Problem, the reliability causing printed circuit board (PCB) to weld is the strongest.
Summary of the invention
Present invention is primarily targeted at the welding method that a kind of printed circuit board (PCB) is provided, it is intended to solve existing
The strongest technical problem of reliability of printed circuit board (PCB) welding.
For achieving the above object, the present invention provides the welding method of a kind of printed circuit board (PCB), described printing electricity
The welding method of road plate comprises the following steps:
Steel mesh is used the welding disking area that each components and parts to be welded of printed circuit board (PCB) are corresponding to be carried out on first
Stannum processes；
The welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding is carried out secondary and adds stannum process；
Each components and parts to be welded of described printed circuit board (PCB) are carried out paster process；
Printed circuit board (PCB) after paster is carried out reflow process, to be welded to complete each of printed circuit board (PCB)
Connect the welding of unit's device.
Alternatively, described steel mesh is steel mesh in uniform thickness, and the thickness of described steel mesh is 0.08-0.1mm.
Alternatively, the welding disking area that the described to be welded components and parts not enough to tin cream amount are corresponding carries out secondary and adds
The step that stannum processes includes:
At the welding disking area attachment molding block tin that the components and parts to be welded that tin cream amount is not enough are corresponding, wherein, institute
The specification stating molding block tin is adaptive with the supplementary tin cream amount of described welding disking area.
Alternatively, the composition of described molding block tin is consistent with the composition of the tin cream that first upper stannum processes.
Alternatively, the welding disking area attachment molding stannum that the described to be welded components and parts not enough in tin cream amount are corresponding
Before the step of block, also include:
Calculate the supplementary tin cream amount of welding disking area corresponding to the not enough components and parts to be welded of tin cream amount；
According to the described supplementary tin cream amount calculated, determine the molding block tin fitting in the attachment of described welding disking area
Specification.
Alternatively, the welding disking area attachment molding stannum that the described to be welded components and parts not enough in tin cream amount are corresponding
The step of block includes:
Marginal position attachment molding block tin at welding disking area corresponding to the components and parts to be welded that tin cream amount is not enough.
Alternatively, the welding disking area that the described to be welded components and parts not enough to tin cream amount are corresponding carries out secondary and adds
The step that stannum processes includes:
At the welding disking area spraying tin cream that the components and parts to be welded that tin cream amount is not enough are corresponding, wherein, spraying
Tin cream amount is corresponding consistent with the supplementary tin cream amount of described welding disking area.
Alternatively, the welding disking area spraying tin cream that the described to be welded components and parts not enough in tin cream amount are corresponding
Step includes:
Employing sprays the tin cream machine spraying method with piezoelectric type and tin cream is sprayed at the to be welded of tin cream amount deficiency
The welding disking area that components and parts are corresponding.
Alternatively, described spraying tin cream machine includes Mini-type spiral pump and airtight cavity, at described spraying tin cream
When adding tin cream in machine, tin cream is imported in described airtight cavity by described Mini-type spiral pump.
Alternatively, appropriate tin cream is sprayed at by described employing spraying tin cream machine with the spraying method of piezoelectric type
Before the step of the welding disking area that components and parts to be welded that tin cream amount is not enough are corresponding, also include:
Calculate the supplementary tin cream amount of welding disking area corresponding to the not enough components and parts to be welded of tin cream amount；
According to the described supplementary tin cream amount calculated, and the tin cream amount that described spraying tin cream machine sprays every time,
Determine that described spraying tin cream machine sprays tin cream at the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding
Spraying number of times；
Described employing sprays the tin cream machine spraying method with piezoelectric type and tin cream is sprayed at not enough the treating of tin cream amount
The step of the welding disking area that welding component is corresponding includes:
Use described spraying tin cream machine with the spraying method of piezoelectric type, at the unit to be welded device that tin cream amount is not enough
The tin cream of number of times is sprayed described in the welding disking area even application that part is corresponding.
The welding method of the printed circuit board (PCB) that the present invention proposes, is carrying out printing welding to printed circuit board (PCB)
In operation, first use steel mesh that the welding disking area that each components and parts to be welded of printed circuit board (PCB) are corresponding is carried out
First upper stannum processes, and then the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding is carried out secondary
Add stannum to process, so that the tin cream of welding disking area corresponding to each components and parts to be welded of printed circuit board (PCB)
Amount is satisfied by welding requirements, carries out paster, reflow process the most again, it is to avoid rosin joint, short circuit etc. are asked
Topic, improves the reliability of printed circuit board (PCB) welding.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the welding method first embodiment of printed circuit board (PCB) of the present invention；
Fig. 2 is the schematic flow sheet of welding method second embodiment of printed circuit board (PCB) of the present invention；
Fig. 3 be printed circuit board (PCB) of the present invention welding method the second embodiment in block tin is mounted on shielded rack
The welding effect schematic diagram of the diverse location of corresponding welding disking area；
Fig. 4 is the schematic flow sheet of welding method the 3rd embodiment of printed circuit board (PCB) of the present invention；
Fig. 5 is the structural representation of spraying tin cream machine；
Fig. 6 is the process chart of welding method the 3rd embodiment of printed circuit board (PCB) of the present invention.
Detailed description of the invention
Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not used to limit
Determine the present invention.
The present invention provides the welding method of a kind of printed circuit board (PCB).It is that the present invention prints electricity with reference to Fig. 1, Fig. 1
The schematic flow sheet of the welding method first embodiment of road plate.In the present embodiment, described printed circuit board (PCB)
Welding method comprise the following steps:
Step S10, uses steel mesh to enter the welding disking area that each components and parts to be welded of printed circuit board (PCB) are corresponding
The first upper stannum of row processes；
In the present embodiment, when pcb board (Printed circuit board, printed circuit board (PCB)) is printed
During brush, this pcb board is carried out upper plate by upper trigger by the first step, is then used corresponding by printer
Steel mesh carries out steel mesh printing operation to pcb board.Specifically, due to each components and parts to be welded of pcb board
Including accurate device and the structure class device such as the shielded rack of large-size, deck of reduced size, in order to complete
Become the welding operation of each components and parts to be welded of pcb board, initially with relatively thin steel mesh to pcb board
The welding disking area that each components and parts to be welded are corresponding carries out going up stannum for the first time and processes, and alternatively, steel mesh is thickness
Uniform non-ladder steel mesh, the thickness of steel mesh is 0.08-0.1mm.Such as, use a size of
3mm*0.8mm*0.08mm steel mesh the welding disking area that the components and parts to be welded of pcb board are corresponding is carried out
First upper stannum processes, and on the welding disking area that components and parts the most to be welded are corresponding, the tin cream amount of stannum is
3*0.8*0.08=0.192mm3.Wherein, 3mm represents steel mesh opening length, and 0.8mm represents steel mesh opening
Width, 0.08mm represents steel mesh thickness.
Step S20, carries out secondary to the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding and adds Xi Chu
Reason；
Owing to each components and parts to be welded of pcb board include the accurate device of reduced size and large-size
The structure class device such as shielded rack, deck, when by using relatively thin steel mesh to be welded to each of pcb board
After the welding disking area that components and parts are corresponding carries out going up stannum process for the first time, now, the tin cream amount of stannum on welding disking area
The welding requirements of the accurate device of reduced size can only be met, for shielded rack, the card of large-size
The welding disking area that the structure class devices such as seat are corresponding, the tin cream amount of first upper stannum is the most not enough, therefore, is directed to
The welding disking area that components and parts to be welded that tin cream amount is not enough are corresponding, carries out secondary and adds stannum and process, so that relatively
The tin cream amount that the welding disking area that the structure class devices such as large-sized shielded rack, deck are corresponding finally goes up stannum is also full
Foot welding requirements.Such as, if when welding disking area corresponding to a certain shielded rack is after stannum on first, should
The tin cream amount that welding disking area is corresponding also lacks 0.168mm3, then carry out secondary at this welding disking area and add stannum process,
Add 0.168mm3Tin cream amount so that altogether go up the stannum of stannum at the welding disking area that this shielded rack is corresponding
Cream amount meets the requirement welding this shielded rack.
Each components and parts to be welded of described printed circuit board (PCB) are carried out paster process by step S30；
Add stannum process when the welding disking area that the components and parts to be welded not enough to tin cream amount are corresponding carries out secondary, make
After the tin cream amount of welding disking area corresponding to each components and parts to be welded of pcb board has been satisfied by welding requirements,
Each components and parts to be welded of pcb board are carried out paster process, namely each unit to be welded at pcb board
The components and parts to be welded of the welding disking area attachment correspondence that device is corresponding.
Step S40, carries out reflow process to the printed circuit board (PCB) after paster, to complete printed circuit board (PCB)
The welding of each unit to be welded device.
After the paster completing pcb board processes, the pcb board after paster is carried out reflow process.Such as,
Pcb board after paster is put in reflow ovens, by reflow ovens each components and parts to be welded to pcb board
On corresponding welding disking area, the tin cream of stannum melts, it is achieved each unit to be welded device of attachment on pcb board
Part and the electrical connection of pad, thus complete the welding of each unit to be welded device of attachment on pcb board.
Complete on pcb board after the welding of each unit to be welded device of attachment, tentatively printing of pcb board
Become.Next this pcb board is carried out AOI detection (Automatic Optic Inspection, automated optical
Detection), AOI detection is that the common deficiency that pcb board is occurred in welding production by optically-based principle is carried out
Detection.Such as, use AOI test equipment automatically to scan this pcb board and gather image, then will test
Solder joint compare with the qualified parameter in data base, through image procossing, check this pcb board
Whether there is weld defect, namely it is the most qualified to detect the printing of this pcb board.When checking that this pcb board is deposited
When weld defect, by display or Automatic Logos, defect is shown/marks, thus for maintenance people
This pcb board is repaired by member.
The scheme that the present embodiment provides, during pcb board carries out printing welding, first uses steel mesh
The welding disking area that each components and parts to be welded of pcb board are corresponding carries out go up stannum for the first time process, then to stannum
The welding disking area that components and parts to be welded that cream amount is not enough are corresponding carries out secondary and adds stannum and process, so that PCB
The tin cream amount of the welding disking area that each components and parts to be welded of plate are corresponding is satisfied by welding requirements, thus avoids
The problem such as rosin joint, short circuit, improves the reliability of pcb board welding.
Further, as in figure 2 it is shown, propose welding method second embodiment of printed circuit board (PCB) of the present invention.
Welding method second embodiment of printed circuit board (PCB) and the district of the welding method first embodiment of printed circuit board (PCB)
Not being, in welding method second embodiment of printed circuit board (PCB), described step S20 includes:
Step S21, at the welding disking area attachment molding block tin that the components and parts to be welded that tin cream amount is not enough are corresponding,
Wherein, the specification of described molding block tin is adaptive with the supplementary tin cream amount of described welding disking area.
In the present embodiment, deposit has the molding block tin of all size, the moulding moulded stannum of such as 0402H in advance
Block, the moulding moulded block tin of 0402H is the molding block tin of 1mm*0.6mm*0.25mm specification, and thickness is
0.25mm.It is directed to the welding disking area that the not enough components and parts to be welded of tin cream amount are corresponding, adds carrying out secondary
When stannum processes, mount the one-tenth of adaptive specification at the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding
Type block tin.The composition of the molding block tin of attachment keeps consistent with the composition of the tin cream that first upper stannum processes.
Such as, if when welding disking area corresponding to a certain shielded rack is after stannum on first, this welding disking area
Corresponding tin cream amount also lacks 0.168mm3, then at the molding block tin of the adaptive specification of this welding disking area attachment.
Owing to the moulding moulded block tin of 0402H is 1mm*0.6mm*0.25mm=0.15mm3, with this welding disking area pair
The 0.168mm that should lack3Tin cream amount is relatively consistent, therefore, it can mount 0402H at this welding disking area
Moulding moulded block tin.So that the welding disking area that this shielded rack is corresponding altogether go up stannum tin cream amount meet
Weld the requirement of this shielded rack.
Further, in this enforcement, before described step S21, also include:
Step a, calculates the supplementary tin cream amount of welding disking area corresponding to the not enough components and parts to be welded of tin cream amount；
Step b, according to the described supplementary tin cream amount calculated, determines the one-tenth fitting in the attachment of described welding disking area
The specification of type block tin.
In the present embodiment, the welding disking area attachment corresponding for the to be welded components and parts not enough in tin cream amount is suitable
Join the molding block tin of specification it may first have to according to the size of pad and the size of the steel mesh of employing, calculate
The supplementary tin cream amount of the welding disking area that components and parts to be welded that tin cream amount is not enough are corresponding.
Such as, when pad size is 3mm*0.8mm*0.08mm, by using the steel mesh of each middle size
Test, such as use 3mm*0.8mm*0.08mm, 3mm*1.2mm*0.08mm,
The steel mesh of 3mm*0.8mm*0.1mm, 3mm*1.2mm*0.1mm is tested, and contrasts welding effect,
Experimental result is as shown in table 1:
Table 1
By experimental result, when pad size is 3mm*0.8mm*0.08mm, use
The welding effect of the steel mesh of 3mm*1.2mm*0.1mm size is best.When using 3mm*1.2mm*0.1mm
When the steel mesh of size carries out going up stannum for the first time, calculate the pad that the not enough components and parts to be welded of tin cream amount are corresponding
The supplementary tin cream amount in region is 3mm*1.2mm*0.1mm-3mm*0.8mm*0.08mm=0.168mm3。
After the supplementary tin cream amount calculating welding disking area corresponding to the not enough components and parts to be welded of tin cream amount,
The molding block tin of reselection adaptation specification is mounted on the pad area that the not enough components and parts to be welded of tin cream amount are corresponding
Territory.Such as, if calculating supplementary tin cream amount is 0.168mm3, then 0402H can be mounted at this welding disking area
Moulding moulded block tin.So that altogether go up the tin cream amount of stannum at this welding disking area to meet welding requirements.
Further, described step S21 includes:
On the marginal position of welding disking area corresponding to the components and parts to be welded that tin cream amount is not enough, attachment adaptation rule
The molding block tin of lattice.
The molding block tin of adaptive specification is mounted at the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding
Time, optional position molding block tin can being mounted in welding disking area, but the position of attachment is to welding
Effect can have a certain impact.By the diverse location that molding block tin is mounted in welding disking area, carry out
Contrast experiment, show that welding effect is optimal when molding block tin is mounted on the marginal position of welding disking area.
Such as, as it is shown on figure 3, by the molding block tin of same specification is mounted on the pad area that shielded rack is corresponding
The diverse locations such as edge right side area in territory, zone line are tested, and draw when molding block tin mounts
During marginal position in the welding disking area that shielded rack is corresponding, do not do with shielded rack after attachment shielded rack
Relating to, welding is good, and upper stannum is uniform；In molding block tin is mounted in the welding disking area that shielded rack is corresponding
Between position time, all interfere with shielded rack after attachment shielded rack, although also welding is good, and upper stannum is more equal
Even, but shielded rack tilts；And when molding block tin is mounted on the interposition in the welding disking area that shielded rack is corresponding
Put, and during by its 90-degree rotation, all interfere with shielded rack after attachment shielded rack, although also weld good
Good, upper stannum is more uniform, but shielded rack tilts；It follows that it is corresponding that molding block tin is mounted on shielded rack
Welding disking area in marginal position time, welding effect is optimal.Therefore, in the present embodiment, in tin cream amount
The marginal position of the welding disking area that not enough components and parts to be welded are corresponding, the molding block tin of the adaptive specification of attachment.
The scheme that the present embodiment proposes, for the welding disking area that the components and parts to be welded of tin cream amount deficiency are corresponding,
At the molding block tin of the adaptive specification of this welding disking area attachment, so that the pad that components and parts to be welded are corresponding
The tin cream amount in region meets welding requirements, owing to mounting the simple and quick of molding block tin, thus improves
The efficiency of welding.
Further, as shown in Figure 4, welding method the 3rd embodiment of printed circuit board (PCB) of the present invention is proposed.
Welding method the 3rd embodiment of printed circuit board (PCB) and the district of the welding method first embodiment of printed circuit board (PCB)
Not being, in welding method the 3rd embodiment of printed circuit board (PCB), described step S20 includes:
Step S22, at the welding disking area spraying tin cream that the components and parts to be welded that tin cream amount is not enough are corresponding, wherein,
The tin cream amount of spraying is corresponding consistent with the supplementary tin cream amount of described welding disking area.
In the present embodiment, it is directed to the welding disking area that the not enough components and parts to be welded of tin cream amount are corresponding, is entering
When row secondary adds stannum process, the welding disking area spraying corresponding at the components and parts to be welded that tin cream amount is not enough is appropriate
Tin cream, the tin cream amount of spraying is corresponding consistent with the supplementary tin cream amount of this welding disking area.The tin cream of spraying
Composition keeps consistent with the composition of the tin cream that first upper stannum processes.
Further, in the present embodiment, use spraying tin cream machine with the spraying method of piezoelectric type by appropriate
Tin cream be sprayed at the welding disking area that the not enough components and parts to be welded of tin cream amount are corresponding.As it is shown in figure 5, spray
It is coated with tin cream machine and includes Mini-type spiral pump, airtight cavity and piezo-electric generator, adding in spraying tin cream machine
During tin cream, by this Mini-type spiral pump, tin cream is imported in airtight cavity.When using spraying tin cream machine spraying
During tin cream, by piezo-electric generator with the spraying method of piezoelectric type, wherein, the spraying method of piezoelectric type is adopted
With the higher-order of oscillation, the highest per second up to 500 times, appropriate tin cream is sprayed at the to be welded of tin cream amount deficiency
Connect the welding disking area that components and parts are corresponding.
Further, in the present embodiment, before described step S22, also include:
Step c, calculates the supplementary tin cream amount of welding disking area corresponding to the not enough components and parts to be welded of tin cream amount；
Step d, according to the described supplementary tin cream amount calculated, and the stannum that described spraying tin cream machine sprays every time
Cream amount, determines that described spraying tin cream machine sprays at the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding
It is coated with the spraying number of times of tin cream.
Described step S22 includes: use described spraying tin cream machine with the spraying method of piezoelectric type, at tin cream
Measure the tin cream spraying number of times described in the welding disking area even application that not enough components and parts to be welded are corresponding.
In the present embodiment, the welding disking area spraying corresponding for the to be welded components and parts not enough in tin cream amount is suitable
The tin cream of amount it may first have to according to the size of pad and the size of the steel mesh of employing, calculate tin cream amount not
The supplementary tin cream amount of the welding disking area that sufficient components and parts to be welded are corresponding.Then according to the supplementary stannum calculated
Cream amount, and the tin cream amount that spraying tin cream machine sprays every time, determine that spraying tin cream machine is in tin cream amount deficiency
The spraying number of times of the welding disking area spraying tin cream that components and parts to be welded are corresponding.
Such as, the supplementary tin cream amount gone out when timing is 0.168mm3, and spray the stannum that tin cream machine sprays every time
Cream amount is 0.5mm*0.5mm*0.2mm=0.05mm3, then spraying tin cream machine sprays 3 times or 4 times tin creams
The supplementary tin cream amount of the welding disking area that tin cream amount is corresponding with the components and parts to be welded of tin cream amount deficiency is close to consistent.
Accordingly, it can be determined that spraying tin cream machine sprays at the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding
The spraying number of times of tin cream is 3-4 time.
Spray at the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding when determining spraying tin cream machine
After the spraying number of times of tin cream, use the spraying method spraying tin cream machine with piezoelectric type, in tin cream amount deficiency
The tin cream of the spraying number of times that the welding disking area even application that components and parts to be welded are corresponding determines.Such as, upper
State in row illustrated example, determine that spraying tin cream machine is at pad corresponding to the components and parts to be welded that tin cream amount is not enough
When the spraying number of times of region spraying tin cream is 3-4 time, then use the spraying method spraying tin cream machine with piezoelectric type,
Tin cream welding disking area even application corresponding to the components and parts to be welded that tin cream amount is not enough 3-4 time.Can manage
Solving, the spraying tin cream that every time sprays of tin cream machine is a tin cream point, then when use spraying tin cream machine with
The spraying method of piezoelectric type, at the welding disking area even application that the components and parts to be welded that tin cream amount is not enough are corresponding
During the tin cream of 3-4 time, 3-4 the tin cream point at this welding disking area even application.Sprayed by spraying tin cream machine
It is coated with after tin cream so that the tin cream amount of the welding disking area that each components and parts to be welded of pcb board are corresponding is the fullest
Foot welding requirements, carries out paster, Reflow Soldering etc. afterwards and processes.As shown in Figure 6, by spraying tin cream
After machine spraying tin cream, then by chip mounter, each components and parts to be welded of PBC plate are carried out paster process,
At the components and parts to be welded that the welding disking area attachment that each components and parts to be welded of pcb board are corresponding is corresponding.?
After paster has processed, then pass through the pad area that reflow ovens is corresponding to each components and parts to be welded of pcb board
On territory, the tin cream of stannum melts, it is achieved each components and parts to be welded mounted on pcb board and the electricity of pad
Gas connects, thus completes the welding of each unit to be welded device of attachment on pcb board.Next to this PCB
Plate carries out AOI detection, detects the printing of this pcb board the most qualified.Owing to each of pcb board is to be welded
The tin cream amount of the welding disking area that components and parts are corresponding has been satisfied by welding requirements, therefore reached upper stannum uniformly,
Weld good effect.
The scheme that the present embodiment proposes, for the welding disking area that the components and parts to be welded of tin cream amount deficiency are corresponding,
Use spraying tin cream machine with the spraying method of piezoelectric type, spray appropriate tin cream at this welding disking area,
So that the tin cream amount of welding disking area corresponding to components and parts to be welded meets welding requirements, due to spraying stannum
Cream machine spraying tin cream is uniform, it is achieved upper stannum is uniform, weld good effect, thus further increases weldering
The reliability connect.
It should be noted that in this article, term " include ", " comprising " or its any other variant
Be intended to comprising of nonexcludability so that include the process of a series of key element, method, article or
Person's device not only includes those key elements, but also includes other key elements being not expressly set out, or also
Including the key element intrinsic for this process, method, article or device.In the feelings not having more restriction
Under condition, statement " including ... " key element limited, it is not excluded that include this key element process,
Method, article or device there is also other identical element.
The invention described above embodiment sequence number, just to describing, does not represent the quality of embodiment.
These are only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every
Utilize equivalent structure or equivalence flow process conversion that description of the invention and accompanying drawing content made, or directly or
Connect and be used in other relevant technical fields, be the most in like manner included in the scope of patent protection of the present invention.
Claims (10)
1. the welding method of a printed circuit board (PCB), it is characterised in that the welding side of described printed circuit board (PCB)
Method comprises the following steps:
Steel mesh is used the welding disking area that each components and parts to be welded of printed circuit board (PCB) are corresponding to be carried out on first
Stannum processes；
The welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding is carried out secondary and adds stannum process；
Each components and parts to be welded of described printed circuit board (PCB) are carried out paster process；
Printed circuit board (PCB) after paster is carried out reflow process, to be welded to complete each of printed circuit board (PCB)
Connect the welding of unit's device.
2. the welding method of printed circuit board (PCB) as claimed in claim 1, it is characterised in that described steel mesh
For steel mesh in uniform thickness, the thickness of described steel mesh is 0.08-0.1mm.
3. the welding method of printed circuit board (PCB) as claimed in claim 1, it is characterised in that described to stannum
The welding disking area that components and parts to be welded that cream amount is not enough are corresponding carries out secondary and adds the step that stannum processes and include:
At the welding disking area attachment molding block tin that the components and parts to be welded that tin cream amount is not enough are corresponding, wherein, institute
The specification stating molding block tin is adaptive with the supplementary tin cream amount of described welding disking area.
4. the welding method of printed circuit board (PCB) as claimed in claim 3, it is characterised in that described molding
The composition of block tin is consistent with the composition of the tin cream that first upper stannum processes.
5. the welding method of printed circuit board (PCB) as claimed in claim 3, it is characterised in that described at stannum
Before the step of the welding disking area attachment molding block tin that components and parts to be welded that cream amount is not enough are corresponding, also include:
Calculate the supplementary tin cream amount of welding disking area corresponding to the not enough components and parts to be welded of tin cream amount；
According to the described supplementary tin cream amount calculated, determine the molding block tin fitting in the attachment of described welding disking area
Specification.
6. the welding method of the printed circuit board (PCB) as described in any one of claim 3-5, it is characterised in that
The step of the welding disking area attachment molding block tin that the described to be welded components and parts not enough in tin cream amount are corresponding includes:
Marginal position attachment molding block tin at welding disking area corresponding to the components and parts to be welded that tin cream amount is not enough.
7. the welding method of printed circuit board (PCB) as claimed in claim 1, it is characterised in that described to stannum
The welding disking area that components and parts to be welded that cream amount is not enough are corresponding carries out secondary and adds the step that stannum processes and include:
At the welding disking area spraying tin cream that the components and parts to be welded that tin cream amount is not enough are corresponding, wherein, spraying
Tin cream amount is corresponding consistent with the supplementary tin cream amount of described welding disking area.
8. the welding method of printed circuit board (PCB) as claimed in claim 7, it is characterised in that described at stannum
The step of the welding disking area spraying tin cream that components and parts to be welded that cream amount is not enough are corresponding includes:
Employing sprays the tin cream machine spraying method with piezoelectric type and tin cream is sprayed at the to be welded of tin cream amount deficiency
The welding disking area that components and parts are corresponding.
9. the welding method of printed circuit board (PCB) as claimed in claim 8, it is characterised in that described spraying
Tin cream machine includes Mini-type spiral pump and airtight cavity, when adding tin cream in described spraying tin cream machine, described
Tin cream is imported in described airtight cavity by Mini-type spiral pump.
10. the welding method of printed circuit board (PCB) as claimed in claim 8, it is characterised in that described in adopt
With spraying the tin cream machine spraying method with piezoelectric type, appropriate tin cream is sprayed at the to be welded of tin cream amount deficiency
Before the step of the welding disking area that components and parts are corresponding, also include:
Calculate the supplementary tin cream amount of welding disking area corresponding to the not enough components and parts to be welded of tin cream amount；
According to the described supplementary tin cream amount calculated, and the tin cream amount that described spraying tin cream machine sprays every time,
Determine that described spraying tin cream machine sprays tin cream at the welding disking area that the components and parts to be welded that tin cream amount is not enough are corresponding
Spraying number of times；
Described employing sprays the tin cream machine spraying method with piezoelectric type and tin cream is sprayed at not enough the treating of tin cream amount
The step of the welding disking area that welding component is corresponding includes:
Use described spraying tin cream machine with the spraying method of piezoelectric type, at the unit to be welded device that tin cream amount is not enough
The tin cream of number of times is sprayed described in the welding disking area even application that part is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610443281.7A CN105979719A (en) | 2016-06-20 | 2016-06-20 | Welding method for printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610443281.7A CN105979719A (en) | 2016-06-20 | 2016-06-20 | Welding method for printed circuit board |
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| CN201610443281.7A Pending CN105979719A (en) | 2016-06-20 | 2016-06-20 | Welding method for printed circuit board |
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| CN108012415A (en) * | 2017-11-17 | 2018-05-08 | 新华三技术有限公司 | Surface Mount pad structure, printed circuit board and its preparation process |
| CN108289389A (en) * | 2018-01-11 | 2018-07-17 | 郑州云海信息技术有限公司 | It is a kind of based on automatic chip mounting add block tin Through-hole reflow connect |
| CN110277025A (en) * | 2019-06-28 | 2019-09-24 | 云谷（固安）科技有限公司 | A kind of display device and preparation method thereof |
| CN110418518A (en) * | 2019-07-18 | 2019-11-05 | 烟台台芯电子科技有限公司 | A kind of process improving IGBT module terminal weld strength |
| CN111417269A (en) * | 2020-04-08 | 2020-07-14 | 中山市睿科智能电子有限公司 | Printed circuit board paster processing technology |
| CN111975151A (en) * | 2020-07-29 | 2020-11-24 | 苏州浪潮智能科技有限公司 | Backboard through hole welding method based on gold needle |
| CN114603225A (en) * | 2022-02-10 | 2022-06-10 | 福莱盈电子股份有限公司 | Tin soldering process for increasing preformed tin blocks |
| WO2023039786A1 (en) * | 2021-09-16 | 2023-03-23 | 京东方科技集团股份有限公司 | Array substrate, detection method therefor, and light-emitting apparatus |
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| CN107889374A (en) * | 2017-11-14 | 2018-04-06 | 北京计算机技术及应用研究所 | A kind of compensation reflow soldering method of the solder of via devices |
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| CN108289389A (en) * | 2018-01-11 | 2018-07-17 | 郑州云海信息技术有限公司 | It is a kind of based on automatic chip mounting add block tin Through-hole reflow connect |
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| CN111975151A (en) * | 2020-07-29 | 2020-11-24 | 苏州浪潮智能科技有限公司 | Backboard through hole welding method based on gold needle |
| WO2023039786A1 (en) * | 2021-09-16 | 2023-03-23 | 京东方科技集团股份有限公司 | Array substrate, detection method therefor, and light-emitting apparatus |
| CN114603225A (en) * | 2022-02-10 | 2022-06-10 | 福莱盈电子股份有限公司 | Tin soldering process for increasing preformed tin blocks |
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Application publication date: 20160928 |