CN101106899A - Component mounting position correcting method and component mouting apparatus - Google Patents
Component mounting position correcting method and component mouting apparatus Download PDFInfo
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- CN101106899A CN101106899A CNA2007101363055A CN200710136305A CN101106899A CN 101106899 A CN101106899 A CN 101106899A CN A2007101363055 A CNA2007101363055 A CN A2007101363055A CN 200710136305 A CN200710136305 A CN 200710136305A CN 101106899 A CN101106899 A CN 101106899A
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Abstract
A component mounting position is corrected in accordance with a printing misalignment amount of a solder with respect to an original mounting position on a board at which a component is to be mounted. More specifically, a mounting position of a predetermined correction object component is corrected in accordance with the printing misalignment amount of the solder printed on a predetermined detection object electrode.
Description
Technical field
The present invention relates to a kind of component mounting position correcting method and apparatus for mounting component, be particularly related to a kind of component mounting position correcting method and a kind of apparatus for mounting component that adopts this component mounting position correcting method, this component mounting position correcting method is suitable for using when by apparatus for mounting component electronic unit (abbreviating parts as) being installed on substrate, departure between the component mounting position on its detection substrate and the printing position of scolding tin, with this departure loading position of correcting unit accordingly, can be accurately with component mounting on substrate.
Background technology
Known a kind of apparatus for mounting component (being also referred to as component mounter) that is used for boarded parts on substrate.
In patent documentation 1, put down in writing following technology, it is in this apparatus for mounting component, for parts are carried accurately on substrate, as carrying preparation before in the printed base plate feeder, printed base plate is fixed in the lift-launch enforcement portion, identification is printed on the reference mark on the substrate, and the position deviation of printed base plate is proofreaied and correct.
In addition, in patent documentation 2, put down in writing following technology, it utilizes the solder printing inspection machine, detection is printed on the printing position of the paste scolding tin of at least 3 positions on the printed base plate, with and predefined position between departure corresponding, the position that is arranged on the mask in the solder printing machine is proofreaied and correct.
In addition, in patent documentation 3 to 5, put down in writing following technology, its for the position that is printed on the scolding tin on this substrate with respect to the departure of the loading position of substrate upper-part and to proofreading and correct the component mounting position, utilize camera head identification to be printed on the position of the scolding tin on the electrode, calculate the departure of scolding tin, and the coordinate of representing the component mounting position is implemented to proofread and correct with respect to substrate.
Patent documentation 1: the spy opens flat 5-267899 communique
Patent documentation 2: specially permit communique No. 3071569
Patent documentation 3: the spy opens the 2002-271096 communique
Patent documentation 4: the spy opens the 2003-92496 communique
Patent documentation 5: specially permit communique No. 3656533
Summary of the invention
But, since patent documentation 1 with the lift-launch enforcement portion that printed base plate is fixed on apparatus for mounting component on the time the relevant technology of deviations in, do not have to consider to be printed on the position deviation of the scolding tin on the substrate, therefore the problem about the solder printing deviation carries over.
In addition, the technology of patent documentation 2 only detects the printing deviation of scolding tin, does not consider the correction of loading position.
In addition, in patent documentation 3 to 5, owing to read in and the image of all electrodes of the solder printing pattern of loading position is discerned, therefore, exist what is called to be used in the elongated problem of productive temp of correction owing to carry quantity or number of electrodes expends recognition time by camera head.
In addition, in disposing the multiaspect installation base plate of a plurality of identical integrated circuits, sometimes be judged as a part of circuit when defective, then do not carry out the component mounting of particular electrical circuit, under the situation of using this function,, each circuit is carried out the identification of position deviation respectively owing to need be that unit produces with the circuit, therefore owing to circuit quantity expends recognition time, there is the so-called elongated problem of productive temp that is used in correction.
The present invention is in order to eliminate described existing problem, efficiently the component mounting position proofreaied and correct as problem with the short time.
The present invention with substrate on the component mounting position and be printed on corresponding to the departure between the solder printing position on the electrode of these parts corresponding, and the loading position of parts is carried out timing, corresponding with the solder printing position deviation amount of detected object electrode, and the loading position of calibration object parts is proofreaied and correct, thereby solve described problem to infer departure.As the coordinate of boarded parts, login is in the lift-launch program in advance in the component mounting position.
Can set the combination of a plurality of described detected object electrodes and calibration object parts on substrate, these calibration object parts are corresponding with this solder printing position deviation amount and carry out mounting position correcting.
In addition, in disposing the multiaspect installation base plate of a plurality of integrated circuits, can use shared solder printing position deviation result to proofread and correct to a plurality of integrated circuits.
The present invention also provides a kind of apparatus for mounting component, and it is used for component mounting it is characterized in that having at substrate: the image unit that the scolding tin on the parts electrode that is printed on substrate is taken; The unit that departure between the printing position of the scolding tin of component mounting position on the substrate and described shooting is discerned; And corresponding with the printing position departure of described scolding tin, and to infer the unit that departure is proofreaied and correct the loading position of the calibration object parts of regulation.
In addition, can have the unit that makes up between a plurality of described detected object electrodes and the calibration object parts setting on the substrate, these calibration object parts are corresponding with this solder printing position deviation amount and carry out mounting position correcting.
In addition, can have in disposing the multiaspect installation base plate of a plurality of integrated circuits the unit that uses shared solder printing position deviation result to proofread and correct to a plurality of integrated circuits.
The effect of invention
According to the present invention, owing to be not as the technology of patent documentation 3 to 5, all scolding tin position deviations are discerned and proofreaied and correct, but only the solder printing position deviation amount of predefined detected object electrode is discerned, therefore can shorten the detection time of solder printing position deviation amount.In addition, owing to be not corresponding with the solder printing position deviation amount of detected object electrode, loading position to all parts is proofreaied and correct, but only the loading position of the calibration object parts in the predefined scope is proofreaied and correct, therefore can be with respect to the solder printing position deviation and boarded parts accurately.
For example, because light parts are when refluxing scolding tin, parts can be because surface tension and flow to the loading position of standard with scolding tin, therefore preferably cooperate with the printing position departure of scolding tin and the loading position of parts is proofreaied and correct, on the other hand, because heavy parts can not flow with scolding tin, therefore not to carry out the correction corresponding with the printing position departure of scolding tin, but be target and boarded parts preferably with original parts electrode position, according to the present invention, can select whether to use corresponding corrections such as weight this and parts neatly.
Especially, described detected object electrode and corresponding with this solder printing position deviation amount and carry out the combination of the calibration object parts of mounting position correcting, can set under a plurality of situations on the substrate, can carry out the solder printing position deviation corresponding and proofread and correct lift-launch with the flexible difference that causes by the position of substrate.
In addition,, judge that solder printing is bad, therefore do not need expensive solder checker because apparatus for mounting component can utilize the camera head of self to detect solder printing position deviation amount.
In addition, owing to have under the situation of a plurality of integrated circuits, also can shared identical solder printing position deviation recognition result, therefore need not the solder printing position deviation amount of each circuit is discerned, can shorten the detection time of solder printing position deviation amount.In addition, because scolding tin uses the flexible little screen mask printing than printed base plate, therefore even be not the printing position deviation of identified in units scolding tin with the circuit, as long as 1 assembly welding tin printing position departure of substrate is discerned, correction position deviation accurately just.
Description of drawings
Fig. 1 is that expression will use the overall structure of electronic components mounting machine of the present invention to cut the oblique view of a part.
Fig. 2 is the vertical view of example of the process object substrate of expression the 1st execution mode of the present invention.
Fig. 3 is the details drawing of the example of this parts electrode of expression and scolding tin image.
Fig. 4 is the flow chart of the treatment process of expression the 1st execution mode.
Fig. 5 is the process object of expression the 2nd execution mode of the present invention, promptly disposes the vertical view of example of the multiaspect installation base plate of a plurality of integrated circuits.
Fig. 6 is the flow chart of the treatment process of expression the 2nd execution mode.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are elaborated.
Shown in Fig. 1 as the skeleton diagram of the electronic components mounting machine of applicable object of the present invention.This electronic components mounting machine 10 has: parts supply unit 20, and it is configured in front portion (the lower-left side of picture); Substrate transport unit 30, its transmission are used for the substrate 32 of boarded parts 22, its central portion after a while the side from upper left to the lower right to extension; And XY moves forward into to portion 40, and it is made of X-axis stand 40X and Y-axis stand 40Y, and they are configured in the front portion of electronic components mounting machine 10 with can move freely.
On described parts supply unit 20, arrange a plurality of belt transport mechanisms 24, wherein contain a large amount of parts 22.
On described XY moves forward into to portion 40, carry suction head 42 in the mode that (Z-direction) along the vertical direction moves freely with adsorption nozzle 44, this adsorption nozzle 44 is used for from parts supply unit 20 adsorption elements 22, and parts 22 are installed on the substrate 32.
Mounted board identification video camera 50 and its lighting device 52 on this suction head 42, they are installed on its support component, are used for from top shooting substrate 32.In addition, near the position the parts supply unit 20 for example, component identification video camera 60 and its lighting device 62 are set, they are used for taking from the below parts that are adsorbed nozzle 44 absorption.
In addition, on described suction head 42 laser cell 46 is set, it is used to detect having or not and shape of the parts that are adsorbed nozzle 44 absorption.
In addition, the performance monitor 70 of described electronic components mounting machine 10 is configured in the upper portion of this electronic components mounting machine 10.
In addition, control part 72 is configured in the following quadrate part of electronic components mounting machine 10, and its image that described substrate identification video camera 50, component identification video camera 60 are taken carries out calculation process, then the component mounting position is proofreaied and correct.
The following describes in electronic components mounting machine 10, utilize the 1st execution mode of the present invention, when substrate orientation, discern the solder printing position of a plurality of parts electrodes, detect the printing position of scolding tin and the departure between the component mounting position, and the operation that loading position is proofreaied and correct.
The detected object electrode position of solder printing position deviation amount is by indicating operation in advance or setting in the lift-launch program as carrying the coordinate login in advance.For example, as shown in Figure 2, on the substrate 32 that is printed with under the state of scolding tin, parts electrode 34-1,34-2 are set at the detected object electrode of printing position departure.In addition, simultaneously will be corresponding and carry out the pairing electrode of calibration object parts of mounting position correcting with the departure of the arithmetic mean value of its departure or each position and the ratio between the distance, for example be set at electrode 36-1,36-2,36-3,34-1,34-2.Similarly, parts electrode 34-3,34-4 are set at printing deviation detected object electrode, will be corresponding and the pairing electrode of calibration object parts that carries out mounting position correcting is set at electrode 36-4,34-3,34-4 with the departure of the arithmetic mean value of its departure or each position and the ratio between the distance.
Set the electrode of detected object electrode and calibration object parts as above-mentioned mode, if begin to produce substrate 32, then before fitting machine 10 boarded parts 22, make substrate identification video camera 50 move the departure of identification solder printing to predefined detected object electrode position.With this scolding tin departure (Δ x, Δ y) correspondence, the loading position (coordinate) of predefined parts is proofreaied and correct, carry each parts.Can make scolding tin departure (Δ x, Δ y) as shown in Figure 3, become departure between the point midway B of the component mounting position A (being equivalent to the electrode point midway of 1 pair of parts electrode 34 in the design) that should carry originally and the 1 pair of scolding tin 38 corresponding with this component mounting position A.At this moment, the position of each scolding tin 38 can be for example position of centre of gravity of each scolding tin 38.In addition, also can detect the edge of each scolding tin 38, and obtain the center of each scolding tin 38.
According to the correcting value that the scolding tin departure between the point midway B of component mounting position A that should carry and 1 pair of scolding tin 38 is obtained, it is corresponding with predefined coefficient k and calculate.For example, during k=0.5,, make the departure (Δ x, Δ y) of scolding tin become 0.5 times, and proofread and correct with respect to current loading position.In addition, coefficient k can be set arbitrarily.
In addition, under the situation of setting a plurality of (group) detected object electrode, can be with its arithmetic mean value as departure.In the example of Fig. 2, for example can be according to the arithmetic mean value of the solder printing position deviation amount of detected object electrode 34-1 and 34-2, proofread and correct electrode 36-1～3, detected object electrode 34-1 and the pairing component mounting of 34-2 position to the calibration object parts, can electrode 36-4, detected object electrode 34-3 and the pairing component mounting of the 34-4 position of calibration object parts be proofreaied and correct according to the arithmetic mean value of the scolding tin position deviation amount of detected object electrode 34-3 and 34-4.
In addition, the residual quantity between the printing position coordinate of above-mentioned component mounting position coordinates that should carry and scolding tin contrasts predefined feasible value, surpassing under the situation of this feasible value, boarded parts is not exported the alarm relative with printing deviation, can prevent underproof lift-launch in advance.
Treatment process when the detected object electrode that Fig. 4 represents to detect solder printing position deviation amount is 2 positions.
At first, in step 100, send into substrate.Then, in step 110, substrate identification video camera 50 is moved to predefined the 1st component mounting position (point midway of detected object electrode), in step 120, import its image, in step 130, the point midway of the solder printing position of 1 pair of scolding tin 38 in the calculating chart 3.
Then, in step 140, substrate identification video camera 50 is moved to the 2nd component mounting position (point midway of detected object electrode), input picture in step 150 calculates the point midway of solder printing position in step 160.
Subsequently, in step 170, calculate the scolding tin departure n between each point midway of 2 locational component mounting positions (point midway of detected object electrode) and solder printing position.Then, in step 180, judge whether each scolding tin departure n is less than or equal to feasible value m.Under judged result is situation greater than feasible value, in step 200, exports alarm, and finish.
On the other hand, in step 180, be judged as scolding tin departure n when being less than or equal to feasible value m, in step 210, judge whether that all login positions are all over.
Under the situation about not being all in all login positions, in step 220, make substrate identification video camera 50 move repeating step 110～180 to next desired location.
On the other hand, in step 210, be judged as all login positions when being all over, enter step 230, corresponding with the arithmetic mean value and the predefined correction coefficient k of the scolding tin departure of 2 positions that in step 170, calculate, calculate the mounting position correcting amount.Then, in step 240, reflection mounting position correcting amount and carrying.
In the present embodiment, owing to set the combination of detected object electrode and calibration object parts on each zone on the substrate, therefore the difference of the scolding tin position deviation that can cause with the flexible difference of substrate diverse location formation is corresponding.
In addition, even in detected object electrode The corresponding area,, regardless of the position deviation amount of scolding tin, all it is equipped on original parts electrode position, thereby carries reliably for parts such as for example heavy parts or QFP.
In addition, in the above description, with the component locations of 2 terminals as identifying object, but identifying object to be not limited to be the parts of 2 terminals, for example also can be set at the part of a plurality of parts electrodes.
Below, the 2nd execution mode of the present invention is described, it is used to dispose the multiaspect installation base plate of a plurality of integrated circuits.
Fig. 5 is the multiaspect installation base plate 33 as the object of the 2nd execution mode, is 2 row on disposing vertically on it, is 6 integrated circuits that amount to of 3 row transversely.An example of the treatment process to the multiaspect installation base plate that disposes a plurality of integrated circuits shown in Figure 6, its detected object electrode position that is used to detect the scolding tin departure is these two positions of following detected object electrode 35-1,35-2.
In the present embodiment, as 35-1,35-2, being distributed in the mode of a plurality of circuit, be benchmark with the coordinate of the circuit of for example lower-left, set the detected object electrode.Be distributed in the detected object electrode of a plurality of circuit for these, the processing of repeating step 110～180 detects the scolding tin departure before component mounting.If the scolding tin departure detect to finish, corresponding based on the arithmetic mean value of the scolding tin departure of 2 positions that calculate in the step 170 then in step 230 with predefined correction coefficient k, calculate the mounting position correcting amount.Detect the loading position that the 1st of the 1st circuit carries point, in step 240, carry out component mounting.Then, in step 250, carry in the decision circuitry and whether finish, in judged result is under the situation not, in step 260, move to next loading position, until the judged result of step 250 become be till, the processing of repeating step 230～260 is with the lift-launch of whole parts of finishing the 1st circuit.
The lift-launch of the whole parts in the ifs circuit is finished, whether the lift-launch of then judging all circuit in step 270 finishes, in judged result is under the situation not, in step 280, move to next circuit position, until the judged result of step 270 become be till, the processing of repeating step 230～280 is with the lift-launch of the parts of finishing entire circuit.At this moment, with the recognition result of step 110～180, in each circuit, use as shared mounting position correcting value.
In addition, in the 2nd execution mode, detecting electrode 35-1,35-2 are provided with in the mode that is distributed in a plurality of circuit, but also can as the 1st execution mode detecting electrode be arranged in 1 circuit.
In addition, can with among the present invention according to the recognition result of solder printing position and actual parts of proofreading and correct and carrying and coordinate are kept at fitting machine 10 inside as file, make the operator of equipment can be thus afterwards with reference to these data.In addition, can directly carrying out in the data communications system with main frame, even for remote site, also can be with reference to utilizing the solder printing position correction to proofread and correct the record of lift-launch.
Claims (7)
1. a component mounting position correcting method is characterized in that,
With substrate on the loading position of answering boarded parts and be printed on corresponding to the printing position departure between the scolding tin on the electrode of described parts correspondingly, and the loading position of parts is carried out timing,
Corresponding with the solder printing position deviation amount on the predetermined member electrode, and the loading position of the predetermined parts of the lift-launch of regulation is proofreaied and correct.
2. component mounting position correcting method according to claim 1 is characterized in that,
The 1 pair of scolding tin that is printed on the predetermined member electrode on the substrate is taken, point midway departure between the loading position of the described predetermined member of corresponding lift-launch and the 1 pair of scolding tin printing position of described shooting is discerned, and obtains described solder printing position deviation amount thus.
3. component mounting position correcting method according to claim 1 is characterized in that,
On substrate, set and a plurality ofly should carry the loading positions of described predetermined member and the combinations of carrying predetermined parts, carry predetermined parts for this, corresponding with the point midway departure in 1 pair of scolding tin printing position and carry out mounting position correcting.
4. according to any described component mounting position correcting method in claim 1 or 2, it is characterized in that,
In disposing the multiaspect installation base plate of a plurality of integrated circuits, use shared solder printing position deviation result to proofread and correct to a plurality of integrated circuits.
5. apparatus for mounting component, it is used for component mounting it is characterized in that having at substrate:
The image unit that scolding tin on the electrode of answering boarded parts that is printed on substrate is taken;
The unit that position deviation amount between the solder printing position of loading position of answering boarded parts on the substrate and described shooting is discerned; And
Corresponding with the position deviation amount of described solder printing position, and the unit that the loading position of the predetermined parts of predefined lift-launch is proofreaied and correct.
6. apparatus for mounting component according to claim 5 is characterized in that,
Have setting on the substrate and a plurality ofly should carry the loading position of described predetermined member and carry the unit that makes up between the predetermined parts, carry predetermined parts for this, corresponding with the point midway departure in 1 pair of scolding tin printing position of described shooting and carry out mounting position correcting.
7. according to any described apparatus for mounting component in claim 5 or 6, it is characterized in that,
Has in disposing the multiaspect installation base plate of a plurality of integrated circuits the unit that uses the point midway deviation result in 1 pair of shared scolding tin printing position to proofread and correct to a plurality of integrated circuits.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006194441 | 2006-07-14 | ||
| JP2006194441 | 2006-07-14 | ||
| JP2007081557 | 2007-03-27 | ||
| JP2007174390 | 2007-07-02 |
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| CN101106899A true CN101106899A (en) | 2008-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101363055A Pending CN101106899A (en) | 2006-07-14 | 2007-07-13 | Component mounting position correcting method and component mouting apparatus |
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